Allegro Microsystems
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Allegro Microsystems
Líder en el desarrollo, fabricación y comercialización de circuitos integrados de alta
performance que incluyen sensores de efecto Hall y circuitos de potencia.
Genera innovadoras soluciones para aplicaciones en las industrias automotriz,
comunicaciones, informática / automatización de oficina, consumo y mercados industriales
Tiene su sede en Worcester, Massachusetts (USA) y centros de diseño, aplicaciones y soporte
de ventas ubicadas alrededor del mundo.
Desarrolla soluciones de packaging especiales que incorporan circuitos magnéticos para
simplificar problemas específicos de aplicaciones
Posee capacidad de fabricacion incluyendo procesos propietarios BCD (bipolar, CMOS,
DMOS) y tecnología BiCMOS que permite la fusión de circuitos digitales de alta densidad
con circuitos de potencia y estructuras de sensado magnético.
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Organización Global
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Products
Magnetic Linear & Angular Position Sensor ICs
 Linear Position Sensor ICs
 Angular Position Sensor ICs
Magnetic Digital Position Sensor ICs
 Hall-Effect Latches and Bipolar Switches
 Hall-Effect Unipolar Switches
 Dual Element Switches
 Micropower Switches and Latches
Current Sensor ICs
 50 to 200 A Integrated Conductor Sensor ICs
 SIP Package 0 to >1000 A Sensor ICs
 0 to 50 A Integrated Conductor Sensor ICs
 High-Side Hot-Swap Hall Effect Based Current
Monitor IC
Magnetic Speed Sensor ICs
 Camshaft Sensor ICs
 Crankshaft Sensor ICs
 Transmission Sensor ICs
 Wheel Speed Sensor Ics
Motor Driver & Interface ICs
 Brushless DC Motor Drivers
 Brush DC Motor Drivers
 Bipolar Stepper Motor Drivers
 High and Low Side Drivers
 Photo and Ion Smoke Detector ICs
Regulators and Lighting
 Single Output Regulators
 Multiple Output Regulators
 Low Noise Block Regulators for Satellite SetTop Boxes
 LED Drivers for Backlighting
 LED Drivers for Lighting
 Xenon Photoflash Drivers
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Automotive – High Temperature
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Automotive – In Cabin
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Consumer Applications
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Packaging
Allegro MicroSystems, Inc. introduces a revolutionary new package offering for Allegro’s current sensor IC family
of devices. Allegro’s smallest current sensor linear IC, the ACS711, is now housed in a 0.75 mm thick low profile
QFN package measuring only 3 mm x 3 mm. This new micro sized device is possibly the smallest fully
integrated linear current sensor IC in the world! With only a 0.6 mΩ internal resistance, this package can really
take the heat. With proper PCB design, the device can be used for applications with over 30 A continuous current
while reducing power consumption by an order of magnitude over existing sense resistor op-amp solutions
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Mixed Signal ASICs
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Mixed Signal ASICs
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Mixed Signal ASIC Design
Requirements Communication
Solutions Exploration
System Modeling
Architectures Exploration
Process / Package definition
Area constraints, Initial floor-planning, Feasibility Analysis
Algorithms Exploration
Architectures / Algorithms Simulation and Validation
Features definition
Datasheet definition
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Mixed Signal ASIC Design
Analog / Digital Architecture Definition
ASIC Specification definition
Analog Design / Simulation
Digital Design / Verification
Mixed Mode Simulation
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Digital Design
Architecture Definition : Area / Speed / Power / Process considerations
RTL Coding / Simulation
Digital System High Level Modeling (System Verilog)
Verification
FPGA prototyping
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Digital Design
Synthesis
DFT Insertion
Equivalency Check
Post-synthesis Timing Analysis
Floorplanning
Placement
Clock Tree synthesis
Routing
Post-route timing analysis
Signoff Analysis
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Digital Design
RC extraction
Gate Level Simulation
Mixed Mode Simulation
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Layout
Manufacturing checks
DRC
LVS
Tape-out
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Mixed Signal ASICs
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Post Si Validation
Post Si Validation
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Allegro Argentina Capabilities
System Level / Digital, Analog Architecture Design
Analog Design
Digital Design (Frontend / Backend)
IC Layout
Wafer / Package Testing
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Contacto
• Ricardo Scheinkerman
• rscheinkerman@allegromicro.com
• http://www.allegromicro.com