PD3068
Datasheet
Package Mechanical Drawings
Microsemi Corporate Headquarters
One Enterprise, Aliso Viejo,
CA 92656 USA
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Outside the USA: +1 (949) 380-6100
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www.microsemi.com
© 2016 Microsemi Corporation. All
rights reserved. Microsemi and the
Microsemi logo are trademarks of
Microsemi Corporation. All other
trademarks and service marks are the
property of their respective owners.
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of
its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the
application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have
been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any
performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all
performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not
rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to
independently determine suitability of any products and to test and verify the same. The information provided by Microsemi
hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely
with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP
rights, whether with regard to such information itself or anything described by such information. Information provided in this
document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this
document or to any products and services at any time without notice.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for
aerospace & defense, communications, data center and industrial markets. Products include high-performance and
radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products;
timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing
devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and
scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design
capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees
globally. Learn more at www.microsemi.com.
5193068. 60.0 9/16
Contents
1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
1.15
1.16
1.17
1.18
1.19
1.20
1.21
1.22
1.23
1.24
1.25
1.26
1.27
1.28
1.29
1.30
1.31
1.32
1.33
1.34
1.35
1.36
1.37
1.38
1.39
Revision 60.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 59.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 58.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 57.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 56.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 55.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 54.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 53.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 52.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 51.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 50.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 49.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 48.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 47.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 46.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 45.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 44.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 43.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 42.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revsion 41.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revsion 40.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision 39.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revsion v11.4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v11.3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v11.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v11.1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v11.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v10.9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v10.8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v10.7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v10.6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v10.5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v10.4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v10.3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v10.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v10.1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v10.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v9.9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision v9.8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
3
3
3
3
4
4
4
4
4
4
5
5
5
5
5
5
5
5
6
6
6
6
2 Package Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
2.2
Naming Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ceramic Pin Grid Array (CPGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.1
PG84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.2
PG100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PD3068 Datasheet Revision 60.0
7
8
8
9
I
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.2.3
PG132 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2.4
PG175 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.2.5
PG176 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.2.6
PG207 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.2.7
PG257 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Ceramic Quad Flat Pack (CQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.1
CQ84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.3.2
CQ84 Side and Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.3.3
CQ132, CQ172, CQ196, CQ208, CQ256 and CQ352—Cavity Up without Heat Sink . . . . . . 18
2.3.4
CQ208 and CQ256—Cavity Up with Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.3.5
CQ256—Cavity Down without Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.3.6
CQ256—Cavity Down with Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.3.7
CQFP without Heat Sink Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.3.8
CQFP with Heat Sink Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Ceramic Chip Carrier Land Grid Substrate (CCLG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.4.1
CC256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.4.2
CCLG Substrate Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.4.3
LG1657 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Ceramic Column Grid Array (CCGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.5.1
CG484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.5.2
CG624 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.5.3
CG896 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
2.5.4
CCGA Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2.5.5
CG1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
2.5.6
CG1272 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
2.5.7
CG1657 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Plastic Leaded Chip Carrier (PLCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
2.6.1
Plastic Leaded Chip Carrier Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Quad Flat No Lead (QFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2.7.1
QN48 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2.7.2
QN68 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
2.7.3
QN48 and QN68 Quad Flat No Leads Single Row Dimensions. . . . . . . . . . . . . . . . . . . . . . . . 41
2.7.4
Quad Flat No Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.7.5
Quad Flat No Lead Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
2.7.6
QN108 Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
2.7.7
QN132 Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
2.7.8
QN180 Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.7.9
Quad Flat No Leads Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Plastic Quad Flat Pack Rectangular Package (TQ144) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Plastic Quad Flat Pack (PQFP, TQFP, VQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Plastic Quad Flat Pack—Exposed Heatsink (RQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Plastic Quad Flat Pack Rectangular Package (PQ100) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
2.11.1 Plastic Quad Flat Pack (PQFP) Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
2.11.2 Plastic Quad Flat Pack (RQFP/PQFP) Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
2.11.3 Thin Quad Flat Pack (TQFP) Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
2.11.4 Very Thin Quad Flat Pack (VQFP) Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Plastic Ball Grid Array (PBGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
2.12.1 BG272 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
2.12.2 BG313 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
2.12.3 BG329 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
2.12.4 BG456 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
2.12.5 BG729 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
2.12.6 Plastic Ball Grid Array Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Fine Pitch Plastic Ball Grid Array (FBGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
2.13.1 FG144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
2.13.2 FG256 MO-192 VAR DAF1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
2.13.3 FG256 MS-034 VAR AAF-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
PD3068 Datasheet Revision 60.0
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2.15
2.13.4 FG324 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
2.13.5 FG484 MS-034 VAR AAL-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
2.13.6 FG484—Fully Populated MS-034 VAR AAJ-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
2.13.7 FG676 (Option 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
2.13.8 FG676 (Option 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
2.13.9 FG676 (Option 1 and 2) Package Mechanical Drawing Dimensions . . . . . . . . . . . . . . . . . . . . 70
2.13.10 FG484—Fully Populated MS-034 VAR AAJ-1, Larger Mold Cap Size . . . . . . . . . . . . . . . . . . 71
2.13.11 FG896 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
2.13.12 FG896—Larger Mold Cap Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
2.13.13 FG1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
2.13.14 Fine Pitch Plastic Ball Grid Array Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
2.13.15 FC1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
2.13.16 FCV484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
2.13.17 FCV484 Package Mechanical Drawing Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
2.13.18 FC1152 Package Mechanical Drawing Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Chip Scale Package (UC/CS/VF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.14.1 UC36 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.14.2 CS49 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
2.14.3 UC81 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
2.14.4 CS81 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
2.14.5 CS121 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
2.14.6 CS128 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
2.14.7 CS180 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
2.14.8 CS196 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
2.14.9 CS201 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
2.14.10 FCS325 – (Option 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
2.14.11 FCS325 – (Option 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
2.14.12 CS281 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
2.14.13 CS288 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
2.14.14 FCS536 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
2.14.15 CS289 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
2.14.16 Chip Scale Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
2.14.17 VF256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Very Fine Pitch Ball Grid Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
2.15.1 VF400 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
2.15.2 Dimensions of VF400 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
2.15.3 Dimensions of VF256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
PD3068 Datasheet Revision 60.0
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Package Outline of PG84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package Outline of PG100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package Outline of PG132 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package Outline of PG175 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package Outline of PG176 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package Outline of PG207 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package Outline of PG257 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Package Top View of CQ84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Bottom and Side Views of CQ84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
CQ132, CQ172, CQ196, CQ208, CQ256 and CQ352—Cavity Up without Heat Sink . . . . . . . . . . 18
CQ208 and CQ256—Cavity Up with Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
CQ256—Cavity Down without Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
CQ256—Cavity Down with Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Package Outline of CC256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
CCLG Substrate Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Package Outline of LG1657 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Package Outline of CG484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Package Outline of CG624 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Package Outline of CG896 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Package Outline of CG1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Package Outline of CG1272 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Package Outline of CG1657 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Plastic Leaded Chip Carrier (PLCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Package Outline of QN48 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Package Outline of QN68 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Quad Flat No Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Quad Flat No Lead Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Bottom View of QN108 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
QN132 Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Bottom View of QN180 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Plastic Quad Flat Pack Rectangular Package (TQ144) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Plastic Quad Flat Pack (PQFP, TQFP, VQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Plastic Quad Flat Pack—Exposed Heatsink (RQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Plastic Quad Flat Pack Rectangular Package (PQ100) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Package Outline of BG272 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Package Outline of BG313 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Package Outline of BG329 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Package Outline of BG456 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Package Outline of BG729 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Package Outline of FG144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Package Outline of FG256 MO-192 VAR DAF1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Package Outline of FG256 MS-034 VAR AAF-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Package Outline of FG324 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Package Outline of FG484 MS-034 VAR AAL-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
FG484—Fully Populated MS-034 VAR AAJ-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Package Outline of FG676 (Option 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Package Outline of FG676 (Option 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Package Outline of FG484 MS-034 VAR AAJ-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Package Outline of FG896 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
FG896 Larger Mold Cap Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Package Outline of FG1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Package Outline of FC1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Package Outline of FCV484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Package Outline of UC36 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
PD3068 Datasheet Revision 60.0
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Package Outline of CS49 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of UC81 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of CS81 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of CS121 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of CS128 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of CS180 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of CS196 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of CS201 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of FCS325 (Option 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of FCS325 (Option 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of CS281 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of CS288 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of FCS536 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of CS289 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of VF256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline of VF400 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Table 8
Table 9
Table 10
Table 11
Table 12
Table 13
Table 14
Table 15
Table 16
Table 17
Table 18
Table 19
Table 20
Table 21
Table 22
Table 23
Table 24
Table 25
Table 26
Table 27
Table 28
Table 29
Table 30
Table 31
Table 32
Table 33
Table 34
Table 35
Table 36
Table 37
Table 38
Table 39
Table 40
Table 41
Table 42
Table 43
Table 44
Table 45
Table 46
Table 47
Table 48
Table 49
Table 50
Table 51
Table 52
Table 53
Table 54
Package Naming Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Supported Devices for PG84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Supported Devices for PG100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Supported Devices for PG132 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Supported Devices for PG175 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Supported Devices for PG176 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Supported Devices for PG207 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Supported Devices for PG257 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Supported Devices for CQ84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Plate Thickness for CQ84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Lid Size for CQ84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Supported Devices for CQ132, CQ172, CQ196, CQ208, CQ256, and CQ352 . . . . . . . . . . . . . . . 19
Supported Devices for CQ208 and CQ256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Supported Devices for CQ256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Supported Devices for CQ256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Dimensions for CQFP without Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Dimensions for CQFP with Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Supported Devices for CC256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Supported Devices for LG1657 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Supported Devices for CG484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Supported Devices for CG624 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Supported Devices for CG896 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Dimensions of CCGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Supported Devices for CG1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Supported Devices for CG1272 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Supported Devices for CG1657 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Supported Devices for PL44, PL68, and PL84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Plastic Leaded Chip Carrier Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Supported Devices for QN48 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Supported Devices for QN68 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
QN48 and QN68 Quad Flat No Leads Single Row Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Supported Devices for QN108 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Supported Devices for QN132 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Supported Devices for QN180 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Dimensions of Quad Flat No Leads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Dimensions for QN108, QN132, and QN180 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Supported Devices for Plastic Quad Flat Pack Rectangular Package . . . . . . . . . . . . . . . . . . . . . . 53
Plastic Quad Flat Pack (PQFP) Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Plastic Quad Flat Pack (RQFP/PQFP) Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Supported Devices for Quad Slat (TQ/VQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Thin Quad Flat Pack (TQFP) Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Very Thin Quad Flat Pack (VQFP) Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Supported Devices for BG272 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Supported Devices for BG313 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Supported Devices for BG329 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Supported Devices for BG456 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Supported Devices for BG729 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Plastic Ball Grid Array Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Supported Devices for FG144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Supported Devices for FG256 MO-192 VAR DAF1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Supported Devices for FG256 MS-034 VAR AAF-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Supported Devices for FG324 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Supported Devices for FG484 MS-034 VAR AAL-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Supported Devices for FG484 Fully Populated MS-034 VAR AAJ-1 . . . . . . . . . . . . . . . . . . . . . . . 67
PD3068 Datasheet Revision 60.0
VI
Table 55
Table 56
Table 57
Table 58
Table 59
Table 60
Table 61
Table 62
Table 63
Table 64
Table 65
Table 66
Table 67
Table 68
Table 69
Table 70
Table 71
Table 72
Table 73
Table 74
Table 75
Table 76
Table 77
Table 78
Table 79
Table 80
Table 81
Table 82
Table 83
Table 84
Table 85
Table 86
Table 87
Table 88
Table 89
Table 90
Table 91
Supported Devices for FG676 (Option 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Supported Devices for FG676 (Option 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Dimensions of FG676 (Option 1 and 2) Package Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . 70
Supported Devices for FG484 MS-034 VAR AAJ-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Supported Devices for FG896 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Supported Devices for FG896 Larger Mold Cap Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Supported Devices for FG1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Fine Pitch Plastic Ball Grid Array Dimensions for FG144, FG256, and FG324 . . . . . . . . . . . . . . . 75
Fine Pitch Plastic Ball Grid Array Dimensions for FG484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Fine Pitch Plastic Ball Grid Array Dimensions for FG896 and FG1152 . . . . . . . . . . . . . . . . . . . . . 76
Supported Devices for FC1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Supported Devices for FCV484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
FCV484 Package Mechanical Drawing Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Dimensions of FC1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Supported Devices for UC36 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Supported Devices for CS49 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Supported Devices for UC81 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Supported Devices for CS81 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Supported Devices for CS121 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Supported Devices for CS128 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Supported Devices for CS180 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Supported Devices for CS196 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Supported Devices for CS201 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Supported Devices for FCS325 (Option 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Supported Devices for FCS325 (Option 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Supported Devices for CS281 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Supported Devices for CS288 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Supported Devices for FCS536 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Supported Devices for CS289 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Chip Scale Package Dimensions for UC36, CS49, UC81, and CS81 . . . . . . . . . . . . . . . . . . . . . . 95
Chip Scale Package Dimensions for CS121, CS128, CS180, CS196, and CS201 . . . . . . . . . . . . 95
Chip Scale Package Dimensions for FC325 and FC536 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Chip Scale Package Dimensions for CS281, CS288, and CS289 . . . . . . . . . . . . . . . . . . . . . . . . . 96
Supported Devices for VF256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Supported Devices for VF400 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Dimensions of VF400 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Dimensions of VF256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
PD3068 Datasheet Revision 60.0
VII
Revision History
1
Revision History
The revision history describes the changes that were implemented in the document. The changes are
listed by revision, starting with the most current publication.
1.1
Revision 60.0
The following is a summary of the changes in revision 60.0 of this document.
•
•
•
•
•
•
•
•
1.2
Updated CG1657, page 36 by removing C1 pin (SAR 78574)
Updated FG896—Larger Mold Cap Size, page 73 image (SAR 49423)
Updated Fine Pitch Plastic Ball Grid Array Dimensions, page 75 table for D2 and E2 options (SAR
49423)
Updated Fine Pitch Plastic Ball Grid Array Dimensions, page 75 table for in correct decimal values
for A1 FG484 (SAR 51031)
Removed Note in Fine Pitch Plastic Ball Grid Array Dimensions, page 75 (SAR 58283)
Updated CS325 to FCS325 and CS536 to FCS536 throughout the document (SAR 62909)
Added CQ352 MO-134 VAR AE in CQFP without Heat Sink Dimensions, page 24 (SAR 82812)
Added note for CQFP without Heat Sink Dimensions, page 24 (SAR 82812)
Revision 59.0
Updated the FG676 (Option 2), page 69 bottom view diagram for the corner pin balls (SAR 76003).
1.3
Revision 58.0
Updated the M2S060 and M2GL060 device details in the FG676 (Option 2), page 69, FG484—Fully
Populated MS-034 VAR AAJ-1, Larger Mold Cap Size, page 71, FCS325 – (Option 1), page 89, and
VF400, page 98 (SAR 69566).
1.4
Revision 57.0
The following is a summary of the changes in revision 57.0 of this document.
•
•
•
•
•
1.5
Updated VF256, page 97 mechanical drawing (SAR 66875).
Updated Dimensions of VF400, page 99 (SAR 66875).
Updated "FG484 (page 63) (23x23 Fully Populated) MS-034 VAR AAJ-1 with Larger Mold Cap"
Package Mechanical Drawing Dimensions (SAR 64737).
Removed RTAX4000D from CG1272, page 35 support devices (SAR 66765).
Added CG1657, page 36 package and LG1657, page 29 (SAR 66765).
Revision 56.0
Updated FG676 (Option 2), page 69 mechanical drawing (SAR 62340).
1.6
Revision 55.0
Added the mechanical drawing of the Plastic Quad Flat Pack Rectangular Package (TQ144), page 49
package. Removed the mechanical drawing of the VQ144 package and VQ144 Package Mechanical
Drawing Dimensions. (SAR 61533).
1.7
Revision 54.0
Added the mechanical drawing of the FCV484, page 78 package and FCV484 Package Mechanical
Drawing Dimensions, page 79 (SAR 54037).
1.8
Revision 53.0
Added the mechanical drawing of the FCS536, page 93 package and "FCS536" Package Mechanical
Drawing Dimensions (SAR 60514).
PD3068 Datasheet Revision 60.0
1
Revision History
1.9
Revision 52.0
Updated the mechanical drawing of the FCS325 – (Option 2), page 90 package and FCS325 (Option 2)
Package Mechanical Drawing Dimensions (SAR 58504).
1.10
Revision 51.0
Corrected the reference device support for "VQ144" (SAR 58334).
1.11
Revision 50.0
Corrected the pitch (e) on the VQ144 from 0.05 BSC to 0.50 BSC in "Plastic Quad Flat Pack Rectangular
Package (VQ144) Dimensions" section (SAR 57666).
1.12
Revision 49.0
The following is a summary of the changes in revision 49.0 of this document.
•
•
•
•
•
•
•
•
•
1.13
Updated Note 2 and Note 3 for CG1152, page 34 package outline drawing (SAR 55805).
Updated Note 2 and Note 3 for Ceramic Column Grid Array (CCGA), page 30 package outline
drawing (SAR 55805).
