A review of the tunable microinductors Dong-Ming Fang1,Hai-Xia Zhang1, Norman C. Tien2 1 National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China 2 Department of Electrical and Computer Engineering, Case Western Reserve University, Cleveland, OH 44106, USA Abstract: Radio frequency (RF) tunable inductors have a major role in current situation where compact designs with high performance are demanded. The capability of the tunable inductors, to tune the inductance with high or proper quality factor (Q-factor), has been a good advantage in the tunable systems to the designers rather than to use the tunable capacitor which exhibit poor reliability and require large die area. Tunable inductor could be a candidate to save die area and a solution for designs of the tunable systems with large tuning range for portable communication systems in the future. Therefore, a review of the tunable inductors from a device perspective is provided. Based on their tuning mechanism, the tunable inductors can be classified into four categories: discrete tuned, metal shielding tuned, magnetic core tuned and coil-coupled tuned. This paper summarizes the major contributions to the tunable inductors and discusses the advantages and disadvantages of these contributions. Some considerations and results on fabrication, operation, comparison and application of the tunable inductors are presented. Keywords: tunable inductor, tuning ratio, tuning range, inductance, quality factor, MEMS 1. Introduction Radio frequency microelectromechanical system (RF MEMS) is a technology that enables the batch fabrication of miniature mechanical structures, devices, and systems for microwave and wireless communication applications.There are four basic RF MEMS components have been reported so far: (i) the switch; (ii) the (tunable) capacitor; (iii) the (tunable) inductor and (iv) the antenna. These four components can be used to realize high performance and digitally-controlled components (e.g. RCL lumped-elements), circuits (e.g. attenuators, phase shifters, impedance tuners, filters, oscillators) and subsystems (e.g. T/R modules and antenna arrays). By far, the most common actuation mechanism is electrostatic, followed by piezoelectric, magnetic and electrothermal. RF tunable capacitors and inductors can be used to form tunable filters, low-noise voltage-controlled oscillators (VCOs), self-adjusting matching networks or power amplifiers. In general, the tunable capacitors have better tuning range and quality factor(Q-factor) than tunable inductors, however, the tunability of the tunable inductors provides additional functionality, design flexibility and robustness, which make the tunable inductors promising applications in the field of portable communication systems The tunable inductors can be divided into four categories: discrete tuned (DT), metal shielding tuned (MST), magnetic core tuned (MCT) and coil-coupled tuned (CCT). The discrete tuned inductor often uses microswitches [1-4] or microrelays [5, 6] to increase or decrease the effective coil length of the inductor, but the combination of the microswitches or micorelays will reduce the Q-factor of the inductor. The metal shielding tuned inductor is realized using moveable metal structure with large range, resulting in the magnetic flux of the inductor changed [7].The magnetic core tuned inductor is realized using solenoid inductor imbedded with magnetic-core conductor whose permeability can be changed when applying Corresponding author. Tel: +86 10 62752536-17, Fax: +86 10 62751789, E-mail: zhanghx@ime.pku.edu.cn magnetic filed [8, 9]. The coil-coupled tuned inductor mainly adjusts its mutual inductance between the primary coil and the secondary coil of the inductor [10-12]. Key features, measured performance characteristics and various applications based on their performance of the reported tunable inductors are summarized (and referenced) in table 1. Tuning types and configurations vary widely. Tunable inductors with discrete tuned, metal shielding tuned, magnetic core tuned and coil-coupled tuned have been reported are discussed further below. Table 1 Tunable microinductors. Author and year Zhou [13],1999 Tuning Tuning ratio@ Q-factor@ Fabrication Other type Frequency(GHz) Frequency(GHz) process information DT 129.2 1.7@0.5 SBM area Applications n/r 3150μm×930μm 3.3@1.6 , DV: 20V. Park [1],2004 DT 2.87@2.4 4.8@1.5 CMOS area n/r 206μm×217μm driven voltage 1.8V Balachandran[4],2004 DT 1.64@25 n/a MEMS DV:25-35V n/r Mina[14], 2007 DT 1.66@5 45@5 post-CMOS- DV:40V n/r area n/r compatiable Zekry [15],2007 DT 1.63@1.2 