I2C-Compatible, Wide Bandwidth,
Triple 4:1 Multiplexer
ADG792A/ADG792G
FEATURES
FUNCTIONAL BLOCK DIAGRAMS
VDD
VDD
GND
ADG792A
ADG792G
S1A
S1A
S1B
S1B
D1
S1C
S1D
S2A
S2A
S2B
S2B
D2
S2C
S2D
S3A
S3A
S3B
D3
S3C
D3
S3C
S3D
S3D
I2C SERIAL
INTERFACE
A0
RGB/YPbPr video switches
HDTV
Projection TV
DVD-R/RW
AV receivers
D2
S2C
S2D
S3B
D1
S1C
S1D
APPLICATIONS
GND
A1
I2C SERIAL
INTERFACE
GPO1
A2 SDA SCL
A0
A1
A2 SDA SCL
GPO2
06029-001
Bandwidth: 190 MHz
Low insertion loss and on resistance: 2.6 Ω typical
On resistance flatness: 0.3 Ω typical
Single 3 V/5 V supply operation
3.3 V analog signal range (5 V supply, 75 Ω load)
Low quiescent supply current: 1 nA typical
Fast switching times: tON 185 ns, tOFF 181 ns
I2C®-compatible interface
Compact, 24-lead, LFCSP package
Two I2C-controllable logic outputs
ESD protection
4 kV human body model
200 V machine model
1 kV field-induced charged device model
Figure 1.
GENERAL DESCRIPTION
The ADG792A/ADG792G are monolithic CMOS devices, each
comprising three 4:1 multiplexer/demultiplexers that are controllable through a standard I2C serial interface. The CMOS
process provides ultralow power dissipation yet delivers high
switching speed and low on resistance.
The on resistance profile is very flat over the full analog input
range, and wide bandwidth ensures excellent linearity and low
distortion. These features, combined with a wide input signal
range, make the ADG792A/ADG792G the ideal switching
solution for a wide range of TV applications, including RGB
and YPbPr video switches.
When turned on, the switches conduct equally well in both
directions. In the off condition, signal levels, up to the supplies,
are blocked. The ADG792A/ADG792G switches exhibit breakbefore-make switching action. The ADG792G also has two
general-purpose logic output pins controllable through the I2C
interface to control other non-I2C-compatible devices, such as
video filters. The integrated I2C interface provides a large degree
of flexibility in the system design. To build larger switching
arrays, the user can set the three I2C address pins allowing as
many as eight devices to connect to the same bus.
The ADG792A/ADG792G operate from a single 3 V or 5 V
supply voltage and is available in a compact 4 mm × 4 mm
body, 24-lead, Pb-free, LFCSP package.
PRODUCT HIGHLIGHTS
1.
Wide bandwidth: 190 MHz.
2.
Ultralow power dissipation.
3.
Extended input signal range.
4.
Integrated I2C serial interface.
5.
Compact 4 mm × 4 mm, 24-lead, Pb-free LFCSP package.
6.
ESD protection tested as per ESD Association Standards:
4 kV HBM (ANSI/ESD STM5.1-2001)
200 V MM (ANSI/ESD STM5.2-1999)
1 kV FICDM (ANSI/ESDSTM5.3.1-1999)
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2006 Analog Devices, Inc. All rights reserved.
ADG792A/ADG792G
TABLE OF CONTENTS
Features .............................................................................................. 1
Terminology .................................................................................... 16
Applications....................................................................................... 1
Theory of Operation ...................................................................... 17
Functional Block Diagrams............................................................. 1
I2C Serial Interface ..................................................................... 17
General Description ......................................................................... 1
I2C Address.................................................................................. 17
Product Highlights ........................................................................... 1
Write Operation.......................................................................... 17
Revision History ............................................................................... 2
LDSW Bit..................................................................................... 19
Specifications..................................................................................... 3
Power On/Software Reset.......................................................... 19
I2C Timing Specifications............................................................ 7
Read Operation........................................................................... 19
Absolute Maximum Ratings............................................................ 9
Evaluation Board ............................................................................ 20
ESD Caution.................................................................................. 9
Using the ADG792G Evaluation Board .................................. 20
Pin Configurations and Function Descriptions ......................... 10
Outline Dimensions ....................................................................... 23
Typical Performance Characteristics ........................................... 11
Ordering Guide .......................................................................... 23
Test Circuits..................................................................................... 14
REVISION HISTORY
7/06—Revision 0: Initial Version
Rev. 0 | Page 2 of 24
ADG792A/ADG792G
SPECIFICATIONS