Added note QN180 Bottom View, page 46, "QN132 Bottom View" and "QN180 Bottom View"
packages in the document (SAR 56846).
Added "Plastic Quad Flat Pack Rectangular Package (VQ144)" package outline drawings and
supported devices.Added "Plastic Quad Flat Pack Rectangular Package (VQ144) Dimensions"
(SAR 53464).
Renamed FG676 (Option 1), page 68 and FG676 (Option 2), page 69 (SAR 54063).
Updated FG676 (Option 2), page 69 package outline drawing (SAR 55191).
Updated the mechanical drawing of the FCS325 – (Option 1), page 89 package and "FCS325
(Option 1)" Package Mechanical Drawing Dimensions (SAR 53464).
Added Chip Scale Package (UC/CS/VF), page 80 package outline drawing and added "FCS325
(Option 2)" Package Mechanical Drawing Dimensions (SAR 53464).
Added VF256, page 97 package outline drawing and also added Dimensions of VF400, page 99
(SAR 53464).
Revision 48.0
Updated the mechanical drawing of FG896—Larger Mold Cap Size, page 73 package (SAR 49607).
1.14
Revision 47.0
Added FG676 (Option 2), page 69, FC1152, page 77, and FCS325 – (Option 1), page 89 package outline
drawings and supported devices (SAR 51485).
1.15
Revision 46.0
Updated the mechanical 3awing of the VF400, page 98 package (SAR 49374).
1.16
Revision 45.0
Updated the Supported Devices details for FG484—Fully Populated MS-034 VAR AAJ-1, Larger Mold
Cap Size, page 71, FG896—Larger Mold Cap Size, page 73, and VF400, page 98 (SAR 48235).
1.17
Revision 44.0
The following is a summary of the changes in revision 44.0 of this document.
•
•
•
Table 2.1, page 7 was updated to include the VFPBA package.
The cross-reference to the CQFP with Heat Sink Dimensions, page 25 dimensions table was
corrected in the table notes for the CQ208 and CQ256—Cavity Up with Heat Sink, page 20 section
(SAR 44419).
AGL250 was added as a supported device in the CS81, page 83 section
(SAVF256_Package_Outline_Drawing R 43697).
PD3068 Datasheet Revision 60.0
2
Revision History
•
1.18
The VF400, page 98 is new (47028).
Revision 43.0
The following is a summary of the changes in revision 43.0 of this document.
•
•
1.19
A2F060 was added as a supported device for "TQ144" (SAR 43622).
The FG484—Fully Populated MS-034 VAR AAJ-1, Larger Mold Cap Size, page 71 and FG896—
Larger Mold Cap Size, page 73 section are new. These packages are new for the SmartFusion2
family and differ from the existing FG484 and FG896 packages due to a larger mold cap and the pin
gate feature, which prevents marking in the center of the package (SAR 42898).
Revision 42.0
Added new note in Fine Pitch Plastic Ball Grid Array Dimensions, page 75 (SAR 35957).
1.20
Revsion 41.0
Removed “RTSX72SU” from "CQ208" and "CQ256" columns in Table 12, page 19 (SAR 32881).
1.21
Revsion 40.0
The following is a summary of the changes in revision 40.0 of this document.
•
•
•
•
•
•
•
•
•
Table 2.1, page 7 was added. References to packages throughout the document were changed in
conformance with the conventions (SAR 27395).
The supported devices listings for the following packages were updated and corrected (SAR 27395):
•
PG100, page 9 – Obsolete for 1415A
•
PG175, page 11 – Obsolete for A1440A
•
CQ84, page 15 – Obsolete for A32100DX
•
"CQ208" – Supported for AX250 and AX500 (SAR 26344)
•
"CQ256" – Supported for AX2000 (SAR 22918), RT3PE600L, and RT3PE3000L
•
"CQ352" – Supported for RTAX4000S (SAR 30672), RTAX2000D, and RTAX4000D
•
CG624, page 31 – Supported for RTAX250S
•
CG1152, page 34 – Supported for RTAX2000S, not RTAX4000S
•
Ceramic Column Grid Array (CCGA), page 30 – Supported for RTAX2000D and RTAX4000D
•
"PL84" – Obsolete for A3265A
•
"QN132" – Not supported for M1ASGL250 or M1A3P250
•
"PQ144" – Obsolete for A1240XL
•
"PQ208" – Not supported for M1A3PE600. Supported for A2F200 and A2F500 (SAR 31179)
•
"BG272" – Obsolete for A500K050 and A500K130
•
"FG256 MO-192 VAR DAF1" – Supported for M1AGL600
•
FG484—Fully Populated MS-034 VAR AAJ-1, page 67 – Not supported for M1A3P600 or
M1A3PE600
•
"CS49" – Obsolete for eX64 and eX128
•
"CS128" – Obsolete for eX64, eX128, and eX256
•
"CS180" – Obsolete for AX125 and eX256
The lid size table for the CQ84, page 15 package was updated to add dimensions for RT1020 (SAR
27395).
The CQ84 Side and Bottom View, page 16 diagram was revised to add additional dimensions to the
side view, noting the maximum distances between the lead and the top of the package (SAR 27406).
Corrected the CG484, page 30 diagram by removing the pin in the A1 position (SAR 30549).
The CG896, page 32 package drawing was corrected to show the chamfered corner is at A1 (SAR
30227).
The CG1152, page 34 and Ceramic Column Grid Array (CCGA), page 30 package drawings were
revised to add the CLGA side view (SARs 29751, 30553).
The FG896, page 72 diagram was corrected to show the D1 dimension extends from pin 1 to pin 30.
Previously the diagram showed that D1 extended from pin 1 to pin 29 (SAR 26792).
The FG1152, page 74 diagram was corrected to show the D1 dimension extends from pin 1 to pin
34. Previously the diagram showed that D1 extended from pin 1 to pin 33 (SAR 26792).
PD3068 Datasheet Revision 60.0
3
Revision History
•
•
•
1.22
In the Fine Pitch Plastic Ball Grid Array Dimensions, page 75 table, dimension c for FG256 MO-192
VAR DAF1 was corrected to 0.4 to 0.6 mm. Previously it was 0.25 to 1.10 mm (SAR 28605).
A second FG896 package was added to the Fine Pitch Plastic Ball Grid Array Dimensions, page 75
table. It differs from the first FG896 package only in the D2 and E2 dimensions.
The VF289 package name was changed back to CS289, page 94 (SAR 27395).
Revision 39.0
The following is a summary of the changes in revision 39.0 of this document.
•
•
•
•
•
•
•
1.23
The versioning system has been changed. This document is assigned a revision number that
increments each time the document is updated.
SmartFusion devices A2F060, A2F200, and A2F500 were added to the supported devices table for
the FG256 MO-192 VAR DAF1, page 63 and Fine Pitch Plastic Ball Grid Array (FBGA), page 62
(SAR 25571).
SmartFusion devices A2F200 and A2F500 were added to the supported devices table for the
FG484—Fully Populated MS-034 VAR AAJ-1, page 67 Fine Pitch Plastic Ball Grid Array (FBGA),
page 62 (SAR 25571).
The following package names were changed:
•
36-Pin CSP was changed to UC36, page 80
•
289-Pin CSP was changed to CS289, page 94
The side views in the following Chip Scale Package (UC/CS/VF), page 80 drawings were corrected
to show half sphere bumps instead of solder balls (SAR 26665):
•
UC36, page 80
•
UC81, page 82
•
CS81, page 83
The CS288, page 92 Chip Scale Package (UC/CS/VF), page 80 section is new (SAR 27106).
The A1 dimension values were changed to 0.07 REF in the Table 2.14.16, page 95 for UC36,
page 80, UC81, page 82, and CS81, page 83 (SAR 26432). The c dimension values were changed
to 0.21 REF. The text, “MO-195, Variation AB,” was deleted from the heading for these two
packages. The b dimension values for the CS81, page 83 package were revised.
Revsion v11.4
The "CCGA Dimensions" table was updated. The D1 and E1 dimensions for CG484 were changed from
22.00 to 21 (SAR 22814).
1.24
Revision v11.3
Updated dimension for FBGA 144 package in the Fine Pitch Plastic Ball Grid Array Dimensions, page 75
table.
1.25
Revision v11.2
A54SX16 was removed from the CQ256—Cavity Down with Heat Sink, page 23.
1.26
Revision v11.1
The following is a summary of the changes in revision v11.1 of this document.
•
•
•
•
1.27
The ccc specification was changed from 0.10 to 0.08 in the Plastic Quad Flat Pack (RQFP/PQFP)
Dimensions, page 54 table.
The ccc specification was changed from 0.10 to 0.08 for the TQFP 167 in theThin Quad Flat Pack
(TQFP) Dimensions, page 55 table.
The ccc specification was changed from 0.10 to 0.08 for the CSP 289 in theChip Scale Package
Dimensions, page 95 table.
In the Fine Pitch Plastic Ball Grid Array Dimensions, page 75 table, the following specs were
updated for the FG256 MO-192 VAR DAF1, page 63:A, A1, and c.
Revision v11.0
The following is a summary of the changes in revision v11.0 of this document.
PD3068 Datasheet Revision 60.0
4
Revision History
•
•
•
1.28
The document has been updated to include IGLOO nano packages.
The "QN48" section is new.
The UC36, page 80 section is new.
Revision v10.9
The AGL400 device is new and has been added to FG144, page 62, FG256 MO-192 VAR DAF1,
page 63, FG484—Fully Populated MS-034 VAR AAJ-1, page 67, and CS196, page 87.
1.29
Revision v10.8
The following is a summary of the changes in revision v10.8 of this document.
•
•
•
•
1.30
The CG484, page 30 section is new.
The CG896, page 32 is new.
Data for the 484 and 896 CCGA/LGA packages was added to the Table 2.5.4, page 33.
In the Table 2.7.9, page 47, “d” was deleted.
Revision v10.7
The following is a summary of the changes in revision v10.7 of this document.
•
•
1.31
"VQ128" and "VQ176" were added to the VQFP "Supported Devices" table.
"VQ128 MS-026 VAR AEE3" and "VQ176 MS-026 VAR BFC" dimension data are new.
Revision v10.6
The following is a summary of the changes in revision v10.6 of this document.
•
•
1.32
A3PE600L was added to the supported devices table of the FG484—Fully Populated MS-034 VAR
AAJ-1, page 67 package.
The following specifications have been updated for the FG256 MO-192 VAR DAF1, page 63:
•
DimensionNew Data
•
A1.80
•
A10.35 and 0.45
•
c0.35 and 0.60
Revision v10.5
The following is a summary of the changes in revision v10.5 of this document.
•
•
•
1.33
bbb has been removed from all chip scale package drawings.
The Detail A circle on the side view was added to the CS288, page 92 package drawing.
The CS289, page 94 information is new.
Revision v10.4
Note 2 under the Quad Flat No Lead (QFN), page 39 package drawing is new and bottom view has been
removed from the heading.
1.34
Revision v10.3
The following is a summary of the changes in revision v10.3 of this document.
•
•
•
1.35
The note under the QN108 Bottom View, page 44 package drawing is new.
The note under the QN132 Bottom View, page 45 package drawing is new. The figure was also
updated to include D1 to D4.
The note under the QN180 Bottom View, page 46 package drawing is new. The figure was also
updated to include D1 to D4.
Revision v10.2
M1A3P250L was deleted; it is no longer supported.
PD3068 Datasheet Revision 60.0
5
Revision History
1.36
Revision v10.1
In Detail A, the A1 top arrow was incorrectly placed. It was originally at the top of the substrate and it has
been moved to the bottom of the substrate in.
1.37
Revision v10.0
The following is a summary of the changes in revision v10.0 of this document.
•
•
•
•
1.38
In the CC256, page 26 figure, one of the side view dimensions was updated from 0.45±0.05 to
0.254±0.025.
The CS201, page 88 section is new.
In the CS288, page 92 supported devices, the AGLP125 was added to the table.
In the Chip Scale Package Dimensions, page 95 table, several CS package dimensions were
updated and the CS201 information is new. Please review carefully.
Revision v9.9
The Ø symbol was missing from all CCGA, PBGA, FBGA, and CSP figures. It has been added back into
the document.
1.39
Revision v9.8
The Quad Flat No Lead (QFN), page 39 section, which includes the mechanical drawings and dimension
measurements, is new.
PD3068 Datasheet Revision 60.0
6
Package Mechanical Drawings
2
Package Mechanical Drawings
2.1
Naming Conventions
This document lists all the package types used for Microsemi FPGAs and provides detailed drawings and
dimensions. The following table lists the package types, their acronyms, and the naming convention used
when referring to a package of that type with a particular pin count.
Table 1 •
Package Naming Conventions
Package Type
Ceramic Packages
Package Name
Acronym
Ceramic Pin Grid Array
CPGA
PG84
Ceramic Quad Flat Pack
CQFP
CQ208
Ceramic Chip Carrier Land Grid Substrate
CCLG
CC256
Ceramic Column Grid Array
CCGA
CG484
Ceramic Land Grid Array
CLGA
LG484
QFN
QN48
Plastic Packages
Quad Flat No Lead
(leadframe-based, peripheral
Plastic Quad Flat Pack
leads)
Thin Quad Flat Pack
PQFP
PQ208
TQFP
TQ144
Very Thin Quad Flat Pack
VQFP
VQ176
Plastic Quad Flat Pack (exposed heatsink)
RQFP
RQ208
Plastic Leaded Chip Carrier
PLCC
PL44
PBGA
BG272
FBGA
FG144
CSP
CS81
CSP
CS49
Micro Chip Scale Package
UCS
UC36
Very Fine Ball Pitch Grid Array
VFPBA
VF400
Plastic Packages
Plastic Ball Grid Array (1.27 mm pitch)
(substrate-based, area array
Fine Pitch Plastic Ball Grid Array (1.00 mm
pins)
pitch)
Chip Scale Package (0.50 mm pitch)
Chip Scale Package (0.80 mm
1.
Package/Pin Naming
Convention (example)
pitch)1
Currently the CS49, CS128, CS180, and CS289 packages are 0.80 mm pitch rather than 0.50 mm pitch.
PD3068 Datasheet Revision 60.0
7
Package Mechanical Drawings
2.2
Ceramic Pin Grid Array (CPGA)
The following figures show package outlines for various packages under CPGA.
2.2.1
PG84
The following figure shows the package outline of PG84.
Figure 1 •
Package Outline of PG84
Top View
0.050" ± 0.010"
Pin #1 ID
0.045"
0.055"
0.015"
0.018" ± 0.002"
0.100" BSC
1.100" ± 0.020" square
0.072"
0.088"
L
0.120"
0.140"
Side View
K
J
H
G
F
1.000" BSC
E
D
C
B
A
1
2
3
Orientation
Pin
4
5
6
7
8
9
10 11
Bottom View
Note: All dimensions are in inches unless otherwise stated.
Note: BSC = Basic spacing between centers.
The following table shows the supported devices for PG84.
Table 2 •
Supported Devices for PG84
Supported Devices
A1010B
A1020B
PD3068 Datasheet Revision 60.0
8
Package Mechanical Drawings
2.2.2
PG100
The following figure shows the package outline of PG100.
Figure 2 •
Package Outline of PG100
Top View
0.072"
0.88"
Pin #1 ID
0.0 5"
0.055"
0.01
± 0.00 "
0.100" BSC
0.015"
0.050" ± 0.010"
1.100" ± 0.015" square
0.120"
0.140"
Side View
1.000" BSC
1
5
10 11
Orientation
Pin
Bottom View
Note: All dimensions are in inches unless otherwise stated.
Note: BSC = Basic spacing between centers.
The following table lists the supported device for PG100.
Table 3 •
Supported Devices for PG100
Supported Devices
A1225XL1
1.
A1415A1
This product is obsolete.
PD3068 Datasheet Revision 60.0
9
Package Mechanical Drawings
2.2.3
PG132
The following figure shows the package outline of PG132.
Figure 3 •
Package Outline of PG132
Top View
0.072"
0.088"
Pin #1 ID
0.045"
0.055"
0.018" ± 0.002"
0.015"
0.100" BSC
0.050" ± 0.010"
1.360" ± 0.015" square
0.120"
0.140"
N
Side View
M
L
K
J
H
G
1.200" BSC
F
E
D
C
B
A
1 2 3 4
Orientation
Pin
5
6
7
8
9
10 11 12 13
Bottom View
Note: All dimensions are in inches unless otherwise stated.
Note: BSC = Basic spacing between centers.
The following table lists the supported device for PG132.
Table 4 •
Supported Devices for PG132
Supported Devices
A1240A
1.
A1240XL1
This product is obsolete.
PD3068 Datasheet Revision 60.0
10
Package Mechanical Drawings
2.2.4
PG175
The following figure shows the package outline of PG175.
Figure 4 •
Package Outline of PG175
Top View
Index Mark
0.100" BSC
0.018" ± 0.002"
0.05" ± .0005"
0.130" ± 0.010"
0.050" ± 0.005"
0.105" ± 0.010"
1.570" ± 0.015" square
Side View
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1.400" BSC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Bottom View
Note: All dimensions are in inches unless otherwise stated.
Note: BSC = Basic spacing between centers.
The following table shows the supported device for PG175.
Table 5 •
Supported Devices for PG175
Supported Devices
A1440A1
1.
This product is obsolete.