18.5@1.2 MEMS 620μm×620μm Okada [17],2006 Sugawara[19],2004 Ito [20],2005 Vroubel [22],2004 MST MST MST MCT A:2.13@1.8 A:33@1.8 B:2.11@2 B:50.1@2 1.53@2.45 4.4@3.5 1.8@2.02 6.66@0.1 About 3@2.202 Less than 2@? MEMS area about VCO:TR 146.5% 460μm×460μm 0.35μm area about CMOS 400μm×400μm 0.18μm area about CMOS 400μm×400μm n/r FM core area 1.54@1 about 1.25@2 200μm×50μm VCO:TR 123.7% VCO:TR 72% n/r Salvia [8],2005 MCT 1.17@5 5~10@over 5 BiCMOS n/a n/r Sarkar[25],2005 MCT 1.24@1~5 34@2.2 n/r n/a n/r 1.47@7.5 30@7.5 1.22@15GHz About MUMPS n/a n/r Lubecke [26],2001 CCT 13@2GHz Zine-El-Abidine[27], CCT 1.13@2~5 n/a MUMPS n/a n/r CCT 1.43@over 2 25@10 SBM SRF:35GHz n/r CCT 2.1@ n/a 5@3 MetalMUMPs n/a n/r 2003 Zine-El-Abidine[11,12], 2005 Zine-El-Abidine[28], 2007 Fukushige [29],2003 CCT 1.03@2 Less than MEMS n/a n/r 2@0.05~16 Chang[32],2006 CCT 1.46@0.5~5 15@3.5 MEMS DV:0~2V n/r Dell [33],2002 CCT 3.33@0.001 n/a BM n/a n/r Sugawara [16],2004 MST 2.11@2 50.1@2 MEMS n/a VCO:TR 146.5% YANG [38],2006 CCT n/a n/a 0.18μm n/a VCO: TR 106.5% CMOS Worapishet [39],2002 CCT n/a n/a BiCMOS n/a Filter: TR 171.4% Lin [3],2005 DT 1.56@5.5 12@3.5 CMOS n/a LNA: TR 174.2% Sugawara [41],2005 MST 1.4@2 3.5@2 0.18μm n/a LAN: CMOS Tassetti[42],2004 CCT 2@1~5 n/a MEMS TR 188.2% n/a phase shifter: 25° at 5GHz and 48°at 8GHz n/a: not applicable; n/r: not reported; SBM: surface and bulk micromachining; SRF: self-resonance frequency; DV: driven voltage; TR: tuning range 2. Discrete tuned inductor The electrical model of the discrete tuned inductor is usually described as shown in Fig.1. When the switches at port two are open, the inductance is L1. When the switches at port two are closed, the length of the coils at port two will be changed and the different mutual inductance will affect the effective inductance Leq. Leq can have n2 discrete values depending on which coil at port two is switched on. The effective inductance Leq and the effective resistance Req can be written as n Leq L1 (1 i 2 n kn2 L2n 2 ) Rn2 L2n 2 n kn2 Rn L1Ln 2 Req R1 Rn2 L2n 2 i 2 (1) n (2) where Ln is the inductance of the coil at port two, kn is the coupling coefficient, Rn is the series resistance of the coil at port two and the contact resistance of the corresponding switch, δn is 1 when the switch is at the „on‟ status and 0 when it is at the „off‟ status. To achieve high Q-factor, Rn must be much smaller than the reactance of the coil (Ln•ω ). Fig.1 Electrical model of the discrete tunable inductor. Zhou [13] fabricated a tunable inductor, as shown in Fig.2, with digitally controlled microrelays by using combined surface and bulk micromachining technology. The microrelays used TaSi2/SiO2 layers as the bimorph cantilever beam, aluminum as sacrificial layer. The combined thermal and electrostatic mechanism made the possibility of the gold-to-gold contacting. In order to reduce the losses of the parasitic oxide capacitances and the eddy current loss in the substrate, the silicon substrate under the inductor was etched. By using the planar spiral coil and four microrelays, the inductances of the tunable inductor varied from 2.5nH to 324.8nH to obtain sixteen different inductance values. The self-resonant frequencies were 1.9 GHz and 4.6 GHz, while the quality factor (Q-factor) was 1.7 (f = 530 MHz) and 3.3 (f =1.6 GHz), respectively. The lowest thermal power was 8mW and the electrostatic driven voltage was 20V. Because of the limitation of the mechanical self-resonance, the highest operation frequency of the microrelays was 10 kHz, which leaded the tunable inductor to be used in the portable mobile communication systems in the range from 0.5GHz to 1.6GHz. Moreover, the whole device was 3150μm×930μm which is relatively larger compared to other tunable inductors. Because the fabrication process combined surface and bulk micromachining technology, seven masks was used, resulting in the complexity and incompatibility with IC technology. Park [1] fabricated the stacked spiral inductor using standard CMOS process and the inductor was connected with MOSFET switch. When the status of the switch varied, the inductance of the inductor changed. The measured results showed that the inductances changed form 8nH to 23nH at the frequency of 2.4GHz. The resonance frequency of the proposed inductor decreased from 3.9 to 3.6 GHz for the three-stacked inductor and from 6.8 to 6.4 GHz for the two-stacked inductor. The stacked inductor had a comparable Q-factor 4.8 at the frequency about 1.5 GHz. Compared to the traditional single-layer inductors, because the structure of the inductor was stacked, fifty percent