Publishing Your Paper in IET
Journals
Stuart Govan
Journals Publisher
The Institution of Engineering and Technology
sgovan@theiet.org
Welcome! Thank You For
Your Invitation and Your
I t
t in
i IET Journals
J
l
Interest
Two
Interesting
T
I t
ti Facts
F t About
Ab t IET
Journals and China
IET Journals Receive More Papers From China
Than From Any Other Country (23%)
Chinese Articles Represent 10% of Papers
Published in IET Journals
What This Shows
•
•
g y high
g number of Chinese
The IET has a p
pleasingly
submissions
There is the potential to increase the acceptance rate
of Chinese papers
Purpose of Presentation
•
•
•
To encourage you to continue submitting to IET journals
To inform you about our new and existing journals
To help you publish in IET journals
Structure of Presentation
j
• The IET and IET journals
• How to write your paper
• How to submit your paper
About the Institution of
Engineering and Technology
The Institution of Engineering and Technology is a charitable, not-for-profit
organisation. Its aim is to promote and support the fields of science,
engineering
i
i and
d ttechnology.
h l
It was fformed
db
by th
the coming
i ttogether
th off th
the
Institution of Electrical Engineers (IEE) and the Institution of Incorporated
Engineers (IIE) in March 2006 and now has more than 150,000 members
worldwide. It is the largest professional engineering society in Europe and the
second largest of its type in the world. It has offices in London, Beijing, Hong
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00 )
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Electronics Letters
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The advantages of publishing in
Electronics Letters
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Rapid publication (8 weeks to publication)
Highly cited
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New IET Letters and Research
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Call
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Papers
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Very fast turnaround
(decision within 3 months and publication within 6)
Freely available on IET Digital Library – thus high visibility for
your paper
Will appear in Inspec, SCI, Ei, Medline
The Micro
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Mi
& Nano
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Letters
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The
off publishing
Th advantages
d
t
bli hi in
i
Micro & Nano Letters
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New journal
Free
access – hence
visibility
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h
i ibilit ffor your work
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Covers latest advances in the science, engineering, technology
and applications of miniature and ultraminiature structures and
systems that have at least one dimension ranging from a few tens of
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Synthetic biology is a new interdisciplinary endeavour which involves
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biological elements can be adopted as reusable, components, which
are well characterised and can be used for the construction of more
complex devices and systems. The approach allows the biological
application of engineering concepts such as modularity, abstraction
and insulation from underlying detail. The reuse of modular
t also
l ffacilitates
ilit t software
ft
d lli
d work
k iin th
ld
components
modelling,
and
the fifield
is promoting parallel developments in computer software. New
students and workers are coming into the field from very diverse
areas. There is a demand for specialised coverage of this new field,
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pores and channels
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How to Write Your Paper
Common Reasons for Rejection
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Paper over length guidelines
English diffic
difficult
lt to understand
nderstand
Incorrect format (double column)
Incorrect presentation (references in Abstract, references not in numerical order)
Insufficient information in references (all authors, title, publication, volume, issue
and page range)
Inadequate number of references (recommended minimum: 15-20)
Majority of references out of date (over five years old)
Absence of top quality references (IEEE and IET journals and conferences)
Majority of references self-citations; work of other research groups not cited
No clear motivation
No significant new results
Paper detailed and highly mathematical but is not a significant contribution, since
it represents
p
work which is very
y similar to p
previous work by
y other authors and
differs only in small changes in assumptions or problem setup
Paper is purely methodological, and considers a problem of only limited scope or
is studied in only a limited way
Insufficient experimental or simulation details for others to repeat the results
Three Golden Rules
1. Choose an area of current interest and provide clear motivation
for writing your paper
2. Conduct a thorough research of other work and cite the most recent,
relevant and high-quality work
3. Structure your paper well
Choosing
Ch
i an Area
A
off C
Currentt IInterest
t
t and
d
Importance
•
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•
•
•
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•
Do as much background research as you can before choosing
your project
j t
Choose a topic that will be interesting in the future – not one
that was interesting in the past
Attend the main conference in your area of research
research. What
topics were covered in last year’s conference? What are the
research interests of the technical program chairs?