PD3068 Datasheet Revision 60.0
11
Package Mechanical Drawings
2.2.5
PG176
The following figure shows the package outline of PG176.
Figure 5 •
Package Outline of PG176
Top View
Index Mark
0.105" ± 0.010"
0.100" BSC
0.018" ± 0.002"
0.05" ± 0.005"
0.050" ± 0.005"
1.570" ± 0.015" square
0.120"
0.140"
Side View
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1.400" BSC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Bottom View
Note: All dimensions are in inches unless otherwise stated.
Note: BSC = Basic spacing between centers.
The following table lists the supported devices for PG176.
Table 6 •
Supported Devices for PG176
Supported Devices
A1280A
1.
A1280XL1
This product is obsolete.
PD3068 Datasheet Revision 60.0
12
Package Mechanical Drawings
2.2.6
PG207
The following figure shows the package outline of PG207.
Figure 6 •
Package Outline of PG207
Top View
Index Mark
0.115" ± 0.011"
0.100" BSC
0.018" ± 0.002"
0.05" ± 0.005"
0.180" ± 0.010"
1.77" ± 0.010" square
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
0.05" ± 0.005"
Side View
1.600" BSC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
Bottom View
Note: All dimensions are in inches unless otherwise stated.
Note: BSC = Basic Spacing between Center.
The following table shows the supported device for PG207.
Table 7 •
Supported Devices for PG207
Supported Devices
A1460A
PD3068 Datasheet Revision 60.0
13
Package Mechanical Drawings
2.2.7
PG257
The following figure shows the package outline of PG257.
Figure 7 •
Package Outline of PG257
Top View
0.105" ± 0.012"
Index Mark
0.100" BSC
0.018" ± 0.002"
0.05" ± 0.005"
0.005" ± 0.005"
0.120"
0.140"
1.970" ± 0.015" square
Side View
Y
X
V
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1.800" ± 0.012
1 2 3 4 5 6 7 8 9 10111213141516171819
Bottom View
Note: All dimensions are in inches unless otherwise stated.
Note: BSC = Basic spacing between centers.
The following table shows the package outline of PG257.
Table 8 •
Supported Devices for PG257
Supported Devices
A14100A
2.3
Ceramic Quad Flat Pack (CQFP)
The following figures show package outlines for various packages under CQFP.
PD3068 Datasheet Revision 60.0
14
Package Mechanical Drawings
2.3.1
CQ84
The following figure shows the package top view of CQ84.
Figure 8 •
Package Top View of CQ84
Top View
Note: Units are in mm.
Note: LID and die attach area must be connected to ground (GND).
PD3068 Datasheet Revision 60.0
15
Package Mechanical Drawings
2.3.2
CQ84 Side and Bottom View
The following figure shows the package side and bottom view of CQ84.
Figure 9 •
Bottom and Side Views of CQ84
Bottom View
(2.55)
(2.15)
(2.40)
DEPTH
(2.05)
DEPTH (0.45)
INDEX MARK
4X
(0.76 × 45º)
MAX. 2.31
(PLATING OPTION)
CHAMFER
MAX. 2.00
1.77 ± 0.18
64
84
64
24.13 ± 0.25
1
4X
2.15 ± 0.25
CERAMIC
21
43
42
22
BRAZED
Ag-Cu ALLOY
LEAD MATERIAL
(1.25)
Fe-Ni-Co ALLOY
(1.10)
(DEPTH 0.45)
4X
0.889
4X
Side View
Note: Units are in mm.
Note: LID and die attach area must be connected to ground (GND).
The following table shows the supported devices for CQ84.
Table 9 •
Supported Devices for CQ84
Supported Devices
A1020B
RT10201
A32100DX1
RH10201
A54SX32A
RT54SX32S1, RTSX32SU
1.
This product is obsolete.
PD3068 Datasheet Revision 60.0
16
Package Mechanical Drawings
Table 10 •
Plate Thickness for CQ84
Plate Thickness
Ni Plating
2.03~8.89 micron
Au Plating
2.54 micron min.
Table 11 •
Lid Size for CQ84
Lid Size
A
B
13.21
13.21
13.97
13.97
A54SX32A
13.21
13.21
RH10201
13.21
13.21
RT10201
13.21
13.21
10.54
13.61
A1020B
A32100DX
1
RT54SX32S1,
1.
RTSX32SU
This product is obsolete.
PD3068 Datasheet Revision 60.0
17
Package Mechanical Drawings
2.3.3
CQ132, CQ172, CQ196, CQ208, CQ256 and CQ352—Cavity Up
without Heat Sink
The following figure shows the dimensions, top view and side view of CQ132, CQ172, CQ196, CQ208,
CQ256 and CQ352—Cavity Up devices without Heat Sink.
Figure 10 • CQ132, CQ172, CQ196, CQ208, CQ256 and CQ352—Cavity Up without Heat Sink
Top View
H
D1
D2
Number 1
Ceramic
Tie Bar
L1
E2
E1
K
F
b
e
Side View
Lid
A
A1
C
Lead Kovar
Note: All dimensions are in inches except for CQ208, CQ256, and CQ352, which are in millimeters. For more
information on dimensions, see CQFP without Heat Sink Dimensions, page 24.
Note: Outside lead frame holes (from dimension H) are circular for the CQ208, CQ256, and CQ352.
Note: Seal ring and lid are connected to Ground.
PD3068 Datasheet Revision 60.0
18
Package Mechanical Drawings
Note: Packages are shipped with the uniform ceramic tie bar in a test carrier.
Table 12 •
Supported Devices for CQ132, CQ172, CQ196, CQ208, CQ256, and CQ352
Supported Devices
CQ132
CQ172
CQ196
CQ208
CQ256
CQ352
A1425A
RT1425A
A1280A
RH12801
RT1280A
A1460A
RT1460A
A42MX36
AX250
AX500
A54SX16
A54SX32
A54SX32A
A54SX72A
APA300
APA600
APA1000
RT54SX32S1
RTSX32SU
RTAX250S
A14100A
AX2000
A54SX32A
A54SX72A
RT14100A
RT54SX32S1
RTSX32SU
RTAX2000S
RT3PE600L
RT3PE3000L
AX250
AX500
AX1000
AX2000
APA300
APA600
APA1000
RTAX250S
RTAX1000S
RTAX2000S
RTAX4000S
RTAX2000D
RTAX4000D
1.
This product is obsolete.
PD3068 Datasheet Revision 60.0
19
Package Mechanical Drawings
2.3.4
CQ208 and CQ256—Cavity Up with Heat Sink
Figure 11 • CQ208 and CQ256—Cavity Up with Heat Sink
Top View
H
D1
D2
Number 1
Ceramic
Tie Bar
L1
E2 E1
K
F
e
b
Side View
Lid
A1
A
Heat Sink
C
Lead Kovar
Note: All dimensions are in inches except for CQ208, CQ256, and CQ352, which are in millimeters. For more
information on dimensions, see CQFP with Heat Sink Dimensions, page 25.
Note: Outside lead frame holes (from dimension H) are circular for the CQ208, CQ256, and CQ352 devices.
Note: Seal ring and lid are connected to the Ground.
Note: Lead material is Kovar with minimum of 60 microinches gold over nickel.
Note: Packages are shipped with the uniform ceramic tie bar.
PD3068 Datasheet Revision 60.0
20
Package Mechanical Drawings
The following table lists the supported devices for CQ208 and CQ256.
Table 13 •
Supported Devices for CQ208 and CQ256
Supported Devices
CQ208
CQ256
A32200DX1
A54SX16
A54SX32
RT54SX72S1
RTSX72SU
RT54SX72S1
RTSX72SU
1.
This product is obsolete.
PD3068 Datasheet Revision 60.0
21
Package Mechanical Drawings
2.3.5
CQ256—Cavity Down without Heat Sink
Figure 12 • CQ256—Cavity Down without Heat Sink
Top View
L1
D1
F
D2
256
1
Lid
H K
e
E2
E1
b
Side View
Lead Material
Fe–Ni–Co Alloy
Lid
A
A1
c
Note: Dimensions are in millimeters. For more information on dimensions, see CQFP with Heat Sink
Dimensions, page 25.
Note: Seal ring and lid are connected to Ground.
Note: Lead material is Kovar with gold plate over nickel.
Note: Packages are shipped with the uniform with the ceramic tie bar.
Note: Package is cavity down, with the lid facing the bottom of the package. However, the leads can be formed
on either side if the application requires the lid to be facing the top.
PD3068 Datasheet Revision 60.0
22
Package Mechanical Drawings
The following table lists the supported device for CQ256.
Table 14 •
Supported Devices for CQ256
Supported Devices
A42MX36
2.3.6
CQ256—Cavity Down with Heat Sink
Figure 13 • CQ256—Cavity Down with Heat Sink
Top View
L1
D1
F
D2
256
1
HK
Lid
e
E2
E1
b
Side View
Lead Material Lid
Fe–Ni–Co Alloy
c
A
A1
Heat Sink
Note: Packages are shipped with the uniform ceramic tie bar in a test carrier.
PD3068 Datasheet Revision 60.0
23
Package Mechanical Drawings
Note: Dimensions are in millimeters. For more information on dimensions, see CQFP with Heat Sink
Dimensions, page 25.
Table 15 •
Supported Devices for CQ256
Supported Devices
A32200DX1
1.
This product is obsolete.
2.3.7
CQFP without Heat Sink Dimensions
The following table lists the dimensions for CQFP without heat sink.
Table 16 •
Dimensions for CQFP without Heat Sink
JEDEC
Equivalent
CQ132
MO-113 VAR AC
Symbol
Min.
Nom.
Max.
Min.
Nom.
Max.
Min.
Nom.
Max.
Min.
Nom.
Max.
A
0.094
0.105
0.116
0.094
0.105
0.116
0.094
0.105
0.116
2.30
2.80
3.30
A1
0.080
0.090
0.100
0.080
0.090
0.100
0.080
0.090
0.100
2.00
2.30
2.80
b
0.007
0.008
0.010
0.007
0.008
0.010
0.007
0.008
0.010
0.17
0.20
0.22
c
0.004
0.006
0.008
0.004
0.006
0.008
0.004
0.006
0.008
0.11
0.15
0.18
D1/E1
0.940
0.950
0.960
1.168
1.180
1.192
1.336
1.350
1.364
28.96
29.21
29.46
D2/E2
0.800 BSC
1.050 BSC
1.200 BSC
25.5 BSC
e
0.025 BSC
0.025 BSC
0.025 BSC
0.50 BSC
F
0.325
H
2.320 BSC
2.320 BSC
2.320 BSC
70.00 BSC
K
2.140 BSC
2.140 BSC
2.140 BSC
65.90 BSC
L1
2.485
0.350
2.500
CQ172
MO-113 VAR AE
0.375
2.505
0.175
2.485
0.200
2.495
CQ196
MO-113 VAR AB
0.225
2.505
0.175
2.485
0.200
2.495
CQ208
0.225
2.505
CQ256
MO-134 VAR AB
CQ352
MO-134 VAR AE
Symbol
Min.
Nom.
Max.
Min.
Nom.
Max.
Min.
Nom.
Max.
A
2.30
2.80
3.30
2.43
2.66
3.11
2.96
3.32
3.69
A1
2.00
2.30
2.80
2.05
2.29
2.51
2.5
2.79
3.08
b
0.18
0.20
0.22
0.18
0.2
0.22
0.18
0.2
0.22
c
0.11
0.15
0.18
0.1
0.15
0.2
0.1
0.15
0.2
D1/E1
35.64
36.00
36.64
47.75
48.00
48.25
47.75
48.00
48.25
D2/E2
31.5 BSC
43.51 BSC
43.5 BSC
e
0.50 BSC
0.50 BSC
0.50 BSC
F
7.05
H
70.00 BSC
70.00 BSC
70.00 BSC
K
65.90 BSC
65.90 BSC
65.9 BSC
L1
74.60
1.
75.00
8.45
75.40
75.00
75.00
8.45
75.40
MO-134 VAR AE
5.00
74.60
74.60
7.75
CQ3521
JEDEC
Equivalent
7.75
7.05
5.00
75.40
74.60
75.00
75.40
For device RTAX2000D-CQ352 and RTAX4000D-CQ352 only.
Note: All dimensions are in inches except for CQ208, CQ256, and CQ352, which are in millimeters.
PD3068 Datasheet Revision 60.0
24
Package Mechanical Drawings
Note: BSC = Basic spacing between centers. This is a theoretical true position dimension and so has no
tolerance.
2.3.8
CQFP with Heat Sink Dimensions
The following table lists the dimensions for CQFP with Heat Sink.
Table 17 •
Dimensions for CQFP with Heat Sink
CQ256
MO-134 VAR AB
JEDEC Equivalent CQ208
Symbol
Min.
Nom.
Max.
Min.
Nom.
Max.
A
2.79
3.30
3.90
2.79
3.30
3.90
A1
2.00
2.30
2.80
2.00
2.30
2.80
b
0.18
0.20
0.22
0.18
0.20
0.22
c
0.11
0.15
0.17
0.11
0.15
0.18
D1/E1
28.96
29.21
29.46
35.64
36.00
36.66
D2/E2
25.5 BSC
31.5 BSC
e
0.50 BSC
0.50 BSC
F
7.05
7.75
8.45
H
70.00 BSC
70.00 BSC
K
65.90 BSC
65.90 BSC
L1
74.60
75.00
75.40
7.75
75.00
8.45
75.40
7.05
74.60
Note: All dimensions are in inches except for CQ208, CQ256 and CQ352, which are in millimeters.
Note: BSC = Basic spacing between centers. This is a theoretical true position dimension and so has no
tolerance.
The dimensions above are for reference only. For more accurate dimensions, use the dimensions in the
SMD drawings for the specified device.
For heat sink information, see the Hermetic Package Mechanical Configuration document (Cavity,
weight, lid size and heat sink size) located at: http://www.microsemi.com/documentportal/doc_view/131087-hermetic-package-mechanical-configuration
PD3068 Datasheet Revision 60.0
25
Package Mechanical Drawings
2.4
Ceramic Chip Carrier Land Grid Substrate (CCLG)
The following figures show package outlines for various packages under CCLG.
2.4.1
CC256
The following figure shows the package outline of CC256.
Figure 14 • Package Outline of CC256
Top View
(see next page for clear dimension)
17.000±0.203
A1 Index Corner
(1.000X45°)
CHAMFER
1.397±0.140
6.140
193
256
6.001
192 TYP.
External Bonding Pad 1
A
6.140
0.254±0.025
LID
0.508±0.051
6.001
6.001
4X 0.254
6.140
LID 15.240±0.152
(R 0.254)
R 0.500
4X (0.250X45)
o
Chamfer
64
65
4X (0.1651)
4X (0.0953)
0.114TYP.
0.076TYP.
128
129
3X
(0.500X45°)
CHAMFER
6.140
6.001
0.889±0.051 (bottom to External Bonding pads)
LID 12.954±0.152
Detail A
TYP.
(0.127)
(0.762)
TYP.
Side View
(with partial section view)
4X (13.70)
15.000
1.000
T
R
P
N
M
L
15.000
K
J
H
G
F
1.000
E
D
C
B
A
1
2
3
4
5 6 7
256X
8
9
10 11 12 13 14 15 16
Ø0.600±0.050
Bottom View
Note: Units are in mm.
PD3068 Datasheet Revision 60.0
26
Package Mechanical Drawings
The following table shows the supported devices for CC256.
Table 18 •
Supported Devices for CC256
Supported Devices
RT54SX32S1
RTSX32SU
1.
This product is obsolete.
PD3068 Datasheet Revision 60.0
27
Package Mechanical Drawings
2.4.2
CCLG Substrate Dimensions
The following figure shows the dimensions of CCLG substrate.
Figure 15 • CCLG Substrate Dimensions
Top View (Zoom 2.4x)
17.000±0.203
LID 12.954±0.152
6.001
A1 Index Corner
193
256
(1.000X45°)
CHAMFER
6.140
External Bonding Pad 1
192
TYP.
6.001
6.140
6.140
4X 0.254
LID 15.240±0.152
6.001
(R 0.254)
R 0.500
129
64
65
(0.500X45°)
CHAMFER
4X (0.1651)
0.114 TYP.
4X (0.0953)
0.076 TYP.
6.140
6.001
128
TYP.
3X
(0.127)
(0.762)
TYP.
4X (13.70)
PD3068 Datasheet Revision 60.0
28
Package Mechanical Drawings
2.4.3
LG1657
The following figure shows the package outline of LG1657.
Figure 16 • Package Outline of LG1657
Top View
Side View
A
42.50±0.15
C
2.00±0.20
(0.10+0.15X12+0.10)
PIN A1 CORNER
REF MARKING AREA
40.30±0.20 (SEAL RING)
4X
(R0.50)
B
~
42.50±0.15
40.30±0.20 (SEAL RING)
1.21 ±0.07
SEAL RING
Fe-Ni-Co ALLOY
1.10±0.05
(MATERIAL THICKNESS)
~
4X
(0.5X45°)
CHAMFER
8X
(R0.50)
~
ALUMINA COAT
BRAZED
Ag-Cu ALLOY
4X
(0.20X45°)
CHAMFER
P. 1.00X40=40.00±0.15 (TARGET ±0.10)
P. 1.00
3.21 ±0.27
1657XØ0.80±0.05
INDEX MARK
(ID)
A
B
C
D
E
F
G
H
P. 1.00X40=40.00±0.15 (TARGET ±0.10)
J
K
L
M
N
P
R
T
U
V
W
Y
~
P. 1.00
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
AY
BA
1
7
41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9
5
3
40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8
6
4 2
ALUMINA COAT
Bottom View
Note: The units are in mm.
