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TPS62736, TPS62737
SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
TPS6273x Programmable Output Voltage Ultra-Low Power Buck Converter
With Up to 50 mA / 200 mA Output Current
1 Features
3
•
The TPS6273x family provides a highly integrated
ultra low power buck converter solution that is well
suited for meeting the special needs of ultra-low
power applications such as energy harvesting. The
TPS6273x provides the system with an externally
programmable regulated supply to preserve the
overall efficiency of the power-management stage
compared to a linear step-down converter. This
regulator is intended to step-down the voltage from
an energy storage element such as a battery or super
capacitor to supply the rail to low-voltage electronics.
The regulated output has been optimized to provide
high efficiency across low-output currents (<10 µA) to
high currents (200 mA).
1
•
•
•
•
Industry's Highest Efficiency at Low Output
Currents: > 90% With IOUT = 15 µA
Ultra-Low Power Buck Converter
– TPS62736 Optimized for 50-mA Output
Current
– TPS62737 Optimized for 200-mA Output
Current
– 1.3-V to 5-V Resistor Programmable Output
Voltage Range
– 2-V to 5.5-V Input Operating Range
– 380-nA and 375-nA Quiescent Current During
Active Operation for TPS62736 and TPS62737
– 10-nA Quiescent Current During Ship Mode
Operation
– 2% Voltage Regulation Accuracy
100% Duty Cycle (Pass Mode)
EN1 and EN2 Control
– Two Power-Off States:
1. Shipmode (Full Power-Off State)
2. Standby Mode Includes VIN_OK Indication
Input Power-Good Indication (VIN_OK)
– Push-Pull Driver
– Resistor Programmable Threshold Level
Description
The TPS6273x integrates an optimized hysteretic
controller for low-power applications. The internal
circuitry uses a time-based sampling system to
reduce the average quiescent current.
Device Information(1)
PART NUMBER
PACKAGE
TPS6273x
BODY SIZE (NOM)
VQFN (14)
3.50 mm × 3.50 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
> 90% at
IOUT = 15 PA
VIN
L
10 PH
SW
IN
VOUT
OUT
2 Applications
Ultra-Low Power Applications
2-Cell and 3-Cell Alkaline-Powered Applications
Energy Harvesting
Solar Chargers
Thermal Electric Generator (TEG) Harvesting
Wireless Sensor Networks (WSN)
Low-Power Wireless Monitoring
Environmental Monitoring
Bridge and Structural Health Monitoring (SHM)
Smart Building Controls
Portable and Wearable Health Devices
Entertainment System Remote Controls
TPS62736
22 PF
Efficiency vs Output Current
100
95
TPS62736
90
Efficiency (%)
•
•
•
•
•
•
•
•
•
•
•
•
4.7F
85
80
75
70
65
Test Conditions:
VO = 2.5V, VIN = 3V,
TA = 25oC, L = 10mH (Toko DFE252012C)
60
55
0.001
0.01
0.1
1
Iout (mA)
10
100
G000
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
TPS62736, TPS62737
SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (continued).........................................
Device Voltage Options.........................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
5
8.1
8.2
8.3
8.4
8.5
8.6
5
5
5
5
6
8
Absolute Maximum Ratings ......................................
Handling Ratings ......................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 18
9.1 Overview ................................................................. 18
9.2 Functional Block Diagram ....................................... 18
9.3 Feature Description................................................. 18
9.4 Device Functional Modes........................................ 20
10 Application and Implementation........................ 21
10.1 Application Information.......................................... 21
10.2 Typical Applications ............................................. 21
11 Power Supply Recommendations ..................... 28
12 Layout................................................................... 28
12.1 Layout Guidelines ................................................. 28
12.2 Layout Example .................................................... 28
13 Device and Documentation Support ................. 29
13.1
13.2
13.3
13.4
13.5
Device Support......................................................
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
29
29
29
29
29
14 Mechanical, Packaging, and Orderable
Information ........................................................... 29
4 Revision History
Changes from Revision B (July 2013) to Revision C
•
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
Changes from Revision A (March 2013) to Revision B
Page
•
Added the TPS62737 Pinout information ............................................................................................................................... 4
•
Added graphs for TPS62737 to the Typical Characteristics................................................................................................. 13
•
Added the TPS62737 Application Circuit. ............................................................................................................................ 21
•
Changed Figure 72 .............................................................................................................................................................. 28
•
Added Figure 73 ................................................................................................................................................................... 28
Changes from Original (October 2012) to Revision A
•
2
Page
Changed the device From: Preview To: Active ...................................................................................................................... 1
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Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
TPS62736, TPS62737
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SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
5 Description (continued)
To further assist users in the strict management of their energy budgets, the TPS6273x toggles the input powergood indicator to signal an attached microprocessor when the voltage on the input supply has dropped below a
preset critical level. This signal is intended to trigger the reduction of load currents to prevent the system from
entering an undervoltage condition. In addition, independent enable signals allow the system to control whether
the converter is regulating the output, monitoring only the input voltage, or to shut down in an ultra-low quiescent
sleep state.