Speak with your professor
Identify the research interests of the editor-in-chief
Write to the editor-in-chief and ask them what topics they would
particularly like to see published in their journal
Identify the research interests of the editorial board
Look at the most recent issues of the journal. What sort of papers
has it published? What have been the subjects of recent special
issues of the journal?
Providing Clear Motivation for Your Paper
•
You should be able to answer yes to at least one of the following questions
– Do I have
ha e significant new
ne results
res lts to present?
– Do major assumptions made in previous research by other groups need to be
challenged and changed? If so, why?
– Does my paper cover significant new aspects not covered before?
•
Your work is not ready for journal publication if
– it is detailed and highly mathematical but is not a significant contribution, since
it represents work which is very similar to previous work by other authors and
differs only in small changes in assumptions or problem setup
– it is purely methodological, and considers a problem of only limited scope or is
studied in only a limited way
•
If there is clear motivation for your paper, make this very very clear in
th Abstract
the
Ab t t and
d Introduction
I t d ti
Conducting
C
d ti Thorough
Th
h Research
R
h off Other
Oth
Work
•
•
•
•
•
•
Provide a comprehensive, up-to-date and critical assessment
off what research has been done before
f
Cite an adequate number of references (at least 15)
Ensure that the majority of references are from the last five years
C high-quality papers (in
( order off importance: journals,
Cite
conferences, book chapters, symposia, workshops)
Cite work by other groups and not just your own work
Cite recent work by the editor
editor-in-chief
in chief and editorial board
Structuring Your Paper Well
Construct your paper logically so that the reader can easily follow
the de
development
elopment of your
o r arg
argument
ment
Abstract
Introduction (including related work)
Experiments
Results
Discussion
C
Conclusion
l i and
d ffuture
t
work
k
Acknowledgments
References
Appendix
Abstract
•
The abstract is a one paragraph summary (150-200 words) of
the entire work described completely in the article. The abstract
should be a self-contained unit capable of being understood
without the benefit of the text. It should contain these four
elements:
–
–
–
–
a brief statement of the problem and why it is important (Motivation)
a brief statement of what was done (Methods)
a brief statement of what was found (Results)
(
)
a brief statement of what was concluded (Discussion)
Guidelines for Writing the Abstract
•
•
Write the Abstract last, after you have finished writing the paper
I l d kkey tterms, since
Include
i
th
the Abstract
Ab t t will
ill b
be used
db
by search
h engines
i
•
Do not include references, as the Abstract will be used without the main
article
Do not include equations and mathematics in the Abstract
Do not exceed 250 words
•
•
Sample Abstract
Motivation
Methods
Results
Conclusion
Due to aggressive technology scaling and multi-GHz operating frequencies
of RF devices
devices, parametric failure test and diagnosis of RF circuitry is
becoming increasingly important for reduction of production test cost and
faster yield ramp-up. In this paper, a low-cost test and diagnosis method is
proposed for multi-parametric faults in wireless systems that allows accurate
prediction of the end-to-end specifications as well as the specifications of all
th embedded
the
b dd d RF modules.
d l
Th
The procedure
d
iis b
based
d on application
li ti off
optimized multi-tone test stimulus and extraction of transient test response
envelope at RF signal nodes using a simple diode-based envelope detector.
The test response is down-converted to lower frequencies compared to the
operating frequency of the system using the envelope detector, thus
eliminating the need to make costly RF measurements. The specifications
as well as the diagnostic information are computed from the test response
via the envelope detector. Hardware measurement data for a 1.575GHz
transceiver shows high prediction accuracy for the test specifications of the
system as well as the modules.
modules It is shown that the resulting information
(features) in the transient envelope is sufficient to accurately predict a host
of test specifications using a single test configuration and test response
capture event.