Note: Seal ring is connected to the ground (GND).
The following table shows the supported devices for LG1657.
Table 19 •
Supported Devices for LG1657
Supported Devices
RT4G150
PD3068 Datasheet Revision 60.0
29
Package Mechanical Drawings
2.5
Ceramic Column Grid Array (CCGA)
The following figures show package outlines for various packages under CCGA.
2.5.1
CG484
The following figure shows the package outline of CG484.
Figure 17 • Package Outline of CG484
Top View
A
D
A2
A1
A1 Corner
Index Area
A
A2
b
E
CCGA
Side View
CLGA
Side View
D1
e
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
E1
e
1 2 3 4 5 6 7 8 9 101112131415 161718 19 20 2122
Bottom View
Note: The top and side views will be completed in the future.
The following table shows the supported devices for CG484.
Table 20 •
Supported Devices for CG484
Supported Devices
RT3PE600L
RT3PE3000L
PD3068 Datasheet Revision 60.0
30
Package Mechanical Drawings
2.5.2
CG624
The following figure shows the package outline of CG624.
Figure 18 • Package Outline of CG624
Top View
A
D
A
A2
A2
A1
A1 Corner
Index Area
b
E
CCGA
Side View
D1
e
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
CLGA
Side View
E1
e
1 2 3 4 5 6 7 8 9 101112131415 161718 19 20 2122 2324 25
Bottom View
The following table shows the supported devices for CG624.
Table 21 •
Supported Devices for CG624
Supported Devices
AX1000
AX2000
RTAX1000S
RTAX2000S
RTAX250S
APA600
APA1000
PD3068 Datasheet Revision 60.0
RTSX72SU
31
Package Mechanical Drawings
2.5.3
CG896
The following figure shows the package outline of CG896.
Figure 19 • Package Outline of CG896
Top View
A
A
D
A1 Corner
Index Area
A2
A2
A1
b
E
D1
e
CCGA
Side View
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
CLGA
Side View
E1
N
M
L
K
J
H
G
F
E
D
C
B
A
e
1 2 3
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
Bottom View
The following table shows the supported devices for CG896.
Table 22 •
Supported Devices for CG896
Supported Devices
RT3PE3000L
PD3068 Datasheet Revision 60.0
32
Package Mechanical Drawings
2.5.4
CCGA Dimensions
The following table lists the dimensions of CCGA.
Table 23 •
Dimensions of CCGA
CG484
CG624
CG896
Dimension
Min.
Nom.
Max.
Min.
Nom.
Max.
Min.
Nom.
Max.
CCGA - A
5.19
5.72
6.19
4.54
4.88
5.41
5.65
6.23
6.75
CLGA - A
3.06
3.51
3.83
2.41
2.67
3.05
3.16
3.51
3.86
A1
2.15
2.21
2.36
2.15
2.21
2.36
2.15
2.21
2.36
A2
2.70
3.00
3.30
2.06
2.29
2.52
3.16
3.51
3.86
b
0.43
0.51
0.59
0.43
0.51
0.59
0.43
0.51
0.59
D
22.77
23.00
23.23
32.17
32.50
32.83
30.69
31.00
31.31
D1
21.00 BSC
E
22.77
31.00
31.31
E1
21.00 BSC
30.48 BSC
29.00 BSC
e
1.00 BSC
1.27 BSC
1.00 BSC
23.00
30.48 BSC
23.23
32.17
29.00 BSC
32.50
32.83
PD3068 Datasheet Revision 60.0
30.69
33
Package Mechanical Drawings
2.5.5
CG1152
The following figure shows the package outline of CG1152.
Figure 20 • Package Outline of CG1152
0.100
Top View
(1.00×45º)
CHAMFER
c
35.000 ± 0.350
+0.150
2.210 –0.060
2.772 ± 0.270
35.000 ± 0.350
0.508 ± 0.025
3X (0.50 × 45º)
CHAMFER
33.000
1.000
0.150 A
AP
AN
AM
5.935 MAX.
5.135 MIN.
AL
AK
A SEATING PLANE
AJ
AH
AG
AF
AE
CCGA
Side View
AD
AC
AB
CLGA
Side View
AA
Y
33.000
W
V
U
T
R
P
N
M
L
K
J
H
1.000
G
F
E
D
C
B
A
1
2
3 4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
1152X Ø0.510 ± 0.080
Bottom View
Note: The units are in mm.
Note: Seal ring and die attach are connected to the ground (GND).
The following table shows the supported devices for CG1152.
Table 24 •
Supported Devices for CG1152
Supported Devices
RTAX2000S
PD3068 Datasheet Revision 60.0
34
Package Mechanical Drawings
2.5.6
CG1272
The following figure shows the package outline of CG1272.
Figure 21 • Package Outline of CG1272
Top View
0.100
2.772 ± 0.270
37.500 ± 0.380
+0.150
2.210 –0.060
0.508 ± 0.025
37.500 ± 0.380
(1.50 × 45º)
CHAMFER
3X (1.50 × 45º)
CHAMFER
0.150 A
5.935 MAX.
5.135 MIN.
35.000
A SEATING PLANE
1.000
CCGA
Side View
AT
AR
AP
CLGA
Side View
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
35.000
AA
Y
W
V
U
T
R
P
N
M
L
K
J
1.000
H
G
F
E
D
C
B
A
1
2
3 4
5 6
7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
1272X Ø0.510 ± 0.080
Bottom View
Note: The units are in mm.
Note: Seal ring and die attach paddle are connected to the ground (GND).
The following table shows the supported devices for CG1272.
Table 25 •
Supported Devices for CG1272
Supported Devices
RTAX4000S
RTAX2000D
PD3068 Datasheet Revision 60.0
35
Package Mechanical Drawings
2.5.7
CG1657
The following figure shows the package outline of CG1657.
Figure 22 • Package Outline of CG1657
Top View
Side View
A
42.50±0.15
PIN A1 CORNER
REF MARKING AREA
C
+0.15
2.21
-0.06
40.30±0.20 (SEAL RING)
4X
(R0.50)
2.00±0.20
(0.10+0.15X12+0.10)
B
~
42.50±0.15
40.30±0.20 (SEAL RING)
Ø0.51±0.08
1.21±0.07
SEAL RING
Fe-Ni-Co ALLOY
1.10±0.05
(MATERIAL THICKNESS)
~
4X
(0.5X45°)
CHAMFER
8X
(R0.50)
~
ALUMINA COAT
BRAZED
Ag-Cu ALLOY
4X
(0.20X45°)
CHAMFER
P. 1.00X40=40.00±0.15 (TARGET ±0.10)
P. 1.00
+0.42
5.42
-0.33
1657X Ø0.80±0.05
INDEX MARK
(ID)
A
B
C
D
E
F
G
H
J
K
L
P. 1.00X40=40.00±0.15 (TARGET ±0.10)
M
N
P
R
T
U
V
W
Y
~
P. 1.00
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
AY
BA
1
7
41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9
5
3
40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8
6
4 2
ALUMINA COAT
Bottom View
Note: The units are in mm.
Note: Seal ring is connected to the ground (GND).
The following table shows the supported devices for CG1657.
Table 26 •
Supported Devices for CG1657
Supported Devices
RT4G150
PD3068 Datasheet Revision 60.0
36
Package Mechanical Drawings
2.6
Plastic Leaded Chip Carrier (PLCC)
The following figure shows the dimensions and details of Plastic Leaded Chip carrier.
Figure 23 • Plastic Leaded Chip Carrier (PLCC)
Top View
0.048 (1.219)
0.042 (1.067)
D1 D
E1
E
Side View
Detail A
Detail B
A
A1
0.004
e1
D2/E2
Detail A
B2
Detail B
0.083
0.062
0.007 Max.
Base Line
B
0.020 (0.508)
Min.
R 0.045
0.025
Note: Dimensions are in millimeters. For more information on dimensions, see Plastic Leaded Chip Carrier
Dimensions, page 38.
PD3068 Datasheet Revision 60.0
37
Package Mechanical Drawings
The following table lists the supported device for PL44, PL68, and PL84.
Table 27 •
Supported Devices for PL44, PL68, and PL84
Supported Devices
PL44
PL68
PL84
A1010B
A1020B
A40MX02
A40MX04
A1010B
A1020B
A10V10B
A10V20B
A40MX02
A40MX04
A10V20B
A1225XLV1
A1280XLV1
A1240XLV1
A14V15A
A14V25A
A14V40A
A3265DXV1
A32100DXV1
A32140DXV1
1.
A3265A1
A54SX08
A32100DX1
A32140DX1
A40MX04
A42MX09
A42MX16
A42MX24
A1020B
A1225A
A1240A
A1280A
A1225XL1
A1240XL1
A1280XL1
A1415A
A1425A
A1440A
This product is obsolete.
2.6.1
Plastic Leaded Chip Carrier Dimensions
The following table lists the dimensions of Plastic Leaded Chip Carrier.
Table 28 •
Plastic Leaded Chip Carrier Dimensions
JEDEC
PL44
Equivalent MS-018 VAR AC
PL68
MS-018 VAR AE
PL84
MS-018 VAR AF
Dimension Min.
Nom.
Max.
Min.
Nom.
Max.
Min.
Nom.
Max.
A
0.165
0.172
0.180
0.165
0.172
0.180
0.165
0.172
0.180
A1
0.090
0.105
0.120
0.090
0.105
0.120
0.090
0.105
0.120
B
0.013
–
0.021
0.013
–
0.021
0.013
–
0.021
B2
0.026
–
0.032
0.026
–
0.032
0.026
–
0.032
D/E
0.685
0.690
0.695
0.985
0.990
0.995
1.185
1.190
1.195
D1/E1
0.650
0.653
0.656
0.950
0.954
0.958
1.150
1.154
1.158
D2/E2
0.590
0.610
0.630
0.890
0.910
0.930
1.090
1.110
1.130
e1
0.050 BSC
0.050 BSC
0.050 BSC
Note: All dimensions are in inches.
Note: BSC = Basic spacing between centers.
PD3068 Datasheet Revision 60.0
38
Package Mechanical Drawings
2.7
Quad Flat No Lead (QFN)
The following figures show package outlines for various packages under QFN.
2.7.1
QN48
The following figure shows the package outline of QN48.
Figure 24 • Package Outline of QN48
Bottom View
Top View
D2
A
D
Datum A
D/2
B
e
NX k
E/2
D2
2
E2
2
Datum B
E2
E
D
Detail C
Pin 1 Indicator
NX b
Detail A
bbb M C A B
ddd M C
Side View
A3
// ccc C
NX
0.08 C
A
Seating PLANE
C
A1
Detail C 1
Detail A
(Datum A or B)
NX L
(0.45 REF)
e
Terminal Tip
Note: Corner chamfer leads are applied to maintain minimum spacing between corner leads; otherwise, keep
normal lead shape.
Note: Die attach paddle center of package is tided to the ground (GND).
The following table shows the supported devices for QN48.
Table 29 •
Supported Devices for QN48
Supported Devices
A3PN010
A3P030/A3PN030
AGN010
AGL030/AGLN030
PD3068 Datasheet Revision 60.0
39
Package Mechanical Drawings
2.7.2
QN68
The following figure shows the package outline of QN68.
Figure 25 • Package Outline of QN68
Bottom View
Top View
D2
A
D
D2
2
Datum A
D/2
B
e
NX k
E/2
E2
2
Datum B
E2
E
Detail C
Pin 1 Indicator
NX b
bbb M C A B
ddd M C
Detail A
Side View
A3
// ccc C
NX
0.08 C
A
Seating PLA
C
A1
Detail C 1
Detail A
(Datum A or B)
NX L
(0.45 REF)
e
Terminal Tip
Note: Corner chamfer leads are applied to maintain minimum spacing between corner leads; otherwise, keep
normal lead shape.
Note: Die attach paddle center of package is tided to the ground (GND).
The following table shows the supported devices for QN68.
Table 30 •
Supported Devices for QN68
Supported Devices
AGL015
AGL030
AGLN015
AGLN020
AGLN030
A3P015
A3P030
PD3068 Datasheet Revision 60.0
A3PN015
A3PN020
A3PN030
40
Package Mechanical Drawings
2.7.3
QN48 and QN68 Quad Flat No Leads Single Row Dimensions
Table 31 •
QN48 and QN68 Quad Flat No Leads Single Row Dimensions
QN48, page 39
MO-220, Variation VLLE-1
QN68, page 40
MO-220, Variation VLLE-1
Dimension
Min.
Nom.
Max.
Min.
Nom.
Max.
A
0.80
0.90
1.00
0.80
0.90
1.00
A1
0
.02
0.05
0.00
0.02
0.05
A3
0.20 REF
b
0.15
0.20
0.25
0.15
0.20
0.25
D/E
5.90
6.00
6.1
7.90
8.00
8.10
D2/E2
4.50
4.65
4.8
2.77
2.92
3.07
e
0.40 BSC
k
0.20
–
–
0.20
–
–
L
0.30
0.40
0.5
0.35
0.40
0.45
N
48
68
bbb
0.07
0.07
ccc
0.10
0.10
ddd
0.05
0.05
0.20 REF
0.40 BSC
Note: All dimensions are in millimeters.
PD3068 Datasheet Revision 60.0
41
Package Mechanical Drawings
2.7.4
Quad Flat No Lead
The following figure shows the dimensions of quad flat no lead.
Figure 26 • Quad Flat No Lead
Top View
Pin Number A1
Area (D/2 x E/2)
ccc C
eee C
E
aaa C
B
A
D
aaa C
NDA - 1 x 0.5
A1
NDB - 1 x 0.5
Detail B (when present)
A
NDC - 1 x 0.5
C
Seating Plane
Side View
(Datum A)
NEC - 1 x 0.5
NEB - 1 x 0.5
NEA - 1 x 0.5
fff M C A B
E2
(Datum B)
Optional Corner Pad (4x)
D2
fff M C A B
(Detail A)
Bottom View
PD3068 Datasheet Revision 60.0
42
Package Mechanical Drawings
2.7.5
Quad Flat No Lead Details
The following figure shows the details of quad flat no lead.
Figure 27 • Quad Flat No Lead Details
Detail A
bbb M C A B
ddd M C
(Datum A or B)
bbb M C A B
ddd M C
(Datum A or B)
0.5
Nxb
0.5
0.5
Nxb
bbb M C A B
bbb M C A B
0.5/2
0.5/2
0.5
Terminal Tip 6
0.5
QN180/QN132
QN108
Detail B
L1
7
LC
k
K
LC
(LC When Present)
L1
PD3068 Datasheet Revision 60.0
43
Package Mechanical Drawings
2.7.6
QN108 Bottom View
The following figure shows the package bottom view of QN108.
Figure 28 • Bottom View of QN108
A44
A56
B41
B52
Pin A1 Mark
A1
A43
B40
B1
B13
A14
B27
A29
B26
B14
A28
A15
Note: Die attach paddle center of package is tied to the ground (GND).
Note: Package is discontinued and not available.
The following table shows the supported devices for QN108.
Table 32 •
Supported Devices for QN108
Supported Devices
AFS090
PD3068 Datasheet Revision 60.0
44
Package Mechanical Drawings
2.7.7
QN132 Bottom View
The following figure shows the package bottom view of QN132.
Figure 29 • QN132 Bottom View
A37
B34
C31
A48
B44
C40
Pin A1Mark
D1
D4
A36
B33
C30
C1
C21
B23
A25
C10
B11
A12
D3
A1
B1
D2
C20
B22
A24
C11
B12
A13
Optional
Corner Pad (4x)
Note: Die attach paddle center of package is tied to the ground (GND).
Note: Package is discontinued and not available.
The following table lists the supported devices for QN132.
Table 33 •
Supported Devices for QN132
Supported Devices
AGL030
AGL060
AGL125
AGL250
A3P030
A3P060
A3P125
A3P250
PD3068 Datasheet Revision 60.0
45
Package Mechanical Drawings
2.7.8
QN180 Bottom View
The following figure shows the package bottom view of QN180.
Figure 30 • Bottom View of QN180
A64
B60
A49
B46
C43
C56
Pin A1 Mark
D4
D1
A48
B45
C42
A33
C1
A1
C14
B15
A16
C29
B31
D3
Optional Corner
Pad (4X)
B1
D2
C28
B30
A32
C15
B16
A17
Note: Die attach paddle center of package is tided to the ground (GND).
Note: Package is discontinued and not available.
Table 34 •
Supported Devices for QN180
Supported Devices
AFS090
AFS250
M1AFS250
PD3068 Datasheet Revision 60.0
46
Package Mechanical Drawings
2.7.9
Quad Flat No Leads Dimensions
The following table lists the dimensions of the quad flat no leads.
Table 35 •
Dimensions of Quad Flat No Leads
Symbol
Min.
Nom.
Max.
A
0.70
0.75
0.80
A1
0.00
–
0.05
b
0.25
–
0.35
k
0.20
–
–
L
0.25
–
0.35
L1
0.05
–
0.15
Tolerance of Form and Position
aaa
0.15
bbb
0.10
ccc
0.10
ddd
0.05
eee
0.08
fff
0.10
Note: All dimensions are in millimeters.
