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ECE145A /218CA notes, M. Rodwell, copyrighted
ECE145a / 218a: Notes Set 5
device models &
device characteristics:
Mark Rodwell
University of California, Santa Barbara
rodwell@ece.ucsb.edu 805-893-3244, 805-893-3262 fax
Content:
Bipolar Transistor M odels
M OSFET M odels
HEM T (JFET) models
Cutoff frequencie s.
ECE145A /218CA notes, M. Rodwell, copyrighted
ECE145A /218CA notes, M. Rodwell, copyrighted
Active Devices:
Bipolar Transistors
HBT Physical Structure
ECE145A /218CA notes, M. Rodwell, copyrighted
Increasing total emitter area
ECE145A /218CA notes, M. Rodwell, copyrighted
J E  I E /( total emitter area)
Increasing the emitter area (increasin g LE , or multiple fingers) increases the maximum current.
Emitter area generally selected to reach peak bandwidth at some specified current.
ECE145A /218CA notes, M. Rodwell, copyrighted
Bipolar Transistor: DC characteristics: common-emitter
10
-2
10
-4
10
-6
10
-8
20
c
2
I
10
-10
10
-12
I
b
mA/m
c
b
I , I (A)
Vce,sat
15
I c  I b
10
5
0
0 0.25 0.5 0.75 1
V
be
0
1
(V)
Approximately :
I c  I s e qVbe / nkT and I b  I c / 
These relationships are approximate,
and fail at higher current densities
2
V
3
4
ce
Vbr,ceo
ECE145A /218CA notes, M. Rodwell, copyrighted
HBT hybrid-Pi equivalent-circuit model
Ccbx
Rbe   / g m
 f   b  c
 f   base   collector
g mo 
I C
IC

VBE (nkT / q)
g m  g mo e j c 0    1 (typically~ 0.8)
B
Rbb
Ccbi
Rbe
Cbe,diff =gm f Cje
Rc
C
gm Vbee -jc
Vbe
Rex
E
C je , Ccbi , Ccbx : depletion capacitances
Cbe,diff : diffusion capacitance
 b , c : carrier transit times in base and collector
Rb , Re , Rc : parasitic resitances
The term e j c , though often neglected, can be significan t in some circuits.
ECE145A /218CA notes, M. Rodwell, copyrighted
Bipolar Transistor T-model


1
 exp  j c 
 1  j b 



1
1


  0 
 1  j b  1  j c 
 ( )   0 


1


 0 
 1  j ( b   c ) 
The approximations above, if taken to first order in , produce the hybrid pi model.
The T model is more convenient for common-base amplifier analysis.
ECE145A /218CA notes, M. Rodwell, copyrighted
How model varies as emitter area is increased
Ccbx
B
Rbb
Ccbi
Rbe
Cbe,diff =gm f Cje
Rc
C
gm Vbee -jc
Vbe
Rex
E
Increasing the emitter area by N : 1  same as wiring N HBTs in parallel.
All capacitances increase N : 1, all resistances decrease 1 : N.
Cbe , Rbe and g m are given by theformulas on the previous pages.
ECE145A /218CA notes, M. Rodwell, copyrighted
Active Devices:
Silicon MOSFETs
ECE145A /218CA notes, M. Rodwell, copyrighted
Planar Bulk MOSFET
Cross-Section
gate metal
(silicide)
Layout (multi-finger)
dielectric
sidewall
G
S
gate oxide
N+ poly
gate
Wg
source contact (silicide)
drain contact (silicide)
G
N+ source
N+ drain
P substrate
gate
dielectric
inversion
layer
P substrate
N+
polysilicon
gate
D
S
D
S
D
S
ECE145A /218CA notes, M. Rodwell, copyrighted
MOSFET DC Characteristics
mobility-limited
ID
Id
increasing
VGS
velocity-limited
Vgs
VDS
Vth
For drain voltages larger tha n the knee voltage :
mobility  limited current
I D ,  coxWg (Vgs  Vth )2 / 2 Lg
velocity  limited current
I D ,v  coxWg vsat (Vgs  Vth )
Generalized Expression
2
 ID   ID

