Wire Bondable Multi-tap Chip Resistors
advertisement
Resistors Wire Bondable Multi-tap Chip Resistors Wire Bondable Wire Bondable Multi-tap ChipResistors Resistors Multi-tap Chip WBC Series Make Possible • High resistor density WBC Series WBC Series • MIL inspection available High resistor density MIL inspection available • MIL inspection available Multi-tapped chip resistor • Multi-tapped chip resistor • Multi-tapped • High resistor density chip resistor All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2) Electrical Data Physical Data Physical Data Absolute Tolerance Electrical Data 0.032˝ ±0.001 (0.813mm ±0.025) 0.032˝ ±0.001 (0.813mm ±0.025) 0.032˝ ±0.001 (0.813mm ±0.025) 0.032˝ ±0.001 (0.813mm ±0.025) Pad 13 to ±5% to ±25ppm/°C Absolute TCR to ±25ppm/°C Package Power Rating 250mW (@ 70°C) Pad 13 Package Power Rating 250mW (@ 70°C) Rated Operating Voltage 100V (not to exceed √ P x R ) Rated Operating Voltage 100V (not to exceed √ P x R ) Operating Temperature -55°C to +150°C Pad 1 chamfered 0.004˝ min Bond Pads Pad 1 chamfered R R R R 13 13 5R 5R 5R 5R R R R 5R 5R 5R 5R RT = 40 R RT = 40 R 5R 5R 5R 1 5R <-30dB <-30dB Oxidized Silicon (10KÅ SiO2 minimum) Oxidized Silicon Substrate Material (10KÅ SiO2 minimum) 0.010˝ ±0.001 Substrate Thickness (0.254mm ±0.025) 0.010˝ ±0.001 Substrate Thickness (0.254mm ±0.025) Aluminum 10KÅ minimum Bond Pad Metallization Aluminum 10KÅ minimum Bond Pad Gold 15KÅ minimum Metallization Gold 15KÅ minimum Backside Silicon (gold available) Backside 5R 5R -55°C to +150°C Substrate Material R R Operating Temperature Noise Noise 0.004˝ min Bond Pads R Absolute Tolerance Absolute TCR to ±5% 1 Passivation Passivation Silicon (gold available) Silicon Dioxide or Silicon Nitride Silicon Dioxide or Silicon Nitride General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject IRC’s own data and is considered accurate at South time ofStaples going toStreet print. • Corpus Christi Texas 78411 USA © IRCto Advanced Film Division • 4222 Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA General Note Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc A subsidiary of WBCTTSeries Issue plc January 2009 Sheet 1 of 3 electronics WBC Series Issue January 2009 Sheet 1 of 3 www.ttelectronicsresistors.com © TT Electronics plc 07.14 Wire Bondable Multi-tap Chip Resistors WBC Series Wire Bondable Multi-tap Chip Resistors Power Derating Data Make Possible TCR/Inspection Code Table Absolute TCR Commercial Code MIL Inspection Code* ±300ppm/°C 00 04 ±100ppm/°C 01 05 ±50ppm/°C 02 06 ±25ppm/°C 03 07 *Notes: Product supplied to Class H of MIL-PRF 38534 include 100% visual inspection Environmental Data Method Max ∆R Typical ∆R MIL-STD-202 Method 107 Test condition F ±0.1% ±0.02% High Temperature Exposure MIL-STD-883 Method 1008 150°C, 1000 hours ±0.1% ±0.05% Low Temperature Storage -55°C, 1000 hours ±0.03% ±0.01% Life MIL-STD-202 Method 108 70°C, 1000 hours ±0.5% ±0.01% Life at Elevated Temperature MIL-STD-202 Method 108 125°C, 1000 hours ±0.5% ±0.05% Test Thermal Shock © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com WBC Series Issue January 2009 Sheet 2 of 3 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. www.ttelectronicsresistors.com © TT Electronics plc 07.14 Wire Bondable Multi-tap Chip Resistors WBC Series Wire Bondable Multi-tap Chip Resistors Make Possible Manufacturing Capabilities Data Resistance R Total Available Absolute Tolerances Best Absolute TCR 100Ω MK ±100ppm/°C 400Ω MKJ ±100ppm/°C 800Ω MKJ ±100ppm/°C 2.4KΩ MKJ ±50ppm/°C 8.0KΩ MKJ ±50ppm/°C 24KΩ MKJ ±25ppm/°C 80KΩ MKJ ±25ppm/°C Ordering Data Prefix WBC - M0303 A S - 01 - 2402 - J Style M0303 Bonding pads A = Aluminum; G = Gold Backside G = Gold; S = Silicon TCR/Inspection Code Reference TCR/Inspection Code Table Total Resistance = RT 4-Digit Resistance Code Ex: 8000 = 800Ω; 2402 = 24.0KΩ Reference manufacturing Capabilities Data Table for available resistances Absolute Tolerance Code M = ±20%; K = ±10%; J = ±5% Packaging Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your specific requirements, please contact our Applications Team using the contact details below. © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com WBC Series Issue January 2009 Sheet 3 of 3 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. www.ttelectronicsresistors.com © TT Electronics plc 07.14