The input power-good threshold and output regulator levels are programmed independently through external
resistors.
All the capabilities of TPS6273x are packed into a small footprint 14-lead 3.5-mm × 3.5-mm QFN package
(RGY).
6 Device Voltage Options
(1)
PART NO.
OUTPUT VOLTAGE
MAX OUTPUT CURRENT
INPUT UVLO
TPS62736 (1)
Resistor Programmable
50 mA
2V
TPS62737 (1)
Resistor Programmable
200 mA
2V
The RGY package is available in tape on reel. Add R suffix to order quantities of 3000 parts per reel, T suffix for 250 parts per reel.
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
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TPS62736, TPS62737
SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
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7 Pin Configuration and Functions
NC
IN
NC
14 Pins
TPS62737 RGY Package
Top View
IN
14 Pins
TPS62736 RGY Package
Top View
1
14
1
14
NC
2
13
SW
SW
2
13
SW
NC
3
12
VSS
VSS
3
12
VSS
NC
4
11
OUT
NC
4
11
OUT
EN1
5
10
VIN_OK
EN1
5
10
VIN_OK
EN2
6
9
VOUT_SET
EN2
6
9
8
VIN_OK_SET
VIN_OK_SET
VRDIV
7
VRDIV
8
7
VOUT_SET
Pin Functions
PIN
TPS62736
RGY
TPS62737
RGY
TYPE
EN1
5
5
Input
EN2
6
6
Input
NAME
DESCRIPTION
Digital input for chip enable, standby, and ship-mode. EN1 = 1 sets ship mode
independent of EN2. EN1=0, EN2 = 0 disables the buck converter and sets
standby mode. EN1=0, EN2=1 enables the buck converter.
Do not leave either pin floating.
IN
1
1
Input
Input supply to the buck regulator
NC
2, 3, 4, 14
4, 14
Input
Connect to VSS
OUT
11
11
Output
SW
13
2, 13
Input
Inductor connection to switching node
Thermal Pad
15
15
Input
Connect to VSS
VIN_OK
10
10
Output
VIN_OK_SET
8
8
Input
Resistor divider input for VIN_OK threshold. Pull to VIN to disable.
Do not leave pin floating.
VOUT_SET
9
9
Input
Resistor divider input for VOUT regulation level
VRDIV
7
7
Output
VSS
12
3, 12
Input
4
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Step down (buck) regulator output
Push-pull digital output for power-good indicator for the input voltage.
Pulled up to VIN pin.
Resistor divider biasing voltage
Ground connection for the device
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
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SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
8 Specifications
8.1 Absolute Maximum Ratings (1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
–0.3
5.5
V
Pin voltage
Input voltage range on IN, EN1, EN2, VRDIV, VIN_OK_SET,
VOUT_SET, VIN_OK, OUT, SW,NC
TPS62736
Peak currents
IN, OUT
100
mA
TPS62737
Peak currents
IN, OUT
370
mA
TJ
Temperature range
Operating junction temperature range
125
°C
(1)
(2)
–40
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS/ground terminal
8.2 Handling Ratings
Tstg
MIN
MAX
UNIT
–65
150
°C
-1
1
kV
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (2)
-500
500
Machine Model (MM)
-150
150
Storage temperature range
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1)
V(ESD)
(1)
(2)
Electrostatic discharge
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
MIN
IN
IN voltage range
TPS62736 Input Capacitance
4.7
TPS62737 Input Capacitance
22
COUT
Output Capacitance
10
R1 +
R2 +
R3
Total Resistance for setting reference voltage
CIN
LBUCK
TA
TJ
NOM
2
TPS62736 Inductance
4.7
TPS62737 Inductance
10
MAX
UNIT
5.5
V
μF
22
μF
13
MΩ
10
μH
TPS62736 Operating free air ambient temperature
–40
85
TPS62737 Operating free air ambient temperature
–20
85
Operating junction temperature
–40
105
°C
°C
8.4 Thermal Information
TPS6273x
THERMAL METRIC (1)
RGY
UNIT
14 PINS
θJA
Junction-to-ambient thermal resistance
33.7
θJCtop
Junction-to-case (top) thermal resistance
37.6
θJB
Junction-to-board thermal resistance
10.1
ψJT
Junction-to-top characterization parameter
0.4
ψJB
Junction-to-board characterization parameter
10.3
θJCbot
Junction-to-case (bottom) thermal resistance
2.9
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