 
I  I
 D ,v   D , 

 1


ECE145A /218CA notes, M. Rodwell, copyrighted
The knee voltage defines the boundary between
ID
Ohmic
Knee Voltage: Mobility-Limited Case
constant-current
the Ohmic and constant - current regions
increasing
VGS
In the mobility - limited regime,
the knee in curve occurs when
Vdg  Vds  Vgs  Vth
VDS
VGD=Vth
The Knee Voltage is further increased by voltage
VGD=Vth
IDRD
drops across the parasitic source & drain resistances.
IDRS
ECE145A /218CA notes, M. Rodwell, copyrighted
Knee Voltage: Velocity-Limited Case
In the velocity - limited regime, the knee in curve
occurs when Vds  vsatLg / 
Again, the Knee Voltage is further increased
by voltage drops across the parasitic
source & drain resistances.
VDS=vsatLg/
IDRD
VDS=vsatLg/
IDRS
ECE145A /218CA notes, M. Rodwell, copyrighted
DC Characteristics---Far Above Threshold
Id
V
Vth
Vgs
I D  coxWg vsat (Vgs  Vth  V ) for (Vgs  Vth ) / V  1
where V  vsat Lg / 
ECE145A /218CA notes, M. Rodwell, copyrighted
MOSFET Transconductance
mobility  limited
Id
I D ,  coxWg (Vgs  Vth ) / 2 Lg
2
V
I D
 gm 
 coxWg (Vgs  Vth ) / Lg
VGS
Vgs
Vth
mobility-limited
velocity  limited
I D ,v  coxWg vsat (Vgs  Vth )
gm
velocity-limited
V
I D
 gm 
 coxWg vsat
VGS
Vth
Vgs
ECE145A /218CA notes, M. Rodwell, copyrighted
Linear vs. Square-Law Characteristics: 90 nm
90 nm MOSFET DC Characteristics
N - channel
g m / Wg  coxv sat  1.4 mS / μm  1.4 S / mm
Vth  0.6 V 1/ ~ 3V
P - channel
g m / Wg  coxv sat  0.7 mS / μm  0.7 S / mm
| Vth | 0.6 V 1/ ~ 3V
ECE145A /218CA notes, M. Rodwell, copyrighted
ECE145A /218CA notes, M. Rodwell, copyrighted
Device Structure and Model: multi-finger device
G
Rg
Cgd
gmVg’s’ Gds
Rd
G
S
D
S
D
S
D
S
D
Ri
Cgs
Wg
Vg’s’
Cdb
G
Csb
Rs
S
gm 

Teq
veff NWg  or

Teq
 NWg Vgs  Vth 
C gd  koWg
ko  (0.3  0.5)fF/m
C gs 

Teq
Lg NWg   koWg
G
Cgd
 s  Wg  Rend


12 Lg  N  2 N
Rd  1 / NWg
Rg ~
Rg
gmVg’s’ Gds
D
Ri
Cgs
Vg’s’
Cdb
Rs  1 / NWg
Gds  NWg
Csb  NWg
Increase f max using
Ri ~ 1 / g m
Cdb  NWg
- short gate fingers
- ample substrate contacts
Rs
S
Csb
ECE145A /218CA notes, M. Rodwell, copyrighted
Oversimplified Model
For rough hand analysis, etc
gm
g mx ~
1  g m Rs
C gsx ~
Gdsx ~
G
Rg
Cgd
gmVg’s’ Gds
D
Ri
Cgs
Vg’s’
Cdb
C gs
1  g m Rs
Rs
Gds
1  g m Rs
Csb
S
Rin ~ Rs  Rg  Ri
G
Rin
Cgd
gmxVg’s’ G
dsx
D
Approximate cutoff frequencie s
1 / 2f ~ Cgs / g m  Cgd / g m  ( Rs  Rd )Cgd
f max ~
Cgsx
Vg’s’
f
2 ( Rs  Rg  Ri )Gds  2Rg Cgd
Cdb
Csb
S
ECE145A /218CA notes, M. Rodwell, copyrighted
Active Devices:
III-V
Field-Effect Transistors
ECE145A /218CA notes, M. Rodwell, copyrighted
FET with Heterojunction for Gate Barrier→ HEMT
drawing : B. Brar.
Gate
Source
Drain
N+ InGaAs contact layer
InAlAs gate barrier layer
undoped InGaAs channel
drawing: K. Shinohara, HRL
HEMT :
FET with semiconduc tor heterojunc tion
for barrier between channel and gate.
ECE145A /218CA notes, M. Rodwell, copyrighted
HEMTs: Typical interdigitated structure
gate
source
drain
Note multiple gate fingers.
ECE145A /218CA notes, M. Rodwell, copyrighted
HEMT: approximate equivalent circuit model
Idss. Cgs, Cgd, gm, Gds all scale proportionally with gate periphery
Ri, Rs scale proportionally with (1/ gate periphery)
Rg scales proportionally to (gate finger length)/(number fingers)
ECE145A /218CA notes, M. Rodwell, copyrighted
HEMT DC-IV characteristics
Data : K. Shinohara, Teledyne Scientific
Schottky diode between gate and channel;
gate will draw current for Vgs more positive than c.a. 0.6 V
ECE145A /218CA notes, M. Rodwell, copyrighted
Figures of Merit
ECE145A /218CA notes, M. Rodwell, copyrighted
Transistor figures of Merit
Transistor small-signal bandwidth is typically stated in terms of
the figures of merit f and fmax
In order to understand these figures of merit, we must introduce
device power gain.
These power gains will be studied in more detail
later in the course.
ECE145A /218CA notes, M. Rodwell, copyrighted
Definition of short-circuit current gain
G
Ri
gmVg's Rds
D
Cgs
G
Vg's
D
example: FET
small-signal model
S
S
Iin
Ri
Cgs
gmVg's Rds
Vg's
Vgs  I in / jC gs
Iout
short-circuit current gain:
drive input with AC current,
short output, measure
Iout/Iin
I out g mVgs  g m   f  