Introduction
•
•
•
•
Identify the problem and explain why it is important
Summarise your method and results
Summarise how other research groups have tackled the problem
Summarise the structure of the paper
Sample Introduction
Motivation
Summary of
Approach
Summary of
Paper
1. Introduction
Advances in semiconductor manufacturing technology during the last decade have
enabled single chip integration of RF transceivers with significant reduction in manufacturing
cost. However, with advanced high frequency RF CMOS processes and shrinking device
dimensions, the impact of process variations on RF system performance and related silicon
yield loss is also increasing in an adverse manner. Hence, RF circuits must be tested
extensively for all RF test specifications and the origin of yield loss must be diagnosed down to
the performances of individual circuit modules if possible
possible.
To reduce test cost, it is necessary to measure all the RF test specifications using a low
cost external test system. In this paper, we propose a low cost test and diagnosis scheme for
integrated RF systems in which small sensors are designed-into the RF load board or the RF
circuit itself to facilitate manufacturing test and diagnosis. When the sensors are designed-into
performance testing
g and diagnosis
g
of the RF systems
y
is
the RF load board, veryy accurate p
possible with no impact on the performance of the device. In addition, using measurements on
the observable system outputs, it is possible to predict the performances of the embedded
modules (LNA, mixers, PA) fairly accurately. When the sensors are designed into the RF circuit
itself, more accurate test and diagnosis is possible for the embedded RF modules in addition to
the capabilities already available for the RF systems. In both situations, it is even possible to
perform the test and diagnosis
p
g
of the RF front end with little or no support
pp from an external
tester via the software running on the transceiver baseband processor.
In the following, the objectives and approach of this paper are presented. Next, prior
work on test and diagnosis of RF circuits and systems is discussed. A theory for test and
diagnosis of RF systems using RF sensors is then developed. This is followed by a discussion
of the use of sensors on the load board and sensors designed into the RF circuit under test. The
pros and cons of both techniques from a design
design, test and calibration perspective are discussed
discussed.
Finally, experimental results are used to show the practical viability, potential and usefulness of
the proposed test and diagnosis methodology.
Sample Objectives and Approach
Objectives
and
Approach
2. Objectives and Approach
The objectives of this research are as follows:
To be able to test (i.e. generate pass/fail information) and diagnose an RF system under simultaneous multiparameter perturbations (simultaneous performance variations in multiple modules) for its test specifications with accuracy
similar to that achievable with standard RF test instrumentation for parametric failures. This will be performed using test
response sensors on the load board with only baseband processing support from an on-chip DSP. Specifically, the goal is to
predict multiple RF test specification values of the various modules of the system using a single test that can be applied using
load board and system-level test resources. The resulting diagnostic data can be used for process debug and rapid yield rampup. Even though a low speed digitizer is used to process the test response signals, the predicted specifications are at-speed
test specification values (i
(i.e.
e at the operating frequency of the transmitter,
transmitter demonstrated later for a 1.575GHz
1 575GHz transmitter)
To be able to predict multiple module-level (LNA, mixer, PA) test specification values from the test response data
obtained from the load board test response sensors (accessible outputs of different modules). The prediction must be accurate
in the presence of simultaneous multi-parameter performance perturbations across one or more modules. We assume that the
output of each load board test response sensor is a baseband signal that can be digitized and analyzed using available systemlevel test resources.
To study how test and diagnosis accuracy is increased by incorporating sensors at the outputs of the RF modules of
a wireless system
y
in addition to those alreadyy available at its observable outputs.
p
The g
goal is to study
y the additional test and
diagnosis accuracy obtained for the extra effort expended in incorporating such sensors into the design of an RF front-end
system. Note that we desire accurate diagnosis of each RF module even when its test input signal has changed due to
parametric variations in other modules that feed its inputs (multi-parameter, multi-module parametric perturbations).