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SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
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8.5 Electrical Characteristics
Over recommended ambient temperature range, typical values are at TA = 25°C. Unless otherwise noted, specifications apply
for conditions of VIN = 4.2 V, VOUT = 1.8 V External components, CIN = 4.7 µF for TPS62736 and 22 µF for TPS62737,
LBUCK = 10 µH, COUT = 22 µF.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
TPS62736 Buck enabled state
(EN1 = 0, EN2 = 1)
380
550
TPS62736 Buck disabled VIN_OK active state
(EN1 = 0, EN2 = 0)
340
520
10
65
375
600
TPS62737 Buck disabled VIN_OK active state
(EN1 = 0, EN2 = 0)
345
560
TPS62737 Ship mode state (EN1 = 1, EN2 = x)
11
45
UNIT
QUIESCENT CURRENTS
TPS62736 Ship mode state (EN1 = 1, EN2 = x)
IQ
TPS62737 Buck enabled state
(EN1 = 0, EN2 = 1)
VIN = 2 V, No load on VOUT
nA
nA
OUTPUT
VBIAS
Output regulation reference
VOUT
VDO
tSTART-STBY
tSTART-SHIP
6
1.205
1.21
1.217
TPS62736 Output regulation (Spec does not include
the resistor accuracy error)
IOUT = 10 mA;
1.3 V < VOUT < 3.3 V
–2%
0%
2%
TPS62737 Output regulation (Spec does not include
the resistor accuracy error)
IOUT = 100 mA;
1.3 V < VOUT < 3.3 V;
–2%
0%
2%
TPS62736 Output line regulation
IOUT = 100 µA;
VIN = 2.4 V to 5.5 V
0.01
TPS62737 Output line regulation
IOUT = 10 mA;
VIN = 2.3 V to 5.5 V
0.31
TPS62736 Output load regulation
IOUT = 100 µA to 50 mA,
VIN = 2.2 V
0.01
%/mA
TPS62737 Output load regulation
IOUT = 100 µA to 200 mA,
VIN = 2.2 V; –20°C < TA < 85°C
0.01
%/mA
TPS62736 Output ripple
VIN = 4.2V, IOUT = 1 mA,
COUT = 22 μF
20
mVpp
TPS62737 Output ripple
VIN = 4.2 V, IOUT = 1 mA,
COUT = 22 μF
40
mVpp
Programmable voltage range for output voltage
threshold
IOUT = 10 mA
TPS62736 Drop-out-voltage when VIN is less than
VOUT(SET)
VIN = 2.1 V, VOUT(SET) = 2.5 V,
IOUT = 10 mA, 100% duty cycle
24
30
mV
TPS62737 Drop-out-voltage when VIN is less than
VOUT(SET)
VIN = 2.1 V, VOUT(SET) = 2.5 V,
IOUT = 100 mA, 100% duty cycle
180
220
mV
Startup time with EN1 low and EN2 transition to high
(Standby Mode)
TPS62736, COUT = 22 µF
400
μs
TPS62737, COUT = 22 µF
300
μs
COUT = 22 µF
100
ms
Startup time with EN2 high and EN1 transition from
high to low (Ship Mode)
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V
%/V
1.3
VIN – 0.2
V
Copyright © 2012–2014, Texas Instruments Incorporated
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SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
Electrical Characteristics (continued)
Over recommended ambient temperature range, typical values are at TA = 25°C. Unless otherwise noted, specifications apply
for conditions of VIN = 4.2 V, VOUT = 1.8 V External components, CIN = 4.7 µF for TPS62736 and 22 µF for TPS62737,
LBUCK = 10 µH, COUT = 22 µF.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SWITCH
RDS(on)
TPS62736 High-side switch ON resistance
VIN = 3 V
2.4
3
Ω
TPS62736 Low-side switch ON resistance
VIN = 3 V
1.1
1.5
Ω
TPS62737 High-side switch ON resistance
VIN = 2.1 V
1.8
2.2
Ω
TPS62737 Low-side switch ON resistance
VIN = 2.1 V
0.9
1.3
Ω
TPS62736 Cycle-by-cycle current limit
2.4 V < VIN < 5.25 V;
1.3 V < VOUT < 3.3 V
68
86
100
mA
TPS62737 Cycle-by-cycle current limit
2.4 V < VIN < 5.25 V;
1.3 V < VOUT < 3.3 V;
–20°C < TA < 85°C
295
340
370
mA
ILIM
fSW
Max switching frequency
2
MHz
INPUT
VIN-UVLO
Input under voltage protection
VIN-OK
Input power-good programmable voltage range
VIN-OK-ACC
VIN falling
TPS62736 Accuracy of VIN-OK setting
VIN increasing
TPS62737 Accuracy of VIN-OK setting
VIN-OK-HYS
Fixed hysteresis on VIN_OK threshold, OK_HYST
VIN increasing
VIN_OK-OH
VIN-OK output high threshold voltage
Load = 10 µA
VIN_OK-OL
VIN-OK output low threshold voltage
1.91
2
V
2
1.95
5.5
V
–2%
2%
–3%
3%
40
mV
VIN – 0.2
V
0.1
V
EN1 and EN2
VIH
Voltage for EN High setting. Relative to VIN
VIL