  
 jC   jf 
I in
I in
gs 

ECE145A /218CA notes, M. Rodwell, copyrighted
Variation of H21 with frequency: Bipolar Transistors
50
h
21
Gains (dB)
40
30
U
20
V
f
2
CE

= 1 V, J = 1.5 mA/um
= 295 GHz
H21 is plotted in dB.
because H21 is a
current gain:
dB( H 21)  20 * log10 ( H 21)
C
10
f
MAX
= 295 GHz
0
1
10
Frequency (GHz)
Ccbx  6.9 fF
B
Vb'e
C diff  C je 
172 fF 34 fF
g m  g mo exp(  j c )
C diff  g mo  f
r cb  7000 
Ccbi  2.3 fF
Rbb  48 
R    g m
10
R 
433 
C
g mVb 'e
Rex  4.7 
E
r ce 
500 
2
Because of effect of R    / g m :
H 21( f ) 
1
1 /    f  / jf 
ECE145A /218CA notes, M. Rodwell, copyrighted
Current-gain cutoff frequency: Bipolar Transistors
Web
We
emitter
contact
base
BC grade
emitter
base contact
collector
EB grade
Tc
B
base contact
N+ sub collector
Rbb
Ccbi
Rc
C
collector contact
N- drift collector
Tb
Ccbx
Wb,cont
Wunder
semi-insulating InP substrate
Wc
Rbe
gm Vbee -jc
Vbe
Cbe,diff =gm f Cje
Rex
E
 kT