VDD = 5 V ± 10%, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range 2
On Resistance, RON
On Resistance Matching Between Channels, ∆RON
On Resistance Flatness, RFLAT(ON)
LEAKAGE CURRENTS
Source Off Leakage (IS(OFF))
Drain Off Leakage (ID(OFF))
Channel On Leakage (ID(ON), IS(ON))
DYNAMIC CHARACTERISTICS 3
tON, tENABLE
tOFF, tDISABLE
Break-Before-Make Time Delay, tD
I2C to GPO Propagation Delay, tH, tL
Off Isolation
Channel-to-Channel Crosstalk
Same Multiplexer
Different Multiplexer
−3 dB Bandwidth
THD + N
Charge Injection
CS(OFF)
CD(OFF)
CD(ON), CS(ON)
Power Supply Rejection Ratio, PSRR
Differential Gain Error
Differential Phase Error
LOGIC INPUTS (A0, A1, A2)3
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
Input Capacitance, CIN
LOGIC INPUTS (SCL, SDA)3
Input High Voltage, VINH
Input Low Voltage, VINL
Input Leakage Current, IIN
Input Hysteresis
Input Capacitance, CIN
Conditions
Min
VS = VDD, RL = 1 MΩ
VS = VDD, RL = 75 Ω
VD = 0 V, IDS = −10 mA, see Figure 22
VD = 0 V to 1 V, IDS = −10 mA, see
Figure 22
VD = 0 V IDS = −10 mA
VD = 1 V IDS = −10 mA
VD = 0 V to 1 V, IDS = −10 mA
0
0
Typ 1
2.6
0.15
0.3
Max
Unit
4
3.3
3.5
4
V
V
Ω
Ω
0.5
0.6
0.55
Ω
Ω
Ω
VD = 4 V/1 V, VS = 1 V/4 V, see
Figure 23
VD = 4 V/1 V, VS = 1 V/4 V, see
Figure 23
VD = VS = 4 V/1 V, see Figure 24
±0.25
nA
±0.25
nA
±0.25
nA
CL = 35 pF, RL = 50 Ω, VS = 2 V, see
Figure 28
CL = 35 pF, RL = 50 Ω, VS = 2 V, see
Figure 28
CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V,
see Figure 29
ADG792G only
f = 10 MHz, RL = 50 Ω, see Figure 26
f = 10 MHz, RL = 50 Ω, see Figure 27
185
240
ns
181
235
ns
1
3
ns
130
RL = 50 Ω, see Figure 25
RL = 100 Ω
CL = 1 nF, VS = 0 V, see Figure 30
f = 20 kHz
CCIR330 test signal
CCIR330 test signal
−60
ns
dB
−55
−75
190
0.14
5
10
26
37
70
0.58
0.81
dB
dB
MHz
%
pC
pF
pF
pF
dB
%
Degrees
2.0
VIN = 0 V to VDD
0.005
3
0.7 × VDD
−0.3
VIN = 0 V to VDD
Rev. 0 | Page 3 of 24
+0.005
0.05 × VDD
3
0.8
±1
VDD + 0.3
+0.3 × VDD
±1
V
V
μA
pF
V
V
μA
V
pF
ADG792A/ADG792G
Parameter
LOGIC OUTPUTS3
SDA Pin
Output Low Voltage, VOL
Floating State Leakage Current
Floating State Output Capacitance
GPO1 and GPO2 Pins
Output Low Voltage, VOL
Output High Voltage, VOH
POWER REQUIREMENTS
IDD
1
2
3
Conditions
Min
Typ1
ISINK = 3 mA
ISINK = 6 mA
ILOAD = +2 mA
ILOAD = −2 mA
Digital inputs = 0 V or VDD, I2C interface
inactive
I2C interface active, fSCL = 400 kHz
I2C interface active, fSCL = 3.4 MHz
All typical values are at TA = +25°C, unless otherwise stated.
Guaranteed by initial characterization, not subject to production test.
Guaranteed by design, not subject to production test.
Rev. 0 | Page 4 of 24
Max
Unit
0.4
0.6
±1
10
V
V
μA
pF
0.4
V
V
1
μA
0.2
0.7
mA
mA
2.0
0.001
ADG792A/ADG792G
VDD = 3 V ± 10%, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range2
On Resistance, RON
On Resistance Matching Between Channels, ∆RON
On Resistance Flatness, RFLAT(ON)
LEAKAGE CURRENTS
Source Off Leakage (IS(OFF))
Drain Off Leakage (ID(OFF))
Channel On Leakage (ID(ON), IS(ON))
DYNAMIC CHARACTERISTICS3
tON, tENABLE
tOFF, tDISABLE
Break-Before-Make Time Delay, tD
I2C to GPO propagation delay, tH, tL
Off Isolation
Channel-to-Channel Crosstalk
Same Multiplexer
Different Multiplexer
−3 dB Bandwidth
THD + N
Charge Injection
CS(OFF)
CD(OFF)
CD(ON), CS(ON)
Power Supply Rejection Ratio, PSRR
Differential Gain Error
Differential Phase Error
LOGIC INPUTS (A0, A1, A2)3
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
Input Capacitance, CIN
LOGIC INPUTS (SCL, SDA)3
Input High Voltage, VINH
Input Low Voltage, VINL
Input Leakage Current, IIN
Input Hysteresis
Input Capacitance, CIN
LOGIC OUTPUTS3
SDA Pin
Output Low Voltage, VOL
Conditions
Min
VS = VDD, RL = 1 MΩ
VS = VDD, RL = 75 Ω
VD = 0 V, IS = −10 mA, see Figure 22
VD = 0 V to 1 V, IS = −10 mA, see Figure 22
VD = 0 V IS = −10 mA
VD = 1 V IS = −10 mA
VD = 0 V to 1 V, IS = −10 mA
0
0
Typ1
3
0.15
0.8
VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23
VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23
VD = VS = 2 V/1 V, see Figure 24
±0.25
±0.25
±0.25
CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28
CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28
CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V,
see Figure 29
ADG792G only
f = 10 MHz, RL = 50 Ω, see Figure 26
f = 10 MHz, RL = 50 Ω, see Figure 27
200
197
3
1
RL = 50 Ω, see Figure 25
RL = 100 Ω
CL = 1 nF, VS = 0 V, see Figure 30
f = 20 kHz
CCIR330 test signal
CCIR330 test signal
Max
Units
2.2
1.7
4
6
0.6
0.8
2.8
V
V
Ω
Ω
Ω
Ω
Ω
nA
nA
nA
260
255
ns
ns
ns
121
−60
ns
dB
−55
−75
180
0.14
3.5
10
26
37
70
0.49
0.56
dB
dB
MHz
%
pC
pF
pF
pF
dB
%
Degrees
2.0
VIN = 0 V to VDD
+0.005
3
0.7 × VDD
−0.3
VIN = 0 V to VDD
+0.005
0.05 × VDD
3
ISINK = 3 mA
ISINK = 6 mA
Floating State leakage Current
Floating State Output Capacitance
3
Rev. 0 | Page 5 of 24
0.8
±1
V
V
μA
pF
VDD + 0.3
+0.3 × VDD
±1
V
V
μA
V
pF
0.4
0.6
±1
V
V
μA
pF
ADG792A/ADG792G
Parameter
GPO1 and GPO2 Pins
Output Low Voltage, VOL
Output High Voltage, VOH
POWER REQUIREMENTS
IDD
Conditions
Min
ILOAD = +2 mA
ILOAD = −2 mA
2.0
Digital inputs = 0 V or VDD,
I2C interface inactive
I2C interface active, fSCL = 400 kHz
I2C interface active, fSCL = 3.4 MHz
1
All typical values are at TA = +25°C, unless otherwise stated.