Voltage for EN Low setting
VIN = 4.2 V
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
VIN – 0.2
V
0.2
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V
7
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SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
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8.6 Typical Characteristics
Table 1. Table of Graphs for TPS62736
Unless otherwise noted, graphs were taken using Figure 62 with L = Toko 10 µH DFE252012C
VO = 2.5 V Efficiency
η
VO = 1.8 V Efficiency
VO = 1.3 V Efficiency
VO = 2.5 V
VOUT (DC)
VO = 1.8 V
VO = 1.3 V
FIGURE
vs Output Current
Figure 1
vs Input Voltage
Figure 2
vs Output Current
Figure 3
vs Input Voltage
Figure 4
vs Output Current
Figure 5
vs Input Voltage
Figure 6
vs Output Current
Figure 7
vs Input Voltage
Figure 8
vs Temperature
Figure 9
vs Output Current
Figure 10
vs Input Voltage
Figure 11
vs Temperature
Figure 12
vs Output Current
Figure 13
vs Input Voltage
Figure 14
vs Temperature
Figure 15
VO = 2.5 V
IOUT MAX (DC)
Figure 16
VO = 1.8 V
vs Input Voltage
Figure 17
VO = 1.3 V
Figure 18
EN1 = 1, EN2 = 0 (Ship Mode)
Input IQ
EN1 = 0, EN2 = 0 (Standby Mode)
Figure 19
vs Input Voltage
Figure 20
EN1 = 0, EN2 = 1 (Active Mode)
Switching Frequency
VO = 2.5 V
Output Ripple
VO = 2.5 V
Figure 21
vs Output Current
Figure 23
vs Input Voltage
Figure 24
vs Output Current
Figure 25
vs Input Voltage
Figure 26
100
100
IO =Series1
0.1 mA
IO =Series2
1 mA
IO =Series4
10 mA
IO =Series5
45 mA
95
98
90
Efficiency (%)
Efficiency (%)
85
80
75
70
65
60
55
50
0.001
Test Conditions:
VO = 2.5 V, TA = 25ƒC
L = 10 µH (Toko DFE252012C)
0.01
0.1
IOUT (mA)
1
VSeries2
IN = 4.2 V
VSeries4
IN = 3.6 V
VSeries5
IN = 3 V
VSeries6
IN = 2.7 V
10
100
Figure 1. Efficiency vs Output Current, VOUT = 2.5 V
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94
92
Test Conditions:
VO = 2.5 V, TA = 25ƒC
L = 10 µH (Toko DFE252012C
90
88
2.0
2.5
3.0
3.5
4.0
VIN (V)
C001
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
8
96
4.5
5.0
5.5
C002
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 2. Efficiency vs Input Voltage, VOUT = 2.5 V
Copyright © 2012–2014, Texas Instruments Incorporated
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SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
100
100
95
96
80
Efficiency (%)
Efficiency (%)
85
75
70
65
60
55
50
45
40
0.001
0.01
0.1
88
86
VIN
= 2.1 V
Series5
10
84
100
2.0
2.5
3.0
3.5
4.0
4.5
C004
Figure 4. Efficiency vs Input Voltage, VOUT = 1.8 V
100
98
IO =Series1
0.1 mA
IO =Series2
1 mA
IO =Series4
10 mA
IO =Series5
45 mA
Test Conditions:
VO = 1.3 V, TA = 25ƒC
L = 10 µH (Toko DFE252012C)
96
Efficiency (%)
94
0.01
0.1
10
IOUT (mA)
92
90
88
86
VIN
= 4.2 V
Series1
VIN
= 3.6 V
Series2
VIN
=3V
Series4
VIN
= 2.1 V
Series5
1
5.5
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 3. Efficiency vs Output Current, VOUT = 1.8 V
Test Conditions:
VO = 1.3 V, TA = 25ƒC
L = 10 µH (Toko DFE252012C)
5.0
VIN (V)
C003
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Efficiency (%)
IO =
45 mA
Series5
90
VIN
=3V
Series4
1
IO =
10 mA
Series4
92
VIN
= 3.6 V
Series2
Test Conditions:
VO = 1.8 V, TA = 25ƒC
L = 10 µH (Toko DFE252012C)
IO =
1 mA
Series2
94
Series1
VIN
= 4.2 V
IOUT (mA)
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
0.001
IO =
0.1 mA
Series1
Test Conditions:
VO = 1.8 V, TA = 25ƒC
L = 10 µH (Toko DFE252012C)
98
90
84
82
80
100
2.0
2.5
3.0
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
3.5
4.0
4.5
5.0
5.5
VIN (V)
C00
C006
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 5. Efficiency vs Output Current, VOUT = 1.3 V
Figure 6. Efficiency vs Input Voltage, VOUT = 1.3 V
2.520
2.6
2.5
2.4
2.510
VOUT (V)
VOUT (V)
2.515
2.505
2.500
2.495
0.001
2.3
2.2
2.1
IO =Series1
0.1 mA
Series2
VIN
= 4.2 V Test Conditions:
VIN
= 3.6 V VO = 2.5 V, TA = 25ƒC
Series1
VIN
=3V
L = 10 µH (Toko DFE252012C)
Series4
VIN
= 2.7 V
Series5
0.01