of the chip area was saved. However, because of multi switches, which induced parasitic capacitances, resulting in the decrease of the self-resonant frequency and thirty percent of the Q-factor. Balachandran et al. fabricated MEMS tunable inductors using DC-contact switches [4]. In their fabrication process, PMMA was used as sacrificial layer and resistive SiCr was used to provide DC-bias. Experimental results show that the inductance value can varies from 0.34nH to 0.56nH at 25GHz, that is, the inductance ratio is of 1.64. However, the measured insertion loss for the switch-actuated state had a difference of 0.3dB. In 2007, Mina fabricated a novel switch controlled tunable inductor [14]. The switched tunable inductor was fabricated by using a post-CMOS-compatiable process. In order to decrease the loss of the Si substrate, the backside of the substrate was selectively etched under the device. As shown in Fig.3, four discrete inductance values were obtained by using the contacts of the switch to contact/leave the primary and the secondary coils of the inductor. The actuation voltage of the switch was 40V. When the switch was off, the inductance was 1.01nH. Through the switch, the maximum tuning range of the tunable inductor was 40% at 5GHz and the corresponding Q-factor was 45. The authors pointed out that the Q-factor of the inductor didn‟t decrease obviously after package. The key point of the structure was the switch. The switch used silver as the cantilever, driven by electrostatic force, to realize the status of on and off. The authors said that compared to other metal materials, silver has good electro and mechanical properties. For example, after electroplated, silver film has high conductivity, low Young‟s module and small mechanical stress. Zekry [15] fabricated a 2-bit digitally tunable inductor on a standard CMOS substrate by using surface micromachined relays which were electrostatically actuated. The mechanism of tuning was to use several microrelays to contact/leave the coil of the inductor, thus to change the effective magnetic area of the inductor and the inductance values. Because there was an oxide insulated layer between the substrate and planar spiral inductor and used a thick copper layer as the spiral inductor and interconnects, for the 4.5-turns spiral inductor with 4-switching microrelays, the maximum Q-factor was about 18.5 at 1.2GHz and the inductance values varied from 2.29nH to 3.73nH resulting in 38.6% tuning range. Fig.2 The unable inductor with digitally controlled microrelays [13]. By using the planar spiral coil and four microrelays, switch sixteen different inductance values can be obtained. Fig.3 A novel switch controlled tunable inductor [14]. Four discrete inductance values were obtained by using the contacts of the to contact/leave the primary and the secondary coils of the inductor. 3. Metal shielding tuned inductor The metal shielding tuned inductor is tuned using a movable metal plate to shield the magnetic flux and change the inductance of the inductor. Fig.4 is the schematic structure of the metal shielding tuned inductor [16]. The inductance is changed using a moving metal plate, which is moved by a MEMS actuator. The simplified equivalent circuit model [17] for the metal shielding tuned inductor is shown in Fig.5.Ls and Rs are the series inductance and resistance of the spiral inductor. Lmet and Rmet represent the equivalent inductance and resistance of the shielding metal plate. Lsub and Rsub indicate the equivalent inductance and resistance of the substrate. Mmet is the mutual inductance between the spiral metal and the shielding metal plate. Msub is the mutual inductance between the spiral metal and the substrate. Yammouch et al. improved the physical model by supplying two-port π equivalent circuit [18]. Fig.4 Schematic structure of the metal Fig.5 Simplified equivalent circuit model for shielding tuned inductor [16]. the metal shielding tuned inductor [17]. Okada presented an on-chip high Q-factor tunable inductor embedded in wafer-level chip-scale package (WL-CSP) [17]. The authors used a metal plate moved by a micromanipulator instead of MEMS actuator (see Fig.6) because they thought that the MEMS actuator has not been implemented up to date. The inductance values of the tunable inductor can be varied according to the insertion with/without of the metal plate or the distance between the spiral inductor and the metal plate. The width and the height of the metal plate were 600μm and 300μm, respectively. They proposed two groups of tunable inductors. The resistivity of the substrate