Guaranteed by initial characterization, not subject to production test.
3
Guaranteed by design, not subject to production test.
2
Rev. 0 | Page 6 of 24
Typ1
0.001
Max
Units
0.4
V
V
1
μA
0.1
0.2
mA
mA
ADG792A/ADG792G
I2C TIMING SPECIFICATIONS
VDD = 2.7 V to 5.5 V; GND = 0 V; TA = −40°C to +85°C, unless otherwise noted. See Figure 2 for timing diagram.
Table 3.
Parameter 1
fSCL
t1
t2
t3
t4 2
t5
t6
t7
t8
t9
t10
t11
Conditions
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Min
Max
100
400
Unit
kHz
kHz
3.4
1.7
4
0.6
MHz
MHz
μs
μs
60
120
4.7
1.3
ns
ns
μs
μs
160
320
250
100
10
0
0
ns
ns
ns
ns
ns
μs
μs
3.45
0.9
0
0
4.7
0.6
160
4
0.6
160
4.7
1.3
4
0.6
160
703
150
1000
300
ns
ns
μs
μs
ns
μs
μs
ns
μs
μs
μs
μs
ns
ns
ns
80
160
300
300
ns
ns
ns
ns
20 + 0.1 CB
80
160
1000
300
ns
ns
ns
ns
10
20
40
80
ns
ns
20 + 0.1 CB
B
10
20
20 + 0.1 CB
B
10
20
B
Description
Serial clock frequency
tHIGH, SCL high time
tLOW, SCL low time
tSU;DAT, data setup time
tHD;DAT, data hold time
tSU;STA, setup time for a repeated start condition
tHD;STA, hold time (repeated) start condition
tBUF, bus free time between a stop and a start condition
tSU;STO, setup time for stop condition
tRDA, rise time of SDA signal
tFDA, fall time of SDA signal
tRCL, rise time of SCL signal
Rev. 0 | Page 7 of 24
ADG792A/ADG792G
Parameter 1
t11A
t12
tSP
1
2
Conditions
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Standard mode
Fast mode
High speed mode
CB = 100 pF max
CB = 400 pF max
Fast mode
High speed mode
Min
Max
1000
300
Unit
ns
ns
20 + 0.1 CB
80
160
300
300
ns
ns
ns
ns
10
20
0
0
40
80
50
10
ns
ns
ns
ns
20 + 0.1 CB
B
10
20
B
Description
tRCL1, rise time of SCL signal after a repeated start condition and after
an acknowledge bit
tFCL, fall time of SCL signal
Pulse width of suppressed spike
Guaranteed by initial characterization. CB refers to capacitive load on the bus line, tr and tf measured between 0.3 VDD and 0.7 VDD.
A device must provide a data hold time for SDA in order to bridge the undefined region of the SCL falling edge.
Timing Diagram
t11
t2
SCL
t12
t6
t1
t6
t4
t5
t3
t8
t10
t9
t7
P
S
S
Figure 2. Timing Diagram for 2-Wire Serial Interface
Rev. 0 | Page 8 of 24
P
06029-002
SDA
ADG792A/ADG792G
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
VDD to GND
Analog, Digital Inputs
Continuous Current, S or D Pins
Peak Current, S or D Pins
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
θJA Thermal Impedance
24-Lead LFCSP
Lead Temperature, Soldering
(10 sec)
IR Reflow, Peak Temperature
(<20 sec)
Rating
−0.3 V to +6 V
−0.3 V to VDD + 0.3 V or 30 mA,
whichever occurs first
100 mA
300 mA (pulsed at 1 ms, 10%
duty cycle max)
−40°C to +85°C
−65°C to +150°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any
one time.
30°C/W
300°C
260°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 9 of 24
ADG792A/ADG792G
24
23
22
21
20
19
24
23
22
21
20
19
GND
VDD
SDA
SCL
A0
A1
GND
VDD
SDA
SCL
A0
A1
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
ADG792A
TOP VIEW
(Not to Scale)
18
17
16
15
14
13
S1A
S1B
D1
S1D
S1C
GPO2
A2
S3C
S3D
D3
S3B
S3A
S2A
S2B
D2
S2D
S2C
NC
PIN 1
INDICATOR
ADG792G
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED PAD
MUST BE TIED TO GND.
06029-012
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PAD
MUST BE TIED TO GND.
1
2
3
4
5
6
18
17
16
15
14
13
A2
S3C
S3D
D3
S3B
S3A
06029-061
PIN 1
INDICATOR
S2A 7
S2B 8
D2 9
S2D 10
S2C 11
GPO1 12
1
2
3
4
5
6
7
8
9
10
11
12
S1A
S1B
D1
S1D
S1C
NC
Figure 4. ADG792G Pin Configuration
Figure 3. ADG792A Pin Configuration
Table 5. Pin Function Descriptions
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Mnemonic
ADG792A/ADG792G
S1A
S1B
D1
S1D
S1C
NC/GPO2
S2A
S2B
D2
S2D
S2C
NC/GPO1
S3A
S3B
D3
S3D
S3C
A2
A1
A0
SCL
22
23
24
SDA
VDD
GND
Function
A Side Source Terminal for Mux 1. Can be an input or output.
B Side Source Terminal for Mux 1. Can be an input or output.
Drain Terminal for Mux 1. Can be an input or output.
D Side Source Terminal for Mux 1. Can be an input or output.
C Side Source Terminal for Mux 1. Can be an input or output.
Not internally connected for ADG792A/General-Purpose Logic Output 2 for ADG792G.
A Side Source Terminal for Mux 2. Can be an input or output.
B Side Source Terminal for Mux 2. Can be an input or output.
Drain Terminal for Mux 2. Can be an input or output.
D Side Source Terminal for Mux 2. Can be an input or output.
C Side Source Terminal for Mux 2. Can be an input or output.
Not internally connected for ADG792A/General-Purpose Logic Output 1 for ADG792G.
A Side Source Terminal for Mux 3. Can be an input or output.