Since the proposed techniques allow measurement/diagnosis of complex RF specifications using only low-frequency
(band-limited) measurements, this method can be used to develop a complete built-in test and diagnosis framework for a
wireless system using algorithms implemented in the transceiver DSP that eliminates the need to use external RF
measurements/instruments.
Th proposed
The
d ttestt and
d diagnosis
di
i approach
h uses a test
t t stimulus
ti l generated
t d by
b the
th b
baseband
b d DSP tto stimulate
ti l t th
the
transmitter. A test sensor (diode-based transient envelope detector) on the load board is designed to produce a low frequency
transient test response when stimulated by the signal obtained at the output of the transmitter on application of the test stimulus
by the baseband DSP. This low frequency signal is multiplexed to the transceiver DSP or a DSP on the load board/ATE for
analysis. Software running on the DSP is used to analyze the data generated by the sensor. Using the principles of “alternate
test” in [1], all the transmitter and sub-module specifications are predicted accurately using calibrated models that map the
detected transient envelope “features” (samples) to the system and sub-module test specifications of interest. Such an
approach compensates for envelope detector non-idealities as well. Accurate diagnosis of sub-module specifications is possible
even when
h th
there are simultaneous
i lt
performance
f
variations
i ti
in
i multiple
lti l modules.
d l
The
Th technique
t h i
can b
be extended
t d d tto complete
l t
built-in test and diagnosis of a transceiver using algorithms implemented in the transceiver DSP and eliminates the need to use
RF measurements/instruments.
Related Work
•
•
It is very important that you include a section on related work.
Papers with inadequate references are often rejected
By citing an adequate number of recent and high quality
references you show the editor that
– you
y are workingg in an area of current interest
– you have researched the area thoroughly and put your paper in the
context of recent work
•
•
When citing conference work, cite relevant work from the last
two or three conference proceedings
When citing journal work, cite journal papers published in the
last two or three years
Sample Related Work
Related Work
Limitations of
Related Work
and thus
Motivation for
this Work
3. Prior Work
Although testing and failure diagnosis of analog circuits has been a major field of research and is well established [1]-[5], most of
the prior research has focused on analog/mixed
analog/mixed-signal
signal systems as opposed to RF test and diagnosis
diagnosis. The core problem with RF test is that
high frequency (multi-GHz) signals need to be applied to the DUT and observed for test and diagnosis purposes, thereby requiring the use of a
high-speed external tester and test access to embedded RF modules. Due to increasing circuit speeds and high levels of device integration,
this has become increasingly difficult and expensive to perform in a high-volume manufacturing environment. In addition, where on-chip test
access is possible, the electrical losses involved in transport high frequency signals from the chip to the external tester have made accurate
test measurement a very hard problem to solve.
RF test equipment such as spectrum analyzers makes use of highly accurate mixers, frequency synthesizers, filters and power
detectors for accurate RF measurements. While it is difficult to replicate such accurate measurement circuitry on a load board, several load
board test structures have been p
proposed
p
to down-convert RF signals
g
to DC values for measuring
g RF circuit specifications
p
such as g
gain,, NF,,
IIP3, ACPR, and phase noise [7]. The approach of employs mixers for up- and down-conversion of the test stimulus and its response,
respectively, hence eliminating the need for RF signal handling at the external tester, and providing a mechanism for extracting multiple RF test
specifications using alternate test methodology. The work of [7], [8], however, only consider testing of discrete RF circuits. In addition, since the
load board test circuitry (i.e. mixer, frequency synthesizer, etc) is too complex to be deployed inside a DUT, the work is not appropriate for
performing embedded circuit testing.
