CLD-AP90 Rev 8A
soldering & handling
Cree® XLamp® XB Family LEDs
Introduction
Table of Contents
This application note applies to XLamp® XB Family LEDs which
Handling XLamp® XB Family LEDs..............................................2
have order codes in the following format.
Circuit Board Preparation & Layouts............................................4
Case Temperature (Ts) Measurement Point................................5
XBxxxx-xx-xxxx-xxxxxxxxx
Notes on Soldering XLamp® XB Family LEDs.............................5
Moisture Sensitivity......................................................................7
This application note explains how XLamp XB Family LEDs and
Low Temperature Operation.........................................................7
assemblies containing these LEDs should be handled during
XLamp® XB Family LED Reflow Soldering Characteristics.........8
manufacturing. Please read the entire document to understand
Chemicals & Conformal Coatings................................................9
how to properly handle XLamp XB Family LEDs.
Assembly Storage & Handling................................................... 10
Tape and Reel - XB Family LEDs............................................... 11
www.cree.com/Xlamp
Packaging & Labels................................................................... 12
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective
owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1
XLamp ® XB Family LED Soldering & Handling
Handling XLamp® XB Family LEDs
Manual Handling
Use tweezers to grab XLamp XB Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do
not push on the lens.
Do not apply more than 1000 g of shear force onto the lens. Excessive force on the lens could damage the LED.
P
CORRECT
X
WRONG
Cree recommends the following at all times when handling XLamp XB Family LEDs or assemblies containing these LEDs:
•
Avoid putting excessive mechanical stress on the LED lens.
•
Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect
the optical performance of the LED.
•
Cree recommends always handling XB family LEDs with appropriate ESD grounding.
•
Cree recommends handling XB family LEDs wearing clean, lint‑free gloves.
Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp XB Family LEDs from the factory tape & reel
packaging.
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
2
XLamp ® XB Family LED Soldering & Handling
Handling
XLamp® XB5 Family LEDs - Continued
6
4
3
2
1
REVISONS
Pick & Place Nozzle
NOTICE
CONFIDENTIAL. THIS PLOT AND THE INFORMATION
AINED WITHIN ARE THE PROPRIETARY AND
IDENTIAL INFORMATION OF CREE, INC. THIS PLOT
NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
THORIZED PERSON WITHOUTTHE WRITTEN CONSENT
REE INC.
REV
A
DESCRIPTION
BY
DATE
APP'D
Initial Release
DDS
1/5/12
D. H.
For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles be constructed of
non-metallic materials. Cree and several of Cree’s customers have had good success using nozzles fabricated from 90d urethane. The
following pick & place tools are specific to the XB Family LEDs.
All dimensions in mm.
D
XB-D
2.500
+.100/-.000
4.500
1.125
5.500
C
Add features as required
to interface with customer's tool
4x 15.0°
2.500
+.100/-.000
4x R.200
2.300 ± .050 thru
x 90°
2.400 +.050/-.000
B
XB-E HVW and XB-G HVW
1.50 ± 0.0508
THIRD ANGLE PROJECTION
60°
6
5
4
3
1.750 ± 0.0508
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
.XX ±
.25
.XXX ±
.125
X°
±
.5 °
FOR SHEET METAL PARTS ONLY
.X
±
1.5
.XX ±
.75
.XXX ±
.25
X°
±
.5 °
DATE
DRAWN BY
D. Seibel
4600 Silicon Drive
Durham, N.C 27703
1/5/12
CHECK
DATE
APPROVED
DATE
Phone (919) 313-5300
Fax (919) 313-5558
Don Hirsh
1/5/12
Tool, Pickup-XB-D
MATERIAL
Delrin
SIZE
FINAL PROTECTIVE FINISH
SCALE
SURFACE FINISH: 1.6
2
A
TITLE
C
13.000
REV.
DRAWING NO.