B Side Source Terminal for Mux 3. Can be an input or output.
Drain Terminal for Mux 3. Can be an input or output.
D Side Source Terminal for Mux 3. Can be an input or output.
C Side Source Terminal for Mux 3. Can be an input or output.
Logic Input. Sets Bit A2 from the least significant bits of the 7-bit slave address.
Logic Input. Sets Bit A1 from the least significant bits of the 7-bit slave address.
Logic Input. Sets Bit A0 from the least significant bits of the 7-bit slave address.
Digital Input, Serial Clock Line. Open-drain input that is used in conjunction with SDA to clock data into the
device. External pull-up resistor required.
Digital Input/Output. Bidirectional open-drain data line. External pull-up resistor required.
Positive Power Supply Input.
Ground (0 V) Reference.
Rev. 0 | Page 10 of 24
ADG792A/ADG792G
TYPICAL PERFORMANCE CHARACTERISTICS
3.0
4.0
VDD = 3.3V, RL = 1MΩ
TA = 25°C
1 CHANNEL
VDD = 3V, RL = 1MΩ
2.5
VDD = 5.0V
VDD = 4.5V
VDD = 5.5V
3.0
VDD = 3.3V, RL = 75Ω
2.5
RON (Ω)
OUTPUT SIGNAL (V)
VDD = 2.7V, RL = 1MΩ
2.0
TA = 25°C
1 CHANNEL
3.5
VDD = 3V, RL = 75Ω
1.5
VDD = 2.7V, RL = 75Ω
2.0
1.5
1.0
1.0
0.5
1.0
1.5
2.0
2.5
3.5
3.0
INPUT SIGNAL (V)
0
0
2.0
2.5
3.0
1.6
7
TA = 25°C
1 CHANNEL
6 VDD = 3V
TA = +85°C
5
3.5
VDD = 5V, RL = 75Ω
3.0
RON (Ω)
OUTPUT SIGNAL (V)
4.0
1.5
Figure 8. On Resistance vs. VD (VS) with 5 V Supply
VDD = 5.5V, RL = 1MΩ
VDD = 5V, RL = 1MΩ
VDD = 5.5V, RL = 75Ω
VDD = 4.5V, RL = 1MΩ
4.5
1.0
VD (VS) (V)
Figure 5. Analog Signal Range (3 V Supply)
5.0
0.5
06029-033
0.5
06029-034
0
06029-030
0
0.5
VDD = 4.5V, RL = 75Ω
2.5
2.0
4
TA = –40°C
3
TA = +25°C
1.5
2
1.0
1
0.5
0
1
2
3
4
6
5
INPUT SIGNAL (V)
0
06029-031
0
TA = 25°C
1 CHANNEL
VDD = 3.0V
5
0.6
0.8
1.0
TA = +25°C
1 CHANNEL
VDD = 5V
4.0
VDD = 2.7V
1.2
1.4
TA = +85°C
TA = +25°C
3.5
4
TA = –40°C
3.0
RON (Ω)
VDD = 3.3V
3
2
2.5
2.0
1.5
1.0
1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
VD (VS) (V)
1.8
Figure 7. On Resistance vs. VD (VS) with 3 V Supply
0
0
0.5
1.0
1.5
2.0
2.5
3.0
VD (VS) (V)
Figure 10. On Resistance vs. VD (VS) for Various Temperatures
with 5 V Supply
Rev. 0 | Page 11 of 24
06029-035
0.5
0
06029-032
RON (Ω)
0.4
Figure 9. On Resistance vs. VD (VS) for Various Temperatures
with 3 V Supply
4.5
TA = 25°C
1 CHANNEL
0.2
VD (VS) (V)
Figure 6. Analog Signal Range (5 V Supply)
6
0
ADG792A/ADG792G
0
0
TA = 25°C
–20
VDD = 3V
CROSSTALK (dB)
–2
VDD = 5V
–3
–4
–40
SAME
MULTIPLEXER
–60
DIFFERENT
MULTIPLEXER
–80
1.0
1.5
2.0
2.5
3.0
3.5
SOURCE VOLTAGE (V)
–120
0.01
0.1
1
10
100
1000
100
1000
06029-050
0.5
06029-051
0
06029-054
–100
–5
1000
06029-036
CHARGE INJECTION (pC)
–1
–6
TA = 25°C
VDD = 3V/5V
FREQUENCY (MHz)
Figure 14. Crosstalk vs. Frequency
Figure 11. Charge Injection vs. Source Voltage
220
0
–2
210
–4
ATTENUATION (dB)
tON (3V)
tON/tOFF (ns)
200
tOFF (3V)
190
tON (5V)
180
tOFF (5V)
–6
–8
–10
–12
–14
–16
170
–18
–20
0
20
40
60
80
TEMPERATURE (°C)
TA = 25°C
VDD = 5V
–20
0.01
0.1
06029-052
160
–40
Figure 12. tON/tOFF vs. Temperature
0
10
Figure 15. Bandwidth
0
TA = 25°C
–10 1 CHANNEL
VDD = 3V/5V
–20 NO DECOUPLING CAPACITORS USED
TA = 25°C
VDD = 3V/5V
–20
–30
PSRR (dB)
–40
–60
–80
–40
–50
–60
–70
–80
–100
–90
–120
0.01
0.1
1
10
100
FREQUENCY (MHz)
1000
06029-053
OFF ISOLATION (dB)
1
FREQUENCY (MHz)
–100
0.0001
0.001
0.01
0.1
1
10
FREQUENCY (MHz)
Figure 16. PSRR vs. Frequency
Figure 13. Off Isolation vs. Frequency
Rev. 0 | Page 12 of 24
100
ADG792A/ADG792G
0.40
6
TA = 25°C
0.35
TA = 25°C
5
0.30
VDD = 5V
GPO VOLTAGE (V)
VDD = 5V
IDD (mA)
0.25
0.20
0.15
VDD = 3V
4
3
VDD = 3V
2
0.10
1.1
1.6
2.1
3.1
2.6
0
–20
fCLK FREQUENCY (MHz)
–18
–16
–14
–12
–10
–8
–6
–4
0
06029-039
0.6
06029-037
0
0.1
35
06029-040
1
0.05
–2
LOAD CURRENT (mA)
Figure 20. GPO VOH vs. Load Current
Figure 17. IDD vs. fCLK Frequency
2.5
1.4
TA = 25°C
TA = 25°C
1.2
VDD = 5V
VDD = 3V
2.0
VDD = 5V
GPO VOLTAGE (V)
1.0
IDD (mA)
0.8
0.6
0.4
1.5
1.0
VDD = 3V
0.2
0.5
0
0
0
1
2
3
4
6
5
I2C LOGIC INPUT VOLTAGE (V)
06029-038
–0.2
115
tPHL (3V)
tPLH (5V)
105
tPLH (3V)
100
95
–40
–20
0
20
40
60
80
TEMPERATURE (°C)
06029-019
PROPAGATION DELAY (ns)
120
tPHL (5V)
5
10
15
20
25
LOAD CURRENT (mA)