Authors in [9] have looked at failure diagnosis of RF circuits for catastrophic faults, however, the approach lacks a general method
to determine fault models and does need RF test equipment to perform such tests. The diagnosis method proposed in [10] attempts to isolate
and classify parametric and catastrophic failures in embedded RF circuits. The authors use a series of specification measurements via
standard RF circuit test techniques to enable failure diagnosis
diagnosis. Even though a high probability of correct parametric and catastrophic RF fault
identification via behavioral simulations in MATLAB is demonstrated, the method does not resolve the problem of test and diagnosis of
parametric failures under simultaneous multi-parameter perturbations. Moreover, to perform a set of complicated RF specification tests for
diagnosis, multiple test configurations and expensive automatic test equipment (ATE) are necessary, resulting in long test times and high cost
for failure diagnosis. Loop-back based transceiver diagnosis methods have also been proposed in [11],[12]. Pseudo-random bit sequences
were used as test stimulus and the test data was used to extract the specifications of the transmitter and receiver. However, the problem of
determining the test specifications of the RF system components from the observed response of the transmitter and receiver was not explored.
In this context, the use of embedded sensors that are designed-into the RF DUT for test purposes is a viable method for
accessing
g internal RF nodes. Several built-in test ((BIT)) schemes have been p
proposed
p
in the p
past that rely
y on the use of embedded p
peak, RMS,
and power detectors for testing discrete LNA modules and RF transceivers [13]-[18].
The main limitations of these methods are that they either require the use of dedicated tests geared towards a few targeted RF
test specifications and specific RF devices, or do not deliver the test measurement accuracy necessary for detection of parametric failures.
Moreover, all the BIT methods in utilize the DC output of the detectors. To overcome the limited information from a single DC value extracted
by a detector, they deploy multiple detectors at an internal node and/or apply multiple test stimuli, thus incurring incur area/power/performance
design penalty due to the complex designs of the sensors.
References
References
Recentt
R
References
Top Quality
International
Conferences
and Journals
[1] Variyam, P.N., Cherubal, S., and Chatterjee, A.: ‘Prediction of analog performance parameters using fast transient testing’, IEEE Trans. CAD of Integrated
Circuits and Systems
Systems, 2002
2002, 21
21, (3)
(3), pp
pp. 349
349-361
361
[2] Bandler, J.W., and Salama, A.E.: ‘Fault diagnosis of analog circuits’, Proceedings of the IEEE, 1985, 73, (8), pp. 1279-1325
[3] Somayajula, S.S., Sanchez-Sinencio, E., and Pineda de Gyvez, J.: ‘A power supply ramping and current measurement based technique for analog fault
diagnosis’. Proc. VLSI Test Symposium, April 1994, pp. 234-239
[4] Cherubal, S., and Chatterjee, A.: ‘Parametric fault diagnosis for analog systems using functional mapping’. Proc. Design, Automation and Test in Europe
Conference and Exhibition, March 1999, pp.195-200
[5] Wang, P., and Yang, S.: ‘A new diagnosis approach for handling tolerance in analog and mixed-signal circuits by using fuzzy math’, IEEE Trans. Circuits and
Systems I, 2005, 52, (10), pp. 2118-2127
[6] Alippi, C., Catelani, M., Fort, A., and Mugnaini, M.: ‘Automated selection of test frequencies for fault diagnosis in analog electronic circuits’, IEEE Trans.
I t
Instrumentation
t ti and
d Measurement,
M
t 2005,
2005 54,
54 (3)
(3), pp.1033-1044
1033 1044
[7] Ferrario, J., Wolf, R., Moss, S., and Slamani, M.: ‘A low-cost test solution for wireless phone RFICs’, IEEE Communications Magazine, 2003, 41, (9), pp. 82-88
[8] Voorakaranam, R., Cherubal, S., and Chatterjee, A.: ‘A signature test framework for rapid production testing of RF circuits’. Proc. Design Automation and Test in
Europe Conf. and Exhibition, March 2002, pp. 186-191
[9] Acar, E., and Ozev, S.: ‘Defect-based RF testing using a new catastrophic fault model’. IEEE Int. Test Conf., Nov. 2005, paper 17.3
[10] Acar, E., and Ozev, S.: ‘Diagnosis of the failing components in RF receivers through adaptive full-path measurements’. Proc. VLSI Test Symposium, May 2005,
pp. 374-379.