12002494
A
SHEET
1
2.75 ± 0.0508
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
3
OF
1 /1
1.016
0.040
2.600
0.102
A
XLamp ® XB Family LED Soldering & Handling
A
8
8
7
6
7
2.286
0.090
5
6
C
4
5
4
THE INFORMATION THE
CONTAINED
INFORMATION
IN THISCONTAINED
DRAWING ISINTHE
THISSOLE
DRAWING
PROPERTY
IS THE
OFSOLE PROPERTY OF
COUNT ON TOOLS, INC.
COUNT
ANYON
REPRODUCTION
TOOLS, INC. ANY
IN REPRODUCTION
PART OR WHOLEINWITHOUT
PART OR WHOLE WITHOUT
THE WRITTEN PERMISSION
THE WRITTEN
OF COUNT
PERMISSION
ON TOOLS,
OFINC.
COUNT
IS PROHIBITED.
ON TOOLS, INC. IS PROHIBITED.
Handling XLamp® XB Family LEDs - Continued
XB-H
6
5
A
SECTION A-A
4
C
2.45
2.45 C
1.016 1.016
B
0.040 0.040
A
A
2.28
2.28
ITEM
NO.
PART OR
IDENTIFYING NO.
0.65
0.65
DECIMALS
XX = .002
XXX = .001
XXXX = .0002
2.45
2.45
ANGLES
1/2
6
7
Board
Preparation
& Layouts5
CAD GENERATED DRAWING,
DO NOT MANUALLY UPDATE
135°
DATE
APPROVALS
DRAWN
5/15/2014
135°
A
SECTION
SECTION
A-A
A-A
2.29
2.29
A
SCALE
3
REV.
DWG. NO.
SIZE
QUAL ENG
4
QTY
REQD
XBH Assembly
MFG ENG
32
2.286 2.286
0.090 0.090
SPECIFICATION
RESP ENG
DO NOT SCALE DRAWING
C
C Printed
NOMENCLATURE
OR DESCRIPTION
CHECKED
MATERIAL
FINISH
B
2.29
2.29
0.33
0.33
0.36
0.36MATERIAL
PARTS LIST
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
TOLERANCES ARE:
8 Circuit
REV
All dimensions in mm. REV
2.600
0.102 0.102
A
2
3
3
CREE CONFIDENTIAL.
NOTICE THIS PLOT AND THE INFORMATION
CONTAINED
WITHIN ARE
PROPRIETARY
AND
CREE
CONFIDENTIAL.
THISTHE
PLOT
AND
THE
INFORMATION
CONFIDENTIAL
INFORMATION
OF
CREE,
INC.
THIS PLOT
CONTAINED
WITHIN
ARE
THE PROPRIETARY
AND
MAY
NOT
BE
COPIED,
REPRODUCED
OR
DISCLOSED
TO ANY
CONFIDENTIAL
INFORMATION
OF CREE,CONSENT
INC. THIS PLOT
UNAUTHORIZED
PERSON
THE
WITHOUT
WRITTEN
MAY
NOT
BE
COPIED,
REPRODUCED
OR
DISCLOSED
TO ANY
OF CREE INC. PERSON
UNAUTHORIZED
THE
WITHOUT
WRITTEN CONSENT
2.600
OF CREE INC.
A
3
REVISIONS
RE
Rev.
DESCRIPTION DESCRIPTIO
A
PRINT RELEASE
PRINT RELEASE
Rev.
135°
6 & place tool, designed in conjunction
5
4
NOTICE
The following pick
with Count On Tools, is specific
to the XB-H LED.
D
D
D
D
3
2
SHEET
CAD FILE:
OF
1
Thursday, May 15, 2014 11:47:10 AM
B
circuit boards (PCBs) should be preparedR1.53
and/or cleaned according to the manufacturer’s specifications before placing or
0.92
0.92
R1.53
soldering XLamp XB Family LEDs onto the PCB.
PRIMARY
PRIMARY
The diagram below shows the recommended PCB solder pad layout for XLamp XB Family LEDs.
ITEM
NO.
ITEM OR
PART
NO.
IDENTIFYING
NO.
PART OR
IDENTIFYING NO.