for Group A was 2~6Ωcm, while Group B was 1kΩcm.The measured inductance tuning range of Group A and Group B were 53.4% and52.6%. The maximum Q-factor of Group A was 33 at 1.8GHz while Group B of 50.1 at 2GHz. Though the parasitic capacitance may be appeared between the spiral inductor and the metal plate, the effect of the parasitic capacitance on the self-resonance frequency (SRF)was expected to be small in that structure because the inductance varied faster than the parasitic capacitance. Fig.6 Photograph of the metal shielding tuned inductor [17]. The metal plate was moved by a micromanipulator instead of MEMS actuator. Sugawara et al. fabricated a novel tunable inductor on Si CMOS chip [19]. The symmetrical spiral inductor was fabricated by using AMS 0.35μm CMOS process (three metal layers). They used a metal (copper) plate which could be moved by a MEMS actuator. When the movable metal plate shielded the magnetic flux, the inductance value of the inductor varied continuously. At 2.45GHz, the inductance value varied from 5.81nH to 3.80nH, that is, the tuning ratio is about 1.35. The maximum Q-factor was about 4.4 at 3.5GHz. When this tunable inductor was applied to a VCO, the tuning range of the VCO was extended into 123.7%.After a year, the authors‟ group used the similar tunable inductors and some switched capacitors to form a novel wide-range tunable VCO (0.18μm CMOS process)[20]. The tuning ratio of the tunable inductor was 1.8 at 2.02GHz and the corresponding Q-factor was about 3. The oscillation frequency could be changed by three switches. The VCO could be tuned from 1.28GHz to 2.75GHz with the tuning range of 72%. The best performance of the phase noise was at 1.28GHz, from about -80dBc/Hz to -160dBc/Hz with the increasing offset frequency from 10 kHz to 10MHz. 4. Magnetic core tuned inductor Magnetic core tuned inductor is tuned based on the magneto impedance effect [21]. As the bias dc magnetic field is applied along to the axis of the inductor body, the transverse permeability of the soft magnetic layer can be changed to achieve the tunability of the inductance. In order to design tunable microinductors for microwave communication systems, such as the frequency range over 1 GHz, most magnetic materials become non-magnetic, with relative permeabilityμ r=1. These materials are unsuitable for high frequency applications. Vroubel [22] firstly fabricated tunable integrated RF inductor with magnetic ore. The tuning effect of such magnetic RF inductor was achieved by the superposition of a dc current onto the primary solenoid winding of a thin-film ferromagnetic (FM) core. The thin NiFe film ferromagnetic core was implanted in the solenoid inductor as shown in Fig.7. By applying different current through the FM core, the effective permeability of the FM core was changed. In the range of inductance from 1nH to 150nH, the variation range of the inductance was 85%, 35% and 20% at 0.1, 1 and 2 GHz, respectively. Although an 85% tuning range was demonstrated at 100 MHz, the Q-factor was limited and the magnitude of the dc current must be as high as 100mA to achieve this. The Q-factors of all the inductors were less than 2. When the DC was 100mA, the power was 0.015~0.3W. The authors thought the reason was because of high conductivity of the FM core and the improper design of the magnetic core coil. They also pointed out that when the conductivity of the FM core was less than 105S/m [23], the simulated permeability was more than 50 and the Q-factor of the tunable inductor would be over 15. However, applying dc control current and RF current in the same inductance device may not be favorable in some applications as the noise from the dc control current may feed into the working current path. When the applied magnetic filed is parallel to the easy magnetizing axis of the NiFe permalloy, the permeability of NiFe permalloy will be changed [24]. Salvia [8] used this effect to fabricate on-chip tunable inductor (see Fig.8) with Ni80Fe20 laminations with BiCMOS process. In the fabrication process, a conformal NiFe deposition followed by a photoresist lift-off results in a permalloy film that wraped around three sides of the conductors. This design simplified the fabrication in comparison to using the high-μ material as the inductor core.The permalloy laminations can decrease the RF eddy current loss and ferromagnetic resonance (FMR) loss. The measured results showed that the tuning range of the tunable inductor was 15% and the Q-factor was between 5 and 11 over 5GHz. Sarkar et al. [25] also fabricated the tunable inductors by using