CMD227
Passive Frequency Doubler, 8-15 GHz Input
Features
Functional Block Diagram
► Low conversion loss
► Excellent Fo isolation
► Broadband performance
► No bias required
► Small die size
1
2
X2
Description
The CMD227 die is a broadband MMIC GaAs
x2 passive frequency multiplier. When driven
by a +15 dBm signal, the multiplier provides 11
dB conversion loss at an output frequency of 23
GHz. The Fo and 3Fo isolations are 40 dBc and
43 dBc respectively. The CMD227 is a 50 ohm
matched design eliminating the need for RF port
matching.
Electrical Performance - TA = 25 oC, Pin = +15 dBm, Fin = 11.5 GHz
Parameter
Min
Typ
Max
Units
Frequency Range, Input
8 - 15
GHz
Frequency Range, Output
16 - 30
GHz
Conversion Loss
11
dB
Fo Isolation (with respect to input level)
40
dB
3Fo Isolation (with respect to input level)
43
dB
ver 1.1 0616
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
CMD227
Passive Frequency Doubler, 8-15 GHz Input
Specifications
Absolute Maximum Ratings
Parameter
Rating
RF Input Power
+27 dBm
Operating Temperature
-55 to 85 °C
Storage Temperature
-55 to 150 °C
Operation of this device outside the maximum
ratings may cause permanent damage.
Electrical Specifications - TA = 25 oC, Pin = +15 dBm
Parameter
Min
Typ
Max
Min
Typ
Max
Units
Frequency Range, Input
8 - 15
10 - 13
GHz
Frequency Range, Output
16 - 30
20 - 26
GHz
Conversion Loss
13
19
11
15.5
dB
Fo Isolation (with respect to input level)
36
44
36
44
dB
3Fo Isolation (with respect to input level)
37
44
37
44
dB
ver 1.1 0616
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
CMD227
Passive Frequency Doubler, 8-15 GHz Input
Typical Performance
Conversion Gain vs. Temperature @ +15 dBm Drive Level
0
+25C
-5
+85C
-55C
Conversion Gain/dB
-10
-15
-20
-25
-30
-35
-40
8
9
10
11
12
13
14
15
Input Frequency/GHz
Conversion Gain vs. Drive Level, TA = 25 oC
0
-5
Conversion Gain/dB
-10
-15
-20
+9 dBm
-25
+11 dBm
+13 dBm
-30
+15 dBm
+17 dBm
-35
-40
8
9
10
11
12
13
14
15
Input Frequency/GHz
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
ver 1.1 0616
CMD227
Passive Frequency Doubler, 8-15 GHz Input
Typical Performance
Isolation (with respect to input level) @ +15 dBm Drive Level, TA = 25 oC
0
Fo
-10
3Fo
-20
Isolation/dB
-30
-40
-50
-60
-70
-80
-90
-100
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
38
40
Frequency/GHz
Output Spectrum @ +15 dBm Drive Level, TA = 25 oC
10
Fo
5
2Fo
0
3Fo
-5
Output Power/dBm
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
Frequency/GHz
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
ver 1.1 0616
CMD227
Passive Frequency Doubler, 8-15 GHz Input
Typical Performance
Input Return Loss @ +15 dBm Drive Level, TA = 25 oC
0
Return Loss/dB
-5
-10
-15
-20
8
9
10
11
12
13
14
15
Input Frequency/GHz
Output Return Loss @ +15 dBm Drive Level, F = 11.5 GHz Input, TA = 25 oC
0
Return Loss/dB
-2
-4
-6
-8
-10
16
18
20
22
24
26
28
30
Frequency/GHz
ver 1.1 0616
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
CMD227
Passive Frequency Doubler, 8-15 GHz Input
Mechanical Information
Die Outline (all dimensions in microns)
1
2
790.00
470.00
104.00
1060.00
Notes:
1. No connection required for unlabeled pads
2. Backside is RF and DC ground
3. Backside and bond pad metal: Gold
4. Die is 100 microns thick
5. RF bond pads are 100 x 150 microns
ver 1.1 0616
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
CMD227
Passive Frequency Doubler, 8-15 GHz Input
Pin Description
Pad Diagram
1
2
Functional Description
Pad
Function
Description
Schematic
RF in
1
RF in
Pad is DC coupled and 50 ohm matched
RF out
2
RF out
Pad is DC coupled and 50 ohm matched
Backside
Ground
Connect to RF / DC ground
GND
ver 1.1 0616
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com
CMD227
Passive Frequency Doubler, 8-15 GHz Input
Applications Information
Assembly Guidelines
The backside of the CMD227 is RF ground. Die attach should be accomplished with electrically and
thermally conductive epoxy or eutectic attach. Standard assembly procedures should be followed for
high frequency devices. The top surface of the semiconductor should be made planar to the adjacent RF
transmission lines.
RF connections should be made as short as possible to reduce the inductive effect of the bond wire. Use
of a 0.8 mil thermosonic wedge bonding is highly recommended as the loop height will be minimized.
The RF input and output require double bond wires as shown.
The semiconductor is 100 um thick and should be handled by the sides of the die or with a custom collet.
Do not make contact directly with the die surface as this will damage the monolithic circuitry. Handle
with care.
Assembly Diagram
RF in
RF out
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions
should be observed during handling, assembly and test.
ver 1.1 0616
Custom MMIC
300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294
Visit us online at www.custommmic.com