Figure 21. GPO VOL vs. Load Current
Figure 18. IDD vs.I2C Logic Input Voltage (SDA, SCL)
110
0
Figure 19. I2C to GPO Propagation Delay vs. Temperature
Rev. 0 | Page 13 of 24
30
ADG792A/ADG792G
TEST CIRCUITS
VDD
IDS
0.1µF
NETWORK
ANALYZER
V1
S
VS
D
50Ω
SA
50Ω
SB
VS
06029-003
RON = V1/IDS
50Ω
VOUT
D
50Ω
06029-008
GND
Figure 22. On Resistance
Figure 25. Bandwidth
VDD
0.1µF
A
S
D
ID (OFF)
NETWORK
ANALYZER
A
VS
VD
50Ω
S
06029-004
IS (OFF)
50Ω
50Ω
VS
50Ω
D
VOUT
50Ω
06029-009
GND
Figure 26. Off Isolation
Figure 23. Off Leakage
VDD
0.1µF
D
NETWORK
ANALYZER
ID (ON)
A
VD
NC = NO CONNECT
SX
50Ω
50Ω
VS
06029-005
SY
50Ω
VOUT
RL
50Ω
DY
DX
GND
Figure 24. On Leakage
50Ω
50Ω
Figure 27. Channel-to-Channel Crosstalk
Rev. 0 | Page 14 of 24
06029-010
NC
S
ADG792A/ADG792G
5V
CLOCK PULSES
CORRESPONDING
TO THE LDSW BITS
0.1µF
CLOCK PULSES
CORRESPONDING
TO THE LDSW BITS
VDD
VOUT
D
RL
50Ω
VS
SCL
CL
35pF
I2C
INTERFACE
SDA
50%
SCL
50%
90%
VOUT
tON
50%
90%
VGPO
10%
SCL
50%
10%
tOFF
tH
tL
GND
Figure 28. Switching Times
5V
CLOCK PULSE CORRESPONDING
TO THE LDSW BIT
0.1µF
VDD
SA
SB
RL
50Ω
CL
35pF
VOUT
80%
VS
I2C
INTERFACE
SCL
06029-007
SDA
tD
GND
Figure 29. Break-Before-Make Time Delay
5V
VDD
RS
S
SWITCH ON
D
VOUT
CL
1nF
VS
ΔVOUT
SWITCH OFF
GND
Figure 30. Charge Injection
Rev. 0 | Page 15 of 24
QINJ = CL × ΔVOUT
06029-011
VS
SCL
VOUT
D
06029-006
S
ADG792A/ADG792G
TERMINOLOGY
On Resistance (RON)
The series on-channel resistance measured between the
S and D pins.
Total Harmonic Distortion + Noise (THD + N)
The ratio of the harmonic amplitudes plus noise of a signal to
the fundamental.
On Resistance Match (ΔRON)
The channel-to-channel matching of on resistance when
channels are operated under identical conditions.
−3 dB Bandwidth
The frequency at which the output is attenuated by 3 dB.
On Resistance Flatness (RFLAT(ON))
The variation of on resistance over the specified range produced
by the specified analog input voltage change with a constant
load current.
Channel Off Leakage (IOFF)
The sum of leakage currents into or out of an off channel input.
Channel On Leakage (ION)
The current loss/gain through an on-channel resistance,
creating a voltage offset across the device.
Off Isolation
The measure of unwanted signal coupling through an off switch.
Crosstalk
The measure of an unwanted signal that is coupled through
from one channel to another as a result of parasitic capacitance.
Charge Injection
The measure of the glitch impulse transferred from the digital
input to the analog output during on/off switching.
Differential Gain Error
Input Leakage Current (IIN, IINL, IINH)
The current flowing into a digital input when a specified low
level or high level voltage is applied to that input.
Input/Output Off Capacitance (COFF)
The capacitance between an analog input and ground when the
switch channel is off.
Input/Output On Capacitance (CON)
The capacitance between the inputs or outputs and ground
when the switch channel is on.
The measure of how much color saturation shift occurs when
the luminance level changes. Both attenuation and amplification
can occur; therefore, the largest amplitude change between any
two levels is specified and expressed in %.
Differential Phase Error
The measure of how much hue shift occurs when the luminance
level changes. It can be a negative or positive value and is
expressed in degrees of subcarrier phase.
Input High Voltage (VINH)
The minimum input voltage for Logic 1.
Digital Input Capacitance (CIN)
The capacitance between a digital input and ground.
Input Low Voltage (VINL)
The maximum input voltage for Logic 0.
Output On Switching Time (tON)
The time required for the switch channel to close. The time is
measured from 50% of the falling edge of the LDSW bit to the
time the output reaches 90% of the final value.
Output High Voltage (VOH)
The minimum output voltage for Logic 1.
Output Off Switching Time (tOFF)
The time required for the switch to open. The time is measured
from 50% of the falling edge of the LDSW bit to the time the
output reaches 10% of the final value.
IDD
Positive supply current.
Output Low Voltage (VOL)
The maximum output voltage for Logic 0.