Note: BSC = Basic spacing between centers.
PD3068 Datasheet Revision 60.0
47
Package Mechanical Drawings
The following table lists the dimensions of QN108, QN132, and QN180 packages.
Table 36 •
Dimensions for QN108, QN132, and QN180
Variation
Symbol
QN108
QN132
QN180
D BSC.
8.00
8.00
10.00
E BSC.
8.00
8.00
10.00
Min.
5.65
4.65
6.65
Nom.
5.70
4.70
6.70
Max.
5.75
4.75
6.75
Min.
5.65
4.65
6.65
Nom.
5.70
4.70
6.70
Max.
5.75
4.75
6.75
Min.
–
0.30
0.30
Nom.
–
–
–
Max.
–
0.40
0.40
N
108
132
180
NDA
12
12
16
NDB
11
11
15
NDC
–
10
14
NEA
12
12
16
NEB
11
11
15
NEC
–
10
14
D2
E2
LC
PD3068 Datasheet Revision 60.0
48
Package Mechanical Drawings
2.8
Plastic Quad Flat Pack Rectangular Package (TQ144)
The following figure shows the details and dimensions of Plastic Quad Flat Pack Rectangular.
Figure 31 • Plastic Quad Flat Pack Rectangular Package (TQ144)
5
7
D1
4
D
D/2
D1/2
A 3
N
+
0.0381
1.0 DIA. 0.089 DP
PIN#1 & EJECTOR PIN
E1/2
SEE DETAIL “A”
D 2
5
7 E1
E 3
7.50 REF.
7.95
GATE PIN
1.50
E/2
+
0.20 C A-B D
4
0.20 H A-B D
B 3
7.50 REF.
7.95 REF.
Bottom View
C
SEATING
PLANE
Top View
ccc C
2 H
3
H
2
O
0 MIN.
EVEN LEAD SIDES
0.08/0.20 R.
A2
0.05
A
e/2
12
0.08
R. MIN.
0.20 MIN.
A1
A, B, OR D
0.25
0-7
GAUGE PLANE
O
DETAIL “A”
(N-4)X e
SEE DETAIL “B”
1.00 REF.
DETAIL “B”
ddd M C A-B D
8
10
b
0.09/0.20
0.09/0.16
0.10 C
0.05
O
11 - 13
O
10
WITH LEAD FINISH
10
b1
BASE METAL
10
DETAIL “C”
Side View
NOTES: UNLESS OTHERWISE SPECIFIED
1. All dimensioning and tolerances confirm to ASME Y14.5-1994.
2. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic
body at bottom of parting line.
3. Datums A-B and D to be determined at centerline between leads where leads exit plastic body
at datum plane H.
4. To be determined at seating plane C.
5. Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.254 mm
per side. Dimension D1 and E1 include mold mismatch and are determined at datum plane H.
6. N is number of terminals.
7. Package top dimensions are smaller than bottom dimensions by 0.10 millimeters and top
of package will not overhang bottom of package.
8. Dimension b does not include damber protrusion. Allowable damber protrusion shall be
not cause the lead width to exceed the maximum b dimension by more than 0.08 mm.
Damber can not be located on the lower radius or the foot.
9. All dimensions are in millimeters.
10. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm
from the lead tip.
11. This drawing conforms to JEDEC registered outline m2s-026-c, variation BFB.
12. A1 is defined as the distance from the seating plane to the lowest point of the package body.
Note: Dimensions are in millimeters. For more information on TQ144 dimensions, see Thin Quad Flat Pack
(TQFP) Dimensions, page 55.
PD3068 Datasheet Revision 60.0
49
Package Mechanical Drawings
2.9
Plastic Quad Flat Pack (PQFP, TQFP, VQFP)
The following figure shows the details and dimensions of Plastic Quad Flat Pack.
Figure 32 • Plastic Quad Flat Pack (PQFP, TQFP, VQFP)
Top View
E1
E
D1
D
See Detail A
Side View
A2 A
A1
C
ccc
L
Detail A
10 ° Typ
R 0.08/0.25
Theta
b
e
R 0.08 Min.
Note: Dimensions are in millimeters. For more information on dimensions, see Plastic Quad Flat Pack (PQFP)
Dimensions, page 53 and Very Thin Quad Flat Pack (VQFP) Dimensions, page 55.
PD3068 Datasheet Revision 60.0
50
Package Mechanical Drawings
2.10
Plastic Quad Flat Pack—Exposed Heatsink (RQFP)
The following figure shows the details and dimensions of Plastic Quad Flat Pack Exposed Heatsink.
Figure 33 • Plastic Quad Flat Pack—Exposed Heatsink (RQFP)
Top View
Exposed
Heat Sink
E1
E
ter
iame
D
D1
D
Side View
See Detail A
A1
A2 A
ccc
L
C
Detail A
10° Typ
R 0.08/0.25
Theta
b
e
R 0.08 Min.
Note: Dimensions are in millimeters. For more information on dimensions, see Plastic Quad Flat Pack
(RQFP/PQFP) Dimensions, page 54.
PD3068 Datasheet Revision 60.0
51
Package Mechanical Drawings
2.11
Plastic Quad Flat Pack Rectangular Package (PQ100)
The following figure shows the details and dimensions of Plastic Quad Flat Pack Rectangular Package.
Figure 34 • Plastic Quad Flat Pack Rectangular Package (PQ100)
Top View
E1
E
D1
D
Side View
See Detail A
A1
A2 A
C
ccc
L
Detail A
10 ° Typ
R 0.13/0.30
Theta
b
e
R 0.13 Min.
Note: Dimensions are in millimeters. For more information on dimensions, see Plastic Quad Flat Pack
(RQFP/PQFP) Dimensions, page 54.
PD3068 Datasheet Revision 60.0
52
Package Mechanical Drawings
The following figure shows the supported devices for or Plastic Quad Flat Pack Rectangular Package.
Table 37 •
Supported Devices for Plastic Quad Flat Pack Rectangular Package
Supported Devices
RQ208
A14V100A
A14100A
A32200DX1
A32300DX1
A32300DXV1
1.
PQ100
PQ144
PQ160
PQ208
RQ240
A1280XL1
A32200DX1
AX250
AX500
APA075
APA150
APA300
APA450
APA600
APA750
APA1000
A3P125
A3P250
A3P400
A3P600
A3P1000
M1A3P250
M1A3P400
M1A3P600
M1A3P1000
M7A3P1000
A1240A
A1010B
A1280A
A1240XL1 A1280XL1
A1020B
A14V60A
A1225A
A1460A
A14V25A
A1225XL1
A32100DX1
A1425A
A14V40A
A1240XL1
A32140DX1
A1440A
A1415A
A32200DX1
A14V60A
A1425A
A32200DXV1
A1460A
A3265DX1
A42MX16
A3265DX1 A42MX24
A40MX02
A40MX04
A32100DX1 A42MX36
A42MX09
A32140DX1 A500K0501
A42MX16
A42MX09
A500K1301
A42MX16
A500K1801
A42MX24
A500K2701
A54SX08
A54SX16
A54SX16P
A54SX32
A54SX08A
A54SX16A
A54SX32A
A54SX72A
PQ240
A3PE600
A42MX36
A3PE1500
A32200DXV1
A3PE3000
M1A3PE1500
M1A3PE3000
A3P250L
A3P1000L
M1A3P600L
M1A3P1000L
A3PE3000L
M1A3PE3000L
AFS250
AFS600
M1AFS250
M1AFS600
M7AFS600
A2F200
A2F500
This product is obsolete.
2.11.1
Plastic Quad Flat Pack (PQFP) Dimensions
The following figure shows the details and dimensions of Plastic Quad Flat Pack.
Table 38 •
Plastic Quad Flat Pack (PQFP) Dimensions
PQ100
JEDEC Equivalent MS-022 VAR GC-1
PQ144
MS-022 VAR DC-1
Dimension
Min.
Nom.
Max.
Nom.
Max.
Min.
Nom.
Max.
A
–
–
3.40
–
4.10
–
–
4.10
A1
0.25
–
0.5
0.25
–
0.50
0.25
0.33
0.50
A2
2.50
2.70
2.9
3.20
3.40
3.60
3.20
3.40
3.60
b
0.22
–
0.40
0.22
–
0.40
0.22
–
0.40
c
0.11
–
0.23
0.11
–
0.23
0.11
–
0.23
D
23.20 BSC
31.20 BSC
31.20 BSC
D1
20.00 BSC
28.00 BSC
28.00 BSC
E
17.20 BSC
31.20 BSC
31.20 BSC
E1
14.00 BSC
28.00 BSC
28.00 BSC
e
0.65 BSC
0.65 BSC
0.65 BSC
L
0.73
ccc
0.10
Theta
0
0.88
1.03
Min.
PQ160
MS-022 VAR DD-1
0.73
0.88
1.03
0.10
–
7 deg
0
0.73
0.88
1.03
–
7 deg
0.10
–
7 deg
PD3068 Datasheet Revision 60.0
0
53
Package Mechanical Drawings
2.11.2
Plastic Quad Flat Pack (RQFP/PQFP) Dimensions
The following figure shows the details and dimensions of Plastic Quad Flat Pack.
Table 39 •
Plastic Quad Flat Pack (RQFP/PQFP) Dimensions
JEDEC Equivalent
RQ208/PQ208
MS-029 VAR FA-1
RQ240/PQ240
MS-029 VAR GA
Dimension
Min.
Nom.
A
–
–
A1
0.25
A2
3.20
b
c
D/E
30.60 BSC
34.60 BSC
D1/E1
28.00 BSC
32.10 BSC
e
0.50 BSC
0.50 BSC
L
0.45
ccc
0.08
Theta
Diameter
Max.
Min.
Nom.
–
4.10
0.50
0.25
–
0.50
3.40
3.60
3.20
3.40
3.60
0.17
–
0.27
0.17
–
0.27
0.09
–
0.20
0.09
–
0.20
0.60
0.75
4.10
0.50
Max.
0.60
0.75
0
3.50
8 deg
0
3.50
8 deg
19.82
20.32
20.82
23.63
24.13
24.63
0.08
Note: All dimensions are in millimeters.
Note: BSC = Basic spacing between centers.
The following table lists the supported devices for Quad.
Table 40 •
Supported Devices for Quad Slat (TQ/VQ)
Supported Devices
TQ64
TQ100
TQ144
TQ176
eX64
eX128
APA075
APA150
A54SX08A
A54SX16A
A54SX32A
eX64
eX128
eX256
A54SX08
A54SX16P
A54SX32
A54SX08A
A54SX16A
A54SX32A
APA075
A3P060
A3P125
A2F060
M2S005
M2GL005
M2S010
M2GL010
A1240A
A1440A
A1460A
A14V40A
A14V60A
A1240XL1
A1280XL1
A1280XLV1
A1240XLV1
A3265DX1
A32140DX1
1.
A3265DXV1
A32140DXV1
A42MX09
A42MX16
A42MX24
A54SX08
A54SX16
A54SX16P
A54SX32
A54SX32A
VQ80
VQ100
A1010B
A10V10B
A1020B
A10V20B
A40MX02
A40MX04
A1225XL1
A1415A
A1425A
A1440A
A14V15A
A14V25A
A14V40A
A42MX09
A42MX16
A54SX16
VQ128
VQ176
A54SX16P AGLP030 AGLP060
A54SX08
AGL030
AGL060
AGL125
AGL250
AGLN030
AGLN060
AGLN125
AGLN250
A3P030
A3P060
A3P125
A3P250
M1A3P250
A3P250L
A3PN030
A3PN060
A3PN125
A3PN250
This product is obsolete.
PD3068 Datasheet Revision 60.0
54
Package Mechanical Drawings
2.11.3
Thin Quad Flat Pack (TQFP) Dimensions
The following table lists the dimensions of thin quad flat pack.
Table 41 •
Thin Quad Flat Pack (TQFP) Dimensions
JEDEC
Equivalent
TQ64
MS-026 VAR BCD
TQ100
MS-026 VAR BED
TQ144
MS-026 VAR BFB
TQ176
MS-026 VAR BCA
Dimension
Min.
Min.
Min.
Min.
Nom.
Max.
Nom.
Max.
Nom.
Max.
Nom.
Max.
A
–
–
1.60
–
–
1.60
–
–
1.60
–
–
1.60
A1
0.05
–
0.15
0.05
–
0.15
0.05
–
0.15
0.05
–
0.15
A2
1.35
1.40
1.45
1.35
1.40
1.45
1.35
1.40
1.45
1.35
1.40
1.45
b
0.17
0.22
0.27
0.17
0.22
0.27
0.17
0.22
0.27
0.17
0.22
0.27
c
0.09
–
0.20
0.09
–
0.20
0.09
–
0.20
0.09
–
0.20
D/E
12.00 BSC
16.00 BSC
22.00 BSC
26.00 BSC
D1/E1
10.00 BSC
14.00 BSC
20.00 BSC
24.00 BSC
e
0.50 BSC
0.50 BSC
0.50 BSC
0.50 BSC
L
0.45
ccc
0.08
Theta
0
0.60
0.75
3.50
deg
7 deg
0.45
0.60
0.75
3.50
deg
7 deg
0.08
0
0.45
0.60
0.75
3.50
deg
7 deg
0.08
0
0.45
0.60
0.75
3.50
deg
7 deg
0.10
0
Note: All dimensions are in millimeters.
Note: BSC = Basic spacing between centers.
2.11.4
Very Thin Quad Flat Pack (VQFP) Dimensions
The following table lists the dimensions of very thin quad flat pack.
Table 42 •
Very Thin Quad Flat Pack (VQFP) Dimensions
JEDEC
Equivalent
VQ80
MS-026 VAR AEC
VQ100
MS-026 VAR AED
VQ128
MS-026 VAR AEE3
VQ176
MS-026 VAR BFC
Dimension
Min.
Nom.
Max.
Min.
Min.
Min.
A
–
–
1.20
A1
0.05
–
0.15
A2
0.95
1.00
b
0.22
c
0.09
D/E
16.00 BSC
16.00 BSC
16.00 BSC
22.00 BSC
D1/E1
14.00 BSC
14.00 BSC
14.00 BSC
20.00 BSC
e
0.65 BSC
0.50 BSC
0.40 BSC
0.40 BSC
L
0.45
ccc
0.10
Theta
0
Nom.
Max.
–
1.20
0.05
–
0.15
1.05
0.95
1.00
0.32
0.38
0.17
–
0.20
0.09
0.60
0.75
0.45
Nom.
Max.
–
1.20
0.05
0.10
0.15
1.05
0.95
1.00
0.22
0.27
0.13
–
0.20
0.09
0.60
0.75
0.08
3.50
deg
7 deg
0
0.45
Nom.
Max.
–
1.20
0.05
0.10
0.15
1.05
0.95
1.00
1.05
0.18
0.23
0.13
0.18
0.23
–
0.20
0.09
–
0.20
0.60
0.75
0.08
3.50
deg
7 deg
0
0.45
0.60
0.75
3.50
deg
7 deg
0.08
3.50
deg
7 deg
0
Note: All dimensions are in millimeters.
PD3068 Datasheet Revision 60.0
55
Package Mechanical Drawings
Note: BSC = Basic spacing between centers.
Note: Variation AEE plus 8 leads.
2.12
Plastic Ball Grid Array (PBGA)
The following figures show package outlines for various packages under PBGA.
2.12.1
BG272
The following figure shows the package outline of BG272.
Figure 35 • Package Outline of BG272
Bottom View
Top View
A1 Ball a
Pd Corner
A
D
A1 Ball a
Pd Corner
2019181716151413121110 9 8 7 6 5 4 3 2 1
B
D2
A
B
C
D
E
F
G
H
J
K
J
M
N
P
R
T
U
V
W
Y
e
E2
E
E1
e
D1
Detail A
SideView
R0.025 Typ.
Detail A
// ccc C
A
A2
30°
D1/E1 SQ
aaa C
NX Øb
A1
C
// bbb C
C
Ø0.25 M C A B
Ø0.10 M C
The following table shows the supported devices for BG272.
Table 43 •
Supported Devices for BG272
Supported Devices
A42MX36
1.
A500K0501
A500K1301
This product is obsolete.
PD3068 Datasheet Revision 60.0
56
Package Mechanical Drawings
2.12.2
BG313
The following figure shows the package outline of BG313.
Figure 36 • Package Outline of BG313
Bottom View
Top View
A1 Ball Pad Corner
D
A
A1 Ball Pad Corner
B
D2
25242322 2120 19181716151413121110 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
e
E2
E
E1
e
D1
Detail A
Side View
R0.025 Typ.
Detail A
A
// ccc C
A2 // bbb C
30°
D1/E1 SQ
aaa C
NX Øb
c
A1
C
Ø0.25 M C A B
Ø0.10 M C
Note: Dimensions are in millimeters. For more information on dimensions, see Plastic Ball Grid Array
Dimensions, page 61.
The following table shows the supported devices for BG313.
Table 44 •
Supported Devices for BG313
Supported Devices
A14100A
A14V100A
A54SX32
PD3068 Datasheet Revision 60.0
57
Package Mechanical Drawings
2.12.3
BG329
The following figure shows the package outline of BG329.