0.1
1
10
IOUT (mA)
2.0
IO =Series2
1 mA
Test Conditions:
VO = 2.5 V, TA = 25ƒC
L = 10 µH (Toko DFE252012C)
1.9
IO =Series4
10 mA
IO =Series5
45 mA
1.8
100
2.0
2.5
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 7. Output Voltage vs Output Current. VOUT = 2.5 V
3.0
3.5
4.0
4.5
5.0
VIN (V)
C007
5.5
C008
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 8. Output Voltage vs Input Voltage, VOUT = 2.5 V
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
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1.805
2.525
Test Conditions:
VO = 2.5 V, VIN = 3 V
L = 10 µH (Toko DFE252012C)
2.520
1.800
2.510
VOUT (V)
VOUT (V)
2.515
2.505
2.500
2.495
IO Series1
= 1 mA
2.490
IO Series2
= 10 mA
±40
±20
0
20
40
60
Temperature (ƒC)
1.780
0.001
80
VINSeries1
= 4.2 V
VINSeries2
= 3.6 V
VINSeries4
=3V
VINSeries5
= 2.7 V
Test Conditions:
VO = 1.8 V, TA = 25ƒC
L = 10 µH (Toko DFE252012C)
0.01
0.1
Figure 9. Output Voltage vs Temperature, VOUT = 2.5 V
1.815
1.8
1.795
100
C010
Figure 10. Output Voltage vs Output Current, VOUT = 1.8 V
1.805
Test Conditions:
VO = 1.8 V, VIN = 3 V
L = 10 µH (Toko DFE252012C)
1.8
VOUT (V)
1.805
10
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
IO Series1
= 0.1 mA
IO Series2
= 1 mA
IO Series4
= 10 mA
IO Series5
= 45 mA
1.81
1
IOUT (mA)
C009
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Thermal stream provided temperature variation
VOUT (V)
1.790
1.785
IO Series4
= 50 mA
2.485
1.795
1.795
1.79
1.79
Test Conditions:
VO = 1.8 V, TA = 25ƒC
L = 10 µH (Toko DFE252012C)
1.785
IO Series1
= 1 mA
IO Series2
= 10 mA
IO Series4
= 50 mA
1.785
1.78
1.78
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VIN (V)
±40
5.5
±20
0
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
20
40
60
Temperature (ƒC)
C011
80
C012
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Thermal stream provided temperature variation
Figure 11. Output Voltage vs Input Voltage, VOUT = 1.8 V
Figure 12. Output Voltage vs Temperature, VOUT = 1.8 V
1.303
1.305
1.301
1.3
VOUT (V)
VOUT (V)
1.299
1.297
1.295
1.293
1.291
1.289
0.001
VIN
= 4.2 V
Series1
Test Conditions:
VIN
=3V
Series2
VO = 1.3 V, TA = 25ƒƒC
VIN
= 3.6 V L = 10 uH (Toko DFE252012C)
Series4
VIN
= 2.1 V
Series5
0.01
0.1
IOUT (mA)
1
10
IO =Series1
0.1 mA
IO =Series2
1 mA
IO =Series4
10 mA
IO =Series5
45 mA
1.28
100
2.0
2.5
3.0
Test Condition:
VO = 1.3 V, TA = 25ƒC
L = 10 µH (Toko DFE252012C)
3.5
4.0
VIN (V)
C013
Figure 13. Output Voltage vs Output Current, VOUT = 1.3 V
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1.29
1.285
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
10
1.295
4.5
5.0
5.5
C014
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 14. Output Voltage vs Input Voltage, VOUT = 1.3 V
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
TPS62736, TPS62737
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SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
1.305
100
VOUT (V)
1.300
Maximum Output Current (mA)
Test Conditions:
VO =1.3 V, VIN = 3 V
L = 10 µH (Toko DFE252012C)
1.295
1.290
IO Series1
= 1 mA
IO Series2
= 10 mA
IO Series4
= 50 mA
1.285
-40
-20
0
20
40
60
80
60
40
TASeries1
= ±40ƒC
TASeries2
= 0ƒC
TASeries4
= 25ƒC
TASeries5
= 85ƒC
20
0
80
Temperature (ƒC)
Test Conditions:
VO = 2.5 V ± 100 mV
L = 10 µH (Toko DFE252012C)
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VIN (V)
C015
5.5
C016
IN = Sourcemeter configured as voltage source and measuring
current
VOUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Thermal stream provided temperature variation
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to increasingly
sink current until V(OUT) < VOUT - 100 mV
Thermal stream provided temperature variation
Figure 15. Output Voltage vs Temperature, VOUT = 1.3 V
Figure 16. Maximum Output Current vs Input Voltage,
VOUT = 2.5 V
100
90
Test Conditions:
VO =1.8 V ± 100 mV
L = 10 µH (Toko DFE252012C)
80
70
60
TSeries1
A = ±40ƒC