I2C to GPO Propagation Delay (tH, tl)
The time required for the logic value at the GPO pin to settle
after loading a GPO command. The time is measured from 50%
of the falling edge of the LDSW bit to the time the output
reaches 90% of the final value for high and 10% for low.
Rev. 0 | Page 16 of 24
ADG792A/ADG792G
THEORY OF OPERATION
The transitions on the SDA line must occur during the low
period of the clock signal, SCL, and remain stable during
the high period of SCL, because a low-to-high transition
when the clock signal is high can be interpreted as a stop
event which ends the communication between the master
and the addressed slave device.
The ADG792A/ADG792G are monolithic CMOS devices, each
comprising three 4:1 multiplexer/demultiplexers controllable
via a standard I2C serial interface. The CMOS process provides
ultralow power dissipation yet it delivers high switching speed
and low on resistance.
The on resistance profile is very flat over the full analog input
range and the wide bandwidth ensures excellent linearity and
low distortion. These features, combined with a wide input
signal range, make the ADG792A/ADG792G the ideal switching
solution for a wide range of TV applications.
4.
The switches conduct equally well in both directions when on.
In the off condition, signal levels up to the supplies are blocked.
The integrated serial I2C interface controls the operation of the
multiplexers and general-purpose logic pins.
The ADG792A/ADG792G have many attractive features, such
as the ability to individually control each multiplexer, the option
of reading back the status of any switch, and two general-purpose
logic output pins controllable through the I2C interface (available
with the ADG792G only). The following sections describe these
features in more detail.
I2C SERIAL INTERFACE
The ADG792A/ADG792G are controlled via an I2C-compatible
serial bus interface (refer to the I2C-Bus Specification available
from Philips Semiconductor) that allows the part to operate as
a slave device (no clock is generated by either the ADG792A or
the ADG792G). The communication protocol between the I2C
master and the device operates as follows:
1.
The master initiates data transfer by establishing a start
condition defined as a high to low transition on the SDA
line while SCL is high. This indicates that an address/data
stream follows. All slave devices connected to the bus
respond to the start condition and shift in the next eight
bits, consisting of a seven bit address (MSB first) plus an
R/W bit. This bit determines the direction of the data flow
during the communication between the master and the
addressed slave device.
2.
The slave device whose address corresponds to the
transmitted address responds by pulling the SDA line
low during the ninth clock pulse (this is termed the
acknowledge bit).
At this stage, all other devices on the bus remain idle while
the selected device waits for data to be written to, or read
from, its serial register. If the R/W bit is set high, the master
reads from the slave device. However, if the R/W bit is set
low, the master writes to the slave device.
3.
After transferring all data bytes, the master establishes a
stop condition, defined as a low to high transition on the
SDA line while SCL is high. In write mode, the master
pulls the SDA line high during the tenth clock pulse to
establish a stop condition. In read mode, the master issues
a no acknowledge for the ninth clock pulse (the SDA line
remains high). The master then brings the SDA line low
before the tenth clock pulse, and then high during the
tenth clock pulse to establish a stop condition.
I2C ADDRESS
The ADG792A/ADG792G has a seven-bit I2C address. The four
most significant bits are internally hardwired and the last three
bits (A0, A1, and A2) are user-adjustable. This allows the user
to connect up to eight ADG792A/ADG792Gs to the same bus.
The I2C bit map shows the configuration of the seven-bit
address.
Seven-Bit I2C Address Bit Configuration
MSB
1
0
1
0
A2
A1
LSB
A0
WRITE OPERATION
When writing to the ADG792A/ADG792G, the user must
begin with an address byte and R/W bit, after which time
the switch acknowledges that it is prepared to receive data
by pulling SDA low. Data is loaded into the device as a 16-bit
word under the control of a serial clock input, SCL. Figure 31
illustrates the entire write sequence for the ADG792A/ADG792G.
The first data byte (AX7 to AX0) controls the status of the
switches and the LDSW and RESETB bits from the second byte
control the operation mode of the device. Table 6 shows a list of
all commands supported by the ADG792A/ADG792G with the
corresponding byte that needs to be loaded during a write
operation.
To achieve the desired configuration, one or more commands
can be loaded into the device. Any combination of the commands
listed in Table 6 can be used with the following restrictions:
•
Only one switch from a given multiplexer can be on at any
given time.
•
When a sequence of successive commands affect the same
element (that is, the switch or GPO pin), only the last
command is executed.
Data transmits over the serial bus in sequences of nine clock
pulses (eight data bits followed by an acknowledge bit).
Rev. 0 | Page 17 of 24
ADG792A/ADG792G
SCL
START
CONDITION
BY MASTER
A1
A0
R/W
AX7
AX6 AX5 AX4 AX3 AX2 AX1 AX0
X
ADDRESS BYTE
ACKNOWLEDGE
BY SWITCH
ACKNOWLEDGE
BY SWITCH
X
X
X
X
X
RESETB
LDSW
ACKNOWLEDGE
BY SWITCH
Figure 31. Write Operation
Table 6. ADG792A/ADG792G Command List
AX7
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
X1
X1
X1
0
1
0
1
0
1
0
1
1
AX6
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
AX5
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
AX4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
AX3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
1
AX2
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
1
AX1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
1
0
0
0
0
1
1
AX0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
1
0
0
1
1
1
1
Addressed Switch/GPO Pin
S1A/D1, S2A/D2, S3A/D3 off
S1A/D1, S2A/D2, S3A/D3 on
S1B/D1,S2B/D2, S3B/D3 off
S1B/D1,S2B/D2, S3B/D3 on
S1C/D1, S2C/D2, S3C/D3 off
S1C/D1, S2C/D2, S3C/D3 on
S1D/D1, S2D/D2, S3D/D3 off
S1D/D1, S2D/D2, S3D/D3 on
S1A/D1 off
S1A/D1 on
S1B/D1 off
S1B/D1 on
S1C/D1 off
S1C/D1 on
S1D/D1 off
S1D/D1 on
S2A/D2 off
S2A/D2 on
S2B/D2 off
S2B/D2 on
S2C/D2 off
S2C/D2 on
S2D/D2 off
S2D/D2 on
S3A/D3 off
S3A/D3 on
S3B/D3 off
S3B/D3 on
S3C/D3 off
S3C/D3 on
S3D/D3 off
S3D/D3 on
Mux1 disabled (all switches connected to D1 are off)
Mux2 disabled (all switches connected to D2 are off)
Mux3 disabled (all switches connected to D3 are off)
Reserved for ADG792A/ GPO1 low for ADG792G
Reserved for ADG792A/ GPO1 high for ADG792G
Reserved for ADG792A/ GPO2 low for ADG792G
Reserved for ADG792A/ GPO2 high for ADG792G
Reserved for ADG792A/ GPO1, GPO2 low for ADG792G
Reserved for ADG792A/GPO1, GPO2 high for ADG792G
All muxes disabled (all switches are off)
Reserved
X = logic state does not matter.