Figure 37 • Package Outline of BG329
A1 Ball Pad Corner
Top View
Bottom View
D
A
A1 Ball Pad Corner
23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
B
D2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
e
E2 E
E1
e
D1
Detail A
Side View
R0.025 Typ.
Detail A
A
// ccc C
A2 // bbb C
30°
D1/E1 SQ
aaa C
NX Øb
c
C
A1
Ø0.25 M C A B
Ø0.10 M C
Note: Dimensions are in millimeters.
For more information on dimensions, see Plastic Ball Grid Array Dimensions, page 61.
The following table lists the supported devices for BG329.
Table 45 •
Supported Devices for BG329
Supported Devices
A54SX32
A53SX32A
PD3068 Datasheet Revision 60.0
58
Package Mechanical Drawings
2.12.4
BG456
The following figure shows the package outline of BG456.
Figure 38 • Package Outline of BG456
Top View
Bottom View
A1 Ball Pad Corner
D
A
A1 Ball Pad Corner
26 25 24 23 2221 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
B
D2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
e
E2
E
E1
D1
e
Detail A
Side View
R0.025 Typ.
Detail A
A
// ccc C
A2 // bbb C
30°
D1/E1 SQ
aaa C
NX Øb
c
C
A1
Ø0.25 M C A B
Ø0.10 M C
Note: Dimensions are in millimeters. For more information on dimensions, see Plastic Ball Grid Array
Dimensions, page 61.
The following table shows the supported devices for BG456.
Table 46 •
Supported Devices for BG456
Supported Devices
A500K1301
A500K1801
A500K2701
1.
APA150
APA300
APA450
APA600
APA750
APA1000
This product is obsolete.
PD3068 Datasheet Revision 60.0
59
Package Mechanical Drawings
2.12.5
BG729
The following figure shows the package outline of BG729.
Figure 39 • Package Outline of BG729
A1 Ball Pad Corner
Top View
Bottom View
A
D
D2
A1 Ball Pad Corner
2726 2524232221 2019181716151413121110 9 8 7 6 5 4 3 2 1
B
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
e
E2
E
E1
e
D1
Detail A
Side View
R0.025 Typ.
Detail A
A
// ccc C
A2 // bbb C
30°
D1/E1 SQ
aaa C
NX Øb
c
C
A1
Ø0.25 M C A B
Ø0.10 M C
Note: Dimensions are in millimeters. For more information on dimensions, see Plastic Ball Grid Array
Dimensions, page 61.
The following table shows the supported devices for BG729.
Table 47 •
Supported Devices for BG729
Supported Devices
AX1000
PD3068 Datasheet Revision 60.0
60
Package Mechanical Drawings
2.12.6
Plastic Ball Grid Array Dimensions
The following table lists the dimensions of Plastic Ball Grid Array.
Table 48 •
Plastic Ball Grid Array Dimensions
JEDEC
Equivalent
BG272
MS-034 VAR BAL-2
BG313
MS-034
Dimension
Min.
Min.
Nom.
Max.
Nom.
BG329
MS-034 VAR BAN-2
BG456
MS-034 VAR BAR-2
Max.
Min.
Min.
Nom.
Max.
Nom.
Max.
A
2.18
2.33
2.50
2.12
2.33
2.52
2.17
2.33
2.70
2.12
2.33
2.54
A1
0.50
0.60
0.70
0.50
0.60
0.70
0.50
0.60
0.70
0.50
0.60
0.70
A2
1.15
1.17
1.19
1.12
1.17
1.22
1.10
1.20
1.30
1.12
1.17
1.19
0.75
0.90
0.76
0.90
0.60
0.76
0.90
0.76
0.90
0.56
0.61
35.00
35.20
aaa
0.20
b
0.60
bbb
0.25
c
0.53
ccc
0.35
D
26.80
0.20
0.60
0.20
0.25
0.56
0.61
0.53
0.25
0.56
0.61
0.35
27.00
27.20
34.80
0.20
0.53
0.25
0.60
0.70
0.35
35.00
35.20
30.48 BSC
30.80
0.60
0.51
0.35
31.00
31.20
D1
24.13 BSC
D2
23.90
24.00
24.10
29.50
30.00
30.70
27.90
28.00
28.10
29.80
30.00
30.20
E
26.80
27.00
27.20
34.80
35.00
35.20
30.80
31.00
31.20
34.80
35.00
35.20
24.10
29.50
E1
24.13 BSC
E2
23.90
e
1.27 typ.
JEDEC
Equivalent
BG729
MS-034 VAR BAR-1
Dimensions
Min.
Nom.
Max.
A
2.12
2.33
2.54
A1
0.50
0.60
0.70
A2
1.12
1.17
1.19
aaa
0.20
b
0.60
0.76
0.90
bbb
0.25
c
0.50
0.56
0.62
ccc
0.35
D
34.80
35.00
35.20
D1
33.02 BSC
D2
29.95
30.00
30.70
E
34.80
35.00
35.20
E1
33.02 BSC
E2
29.95
e
1.27 typ.
24.00
30.00
27.94 BSC
34.80
30.48 BSC
30.00
1.27 typ.
31.75 BSC
27.94 BSC
30.70
27.90
28.00
1.27 typ.
31.75 BSC
28.10
29.80
30.00
30.20
1.27 typ.
30.70
PD3068 Datasheet Revision 60.0
61
Package Mechanical Drawings
2.13
Fine Pitch Plastic Ball Grid Array (FBGA)
The following figures show package outlines for various packages under Fine Pitch Plastic Ball Grid
Array.
2.13.1
FG144
The following figure shows the package outline of FG144.
Figure 40 • Package Outline of FG144
Top View
A1 Ball
Pad Corner
D/D2
Bottom View
A
12 11 10
9
8
7
6
A1 Ball Pad Corner
5 4 3 2 1
A
D/4
B
C
E/4
e
D
E
F
E1
E/E2
G
H
J
K
L
M
e
B
D1
Side View
Detail A
Detail A
C
// ccc C
// bbb B
A
A2
D1/E1 SQ
NX Øb
aaa C
C
A1
Ø0.25 M C A B
Ø0.10 M C
Note: Dimensions are in millimeters. For more information on dimensions, see Fine Pitch Plastic Ball Grid
Array Dimensions, page 75.
PD3068 Datasheet Revision 60.0
62
Package Mechanical Drawings
The following table lists the supported devices for FG144.
Table 49 •
Supported Devices for FG144
Supported Devices
A54SX08
1.
A500K0501
A500K1301
APA075
APA150
APA300
APA450
A54SX08A
A54SX16A
A54SX32A
AGL060
AGL125
AGL250
AGL400
AGL600
AGL1000
M1AGL250
M1AGL600
M1AGL1000
A3P060
A3P125
A3P250
A3P400
A3P600
A3P1000
M1A3P250
M1A3P400
M1A3P600
M1A3P1000
M7A3P1000
A3P250L
A3P600L
A3P1000L
M1A3P600L/
M1A3P1000L
This product is obsolete.
2.13.2
FG256 MO-192 VAR DAF1
The following figure shows the package outline of FG256 MO-192 VAR DAF1.
Figure 41 • Package Outline of FG256 MO-192 VAR DAF1
Top View
A1 Ball Pad Corner
Bottom View
D
A
A1 Ball Pad Corner
B
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
D/4
e
E/4
E
E2
E1
e
D2
D1
Side View
Detail A
Detail A
C
// ccc C
// bbb B
A
A2
D1/E1 SQ
NX Øb
aaa C
C
A1
Ø0.25 M C A B
Ø0.10 M C
Note: Dimensions are in millimeters. For more information on dimensions, see Fine Pitch Plastic Ball Grid
Array Dimensions, page 75.
PD3068 Datasheet Revision 60.0
63
Package Mechanical Drawings
The following table lists the supported devices for FG256 MO-192 VAR DAF1.
Table 50 •
Supported Devices for FG256 MO-192 VAR DAF1
Supported Devices
A500K1301 APA150
A500K1801 APA300
A500K2701 APA450
APA600
1.
A54SX16A AX125
AX250
AGL400
AGL600
AGL1000
M1AGL600
M1AGL1000
AGLE600
A3P250
A3P400
A3P600
A3P1000
M1A3P400
M1A3P600
M1A3P1000
M7A3P1000
A3PE600
A3P250L
A3P600L
A3P1000L
M1A3P600L
M1A3P1000L
AFS090
AFS250
AFS600
AFS1500
M1AFS250
M1AFS600
M1AFS1500
M7AFS600
A2F060
A2F200
A2F500
This product is obsolete.
2.13.3
FG256 MS-034 VAR AAF-1
The following figure shows the package outline of FG256 MS-034 VAR AAF-1.
Figure 42 • Package Outline of FG256 MS-034 VAR AAF-1
A1 Ball Pad Corner
Bottom View
Top View
D
A
A1 Ball Pad Corner
D2
16 15 14 13 12 11 10 9 8 7 6 5 4
3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
e
E1
E E2
e
D1
B
Side View
Detail A
R0.025 Typ.
Detail A
A
// ccc C
A2 // bbb C
30°
D1/E1 SQ
NX Øb
aaa C
Ø0.25 M C A B
Ø0.10 M C
c
C
A1
Note: Dimensions are in millimeters. For more information on dimensions, see Fine Pitch Plastic Ball Grid
Array Dimensions, page 75.
PD3068 Datasheet Revision 60.0
64
Package Mechanical Drawings
The following table lists the supported devices for FG256 MS-034 VAR AAF-1.
Table 51 •
Supported Devices for FG256 MS-034 VAR AAF-1
Supported Devices
A54SX32A
A54SX72A
2.13.4
FG324
The following figure shows the package outline of FG324.
Figure 43 • Package Outline of FG324
Top View
A1 Ball Pad Corner
Bottom View
A
D
A1 Ball Pad Corner
18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
D/4
e
E/4
E
B
E2
E1
e
D2
D1
Side View
Detail A
Detail A
C
// ccc C
// bbb B
A
A2
D1/E1 SQ
aaa C
NX Øb
C
A1
Ø0.25 M C A B
Ø0.10 M C
Note: Dimensions are in millimeters. For more information on dimensions, see Fine Pitch Plastic Ball Grid
Array Dimensions, page 75.
The following table lists the supported devices for FG324.
Table 52 •
Supported Devices for FG324
Supported Devices
AX125
A3PE3000
M1A3PE3000
PD3068 Datasheet Revision 60.0
A3PE3000L
M1A3PE3000L
65
Package Mechanical Drawings
2.13.5
FG484 MS-034 VAR AAL-1
The following figure shows the package outline of FG484 MS-034 VAR AAL-1.
Figure 44 • Package Outline of FG484 MS-034 VAR AAL-1
Bottom View
Top View
A1 Ball Pad Corner
D
A
A1 Ball Pad Corner
D2
2625242322212019181716151413121110 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
e
E1
E E2
e
B
D1
Side View
Detail A
R0.025 Typ.
Detail A
A
// ccc C
A2 // bbb C
30°
D1/E1 SQ
NX Øb
aaa C
Ø0.25 M C A B
Ø0.10 M C
c
C
A1
Note: Dimensions are in millimeters. For more information on dimensions, see Fine Pitch Plastic Ball Grid
Array Dimensions, page 75.
The following table lists the supported devices for FG484 MS-034 VAR AAL-1.
Table 53 •
Supported Devices for FG484 MS-034 VAR AAL-1
Supported Devices
A54SX32A
A54SX72A
PD3068 Datasheet Revision 60.0
66
Package Mechanical Drawings
2.13.6
FG484—Fully Populated MS-034 VAR AAJ-1
The following figure shows the package outline of FG484 Fully Populated MS-034 VAR AAJ-1.
Figure 45 • FG484—Fully Populated MS-034 VAR AAJ-1
Bottom View
Top View
D
A1 Ball Pad Corner
A
A1 Ball Pad Corner
D2
22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
e
E1
E
E2
e
D1
B
Side View
Detail A
R0.025 Typ.
Detail A
A
// ccc C
A2 // bbb C
30°
D1/E1 SQ
NX Øb
aaa C
Ø0.25 M C A B
Ø0.10 M C
c
C
A1
Note: Dimensions are in millimeters. For more information on dimensions, see Fine Pitch Plastic Ball Grid
Array Dimensions, page 75.
The following figure lists the supported devices for FG484 Fully Populated MS-034 VAR AAJ-1.
Table 54 •
Supported Devices for FG484 Fully Populated MS-034 VAR AAJ-1
Supported Devices
APA450
APA600
AX250
AX500
AX1000
AGL400
AGL600
AGL1000
M1AGL600
M1AGL1000
AGLE600
AGLE3000
M1AGLE3000
A3P400
A3P600
A3P1000
M1A3P400
M1A3P600
M1A3P1000
M7A3P1000
A3PE600
A3PE1500
A3PE3000
M1A3PE1500
M1A3PE3000
A3PE600L
A3PE3000L
M1A3PE3000L
A3P600L
A3P1000L
M1A3P600L
M1A3P1000L
PD3068 Datasheet Revision 60.0
AFS600
AFS1500
M1AFS600
M1AFS1500
M7AFS600
A2F200
A2F500
67
Package Mechanical Drawings
2.13.7
FG676 (Option 1)
The following figure shows the package outline of FG676 (Option 1).
Figure 46 • Package Outline of FG676 (Option 1)
Bottom View
Top View
D
A1 Ball Pad Corner
A
A1 Ball Pad Corner
D2
2625242322212019181716151413121110 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
e
E E2
E1
e
B
D1
Side View
Detail A
R0.025 Typ.
Detail A
// ccc C
A2 // bbb C
30°
A
D1/E1 SQ
NX Øb
aaa C
c
Ø0.25 M C A B
Ø0.10 M C
C
A1
Note: Dimensions are in millimeters. For more information on dimensions, see FG676 (Option 1 and 2)
Package Mechanical Drawing Dimensions, page 70.
The following table lists the supported device for FG676 (Option 1).
Table 55 •
Supported Devices for FG676 (Option 1)
Supported Devices
A500K2701
1.
APA600
APA750
AX500
AX1000
A3PE1500
M1A3PE1500
AFS1500
M1AFS1500
This product is obsolete.
PD3068 Datasheet Revision 60.0
68
Package Mechanical Drawings
2.13.8
FG676 (Option 2)
The following figure shows the package outline of FG676 (Option 2).
Figure 47 • Package Outline of FG676 (Option 2)
Top View
D
Bottom View
A
A1 Ball Pad Corner
B
D2
A1 Ball Pad Corner
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
8
7 6 5 4 3
2 1
A
B
C
D
e
E
F
G
H
J
K
L
M
N
P
R
Detail B
+
E2
E
Dimple by Mold
1.0
E1
T
U
V
W
Y
AA
0.20A B
AB
AC
AD
AE
AF
4.00
D1
Side View
Detail B
Scale: None
(X-Section View)
e
30° Typ.
Gate Protrusion
(0.05)
ccc C
bbb C
aaa C
B
1.0±0.1
A
b
A2
Gate Chip Out
C
0.25 M C A B
0.10 M C
Note: Dimensions are in millimeters. For more information on dimensions, see FG676 (Option 1 and 2)
Package Mechanical Drawing Dimensions, page 70.
The following table lists the supported devices for FG676 (Option 2).
Table 56 •
Supported Devices for FG676 (Option 2)
Supported Devices
SmartFusion®2 (M2S090, M2S060)
IGLOO®2 (M2GL090, M2GL060)
PD3068 Datasheet Revision 60.0
69
Package Mechanical Drawings
2.13.9
FG676 (Option 1 and 2) Package Mechanical Drawing
Dimensions
The following table lists the dimensions of FG676 (Option 1 and 2) Package Mechanical Drawing.
Table 57 •
Dimensions of FG676 (Option 1 and 2) Package Mechanical Drawing
JEDEC
Equivalent
FG676 (Option 1), page 68
27mm X 27mm, 1.0mm Pitch, 676 Solder
Balls, PBGA
FG676 (Option 2), page 69
27mm X 27mm, 1.0mm Pitch, 676 Solder
Balls, PBGA
Dimension
Min.
Nom.
Max.
Min.
Nom.
Max.
A
2.02
2.23
2.44
2.02
2.23
2.44
A1
0.40
0.50
0.60
0.40
0.50
0.60
A2
1.12
1.17
1.22
1.12
1.17
1.22
aaa
0.20
b
0.50
0.61
0.70
0.56
0.62
27.00
27.20
25.65
25.70
26.05
26.80
27.00
27.20
25.70
26.05
0.15
0.63
0.70
0.56
0.62
bbb
0.25
c
0.50
ccc
0.35
D
26.80
D1
25.00 BSC
D2
23.95
24.00
24.70
E
26.80
27.00
27.20
E1
25.00 BSC
E2
23.95
e
1.00 typ.
0.50
0.25
0.50
0.35
27.00
27.20
26.80
25.00 BSC
25.00 BSC
24.00
24.70
25.65
1.00 TYP
Note: All dimensions are in millimeters.
Note: BSC = Basic spacing between centers.
PD3068 Datasheet Revision 60.0
70
Package Mechanical Drawings
2.13.10 FG484—Fully Populated MS-034 VAR AAJ-1, Larger Mold Cap
Size
The following figure shows package outlines of FG484 Fully Populated MS-034 VAR AAJ-1, Larger Mold
Cap Size.