TSeries2
A = 0ƒC
TSeries4
A = 25ƒC
TSeries5
A = 85ƒC
50
40
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VIN (V)
Maximum Output Current (mA)
Maximum Output Current (mA)
100
Test Conditions:
VO = 1.3 V ± 100 mV
L = 10 µH (Toko DFE252012C)
90
80
70
60
TASeries1
= ±40ƒC
TASeries2
= 0ƒC
TASeries4
= 25ƒC
TASeries5
= 85ƒC
50
40
2.0
5.5
2.5
3.0
3.5
4.0
4.5
5.0
VIN (V)
C017
5.5
C018
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to increasingly
sink current until V(OUT) < VOUT - 100 mV
Thermal stream provided temperature variation
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to increasingly
sink current until V(OUT) < VOUT - 100 mV
Thermal stream provided temperature variation
Figure 17. Maximum Output Current vs Input Voltage,
VOUT = 1.8 V
Figure 18. Maximum Output Current vs Input Voltage,
VOUT = 1.3 V
450
350
300
Input Quiescent Current (nA)
Input Quiescent Current (nA)
1200
= 85°C
85C
TT
A=
TT
= 55°C
55C
A=
TT
= 25°C
25C
A=
0C
TTA = 0°C
TTA
±40°C
-40 C
A ==
400
250
200
150
100
TT=85C
A = 85°C
TT=55C
A = 55°C
1000
TT=25C
A = 25°C
TT=0C
A = 0°C
TTA
±40°C
-40 C
A ==
800
600
400
200
50
0
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.0
2.5
C019
Input Voltage (V)
IN = Sourcemeter configured as voltage source and measuring
current
OUT = open; EN1 = high; EN2 = x
Thermal stream provided temperature variation
Figure 19. Input Quiescent Current
vs Input Voltage Ship Mode
3.0
3.5
4.0
4.5
5.0
Input Voltage (V)
5.5
C020
IN = Sourcemeter configured as voltage source and measuring
current
OUT = open; EN1 = EN2 = low
Thermal stream provided temperature variation
Figure 20. Input Quiescent Current
vs Input Voltage Standby Mode
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800
TAT=85C
= 85°C
TAT=55C
= 55°C
TAT=25C
= 25°C
TAT=0C
= 0°C
TAT==±40°C
-40 C
1000
800
Input Quiescent Current (nA)
Input Quiescent Current (nA)
1200
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600
400
200
500
400
300
200
100
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
2.0
5.5
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as voltage source > VOUT to
prevent switching
Thermal stream provided temperature variation
Figure 21. Input Quiescent Current
vs Input Voltage Active Mode
60
VIN = 2 V
Vin
Vin
VIN = 3 V
20
Vin
VIN = 4 V
Vin
VIN = 5 V
0
10
20
30
40
50
130
120
110
100
90
80
70
60
50
40
30
20
10
0
Figure 23. Major Switching Frequency vs Output Current
IOUT
= 10 mA
I=10mA
IOUT
= 50 mA
I=50mA
15
10
VIN = 2 V
Vin
Vin
VIN = 3 V
Vin
VIN = 4 V
Vin
VIN = 5 V
20
30
40
Output Current (mA)
50
3.5
4.0
4.5
5.0
5.5
C023
IOUT
= 100 A
Iout=100uA
IOUT
= 1 mA
I=1mA
25
IOUT
= 10 mA
I=10mA
IOUT
= 50 mA
I=50mA
20
15
10
5
VO = 1.3 V
C = 22 PF
0
60
2.0
2.5
Figure 25. Output Voltage Ripple vs Output Current
3.0
3.5
4.0
Input Voltage (V)
C025
IN = Sourcemeter configured as voltage source
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Scope probe with small ground lead used to measure ripple
across COUT
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3.0
Figure 24. Major Switching Frequency vs Input Voltage
Output Voltage Ripple (mVPP)
20
10
2.5
IN = Sourcemeter configured as voltage source
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
30
0
5.5
VO = 1.3 V
L = 10P+
Input Voltage (V)
25
0
5.0
C026
IOUT
= 1 mA
I=1mA
C022
IN = Sourcemeter configured as voltage source
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
VO = 1.3 V
C = 22 PF
4.5
IOUT
= 100 A
Iout=100uA
2.0
60
Output Current (mA)
5
4.0
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as voltage source > VOUT to
prevent switching
Thermal stream provided temperature variation
Major Switching Frequency (kHz)
Major Switching Frequency (kHz)
80
40
3.5
Figure 22. Input Quiescent Current
vs Input Voltage Active Mode where RSUM = R1 + R2 + R3
VO = 1.3 V
L = 10 PH
0
3.0
Input Voltage (V)
120
100
2.5
C021
Input Voltage (V)
Output Voltage Ripple (mVPP)
Rsum=13M