Rev. 0 | Page 18 of 24
STOP
CONDITION
BY MASTER
06029-014
A2
SDA
ADG792A/ADG792G
operation of the multiplexers and GPO pins, this bit should be
set high. When RESETB = low, or after power-up, the switches
from all multiplexers are turned off (open) and the GPO pins
are set to low.
LDSW BIT
The LDSW bit allows the user to control the way the device
executes the commands loaded during the write operations.
The ADG792A/ADG792G execute all the commands loaded
between two successive write operations that have set the
LDSW bit high.
READ OPERATION
When reading data back from the ADG792A/ADG792G, the
user must begin with an address byte and R/W bit. The switch
then acknowledges that it is prepared to transmit data by pulling
SDA low. Following this acknowledgement, the ADG792A/
ADG792G transmit two bytes on the next clock edges. These
bytes contain the status of the switches, and each byte is followed
by an acknowledge bit. A logic high bit represents a switch in
the on (close) state, and a low represents a switch in the off
(open) state. For the GPO pin (ADG792G only), the bit represents the logic value of the pin. Figure 32 illustrates the entire
read sequence.
Setting the LDSW high for every write cycle ensures that the
device executes the command immediately after the LDSW bit
is loaded into the device. This setting is used when the desired
configuration can be achieved by sending a single command, or
when the switches and/or GPO pin are not required to be updated
at the same time. When the desired configuration requires
multiple commands with a simultaneous update, the LDSW bit
should be set low while loading the commands, except for the
last one when the LDSW bit should be set high. Once the last
command with LDSW = high is loaded, the device simultaneously
executes all commands received since the last update.
The bit maps accompanying Figure 32 show the relationship
between the elements of the ADG792A and ADG792G (that is,
the switches and GPO pins) and the bits that represent their
status after a completed read operation.
POWER ON/SOFTWARE RESET
The ADG792A/ADG792G have a software reset function
implemented by the RESETB bit from the second data byte
loaded into the device during a write operation. For normal
Bit Map ADG792A
RB15
S1A/D1
RB14
S1B/D1
RB13
S1C/D1
RB12
S1D/D1
RB11
S2A/D2
RB10
S2B/D2
RB9
S2C/D2
RB8
S2D/D2
RB7
S3A/D3
RB6
S3B/D3
RB5
S3C/D3
RB4
S3D/D3
RB3
RB2
RB1
RB0
RB12
S1D/D1
RB11
S2A/D2
RB10
S2B/D2
RB9
S2C/D2
RB8
S2D/D2
RB7
S3A/D3
RB6
S3B/D3
RB5
S3C/D3
RB4
S3D/D3
RB3
GPO1
RB2
GPO2
RB1
RB0
Bit Map ADG792G
RB15
S1A/D1
RB14
S1B/D1
RB13
S1C/D1
A2
SDA
START
CONDITION
BY MASTER
A1
A0
R/W
RB15 RB14 RB13 RB12 RB11 RB10 RB9
RB8
RB7
ADDRESS BYTE
ACKNOWLEDGE
BY SWITCH
ACKNOWLEDGE
BY SWITCH
Figure 32. Read Operation
Rev. 0 | Page 19 of 24
RB6
RB5
RB4
RB3
RB2
RB1
RB0
STOP
CONDITION
BY MASTER
ACKNOWLEDGE
BY SWITCH
06029-015
SCL
ADG792A/ADG792G
EVALUATION BOARD
The ADG792G evaluation kit allows designers to evaluate the
high performance of the devices with a minimum of effort.
The evaluation kit includes a printed circuit board populated
with the ADG792G. The evaluation board can be used to
evaluate the performance of both the ADG792A and
ADG792G. It interfaces to the USB port of a PC, or it can be
used as a standalone evaluation board.
Software is available with the evaluation board that allows the
user to easily program the ADG792G through the USB port. The
software runs on any PC that has Microsoft® Windows® 2000 or
Windows XP installed with a minimum screen resolution of
1200 × 768. See Figure 33 and Figure 34 for schematics of the
evaluation board.
USING THE ADG792G EVALUATION BOARD
The ADG792G evaluation kit is a test system designed to
simplify the evaluation of the device. Each input/output of the
part comes with a socket specifically chosen for easy audio/video
evaluation. An evaluation board data sheet is also available with
the evaluation board and provides full instructions for operating
the evaluation board.