[11] Heutmaker, M.S., and Le, D.K.: ‘An architecture for self-test of a wireless communication system using sampled IQ modulation and boundary scan’, IEEE
g
) pp
Communications Magazine,
1999, 37, ((6),
pp. 98–102
[12] Halder, A., Bhattacharya, S., Srinivasan, G., and Chatterjee, A.: ‘A system-level alternate test approach for specification test of RF transceivers in loopback
mode’. Proc. Int. Conf. on VLSI Design, Jan. 2005, pp.289-294
[13] Yin, A., Eisenstadt, W.R., Fox, R.M., and Zhang, T.: ‘A translinear RMS detector for embedded test of RF ICs’, IEEE Trans. Instrumentation and Measurement,
2005, 54, (5), pp. 1708-1714
[14] Ryu, J., Kim, B.C., and Sylla, I.: ‘A new low-cost RF built-in self-test measurement for system-on-chip transceivers’, IEEE Trans. Instrumentation and
Measurement, 2006, 55, (2), pp. 381-388
[15] Gopalan, A., Das, T., Washburn, C., and Mukund, P.R.: ‘An ultra-fast, on-chip BiST for RF low noise amplifiers’. Proc. Int. Conf. on VLSI Design, Jan 2005, pp.
485-490
[[16]] Valdes-Garcia,, A.,, Venkatasubramanian,, R.,, Srinivasan,, R.,, Silva-Martinez,, J.,, and Sanchez-Sinencio,, E.: ‘A CMOS RF RMS detector for built-in testing
g of
wireless transceivers’. Proc. VLSI Test Symposium, May 2005, pp. 249-254
[17] Akbay, S.S. and Chatterjee, A.: ‘Built-in test of RF components using mapped feature extraction sensors’. Proc. VLSI Test Symposium, May 2005, pp. 243-248
[18] Bhattacharya, S., and Chatterjee, A.: ‘Use of embedded sensors for built-in-test of RF circuits’. Proc. Int. Test Conf., 2004, pp. 801-809
[19] Dugundji, J.: ‘Envelope and pre-envelopes of real waveforms’, IEEE Trans. Information Theory, 1958, 4, (1), pp. 53-57
[20] Friedman, J.H.: ‘Multivariate adaptive regression splines’, The Annals of Statistics, 1991, 19, (1), pp. 1-141
[21] Kundert, K.S.: ‘Introduction to RF simulation and its application’, IEEE Journal of Solid State Circuits, 1999, 34, (9), pp. 1298-1319
[22] Halder, A., Bhattacharya, S., and Chatterjee, A.,: ‘Automatic multitone alternate test generation for RF circuits using behavioral models’. Proc. Int. Test Conf.,
Sep. 2003, pp. 665-673
[23] H
Hooke,
k R
R., and
d JJeeves, R
R.A.:
A ‘Di
‘Directt search
h solution
l ti off numerical
i l and
d statistical
t ti ti l problems’,
bl
’ JJournall A
Assoc. C
Comp., 1961
1961, 8,
8 pp. 212-229
212 229
Three Further Rules
1. Comply with the IET length guidelines
2. Format your paper correctly
3. Check your paper for spelling and grammar
Length Guidelines for IET Research Journals
Words
Figures
Decision
Less than 3000
Less than 12
Acceptable
Less than 3000
Between 12 and 15
Borderline
Less than 3000
More than 15
Overlong
Between 3000 and 4500
Less than 10
Acceptable
Between 3000 and 4500
Between 10 and 12
Borderline
Between 3000 and 4500
More than 12
Overlong
Between 4500 and 5000
Less than 8
Acceptable
Between 4500 and 5000
Between 8 and 10
Borderline
Between 4500 and 5000
More than 10
Overlong
Between 5000 and 6000
Less than 6
Acceptable
Between 5000 and 6000
Between 6 and 8
Borderline
Between 5000 and 6000
More than 8
Overlong
More than 6000
Any number
Overlong
Length Guidelines for IET Research Journals
•
Paper between 3000-4500 words and no more than 10 figures
•
Paper < 2000 words → for a full research paper this may indicate
that not enough research has been done
Paper > 6000 words → may make paper difficult to review and
read, and may indicates that paper has not been structured well
•
Correct Single Column Format
Incorrect Double Column Format
Tips for Writing Correct English
•
•
•
•
•
•
•
•
•
Plan what you want to say first
Keep your argument simple
Remove any material that is unnecessary to the argument
Structure each point into paragraphs
Start each paragraph with a topic sentence that describes what the
paragraph is about
The start of each paragraph should flow on from the end of the