1
kT
  base   collector  C je
 Cbc 
 Rex  Rcoll 
2f
qI E
 qI E

 base  Tb2 2Dn
 collector  Tc 2vsat
ECE145A /218CA notes, M. Rodwell, copyrighted
Current-gain cutoff frequency: Field-Effect Transistors
gate metal
(silicide)
dielectric
sidewall
G
Rg
Cgd
gmVg’s’ Gds
gate oxide
source contact (silicide)
D
Ri
N+ poly
gate
Cgs
Vg’s’
Cdb
drain contact (silicide)
N+ source
N+ drain
Rs
S
P substrate
f 
gm
2 (C gs  C gd )
Csb
ECE145A /218CA notes, M. Rodwell, copyrighted
Maximum Power Transfer Theorem
generator
Xgen
load
Rgen
Xload
Rload
Vgen
M aximum power is transferred from generator to load if
X load   X gen and Rload  Rgen
this is called * * * conjugate impedance matching * * *
The power delivered, called the available generator power is
Pavg 
2
Vgen
,( RMS )
4 Rgen
ECE145A /218CA notes, M. Rodwell, copyrighted
Impedance Matching
Maximum power transfer can be obtained by adding a
***lossless*** (no resistances) impedance matching network
between the generator and the load:
generator
Xgen
match
Rgen
load
Xload
Vgen
*
Z gen Z gen
*
Z load
Z load
Rload
ECE145A /218CA notes, M. Rodwell, copyrighted
Maximum Available Power Gain (if it exists)
generator
Rgen
Vgen
load
gmVg's Rds
Ri
lossless
matching
network
Cgs
Vg's
lossless
matching
network
RL
The transistor or amplifier is connected to generator and load via lossless
matching networks. If it is possible to match at both input and output, then the
power gain is called the *maximum available gain* (MAG)
Detailed microwave circuit theory (see later notes) indicates that this
procedure often produces an oscillator (if the device is “potentially unstable”) .
In that case we must define Maximum stable gain
ECE145A /218CA notes, M. Rodwell, copyrighted
Maximum Stable Power Gain (if MAG does not exist)
generator
Rgen
Vgen
load
Rds
Ri
lossless
matching
network
resistive
loss
(stabilization)
Cgs
lossless
matching
network
Vg's
RL
gmVg's
If the device is potentially unstable (usually due to strong feedback through
Cgd as indicated), addition of a minimum amount of series/shunt resistance to
the device input/output will prevent oscillation, and the device can then be
matched. The resulting power gain is called the
Maximum stable power gain.
ECE145A /218CA notes, M. Rodwell, copyrighted
Unilateral power gain
shunt
feedback
generator
Rgen
Vgen
load
gmVg's Rds
Ri
lossless
matching
network
Cgs
Vg's
lossless
matching
network
RL
series
feedback
If the device is potentially unstable (due to strong feedback ), addition of
lossless reactive feedback as indicated can cancel the feedback and prevent
oscillation. The device can then be matched. The resulting power gain is called
Mason’s invariant power gain **or** the Unilateral power gain , U.
ECE145A /218CA notes, M. Rodwell, copyrighted
Power-Gain Cutoff Frequency (Fmax)
This is the frequency at which the device Unilateral power gain reaches
unity.
The maximum available gain (either in the forward or reverse direction)
also reaches unity at the same frequency
G
For Field - Effect Transistors :
f max 
Rg
Cgd
gmVg’s’ Gds
D
Ri
Cgs
Vg’s’
f
2 ( Ri  Rs  Rg )Gds  2f Rg Cdg
Rs
Cdb
Csb
S
Ccbx
For Bipolar Transistors ( Rce being large) :
B
f max
f
f


8RbbCcbi
2 Rbb / Rce  2f RbbCcbi
Rbb
Ccbi
Rbe
Cbe,diff =gm f Cje
Rc
C
gm Vbee -jc
Vbe
Rex
E
ECE145A /218CA notes, M. Rodwell, copyrighted
Power gains of a typical transistor
40
U: all 3
35
Gains, dB
30
25
MAG/MSG
common emitter
20
15
MAG/MSG
common base
10
5
MAG/MSG
common collector
0
1
10
Frequency, GHz
100
fmax
The inflection in the curves is the break between unstable (MSG) at lower frequencies
and stable (MAG) at higher frequencies.
MAG/MSG is directly relevant for RF/microwave/mm-wave IC design.
Because U has -20 dB/decade slope, it is used to extrapolate measurements to determine fmax
ECE145A /218CA notes, M. Rodwell, copyrighted
End
ECE145A /218CA notes, M. Rodwell, copyrighted
Appendix
(optional)
ECE145A /218CA notes, M. Rodwell, copyrighted
Bipolar Transistor
Operation
ECE145A /218CA notes, M. Rodwell, copyrighted
Bipolar Transistor ~ MOSFET Below Threshold
Vce
Because emitter energy distribution is thermal (exponential)
I c  exp( qVbe / kT )
Almost all electrons reaching base pass through it
 I c varies little with collector voltage
ECE145A /218CA notes, M. Rodwell, copyrighted
Bipolar Transistor ~ MOSFET Below Threshold
Vbe
Vce
Ic
Because emitter energy distribution is thermal (exponential)
I c  exp( qVbe / kT )
Almost all electrons reaching base pass through it
 I c varies little with collector voltage
ECE145A /218CA notes, M. Rodwell, copyrighted
HBT Equivalent
Circuit Model
ECE145A /218CA notes, M. Rodwell, copyrighted
Physical structure, symbolic
Device Stripe Length  LE
perpendicular to drawing
Web
We
emitter
contact
base
BC grade
emitter
base contact
collector
Wb,cont
EB grade
base contact
collector contact
N- drift collector
Tb
Tc
N+ sub collector
semi-insulating InP substrate
Wc
Wunder
ECE145A /218CA notes, M. Rodwell, copyrighted
Bipolar Transistor DC-IV Characteristics
ECE145A /218CA notes, M. Rodwell, copyrighted
Bipolar Transistor: Carrier Transit Times
ECE145A /218CA notes, M. Rodwell, copyrighted
Base resistance & collector-base capacitance
Device Stripe Length  LE
perpendicular to drawing
Rbb  contact term  spreading under contact  spreading under emitter
Rbb 
Ccb 
 contact
2  LE  Wb,cont