Rev. 0 | Page 20 of 24
Rev. 0 | Page 21 of 24
C13
10µF
Figure 33. Eval-ADG792GEB Schematic, USB Controller Section
T4
J5
C3
0.1µF
A
B
AGND
C6
0.1µF
GND
7
5
8
AGND
AGND
C7
0.1µF
1
AGND
IN1
OUT1
2
OUT2
IN2
6
SD ERROR 3
GND NR
4
U5
C16
0.1µF
C8
0.1µF
C19
0.1µF
T26
AGND
C14
10µF
C20
0.1µF
C21
0.1µF
AGND
C15
0.1µF
33
34
35
36
37
38
39
40
4
3.3V
AGND
AGND
AGND
3.3V
D4
R11
1kΩ
3.3V
6
AGND
8
AGND
R1
2.2kΩ
SCL_EN
AGND
AGND
3
5
C17
22pF
2
U4
S
G
GND
IN2
D1
S2
D2
IN1
VDD
5
6
7
8
Q2
3.3V
S
G
Q1 D
3.3V
ADG821
S1
AGND
4
1
R2
2.2kΩ
4
C10
22pF
T28
R32
10kΩ
T27
XTAL1
24MHz
AGND
R31
10kΩ
U2
A0 VCC
7
A1
WP
6
A2 SCL
5
VSS SDA
24LC64
C22
0.1µF
15
16
18
19
20
21
22
23
24
25
45
46
47
48
49
50
51
52
29
30
31
1
2
3
4
AGND
3.3V
AGND
PB0/FD0
PB1/FD1
PB2/FD2
PB3/FD3
RESET
PB4/FD4
*WAKEUP
PB5/FD5
PB6/FD6
CLKOUT
PB7/FD7
U3
PD0/FD8
CY7C68013-CSP PD1/FD9
D–
PD2/FD10
PD3/FD11
D+
PD4/FD12
PA0/INT0
PD5/FD13
PA1/INT1
PD6/FD14
PA2/*SLOE
PD7/FD15
PA3/*WU2
CTL0/*FLAGA
PA4/FIFOADR0
CTL1/*FLAGB
PA5/FIFOADR1
PA6/*PKTEND CTL2/*FLAGC
PA7/*FLD/SLCS
SDA
RDY0/*SLRD
SCL
RDY1/*SLWR
IFCLK
XTALOUT
RSVD
XTALIN
R10
10kΩ
13
14
1
2
8
5
9
54
44
42
C23
2.2µF
R7
OR
C18
0.1µF
* DENOTES
PROGRAMMABLE
POLARITY.
AGND
C9
0.1µF
R6
75Ω
3.3V
3
AGND
AGND
C4
10µF
R5
75Ω
3.3V
2
1
ADP3303-3.3
C5
0.1µF
3.3V
D+
AGND
IO
D–
VBUS
J1
USB-MINI-B
T1
SHIELD
AGND
J2-2
AGND
VDD
AGND
J2-1
3
7
11
17
27
32
43
55
AVCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
GND
GND
GND
GND
GND
GND
GND
10
12
26
28
41
53
56
3.3V
SCL_EN
C2
0.1µF
D
R12
2.2kΩ
AGND
R9
2.2kΩ
SCL
SDA
VDD
06029-041
3.3V
ADG792A/ADG792G
GPO2
PHONO_DUAL
GND
2
BOTTOM
3
CASE
TOP
5
CASE
4
1
K6
PHONO_DUAL
K5
GND
2
BOTTOM
4
3
CASE
TOP
5
CASE
1
PHONO_DUAL
GND
2
BOTTOM
3
CASE
TOP
5
CASE
4
1
K4
R24
R23
R22
R21
R20
R19
1
K7
T16 T17
T15
T14
T13
T12
R25
T11
GND
2
BOTTOM
3
CASE
TOP
CASE
PHONO_DUAL
T10
4
5
Rev. 0 | Page 22 of 24
Figure 34. Eval-ADG792GEB Schematic, Chip Section
R13
PHONO_DUAL
5
CASE
3
TOP
4
CASE
BOTTOM
1
GND
R26
2
T18
K8
R27
T19
12
11
10
9
8
7
T20
25
PADDLE
ADG792G
13
14
15
16
17
18
K3
R14
R15
T22 T23
6
5
4
3
2
1
R29
PHONO_DUAL
5
CASE
3
TOP
4
CASE
BOTTOM
1
GND
2
R36
0Ω
19
20
21
22
23
24
T21
U1
R34
0Ω
K2
R16
R35
0Ω
R17
A
GPO1
CASE
A
CASE
R28
K9
GND
2
BOTTOM
3
CASE
TOP
T3
GND
2
BOTTOM
3
CASE
TOP
T2
1
4
5
PHONO_DUAL
1
4
5
PHONO_DUAL
R30
PHONO_DUAL
5
CASE
3
TOP
4
CASE
BOTTOM
1
GND
T24
2
T7
K1
T8
T25
R18
T9
R3
10kΩ
J3
R4
10kΩ
J7
J6-2
GPO2
T5
J6-1
J8
GPO1
R8
10kΩ
T6
J4-1
J4-3
SCL
SDA
SCL
C1
0.1µF
SDA
J6-3
J4-2
SCL
SDA
VDD
06029-042
ADG792A/ADG792G
ADG792A/ADG792G
OUTLINE DIMENSIONS
0.60 MAX
4.00
BSC SQ
PIN 1
INDICATOR
0.60 MAX
TOP
VIEW
0.50
BSC
3.75
BSC SQ
0.50
0.40
0.30
1.00
0.85
0.80
12° MAX
SEATING
PLANE
0.80 MAX
0.65 TYP
0.30
0.23
0.18
PIN 1
INDICATOR
19
18
24 1
*2.45
2.30 SQ
2.15
EXPOSED
PAD
(BOTTOMVIEW)
13
12
7
6
0.23 MIN
2.50 REF
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
*COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 35. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADG792ABCPZ-REEL 1
ADG792ABCPZ-500RL71
ADG792ACCPZ-REEL1
ADG792ACCPZ-500RL71
ADG792GBCPZ-REEL1
ADG792GBCPZ-500RL71
ADG792GCCPZ-REEL1
ADG792GCCPZ-500RL71
EVAL-ADG792GEB 2
1
2
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
I2C Speed
100 kHz, 400 kHz
100 kHz, 400 kHz
100 kHz, 400 kHz, 3.4MHz
100 kHz, 400 kHz, 3.4MHz
100 kHz, 400 kHz
100 kHz, 400 kHz
100 kHz, 400 kHz, 3.4MHz
100 kHz, 400 kHz, 3.4MHz
Z = Pb-free part.
The evaluation board is RoHS compliant.
Rev. 0 | Page 23 of 24
Package Description
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
Evaluation Board
Package Option
CP-24-2
CP-24-2
CP-24-2
CP-24-2
CP-24-2
CP-24-2
CP-24-2
CP-24-2
ADG792A/ADG792G
NOTES
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips
I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06029-0-7/06(0)
Rev. 0 | Page 24 of 24