NOMENCLATURE
OR DESCRIPTION
PARTS LIST
NOMENCLA
OR DESCRIP
PARTS LIST
UNLESS OTHERWISE
UNLESS
SPECIFIED
OTHERWISE
SPECIFIED
CAD
GENERATED DRAWING,
CAD GENERATED DRAWING,
DIMENSIONS ARE DIMENSIONS
IN INCHES ARE
INCHES
DOIN
NOT
MANUALLY DO
UPDATE
NOT MANUALLY UPDATE
TOLERANCES ARE:TOLERANCES ARE:
All dimensions in mm.
A
2.29
2.29
DECIMALS
A
0.36
0.36
0.92
0.92
MATERIAL
MATERIAL
FINISH
0.39
FINISH
APPROVALS
ANGLES
XX =
1/2 .002 DRAWN 1/2
XXX = .001
CHECKED
XXXX = .0002
32
0.39
8
7
7
6
6
5
5
4
0.85
0.85
2.29
2.29
2.29
2.29
DATE
5/15/2014
5/15/2014
CHECKED
RESP ENG
MFG ENG
MFG ENG
32
4
DATE
APPROVALS
DRAWN
RESP ENG
QUAL
ENG
DO NOT SCALE DRAWING
DO NOT SCALE
DRAWING
8
B
B
XX = .002
XXX = .001
XXXX = .0002
2.29
2.29
0.85
0.85
ANGLES
DECIMALS
XBH As
SIZE
A
QUAL ENG
3
DWG. NO.
SCALE
3
2
CAD
Thursday,Thursday,
May 15, 2014
May
0.25
0.17 0.25
0.17
1.95
1.95
ALL DIMENSI
ALL DIMENSIO
A
A
Recommended PCB Solder Pad
RECOMMENDED PCB SOLDER PAD
RECOMMENDED PCB SOLDER PAD
6
5
Recommended Stencil Pattern
(Hatched
Area is
Opening)
RECOMMENDED
STENCIL
PATTERN
UNLESS OTHERWISE SD
D
DIMENSIONS
ARESP
IN
UNLESS
OTHERWISE
MILLIMETERS
DIMENSIONSAND
AREAFT
INDC
TOLERANCE
UNLESS
S
C
MILLIMETERS
AND
AFTER
RECOMMENDED
STENCIL
PATTERN
(HATCHED AREA IS OPENING)
.XX ±UNLESS
.25 SPA
TOLERANCE
(HATCHED AREA IS OPENING)
.XXX
± .25
.125 A
.XX
±
X° ±± .125
.5°
.XXX
THIRD ANGLE PROJECTION
FOR SHEET
PAM
X° ± METAL
.5°
THIRD ANGLE PROJECTION
M
.X ±METAL
1.5 PART
FOR SHEET
.75
.X.XX
± ±± 1.5
.XXX
.25
F
.XX
X° ±±± .75
.5°
.XXX
.25
FI
1.6
X° ± FINISH:
.5°
SURFACE
1.6
SURFACE FINISH:
4
3
6 Inc. All rights reserved. The information in this5document is subject to change without notice. Cree
4 ® and XLamp® are registered trademarks and the
3 Cree logo is a trademark
Copyright © 2012-2016 Cree,
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
4
XLamp ® XB Family LED Soldering & Handling
Case Temperature (Ts) Measurement Point
XLamp XB Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This
measurement point is shown in the picture below.
Thermocouple site if
no separate pad
Pad for thermocouple
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XB Family LED itself. In testing, Cree has found
such a solder pad to have insignificant impact on the resulting Ts measurement.
Notes on Soldering XLamp® XB Family LEDs
XLamp XB Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the PCB
on a hotplate and following the reflow soldering profile listed on page 8.
Do not wave solder XLamp XB Family LEDs. Do not hand solder XLamp XB Family LEDs.