magnetic core of NiFe. In their work, the solenoid inductor and NiFe core are fabricated using high aspect-ratio SU8 molding and electroplating on a Pyrex substrate serves as the assembly incorporating signal routing. At high frequency, from 1 to 5GHz, the inductance varied from 5.5to 6.8nH, i.e., tuning ratio about 1.24. As frequency increased more than 5GHz, the insertion of the magnetic core enhanced the inductance, tuning ratio achieved 1.47 at 7.5GHz and Q-factor was 30. The maximum Q-factor was 34 at 2.2GHz. Fig.7 Schematic of a biased solenoid tunable inductor with magnetic core [22]. The magnetization is mainly oriented along the easy axis of the FM film. Fig.8 The photo of the tunable inductor with patterned permalloy laminations [8]. 5. Coil-coupled tuned inductor Coil-coupled tuned inductor is designed by controlling the magnetic coupling coefficient between the two layers or two coils/loop of micoinductors. Fig.9 is the equivalent circuit model of the coupled tuned inductors, where M is the mutual inductance between the two windings or coils/loop, k is the coupling coefficient, Ls1 and Ls2 are the series inductances of the two coils, respectively. M k Ls1 Ls 2 (3) Fig.9 Transformer micro inductor/loop Fig.10 Tunable self-assembling inductor equivalent circuit model. by means of an interlayer stress [26]. Lubecke [26] fabricated self assembling barrette-type tunable inductor (Fig.10) using multi-user microelectromechanical process (MUMPS) . The inductor assembled by means of an interlayer stress that causes portions of the inductor to bend away from the substrate in a controllable manner and obtained high Q-factor and self-resonance frequency (SRF). The measured Q-factor was above 13, SRF was greater than 15GHz and the tuning range is over 18%. When the fabrication process was optimized, the simulated results showed that the performance of the tunable inductor would be improved as the Q-factor was over 20 and the tuning range was greater than 30%. Zine-El-Abidine et al. fabricated the tunable inductors using the MUMPS process [27]. The tunable inductor was formed of inner and outer inductors, a beam and the arrays of thermal actuators. When the array was actuated, the beam buckled and lifted up the outer inductor. This status called “ON” state, corresponding to the minimum inductance value. The measured minimum and maximum inductance of the tunable inductor were 1.045nH and 1.185nH, respectively, that is, the tuning ratio was 1.13. Zine-El-Abidine [11, 12] also fabricated the tunable inductor using surface micromachining combined with bulk micromachining. When the thermal bimorph were actuated, the outer coil (loop) would be moved from the inner coil, thus the mutual inductance of the inductor was changed to realize the tuning. The authors fabricated three types of tunable inductors with the pitch, between the outer coil and the inner coil, of 11, 21,31μm. Fig.11 is the tunable inductor with the pitch of 21μm. Its tuning range could reach 30% over 2GHz, while the maximum Q-factor was 25 at 10GHz and SRF was 35GHz. Two years later, the authors fabricated another tunable inductor using the commercial process MetalMUMPs (multi-user microelectromechanical process) [28]. As shown in Fig.12, the inductor was formed by two pre-bent beams. One beam end was anchored and the other beam end was attached to an array of thermal flexure actuators. To reduce the required force for buckling, the beams were designed such that they are curved at the rest state. In order to increase the Q-factor of the inductor, the silicon underneath the inductor coil was selectively etched. The tuning ratio of the inductor was 2.1:1, that is, the tuning range of the tunable inductor was 52.4%. The maximum Q0factor was 5 at about 3GHz. Fig.11 Tunable inductor using thermal Fig.12 Tunable inductor was formed by two bimorph .When the thermal bimorph pre-bent beams. One beam end was anchored were actuated, the outer coil (loop) would and the other beam end was attached to an be moved from the inner coil [12]. array of thermal flexure actuators [28]. Fukushige [29] fabricated a new type of tunable inductor using MEMS technology. The inductor was formed of spiral conical coil (see Fig.13). The height of the coil could be changed from zero to several hundred micrometers. When the height of the coil was changed, the mutual inductance of the inductor varied. The inductance value could be a few nano Henries. The inductor coil was adopted a new MEMS material, Pd-based thin film metallic glass (TFMG) [30, 31]. The measured and simulated results showed that the tunable