Rsum = 13 M
600
0
12
Rsum = 1 M
Rsum=1M
700
4.5
5.0
5.5
C024
IN = Sourcemeter configured as voltage source
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Scope probe with small ground lead used to measure ripple
across COUT
Figure 26. Output Voltage Ripple vs Input Voltage
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
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SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
Table 2. Table of Graphs for TPS62737
Unless otherwise noted, graphs were taken using Figure 52 with L = Toko 10 µH DFE252012C
VO = 2.5 V Efficiency
η
VO = 1.8 V Efficiency
VO = 1.3 V Efficiency
VO = 2.5 V
VOUT (DC)
VO = 1.8 V
VO = 1.3 V
FIGURE
vs Output Current
Figure 27
vs Input Voltage
Figure 28
vs Output Current
Figure 29
vs Input Voltage
Figure 30
vs Output Current
Figure 31
vs Input Voltage
Figure 32
vs Output Current
Figure 33
vs Input Voltage
Figure 33
vs Temperature
Figure 35
vs Output Current
Figure 36
vs Input Voltage
Figure 37
vs Temperature
Figure 38
vs Output Current
Figure 39
vs Input Voltage
Figure 40
vs Temperature
Figure 41
VO = 2.5 V
IOUT MAX (DC)
Figure 42
VO = 1.8 V
vs Input Voltage
Figure 43
VO = 1.3 V
Figure 44
EN1 = 1, EN2 = 0 (Ship Mode)
Input IQ
Figure 45
EN1 = 0, EN2 = 0 (Standby Mode)
vs Input Voltage
Figure 46
EN1 = 0, EN2 = 1 (Active Mode)
Switching Frequency
Figure 47
VO = 1.8 V
Output Ripple
VO = 1.8 V
90
Figure 49
vs Output Current
Figure 51
vs Input Voltage
Figure 51
= 0.1 mA
IIO
O = 0.1 mA
mA
IIO
O ==11mA
10mA
mA
IIO
O ==10
100mA
mA
IIO
O ==100
IIO
200mA
mA
O ==200
95.0
80
Efficiency (%)
Efficiency (%)
Figure 48
vs Input Voltage
100.0
100
70
60
= 5.5 V
VVIN
IN = 3.0 V
50
40
0.001
vs Output Current
90.0
85.0
80.0
2.3VV
VVIN
IN ==4.2
VVIN
2.5VV
IN ==5.5
0.01
0.1
1
10
IOUT (mA)
100
75.0
1000
2.5
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 27. Efficiency vs Output Current, VOUT = 2.5 V
3
3.5
4
4.5
5
VIN (V)
C048
5.5
C045
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 28. Efficiency vs Input Voltage, VOUT = 2.5 V
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100
100
90
95
Efficiency (%)
Efficiency (%)
80
70
VIN
2.5VV
V
IN ==2.5
60
VIN
3.0VV
V
IN ==3.0
VIN
3.6VV
V
IN ==3.6
50
40
0.001
V
VIN
5.5VV
IN ==5.5
0.1
1
10
100
10mA
mA
IIO
O ==10
IIO
100mA
mA
O ==100
200mA
mA
IIO
O ==200
90
85
80
70
2
1000
IOUT (mA)
0.1mA
mA
IIO
O ==0.1
mA
IIO
O ==11mA
75
VIN
4.2VV
V
IN ==4.2
0.01
0.01mA
mA
IIO
O ==0.01
3
4
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
5
C044
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 29. Efficiency vs Output Current, VOUT = 1.8 V
Figure 30. Efficiency vs Input Voltage, VOUT = 1.8 V
100
90
85
0.01
mA
IIO
mA
O ==0.1
IIO
mA
O ==11mA
95
80
IIO
10mA
mA
O ==10
90
Efficiency (%)
Efficiency (%)
75
70
65
60
VIN
2.5VV
V
IN ==2.5
55
VIN
3.0VV
V
IN ==3.0
50
VIN
3.6VV
V
IN ==3.6
45
VIN
4.2VV
V
IN ==4.2
40
0.001
6
VIN (V)
C047
0.1
1
10
100
IOUT (mA)
IIO
200mA
mA
O ==200
80
75
70
V
VIN
5.5VV
IN ==5.5
0.01
IIO
100mA
mA
O ==100
85
65
2
1000
3
4
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
5
6
VIN (V)
C046
C043
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 31. Efficiency vs Output Current, VOUT = 1.3 V
Figure 32. Efficiency vs Input Voltage, VOUT = 1.3 V
2.53
2.54
2.52
2.52
2.5
2.48
VOUT (V)
VOUT (V)
2.51
2.5
2.49
2.44
2.48
VIN
= 3.0 V
V
IN = 3.0 V
VIN
= 3.6 V
V
IN = 3.6 V
2.42
2.47
VIN
4.2VV
V
IN ==4.2
2.38
2.46
0.001
V
VIN
5.5VV
IN ==5.5
0.01
0.1
= 0.001
IIO
O = 0.001 mA
0.1mA
mA
IIO
O ==0.1
10mA
mA
IIO
O ==10
IIO
170mA
mA
O ==170
2.4
2.36
1
IOUT (mA)
10
100
1000
Figure 33. Output Voltage vs Output Current. VOUT = 2.5 V
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2.5
3
3.5
4
VIN (V)
C061
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
14
2.46
= 0.01 mA
IIO
O = 0.01 mA
mA
IIO
O ==11mA
100mA
mA
IIO
O ==100
IIO
200mA
mA
O ==200
4.5
5
5.5
C058