P
CORRECT
X
WRONG
P
CORRECT
Solder Paste Type
Cree strongly recommends using “no clean” solder paste with XLamp MPL-EZW LEDs
so that cleaning the PCB after reflow soldering is not required. Cree uses the following 5
solder paste internally:
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
XLamp ® XB Family LED Soldering & Handling
Notes on Soldering XLamp® XB Family LEDs - Continued
Solder Paste Type
Cree strongly recommends using “no clean” solder paste with XLamp XB Family LEDs so that cleaning the PCB after reflow soldering is
not required. Cree uses Kester® R276 solder paste internally.
Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
Solder Paste Thickness
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated
dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil
(102-μm) bond line, i.e., the solder joint thickness after reflow soldering.
P
CORRECT
X
WRONG
After Soldering
After soldering, allow XLamp XB Family LEDs to return to room temperature before subsequent handling. Handling of the device, especially
around the lens, before cooling could result in damage to the LED.
Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. This can
be done by X-ray or by shearing selected devices from the circuit board. The solder should appear completely re-flowed (no solder grains
evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning PCBs After Soldering
Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary,
Cree recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
6
XLamp ® XB Family LED Soldering & Handling
Moisture Sensitivity
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Bare XLamp LEDs have a storage
temperature range of -40 °C to 100 °C. However, the MBP, reel, tape and box have a more limited storage temperature range.
Once the MBP is opened, XLamp XB Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life
in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in
the original MBP.
Low Temperature Operation
The minimum operating temperature of these XLamp components is -40 °C.
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
7
XLamp ® XB Family LED Soldering & Handling
XLamp® XB Family LED Reflow Soldering Characteristics
In testing, Cree has found XLamp XB Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a
general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder
paste used.
Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and configurations of
reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
IPC/JEDEC J-STD-020C
Time
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Free Solder
1.2 °C/second
Preheat: Temperature Min (Tsmin)
120 °C
Preheat: Temperature Max (Tsmax)
170 °C
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
1 - 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
8
XLamp ® XB Family LED Soldering & Handling
Chemicals & Conformal Coatings
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and
current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application
Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of
chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer.
Recommended Cleaning Solutions
Cree has found the following chemicals to be safe to use with XLamp XB Family LEDs.
•
Water
•
Isopropyl alcohol (IPA)
Chemicals Tested as Harmful
In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to
XLamp XB Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XB Family LEDs.
The fumes from even small amounts of the chemicals may damage the LEDs.
•
Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
•
Methyl acetate or ethyl acetate (i.e., nail polish remover)
•
Cyanoacrylates (i.e., “Superglue”)
•
Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether)
•
Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive)
Hermetically Sealing Luminaires
For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment
that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically
sealing LEDs in an enclosed space is not recommended.
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
9
XLamp ® XB Family LED Soldering & Handling
Assembly Storage & Handling
Do not stack PCBs or assemblies containing XLamp XB Family LEDs so that anything rests on the LED lens. Force applied to the LED lens
may result in the lens being knocked off. PCBs or assemblies containing XLamp XB Family LEDs should be stacked in a way to allow at
least 1 cm clearance above the LED lens.
Do not use bubble wrap directly on top of XLamp XB Family LEDs. Force from the bubble wrap can potentially damage the LED.
P
CORRECT
P
CORRECT
X
WRONG
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
10
XLamp ® XB Family LED Soldering & Handling
Tape and Reel - XB Family LEDs
4.0±.1
1.5±.1
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
8.0±.1
1.75±.10
Cathode Side
Except as noted, all2.5±.1
dimensions in mm.
+.3
12.0
.0
Anode Side
(denoted by + and circle)
User Feed Direction
END
START
Trailer
160mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
Loaded Pockets
(1,000 Lamps)
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(50 empty pockets min.)
User Feed Direction
Cover Tape
Pocket Tape
13mm
7"
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
11
XLamp ® XB Family LED Soldering & Handling
Packaging & Labels
The diagrams below show the packaging and labels Cree uses to ship XLamp XB Family LEDs. XLamp XB Family LEDs are shipped in tape
loaded on a reel. Each box contains only one reel in a moisture barrier bag.
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin Code,
Quantity, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
(on bottom of box)
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
12