inductor could be worked from 50MHz to 16GHz. At 2 GHz, the inductance values varied from 3.64nH to 3.75nH which means that the tuning range of the inductor is 3%. However, because the thin film metallic glass was used, the Q-factor of the tunable inductor was less than two. The authors thought the low Q-factor dued to the high resistivity of the TFMG (62μΩcm). Chang [32] fabricated the RF MEMS tunable inductor (see Fig.14) using the bimorph effect of an amorphous silicon and aluminum structural layer. When there was no applied voltage, the vertical height of the inductor was 450μm, the maximum Q-factor was 15 at 3.5GHz and SRF was 7GHz. While 2V was applied to the inductor, the inductance values varied from 5.6nH to 8.2nH which means the tuning range of the inductor was 31.7%. Fig.13 The unable inductor, formed of spiral conical coil, could be changed from zero to several hundred micrometers. In this photo , the height of the coil is 200μm [29]. Fig.14 The fabricated inductor viewed at 75ºtilt. The height of the outer turns can reach the emaximum value of 450μm [32]. Dell et al. [33] used silicon bulk micromachining technology to fabricate tunable spiral inductors with the application of low DC bias voltages. With the bias voltages, the movement of the spiral changed the geometrical structure of the inductor, resulting in a change of the inductance value. However, if the spiral structure with suspended state was wanted, the intrinsic stress in the spiral material should be tensile. Silicon nitride via PECVD (plasma enhanced chemical vapor deposition) to form the spiral support material. The measured inductance values varied from 30 to 100nH at 1MHz. It was found that the inductance decreased as the bias voltage increased. The inductance values of the tunable inductor at high frequencies were not mentioned in their work. Hsu et al. presented a double layer spiral coils and studied their coupling effect [34]. Compared to the initial inductance, the mutual inductance between the double coils decreased 33.5%. 6. Applications Tunable inductors are widely used in wireless communication systems, such as voltage-controlled oscillators (VCOs) [16, 20, 35-38], tunable filters [39, 40], tunable low-noise amplifier (LNA) [3, 41], phase shifters [42], RF front-end [43], wireless sensor[44], especially when a wide frequency tuning is desired. Tunable inductors would further benefit wireless communication circuits where impedance matching and frequency tuning would increase the flexibility and reliability of the system. Sugawara [16] presented a tunable inductor using redistributed layers. A metal plate was used to shield the magnetic flux of the inductor. The metal plate was moved by a MEMS actuator. The inductance varied from 4.80nH to 2.27nH, that is, the tuning ratio was about 2.11. The maximum value of Q-factor was 50.1at 2GHz.When the tunable inductor was applied to a VCO, the oscillation frequency range of the VCO achieved 146.5%.YANG [38] presented tunable inductance LC-tank VCOs implemented in 0.18μm CMOS technology. Two prototype LC-VCOs utilized the tunable inductors to extend the operating frequencies at 2.85~3.12 GHz and 6.59~7.02 GHz, respectively. The 3GHz VCO using a symmetry transformer provided the tuning range of 2.85 to 3.12 GHz at 1V supply. The power consumption was 4.8mW while the measured phase noise was -126 dBc/Hz at 1MHz. A small-area stacked transformer was employed in the 7GHz VCO, which achieved a tuning range of 6.59 to 7.02 GHz and measured phase noise of -114 dBc/Hz at 1MHz , consuming 9mW from a 1.2V supply. Worapishet [39] proposed an LC bandpass filter using an improved magnetically-coupled tunable inductor, which was formed of two mutual coils. The best evaluated inductance of the tunable inductor was 8nH with the mutual coupling coefficient, k=0.6. The simulated response at the maximum Q value of ten of the LC bandpass filter could varied from 0.7GHz to 1.2GHz, more than 50% frequency tuning. Moreover, the supplied voltage for the filter was 2V and the consumption of the filter was less than 9mW of power. Georgescu [40] fabricated the tunable coupled inductor using 0.18μm CMOS process with a low-resistivity expitaxial substrate. The tunable inductor was used to form the LC tank in the design of a filter.When the inductance value was 2nH, the simulated insertion loss in the passband was nearly 0dB.The noise figure and the input third-order intercepting point (IIP3) were 23dB and -15dBm, respectively. Lin et al. [3] used the variable planar spiral inductors with MOSFET switch to optimize the CMOS wideband