1 Wb,contact
1 WE
 base_ sheet 
 base_ sheet
6 LE
12 LE
 semiconductorWc Le
Tc
Rbb and Ccb are distributed  splitting of Ccb into Ccbx and Ccbi
Details beyond scope of class (see Rodwell IEEE EDL Nov. 2001, Proc. IEEE Feb. 2008
HBT RC Parasitics
ECE145A /218CA notes, M. Rodwell, copyrighted
base contact width
< 2 transfer lengths
→ simple analysis
Limiting case of
Pulfrey / Vaidyanathan
fmax model.
ECE145A /218CA notes, M. Rodwell, copyrighted
HBT RC Parasitics
Rex  contact,emitter / Aemitter
emitter length LE 
Rspread   sWe / 12 LE
Rgap   sWgap / 4 LE
Rspread,contact   sWbc / 6LE
Rcontact  contact,baseWbc / Abase_ contacts
Ccb,e  Aemitter / Tc
Ccb,gap  Agap / Tc
Ccb,contact  Abase_ contacts / Tc
Base-Collector Time Constant & Fmax.
f max 
f
where
8RbbCcbi
 cb  RbbCcbi  Ccb ,contactRcontact
 Ccb , gap( Rcontact  Rspread,contact  Rgap / 2)
 Ccb ,e ( Rcontact  Rspread,contact  Rgap  Rspread )
ECE145A /218CA notes, M. Rodwell, copyrighted
ECE145A /218CA notes, M. Rodwell, copyrighted
Relationship to HBT Equivalent Circuit Model
Ccbx  Ccbi  Ccb,e  Ccb,gap  Ccb,contact
Rbb  Rspread  Rgap  Rcontact,spread  Rcontact
RbbCcbi  Ccb ,contactRcontact  Ccb, gap( Rcontact  Rspread,contact  Rgap / 2)
 Ccb ,e ( Rcontact  Rspread,contact  Rgap  Rspread )
ECE145A /218CA notes, M. Rodwell, copyrighted
Field-Effect Transistor
Operation (Approximate)
Field-Effect Transistor Operation
source
ECE145A /218CA notes, M. Rodwell, copyrighted
gate
drain
Positive Gate Voltage
→ reduced energy barrier
→ increased drain current
Field-Effect Transistor Operation
source
ECE145A /218CA notes, M. Rodwell, copyrighted
gate
drain
Positive Gate Voltage
→ reduced energy barrier
→ increased drain current
FETs: Basic Operation
Cgs ~ A / D
Id  Q /
ECE145A /218CA notes, M. Rodwell, copyrighted
Cd ch
where   Lg / velectron
Q  CgsVgs  Cd chVds
I d  g m  Vgs  Gds  Vds where g m  Cgs /  and Ggd  Cd ch / 
FET Characteristics
ECE145A /218CA notes, M. Rodwell, copyrighted
ID
increasing
VGS
Cgs ~ A / D
Cd ch
VDS
I d  g m  Vgs  Gds  Vds
g m  Cgs / 
Ggd  Cd ch / 
  Lg / velectron
FET Parasitic Capacitances (Estimate)
Cgd / Wg ~ 
gm / Wg ~ v / Tox
Cgs / Wg ~   Lg / Tox
Cgs, f / Wg ~ 
Csb / Wg ~   Lc / Tsub
ECE145A /218CA notes, M. Rodwell, copyrighted
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