Figure 48 • Package Outline of FG484 MS-034 VAR AAJ-1
Top View
Bottom View
A
D
A1 Ball Pad Corner
D2
A1 Ball Pad Corner
B
22 21 20 19 18 17 16 15 14 1312 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
e
Detail A
E2 E
+
E1
Dimple by Mold
1.0
0.20 A B
4 × 9.00
e
D1
4.0
Detail A
Side View
Detail B
R0.025 Typ.
Detail B
Gate Protrusion
(0.05)
A
30°
D1/E1 SQ
1.0 + 0.1
NX Øb
Gate Chip Out
aaa C
Ø0.25 M C A B
Ø0.10 M C
A1
c
// ccc C
A2 // bbb C
C
The following table lists the supported devices for FG484 MS-034 VAR AAJ-1.
Table 58 •
Supported Devices for FG484 MS-034 VAR AAJ-1
Supported Devices
M2S005, M2S005S
M2S010, M2S010T, M2S010TS
M2S025, M2S025T, M2S025TS
M2S050, M2S050T, M2S050TS
M2S090, M2S090T, M2S090TS
M2S060, M2S060T, M2S060TS
M2GL005, M2GL005S
M2GL010, M2GL010T, M2GL010TS
M2GL025, M2GL025T, M2GL025TS
M2GL050, M2GL050T, M2GL050TS
M2GL090, M2GL090T, M2GL090TS
M2GL060, M2GL060T, M2GL060TS
PD3068 Datasheet Revision 60.0
71
Package Mechanical Drawings
2.13.11 FG896
The following figure shows the package outline of FG896.
Figure 49 • Package Outline of FG896
A1 Ball
Pad Corner
Top View
Bottom View
D
A
A1 Ball Pad Corner
30 2928 272625 242322212019181716151413121110 9 8 7 6 5 4 3 2 1
D2
A
B
C
D
E
F
G
H
e
J
E E2
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
E1
e
D1
B
SideView
Detail A
R0.025Typ.
Detail A
// ccc C
A2
30°
A
D1/E1 SQ
NX Øb
aaa C
c
// bbb C
C
A1
Ø0.25 M C A B
Ø0.10 M C
The following table lists the supported devices for FG896.
Table 59 •
Supported Devices for FG896
Supported Devices
APA750
APA1000
AX1000
AX2000
AGLE3000
M1AGLE3000
A3PE3000
M1A3PE3000
PD3068 Datasheet Revision 60.0
A3PE3000L
M1A3PE3000L
72
Package Mechanical Drawings
2.13.12 FG896—Larger Mold Cap Size
The following figure shows the package outline of Larger Mold Cap Size for FG896.
Figure 50 • FG896 Larger Mold Cap Size
Top View
Bottom View
D
A
B
D2
A1 Ball Pad Corner
A1 Ball Pad Corner
30 29 28 27 26 25 24 23 22 21 20 19 18 17 1 6 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
e
E
F
G
H
J
K
L
M
N
P
R
Detail A
E2
+
E
E1
T
U
V
W
Y
AA
Dimple by Mold
1.0
0.20A B
AB
AC
AD
AE
AF
AG
AH
AJ
AK
e
D1
4.00
Note: The dimple in the center is the mold gate.
Detail A
Side View
Gate Protrusion
Detail B
(0.05)
1.0 + 0.1
R0.025 Typ.
Detail B
A
D1/E1 SQ
Gate Chip Out
NX Øb
// ccc C
A2
30°
aaa C
A1
c
// bbb C
C
Ø0.25 M C A B
Ø0.10 M C
The following table lists the Supported Devices for FG896 Larger Mold Cap Size.
Table 60 •
Supported Devices for FG896 Larger Mold Cap Size
Supported Devices
M2S050, M2S050S, M2S050TS
M2GL050, M2GL050S, M2GL050TS
PD3068 Datasheet Revision 60.0
73
Package Mechanical Drawings
2.13.13 FG1152
The following figure shows the package outline of FG1152.
Figure 51 • Package Outline of FG1152
Top View
A1 Ball
Pad Corner
Bottom View
D
D2
A
A1 Ball Pad Corner
34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
e
E E2
E1
e
D1
B
SideView
Detail A
R0.025Typ.
Detail A
// ccc C
A
A2
30°
D1/E1 SQ
NX Øb
aaa C
Ø0.25 M C A B
Ø0.10 M C
c
// bbb C
C
A1
Note: Dimensions are in millimeters. For more information on dimensions, see Fine Pitch Plastic Ball Grid
Array Dimensions, page 75.
The following table lists the supported devices for FG1152
Table 61 •
Supported Devices for FG1152
Supported Devices
APA1000
AX2000
PD3068 Datasheet Revision 60.0
74
Package Mechanical Drawings
2.13.14 Fine Pitch Plastic Ball Grid Array Dimensions
The following table lists the details and dimensions for FG144, FG256, and FG324.
Table 62 •
Fine Pitch Plastic Ball Grid Array Dimensions for FG144, FG256, and FG324
JEDEC
Equivalent
FG144, page 62
MO-192 VAR DAD-1
FG256 MO-192 VAR
DAF1, page 63
FG256 MS-034 VAR
AAF-1, page 64
FG324, page 65
MS-034 VAR AAG-1
Dimension
Min.
Min.
Min.
Min.
Nom.
Max.
Nom.
Max.
Nom.
Max.
Nom.
Max.
A
1.35
1.45
1.55
1.35
1.60
1.70
1.55
1.76
1.97
1.48
1.63
1.78
A1
0.35
0.40
0.45
0.25
0.40
–
0.30
0.40
0.50
0.33
0.38
0.43
A2
0.65
0.70
0.75
0.65
0.70
0.75
0.75
0.80
0.85
0.65
0.70
0.75
0.55
0.45
0.55
0.40
0.60
0.49
aaa
b
0.10
0.45
bbb
c
0.25
–
–
0.40
0.35
12.80
D1
13.00
0.20
0.50
16.80
0.50
11.00 BSC
17.00
0.54
0.25
0.60
0.50
0.62
0.50
0.55
0.35
17.20
16.80
15.00 BSC
17.00
0.59
0.25
0.56
0.35
13.20
0.20
0.50
0.25
0.35
ccc
D
0.12
0.50
0.60
0.35
17.20
18.80
15.00 BSC
19.00
19.20
17.00 BSC
D2
12.80
13.00
13.20
16.80
17.00
17.20
14.80
15.00
15.20
18.80
19.00
19.20
E
12.80
13.00
13.20
16.80
17.00
17.20
16.80
17.00
17.20
18.80
19.00
19.20
13.20
16.80
17.20
14.80
15.20
18.80
E1
E2
11.00 BSC
12.80
e
13.00
15.00 BSC
1.00 typ.
17.00
15.00 BSC
1.00 typ.
15.00
17.00 BSC
1.00 typ.
19.00
19.20
1.00 typ.
Note: All dimensions are in millimeters.
Note: BSC = Basic spacing between centers.
The following table lists the details and dimensions for FG484.
Table 63 •
Fine Pitch Plastic Ball Grid Array Dimensions for FG484
JEDEC
Equivalent
FG484 MS-034 VAR AAL-1,
page 66
FG484—Fully Populated MS034 VAR AAJ-1, page 67
FG484—Fully Populated MS034 VAR AAJ-1, Larger Mold
Cap Size, page 71
Dimension
Min.
Nom.
Max.
Min.
Nom.
Max.
Min.
Nom.
Max.
A
2.02
2.23
2.44
2.02
2.23
2.44
2.02
2.23
2.44
A1
0.40
0.50
0.60
0.40
0.50
0.60
0.40
0.50
0.60
A2
1.12
1.17
1.22
1.12
1.17
1.22
1.12
1.17
1.22
aaa
0.20
b
0.50
0.61
0.70
bbb
0.25
c
0.50
0.56
0.62
ccc
0.35
D
26.80
23.00
23.20
D1
25.00 BSC
0.20
0.63
0.70
0.50
0.15
0.63
0.70
0.25
0.56
0.62
0.50
0.25
0.56
0.62
0.35
27.00
27.20
22.80
0.50
0.50
0.35
23.00
23.20
21.00 BSC
PD3068 Datasheet Revision 60.0
22.80
21.00 BSC
75
Package Mechanical Drawings
Table 63 •
Fine Pitch Plastic Ball Grid Array Dimensions for FG484
D2
23.80
24.00
24.20
19.45
19.50
20.20
22.35
22.40
22.75
E
26.80
27.00
27.20
22.80
23.00
23.20
22.80
23.00
23.20
E1
25.00 BSC
E2
23.80
22.40
22.75
e
1.00 typ.
21.00 BSC
24.00
24.20
19.45
21.00 BSC
19.50
20.20
1.00 typ.
22.35
1.00 typ.
Note: All dimensions are in millimeters.
Note: BSC = Basic spacing between centers.
The following table lists the details and dimensions for FG896 and FG1152.
Table 64 •
Fine Pitch Plastic Ball Grid Array Dimensions for FG896 and FG1152
JEDEC
Equivalent
FG896, page 72
MS-034 VAR AAN-1
Dimension
Min.
Nom.
Max.
FG896—Larger Mold Cap
Size, page 73
MS-034 VAR AAN-1
FG1152, page 74
MS-034 VAR AAR-1
Min.
Nom.
Max.
Min.
Nom.
Max.
A
2.02
2.23
2.44
2.02
2.23
2.44
2.02
2.23
2.44
A1
0.40
0.50
0.60
0.40
0.50
0.60
0.40
0.50
0.60
A2
1.12
1.17
1.22
1.12
1.17
1.22
1.12
1.17
1.22
0.63
0.70
0.61
0.70
0.50
0.63
0.70
0.56
0.62
35.00
35.20
aaa
0.20
b
0.50
bbb
0.25
c
0.50
ccc
0.35
D
30.80
0.15
0.56
0.62
31.00
29.00 BSC
25.95
26.00
31.20
E
30.80
E1
29.00 BSC
E2 (option
1.
0.56
0.62
31.00
26.00
30.80
31.00
31.20
29.00 BSC
31.20
29.65
29.70
30.05
30.80
31.00
31.20
33.65
33.70
34.20
34.80
35.00
35.20
33.00 BSC
26.70
33.65
29.65
1.00 typ.
34.80
33.00 BSC
29.00 BSC
2)1
0.50
0.35
26.70
D2 (option 2)1
e
0.50
0.25
0.35
D2 (option 1)1
25.95
0.20
0.25
D1
E2 (option 1)1
0.50
29.70
33.70
34.20
30.05
1.00 typ.
1.00 typ.
As per JEDEC specification MS-034, a different lid size is allowed (D2/E2) for FG896.
Note: All dimensions are in millimeters.
Note: BSC = Basic spacing between centers.
PD3068 Datasheet Revision 60.0
76
Package Mechanical Drawings
2.13.15 FC1152
The following figure shows the package outline of FC1152.
Figure 52 • Package Outline of FC1152
Top View
Bottom Vie
1152 Solder B
D
A1 Ballpad
Corner
A
B
D2
34 32 30 28 26 24 22 20 18 16 14
33 31 29 27 25 23 21 19 17 15 13
Pin 1 ID
e
E2
E
D1
E1
Side View
D3/E3
ccc C
aaa C
A2
Note: Dimensions are in millimeters.
For more information on dimensions, see FC1152 Package Mechanical
Drawing Dimensions, page 79.
Table 65 •
Supported Devices for FC1152
Supported Devices
SmartFusion2 (M2S150)
IGLOO2 (M2GL150)
PD3068 Datasheet Revision 60.0
77
Package Mechanical Drawings
2.13.16 FCV484
The following figure shows the package outline of FCV484.
Figure 53 • Package Outline of FCV484
ddd C (3X)
D
A1 BALLPAD
CORNER
A1 BALL PAD CORNER
A
22
B
D2
20
21
18
19
16
17
14
15
12
13
10
11
8
9
6
7
4
5
2
3
1
A
B
C
D
E
F
G
H
e
J
K
E
0.15 U 0.10 C
L
D1
M
N
E2
P
R
T
U
V
W
Y
(1.10)
AA
AB
(1.10)
e
E1
Top View
Bottom View
484 SOLDER BALLS
A2
E3/D3
c
ccc
C
C
A1
A
SEATING PLANE
aaa C
b
eee M C A B
fff M C
Side View
Note: Dimensions are in millimeters. For more information on dimensions, see FCV484 Package Mechanical
Drawing Dimensions, page 79.
Table 66 •
Supported Devices for FCV484
Supported Devices
SmartFusion2 (M2S150)
IGLOO2 (M2GL150)
PD3068 Datasheet Revision 60.0
78
Package Mechanical Drawings
2.13.17 FCV484 Package Mechanical Drawing Dimensions
The following figure shows the details and dimensions of FCV484 Package Mechanical Drawing.
Table 67 •
JEDEC
Equivalent
FCV484 Package Mechanical Drawing Dimensions
FCV484, page 78
Dimension
Min.
Nom.
Max.
A
2.85
3.00
3.15
A1
0.30
0.40
0.50
A2
0.50
aaa
0.20
b
0.45
0.50
0.55
ccc
0.25
D
19.00
D1
16.80 BSC
D2
18.00 REF
D3
18.00 REF
E
19.00
E1
16.80 BSC
E2
18.00 REF
E3
18.00 REF
e
0.80 BSC
eee
0.15
fff
0.08
Note: All dimensions are in millimeters.
Note: BSC = Basic spacing between centers.
2.13.18 FC1152 Package Mechanical Drawing Dimensions
The following figure shows the dimensions of FC1152
Table 68 •
Dimensions of FC1152
JEDEC
Equivalent
FC1152, page 77
Dimension
Min.
Nom.
Max.
A
2.34
2.62
2.90
A1
0.40
0.50
0.60
A2
0.8
aaa
0.20
0.64
0.70
35.00
35.15
b
0.50
ccc
0.25
D
34.85
D1
33.00 BSC
PD3068 Datasheet Revision 60.0
79
Package Mechanical Drawings
Table 68 •
Dimensions of FC1152
D2
29.00 REF
D3
27.00 REF
E
34.85
E1
33.00 BSC
35.00
E2
29.00 REF
E3
27.00 REF
e
1.00 BSC
eee
0.25
fff
0.10
35.15
Note: All dimensions are in millimeters.
Note: BSC = Basic spacing between centers.
2.14
Chip Scale Package (UC/CS/VF)
The following figures show package outlines for various packages under chip scale package.
2.14.1
UC36
The following figure shows the package outline of UC36.
Figure 54 • Package Outline of UC36
Top View
Bottom View
A
D
A1 Ball Pad Corner
D/2
B
6 5 4 3 2 1
A
B
C
D
E
F
e
E/2
E
(0.5)
e
(0.5)
Side View
Detail A
Detail A
// ccc C
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
PD3068 Datasheet Revision 60.0
80
Package Mechanical Drawings
The following table shows the supported devices for UC36.
Table 69 •
Supported Devices for UC36
Supported Devices
AGLN010
2.14.2
CS49
The following figure shows the package outline of CS49.
Figure 55 • Package Outline of CS49
Bottom View
Top View
D/D2
A
B
A1 Ball Pad Corner
7
6
5
A1 Ball Pad Corner
2
4
3
1
D/4
A
e
B
E/4
C
E/E2
D
E1
E
F
G
e
ddd
(4X)
D1
Detail A
Side View
Detail A
// ccc C
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
The following table shows the supported devices for CS49.
Table 70 •
Supported Devices for CS49
Supported Devices
eX641
eX1281
1.
This product is obsolete.
PD3068 Datasheet Revision 60.0
81
Package Mechanical Drawings
2.14.3
UC81
The following figure shows the package outline of UC81.
Figure 56 • Package Outline of UC81
Top View
Bottom View
81 Metal Lands
0.10 (4X)
E
A
Pin A1
Pad Corner
Pin A1
Pad Corner
9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
e
D
B
e
(0.40)
(0.40)
Side View
Detail A
Detail A
// ccc C
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
The following table lists the supported devices for UC81.
Table 71 •
Supported Devices for UC81
Supported Devices
AGL030
AGLN020
AGLN030
PD3068 Datasheet Revision 60.0
82
Package Mechanical Drawings
2.14.4
CS81
The following figure shows the package outline of CS81.
Figure 57 • Package Outline of CS81
Top View
Bottom View
0.10 (4X)
81 Metal Lands
A
E
Pin A1
Pad Corner
Pin A1
Pad Corner
9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
e
D
B
e
(0.50)
(0.50)
Side View
Detail A
Detail A
// ccc C
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
Table 72 •
Supported Devices for CS81
Supported Devices
AGL030
AGL250
AGLN020
AGLN030
AGLN060
AGLN125
AGLN250
PD3068 Datasheet Revision 60.0
83
Package Mechanical Drawings
2.14.5
CS121
The following figure shows the package outline of CS121.
Figure 58 • Package Outline of CS121
Top View
E
A1 Ball Pad
Corner
Bottom View
0.10 (4X)
121 Solder Balls
A1 Ball Pad Corner
A
1110 9 8 7 6 5 4 3 2 1
e
A
B
C
D
E
F
G
H
J
K
L
D
(0.50)
B
(0.50)
e
Side View
Detail A
Detail A
// ccc C
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
The following table lists the supported devices for CS121.
Table 73 •
Supported Devices for CS121
Supported Devices
AGL060
PD3068 Datasheet Revision 60.0
84
Package Mechanical Drawings
2.14.6
CS128
The following figure shows the package outline of CS128.