previous one. Use keywords to maintain this flow
It is often useful to start a paragraph with a question
Use short sentences of even length
Link sentences using words that indicate the flow of your argument,
such as “firstly”
firstly , “secondly”
secondly , “therefore”
therefore , “then”
then , but do not over
over-use
use
these words and seek variety
Sample Paragraphs
In this section I announce what the IEE Proceedings journals will be called in 2007 and explain
the reasoning behind this decision
decision. Firstly
Firstly, I provide some information on the Institution of
Engineering and Technology. Secondly, I explain the reason behind its formation. I then finish
by announcing the names of the new journals.
The Institution of Engineering and Technology (IET) is the largest professional membership
body for engineers and ICT professionals in Europe. It provides professional accreditation,
mentoring events and a range of publishing products to support the engineering profession.
mentoring,
profession It
was formed in 2006 from the coming together of the Institution of Electrical Engineers (IEE) and
the Institution of Incorporated Engineers (IIE).
Why was the new institution formed and why was the name changed? The reason is the
increasingly interdisciplinary nature of engineering today. Members of the IET work and
collaborate
ll b t across many fi
fields
ld off engineering
i
i and
d ttechnology,
h l
e.g. electrical
l t i l engineering,
i
i
manufacturing engineering, communication engineering and biomedical engineering. Our
members no longer class themselves as just electrical engineers. The new name thus reflects
the fact that our membership activities and publishing products embrace the wide field of
engineering and technology.
Th IET’s
The
IET’ publishing
bli hi products
d t include
i l d 22 research
h journals,
j
l comprising
i i 2 Letters
L tt
Journals
J
l and
d
20 Research Journals [ ]. The Research Journals used to be called IEE Proceedings, but with
effect from January 2007 they are being renamed. Collectively, the IEE Proceedings will be
known as the IET Research Journals. Individually, each journal will change name as follows:
the IEE will be replaced by IET; the word Proceedings will be removed; and the rest remains
th same. Thus,
the
Th
ffor example,
l IEE Proceedings
P
di
Electric
El t i Power
P
Applications
A li ti
will
ill b
be kknown as
IET Electric Power Applications, and so on for each title.
Link
by
repeating
Use
toQuestion
indicate
order
Topic
sentences
g g and
In 2007 the IET will introduce a language
presentation service for non-native speakers of
English to help them improve the presentation
of their paper
paper. For further details please email
Stuart Govan
Journals Publisher
The Institution of Engineering and Technology
sgovan@theiet.org
How to Submit Your Paper
The IET Journal Publishing Process
•
•
•
•
•
•
•
Author submits paper
IET office checks paper for length, format, number and quality
of references
Editor chooses experts (peer review) for papers worthy of review
Reviewers submit their report
Editor accepts good papers and rejects poor ones on the basis
of reviewer reports
A
Accepted
t d papers are edited,
dit d ttypeset,
t printed
i t d and
d published
bli h d online
li
Accepted papers are indexed in major databases
IET Manuscript Central and How it Works
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
Website
http://mc.manuscriptcentral.com/iet
Checklist
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Does my paper comply with the IET length guidelines?
Is my paper formatted correctly (single column)?
Is the general presentation correct (no references in Abstract, references in numerical order)?
Have I checked my paper for spelling and grammar?
Is there sufficient information in references (all authors, title, publication, volume, issue and
page range)?