low-noise amplifiers (LNAs) and to implement low-phase noise VCOs. When the maximum inductance of the variable inductor was 0.58 nH, a improvement of 74.2% (from 3.1 GHz to 5.4 GHz) in bandwidth of the CMOS wideband LNA were achieved. The measured noise figures were2.2 dB at 1 GHz and 4.0 dB at 6 GHz. The measured input third-order intercepting point (IIP3) was -3 dBm at 3 GHz. Sugawara [41] proposed a novel wide-tunable LNA using on-chip tunable inductor with 0.18μm CMOS process. The tunable iuductor was realized using metal to shield the spiral inductor. The minimum and maximum inductance values were 1.5 and 2.1nH, i.e., tuning ratio of 1.4. At the frequency of 1.9 GHz, the power gain (PG) of the LAN was 13.5 dB, the noise figure (NF) was 7.1 dB, and the IIP3 was -1.9 dBm. The LNA achieved PG of 14 dB and over 10 dB from 1.7 GHz to 3.2 GHz. The NF was not degraded by the shielding metal plate. This tunable LNA is quite useful for multi-band RF communication system. Fig.15 Photo of the tunable filter Fig.16 Photo of the LNA with size of 650μm×650μm [40]. with size of 0.97mm×1.28mm [41]. Tassetti et al. designed and fabricated the tunable inductors [42]. They used two different wafers, SOI wafer and glass wafer. SOI wafer was for mechanical parts while the glass wafer was to build the microinductor, pads and electrodes. The inductance values were changed by controlling magnetic coupling coefficient between the two different coils. The primary coil was stationary and the secondary coil was patterned on a movable cantilever, which will bend when there was electrostatic pressure produced by an electrostatic actuator. An anodic bonding step was used to align the inductors and the electrodes. Thus, the electrodes were used to provide an electrostatic actuation to change the gap between the two inductors. A high actuation voltage of 150 V was used. The measured results showed that the first prototypes present 50% inductance variation and the second prototype variation ratio was expected to reach at least 4 over 1 to 10 GHz. Although the tuning range was close to 50%, the Q-factor was unacceptably low due to strong interactions with silicon. The authors used the tunable inductors and tunable capacitors to design and realize some tunable radio frequency basic functions, such as tunable impedance (Fig.17) and tunable phase shifter (Fig.18). The simulated phase shift was of 25°at 5GHz and 48° at 8GHz. Fig.17 SEM photo of the tunable impedance Fig.18 SEM photo of the phase shifter [42]. It was a series association of one tunable based on the simple π high –pass cell [42]. inductor and one basic metal-air-metal (MAM) It was composed of two parallel tunable tunable capacitor. Either a capacitive behavior inductors and one metal-insulator-metal or an inductive behavior was depended on (MIM) constant value capacitor. the applied actuation voltages. Sridhar et al. [44] developed new micromachined tunable inductors with folded flex-circuit structures and apply it into a hydrogel-based wireless sensor (Fig.17) for biomedical applications. The tunable inductor was formed of two parallel spiral coils with 5~10mm size, which were connected and aligned to each other with air gap. The mutual inductance is positive when the current flow in the two parallel conductors is in the same direction, while it is negative when the current flow is in opposite direction. The response to the displacement of the coils of the tunable inductor was 0.40nH/m. The authors though they should extend their efforts to adopt appropriate response or other materials to form the simple fold-and-sandwich construction of the tunable inductor. 7. Conclusions A review of the tunable inductors, from the perspective of their tuning way (e.g. discrete tuned, metal shielding tuned, magnetic core tuned and coil-coupled tuned) to their applications for microwave communication systems (e.g. VCOs, filters, phase shifters) is presented. The intent of this review paper is to provide perspectives to newcomers in the field, and empower potential end-users with an overall device picture, current status, and a vision of their ultimate performance capabilities. The difficulty for the device designers is to increase the tuning ratio of the tunable inductors and reduce their inherently losses due to ohmic losses in the metal traces and due to substrate resistance and eddy currents. The more efforts toward increasing the Q-factor at microwave and millimeterwave frequencies for tunable inductors fabricated by standard silicon technology should be devoted. 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