Figure 59 • Package Outline of CS128
Bottom View
Top View
A
D/D2
A1 Ball Pad Corner
B
A1 Ball Pad Corner
12 11 10 9
8
7
6
5
4
3
2
1
A
B
D/4
C
e
E/4
D
E
F
E/E2
E1
G
H
J
K
L
M
e
ddd
(4X)
D1
Detail A
Side View
// ccc C
Detail A
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
Table 74 •
Supported Devices for CS128
Supported Devices
eX641
eX1281
eX2561
1.
This product is obsolete.
PD3068 Datasheet Revision 60.0
85
Package Mechanical Drawings
2.14.7
CS180
The following figure shows the package outline of CS180.
Figure 60 • Package Outline of CS180
Bottom View
Top View
B
A
D/D2
A1 Ball Pad Corner
A1 Ball Pad Corner
14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
D/4
e
E/4
E/E2
E1
ddd
(4X)
e
D1
Detail A
Side View
// ccc C
Detail A
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
The following table shows the supported devices for CS180.
Table 75 •
Supported Devices for CS180
Supported Devices
eX2561
1.
AX1251
This product is obsolete.
PD3068 Datasheet Revision 60.0
86
Package Mechanical Drawings
2.14.8
CS196
The following figure shows the package outline of CS196.
Figure 61 • Package Outline of CS196
Bottom View
Top View
B
A
D/D2
A1 Ball Pad Corner
A1 Ball Pad Corner
14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
D/4
e
E/4
E/E2
E1
ddd
(4X)
e
D1
Detail A
Side View
// ccc C
Detail A
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
The following table lists the supported device for CS196.
Table 76 •
Supported Devices for CS196
Supported Devices
AGL125
AGL250
AGL400
PD3068 Datasheet Revision 60.0
87
Package Mechanical Drawings
2.14.9
CS201
The following figure shows the package outline of CS201.
Figure 62 • Package Outline of CS201
Top View
Bottom View
0.10 (4X)
E
201 Solder Balls
A1 Ball Pad Corner
A
B
e
15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
D
H
J
K
L
M
(0.50)
N
P
R
ddd
(4X)
(0.50)
e
Detail A
Side View
// ccc C
Detail A
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
The following table shows the supported devices for CS201.
Table 77 •
Supported Devices for CS201
Supported Devices
AGLP030
AGLP060
PD3068 Datasheet Revision 60.0
88
Package Mechanical Drawings
2.14.10 FCS325 – (Option 1)
The following figure shows the package outline of FCS325 (Option 1).
Figure 63 • Package Outline of FCS325 (Option 1)
ddd C (2X)
A
E
A1 BALL PAD CORNER
B
TERMINAL A1 CORNER
INDEX AREA
20 18 16 14 12
10 8
6
4
2
21 19 17 15 13 11
9 7
5
3
1
A
B
C
D
e
E
F
G
H
D1
J
K
L
M
D
N
P
R
T
U
V
W
Y
AA
ddd C (2X)
(0.500)
e
(0.500)
Top View
E1
Bottom View
A2
325 SOLDER BALLS
ccc C
A
A1
C
SEATING PLANE
aaa C
b
eee M C A B
fff M C
Side View
Note: Dimensions are in millimeters. For more information on dimensions, see FC325 column under Chip
Scale Package Dimensions, page 95.
The following table lists the supported devices for FCS325 (Option 1).
Table 78 •
Supported Devices for FCS325 (Option 1)
Supported Devices
SmartFusion2 (M2S050, M2S025,
M2S060)
IGLOO2 (M2GL050, M2GL025, M2GL060)
PD3068 Datasheet Revision 60.0
89
Package Mechanical Drawings
2.14.11 FCS325 – (Option 2)
The following figure shows the package outline of FCS325 (Option 2).
Figure 64 • Package Outline of FCS325 (Option 2)
(2X)
ddd
E
A1 Ball Pad Corner
A
20 18 16 14 12
10 8
6
4
2
21 19 17 15 13 11
9 7
5
3
1
B
TERMINAL A1 CORNER
INDEX AREA
A
B
C
D
e
E
F
G
H
J
K
D1
L
M
N
D
P
R
T
U
V
W
Y
AA
(1.750)
ddd
(2X)
e
(0.500)
Top View
E1
Bottom View
325 SOLDER BALLS
A2
ccc C
A
C
A1
SEATING PLANE
aaa C
b
eee
fff
C AB
C
Side View
Note: Dimensions are in millimeters. For more information on dimensions, see FCS325 (Option 2) column
under Chip Scale Package Dimensions, page 95.
The following table lists the supported devices for FCS325 (Option 2).
Table 79 •
Supported Devices for FCS325 (Option 2)
Supported Devices
SmartFusion2 (M2S090)
IGLOO2 (M2GL090)
PD3068 Datasheet Revision 60.0
90
Package Mechanical Drawings
2.14.12 CS281
The following figure shows the package outline of CS281.
Figure 65 • Package Outline of CS281
Bottom View
Top View
A
E
A1 Ball Pad Corner
B
19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
e
D
D1
ddd
(4X)
e
E1
Detail A
Side View
Detail A
// ccc C
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
The following table shows the supported devices for CS281.
Table 80 •
Supported Devices for CS281
Supported Devices
AGLP125
AGL600
AGL1000
M1AGL600
M1AGL1000
PD3068 Datasheet Revision 60.0
91
Package Mechanical Drawings
2.14.13 CS288
The following figure shows the package outline of CS288.
Figure 66 • Package Outline of CS288
Top View
Bottom View
A1 Ball Pad Corner
21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
E
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
e
D
D1
e
E1
Detail A
Side View
Detail A
// ccc C
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
The following table lists the supported devices for CS288.
Table 81 •
Supported Devices for CS288
Supported Devices
A2F060
A2F200
A2F500
PD3068 Datasheet Revision 60.0
92
Package Mechanical Drawings
2.14.14 FCS536
The following figure shows the package outline of FCS536.
Figure 67 • Package Outline of FCS536
ddd C
A1 BALL PAD CORNER
E
TERMINAL A1 CORNER
INDEX AREA
29 27 25 23 21 19 17 15 13 11 9
7 5
3 1
30 28 26 24 22 20 18 16 14 12 10 8 6
4 2
A
B
C
D
E
e
F
G
H
J
K
L
M
N
D1
P
R
D
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
ddd C
(0.750)
Top View
e
(0.750)
E1
Bottom View
A2
536 SOLDER BALLS
c
ccc C
A
C
A1
SEATING PLANE
aaa C
b
eee M C A B
fff M C
Side View
Dimensions are in millimeters. For more information on dimensions, see FC536 column under Chip Scale
Package Dimensions, page 95.
The following table lists the supported devices for FCS536.
Table 82 •
Supported Devices for FCS536
Supported Devices
IGLOO2 (M2GL150)
PD3068 Datasheet Revision 60.0
93
Package Mechanical Drawings
2.14.15 CS289
The following figure shows the package outline of CS289.
Figure 68 • Package Outline of CS289
Top View
Bottom View
A1 Ball Pad Corner
A
E
B
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
e
D1
D
ddd (4X)
e
E1
Detail A
Side View
Detail A
// ccc C
C
A
A2
D1/E1 SQ
NX Øb
aaa C
A1
C
eee C A B
fff C
Note: Dimensions are in millimeters. For more information on dimensions, see Chip Scale Package
Dimensions, page 95.
The following table lists the supported devices for CS289.
Table 83 •
Supported Devices for CS289
Supported Devices
AGLP030
AGLP060
AGLP125
PD3068 Datasheet Revision 60.0
94
Package Mechanical Drawings
2.14.16 Chip Scale Package Dimensions
The following table lists the Chip Scale Package Dimensions for UC36, CS49, UC81, and CS81.
Table 84 •
Chip Scale Package Dimensions for UC36, CS49, UC81, and CS81
JEDEC
Equivalent
UC36, page 80
CS49, page 81
MO-205
Dimension
Min.
Nom.
Max.
Min.
Nom.
Max.
Min.
Nom.
Max.
Min.
Nom.
Max.
A
0.66
0.73
0.80
–
–
1.50
0.66
0.73
0.80
0.66
0.73
0.80
A1
0.07 REF
0.25
–
–
0.07 REF
A2
0.40
–
–
0.42
UC81, page 82
0.45
0.50
0.85
0.23
0.28
0.45
0.50
0.55
0.18
0.36
–
0.21 REF
0.12
CS81, page 83
0.07 REF
0.45
0.48
0.23
0.28
0.42
0.08
0.45
0.48
0.25
0.30
aaa
0.08
b
0.18
c
0.21 REF
–
ccc
0.10
0.10
0.10
0.10
D/E
3.00 BSC
7.00 BSC
4.00 BSC
5.00 BSC
D1/E1
2.00
–
e
0.4 BSC
0.8 BSC
0.4 BSC
0.5 BSC
eee
0.15
0.15
0.15
0.15
fff
0.05
0.08
0.05
0.05
4.80
–
0.08
–
0.20
0.21 REF
3.20
–
–
4.00
–
Note: All dimensions are in millimeters.
Note: Variation AG depopulated.
The following table lists the Chip Scale Package Dimensions for CS121, CS128, CS180, CS196, and
CS201.
Table 85 •
Chip Scale Package Dimensions for CS121, CS128, CS180, CS196, and CS201
CS121, page 84
CS128, page 85
CS180, page 86
CS196, page 87
CS201, page 88
JEDEC
MO-195, Variation MO-205, Variation MO-205, Variation MO-195, Variation MO195, Variation
Equivalent AC
BD
BF
BE
AE2
Dimension Min. Nom. Max. Min. Nom. Max. Min. Nom. Max. Min. Nom. Max. Min.
Nom. Max.
A
0.79
0.89
0.99
–
–
1.50
–
–
1.50
–
–
1.20
0.79
0.89
0.99
A1
0.18
0.23
0.28
0.25
–
–
0.25
–
-
0.15
–
–
0.18
0.23
0.28
A2
0.40
0.45
0.50
0.85
–
–
0.85
–
-
0.60
–
–
0.40
0.45
0.50
aaa
0.08
b
0.25
0.30
0.35
0.45
0.50
0.55
0.45
0.50
0.55
0.25
0.30
0.35
0.25
0.30
0.35
c
0.16
0.21
0.26
–
0.36
–
–
0.36
–
–
0.36
–
0.16
0.21
0.25
ccc
0.10
0.10
0.10
0.10
0.10
D/E
6.00 BSC
11.00 BSC
13.00 BSC
8.00 BSC
8.00 BSC
D1/E1
–
–
–
e
0.5 BSC
0.8 BSC
0.8 BSC
0.5 BSC
0.5 BSC
eee
0.15
0.15
0.15
0.15
0.15
fff
0.05
0.08
0.08
0.05
0.05
0.12
5.00
–
–
0.12
8.80
–
0.08
10.40 –
PD3068 Datasheet Revision 60.0
0.08
6.50
–
–
7.00
–
95
Package Mechanical Drawings
Note: All dimensions are in millimeters.
Note: Variation AG depopulated.
The following table lists the Chip Scale Package Dimensions for FC325 and FC536.
Table 86 •
Chip Scale Package Dimensions for FC325 and FC536
JEDEC
Equivalent
FCS325 – (Option 1), page 89
FCS325 – (Option 2),
page 90
FCS536, page 93
Dimension
Min.
Min.
Min.
Nom.
Max.
A
Nom.
Max.
1.01
Nom.
1.16
0.21
0.55
0.60
1.45
A1
0.15
0.21
A2
0.40
0.45
aaa
0.08
b
0.25
bbb
N.A.
c
0.21
ccc
0.10
0.10
0.10
D
11.00
13.50
16.0
D1
10.00 BSC
10.00 BSC
14.50 BSC
E
11.00
11.00
16.0
ddd
0.15
0.15
0.15
E1
10.00 BSC
10.00 BSC
14.50 BSC
e
0.50 TYP
0.50 TYP
0.50 TYP
eee
0.15
0.15
0.15
0.50
0.15
0.65
0.08
0.30
0.35
0.25
0.29
0.15
0.24
0.55
0.60
0.65
0.30
0.35
0.512
0.552
0.08
0.30
0.35
N.A.
0.25
Max.
0.25
N.A.
0.21
0.25
0.29
0.472
Note: All dimensions are in millimeters.
Note: Variation AG depopulated.
The following table lists the Chip Scale Package Dimensions for CS281, CS288, and CS289.
Table 87 •
Chip Scale Package Dimensions for CS281, CS288, and CS289
JEDEC
Equivalent
CS281, page 91
MO-195, Variation AG2
CS288, page 92
Dimension
Min.
Nom.
Max.
Min.
Nom.
Max.
Min.
Nom.
Max.
A
–
–
1.05
–
–
1.05
1.01
1.11
1.20
A1
0.18
0.23
0.28
0.18
0.23
0.28
0.25
0.30
0.35
A2
–
0.45 REF –
–
0.45 REF –
0.55
0.60
0.65
aaa
0.08
b
0.26
0.31
0.35
0.40
0.45
c
–
0.26 REF –
0.17
0.21
0.25
ccc
0.20
D/E
9.85
D1/E1
9.00 BSC
e
CS289, page 94
0.08
0.36
0.08
0.26
0.31
0.36
–
0.26 REF –
0.20
10.00
10.15
10.85
0.10
11.0
11.15
10.00 BSC
0.5 BSC
14.00 BSC
–
0.5 BSC
PD3068 Datasheet Revision 60.0
12.80
–
0.8 BSC
96
Package Mechanical Drawings
Table 87 •
Chip Scale Package Dimensions for CS281, CS288, and CS289
eee
0.15
0.15
0.15
fff
0.05
0.05
0.08
Note: All dimensions are in millimeters.
Note: Variation AG depopulated.
2.14.17 VF256
The following figure shows the package outline of VF256.
Figure 69 • Package Outline of VF256
ddd
A1 BALL PAD CORNER
E
A1 BALL PAD CORNER
e
D1
D
e
E1
Bottom View
Top View
256 SOLDER BALLS
A
ccc
C
A2
A1
SEATING PLANE
b
eee
C
aaa C
fff
Side View
Note: Dimensions are in millimeters. For more information on dimensions, see "Dimensions of VF256" section
on page 100.
The following table lists the supported devices for VF256.
Table 88 • Supported Devices for VF256
Supported Devices
SmartFusion2
M2S025, M2S025T, M2S025TS
M2S010, M2S010T, M2S025TS
M2S005, M2S005S
IGLOO2
M2GL025, M2GL025T, M2S025TS
M2GL010, M2GL010T, M2GL025TS
M2GL005, M2GL005S
PD3068 Datasheet Revision 60.0
97
Package Mechanical Drawings
2.15
Very Fine Pitch Ball Grid Array
The following figures show package outlines for various packages under Very Fine Pitch Ball Grid Array.
2.15.1
VF400
The following figure shows the package outline of VF400.
Figure 70 • Package Outline of VF400
0.10 (4X)
Top View
Bottom View
A
D
A1 Ball Pad Corner
A1 Ball Pad Corner
20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
e
E1
E
(0.90)
e
(0.90)
D1
B
Side View
Detail A
Detail A
// ccc C
C
A
A2
D1/E1 SQ
NX Ø b
aaa C
A1
C
eee C A B
fff C
The following table lists the supported device for VF400.
Table 89 •
Supported Devices for VF400
Supported Devices
M2S005, M2S005S
M2S010, M2S010T, M2S010TS
M2S025, M2S025T, M2S025TS
M2S050, M2S050T, M2S050TS
M2S060, M2S060T, M2S060TS
M2GL005, M2GL005S
M2GL010, M2GL010T, M2GL010TS
M2GL025, M2GL025T, M2GL025TS
M2GL050, M2GL050T, M2GL050TS
M2GL060, M2GL060T, M2GL060TS
PD3068 Datasheet Revision 60.0
98
Package Mechanical Drawings
2.15.2
Dimensions of VF400
The following table lists the dimensions of VF400.
Table 90 •
Dimensions of VF400
JEDEC
Equivalent
VF400, page 98
Dimension
Min.
Nom.
Max.
A
1.31
1.41
1.51
A1
0.32
0.37
0.42
A2
0.65
0.70
0.75
aaa
0.12
b
0.41
0.46
0.51
c
0.29
0.34
0.39
15.20
–
ccc
0.10
D/E
17.00 BSC
D1/E1
–
e
0.80 BSC
eee
0.15
fff
0.08
Note: All dimensions are in millimeters.
PD3068 Datasheet Revision 60.0
99
Package Mechanical Drawings
2.15.3
Dimensions of VF256
The following table lists the dimensions of VF256.
Table 91 •
Dimensions of VF256
JEDEC
Equivalent
VF256, page 97
Dimension
Min.
Nom.
Max.
A
1.36
1.46
1.56
A1
0.35
0.40
0.45
A2
0.65
0.70
0.75
aaa
0.12
b
0.45
0.50
0.55
ccc
0.10
D
14.00
D1
12.00 BSC
E
14.00
E1
12.00 BSC
ddd
0.10
fff
0.08
e
0.80 TYP
eee
0.15
Note: All dimensions are in millimeters.
Note: BSC = Basic spacing between centers.
PD3068 Datasheet Revision 60.0
100