Are there an adequate number of references (recommended minimum: 15
15-20)?
20)?
Are the majority of references recent (within last five years)?
Are the references from top quality sources (e.g. IEEE and IET journals and conferences)?
Do I cite the work of other groups working in the field?
Is the motivation of my paper clear, particularly in the Abstract?
Have I got significant new results to report, and do I make clear what they are in the Abstract?
Have I provided sufficient experimental or simulation details for others to repeat the results?
Have I asked at least two colleagues to read through my paper and provide me with some
feedback?
Have I consulted the IET Author Guide?
IET A
Author
th Guide
G id
http://www.ietdl.org
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
IET Manuscript Central
•
•
•
•
•
Introduced in 2004
State-of-the-art functionality
Everything done online
Very easy for authors
Leads to very fast publication times
The Institution of Engineering and
Technology
The Institution of Engineering and
Technology wants to…
g
gp
• Promote the engineering
profession in China
• Help Chinese academics to publish their papers in
IET journals
• Encourage more Chinese members to become
members of the IET
Publications
Communities
Events and Training
Careers and Education
Membership
IET Student Member Website
http://www.iee.org/oncomms/circuit/
Benefits of IET Student Membership
•
Technical Professional Networks: Web Based Communities That
Connect
People
Specific
Fields
C
P
l iin S
ifi Technical
T h i l Fi
ld and
d IIndustries
d
i
– specific engineering sector news
– library of technical articles
li andd physical
h i l events
t
– online
– interviews with industry leaders
– online discussion forums
Benefits of IET Student Membership
•
Online Student Community
–
–
–
–
–
global network of students
career advice
work placements and job opportunities
essential news, web links, discussion forums
online student magazine
Benefits of IET Student Membership
•
Learning Resources
–
–
–
–
–
–
–
www.iet.tv. Access a range of events and lectures from your home
IET Library: 70,000 books 3,000 periodicals, 1,500 new books every
year. Books can be posted to China from the UK. Plus you can receive
photocopies of journals
journals, articles and extracts
online access to our reference library
20 % discount on books
free engineering & technology magazine
free specialist sector magazine (choice from seven)
free student and graduate magazine
Benefits of IET Student Membership
•
Scholarships and Competitions
–
–
writing competitions – write on an area of engineering of your choice
RMB 15,000 to an outstanding student in the final year of a degree
course in IT, electrical, electronic or manufacturing engineering in
China For more information
China.
information, visit
http://www.iee.org/educareers/awards
Benefits of IET Student Membership
•
Professional Development
–
–
career advice
website for developing technical and non technical skills. See
http://www.iee.org/EduCareers
Benefits of IET Student Membership
•
Email Alias
–
–
sign up for your free personalised IET email address at
http://www.iee.org/oncomms/circuit/members/ieealias
you can take your email address with you after university or when
moving on throughout your career – adding that professional touch to
your correspondence with potential employers
Benefits of IET Student Membership
•
Local Information
– local networks events for students and young professionals
– visit the IET China website at www.theiet.org.cn
– the IET Beijing office is situated in the China Merchants Tower, Chaoyang
Di t i t
District
– the IET is planning further development in China
– student membership of the IET costs 180 RMB
Some Useful Websites
•
•
•
•
•
•
•
•
The IET Website www.theiet.org
The IET Website in China www.theiet.org.cn
The IET Membership Webpage www.theiet.org/membership
The IET Publications Webpage www.theiet.org/publications
The IET Digital Library and Link to Author Guide www.ietdl.org
The IET TV Webpage www.iet.tv
The IET Journals Submission Page http://mc.manuscriptcentral/theiet
The Inspec Webpage http://inspec-web.theiet.org/inspec/
User ID TrialUser06
Password ivogmuja
Thank You Very Much For Your
Attention!
How Can We Further Collaborate
and Learn From Each Other?
Stuart Govan
Journals Publisher
The Institution of Engineering and Technology
sgovan@theiet.org