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 34. Output Voltage vs Input Voltage, VOUT = 2.5 V
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
TPS62736, TPS62737
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SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
1.8
2.52
IO = 1 mA
2.51
1.795
1.79
1.785
IO = 10 mA
2.49
VOUT (V)
Output Voltage (V)
2.50
2.48
IO = 100 mA
2.47
1.78
1.775
1.77
VIN
= 2.5 V
V
IN = 2.5 V
1.765
VIN
3.0VV
V
IN ==3.0
1.76
VIN
3.6VV
V
IN ==3.6
1.755
VIN
4.2VV
V
IN ==4.2
IO = 180 mA
2.46
1.75
0.001
2.45
±20
±5
10
25
40
55
70
85
Temperature (oC)
VIN
5.5VV
V
IN ==5.5
0.01
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Thermal stream provided temperature variation
Figure 35. Output Voltage vs Temperature, VOUT = 2.5 V
10
100
1000
C060
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 36. Output Voltage vs Output Current, VOUT = 1.8 V
1.84
1.8
1.83
IO = 1 mA
Output Voltage (V)
1.79
1.78
VOUT (V)
1
IOUT (mA)
1.81
1.77
1.76
1.75
1.74
= 0.001
IIO
O = 0.001 mA
0.1mA
mA
IIO
O ==0.1
10mA
mA
IIO
O ==10
IIO
170mA
mA
O ==170
1.73
1.72
1.71
2
3
= 0.01 mA
IIO
O = 0.01 mA
mA
IIO
O ==11mA
100mA
mA
IIO
O ==100
IIO
200mA
mA
O ==200
4
1.79
IO = 100 mA
IO = 180 mA
±5
10
25
40
55
70
Temperature (oC)
C057
85
C020
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Thermal stream provided temperature variation
Figure 38. Output Voltage vs Temperature, VOUT = 1.8 V
1.33
1.325
1.33
1.32
1.325
1.315
1.31
VOUT (V)
1.32
1.315
1.295
0.001
IO = 10 mA
±20
1.335
1.3
1.80
1.77
Figure 37. Output Voltage vs Input Voltage, VOUT = 1.8 V
1.305
1.81
1.78
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
1.31
1.82
5
VIN (V)
VOUT (V)
0.1
C020
VIN
= 2.5 V
V
IN = 2.5 V
= 0.001
IIO
O = 0.001 mA
0.1mA
mA
IIO
O ==0.1
IIO
10mA
mA
O ==10
IIO
170mA
mA
O ==170
1.285
VIN
3.6VV
V
IN ==3.6
1.28
VIN
4.2VV
V
IN ==4.2
1.275
VIN
5.5VV
V
IN ==5.5
0.1
1.3
1.295
1.29
VIN
3.0VV
V
IN ==3.0
0.01
1.305
1.27
1
10
IOUT (mA)
100
1000
2
Figure 39. Output Voltage vs Output Current, VOUT = 1.3 V
4
5
VIN (V)
C059
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
3
= 0.01 mA
IIO
O = 0.01 mA
mA
IIO
O ==11mA
IIO
100mA
mA
O ==100
IIO
200mA
mA
O ==200
C056
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 40. Output Voltage vs Input Voltage, VOUT = 1.3 V
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Product Folder Links: TPS62736 TPS62737
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1.325
300
Maximum Output Current (mA)
IO = 1 mA
1.320
Output Voltage (V)
1.315
1.310
IO = 10 mA
1.305
1.300
1.295
1.290
IO = 100 mA
1.285
1.280
±20
±5
10
25
40
55
260
240
220
200
180
TA =T=85C
85°C
TA =TA
55°C
= 55
TA =TA=25
25°C
TA =
0°C
TA=0
TA TA=-20
= ±20°C
160
140
120
IO = 180 mA
1.275
280
100
70
85
Temperature (oC)
2.0
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Thermal stream provided temperature variation
3.5
4.0
5.0
5.5
C020
Figure 42. Maximum Output Current
vs Input Voltage VOUT = 2.5 V
Maximum Output Current (mA)
330
280
230
180
TA =T=85C
85°C
TA =TA
55°C
= 55
TA =
25°C
TA=25
TA =
0°C
TA=0
TA TA=-20
= ±20°C
130
80
2.0
2.5
3.0
3.5
4.0
4.5
5.0
280
230
180
TA =TA=85
85°C
TA =TA
55°C
= 55
TA =
25°C
TA=25
TA =
0°C
TA=0
TA TA=-20
= ±20°C
130
80
5.5
2.0
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to increasingly
sink current until V(OUT) < VOUT - 100 mV
Thermal stream provided temperature variation
350
4.0
250
200
150
100
0
800
C020
TA = 85oC
600
TA = 0oC
TA = 25oC
400
200
TA = -40oC
0
3
5.5
1,000
50
2.5
5.0
1,200
300
2
4.5
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to increasingly
sink current until V(OUT) < VOUT - 100 mV
Thermal stream provided temperature variation
Input Quiescent Current (nA)
400
3.5
Figure 44. Maximum Output Current
vs Input Voltage, VOUT = 1.3 V
o ƒC
= 85
TTA
A = 85 C
oC
TTA
2525
ƒC
A ==
o
TTA
A = =0 0CƒC
oC
TTA
=
-40
A = -40 ƒC
450
3.0
Input Voltage (V)
Figure 43. Maximum Output Current
vs Input Voltage, VOUT = 1.8 V
500
2.5
C020
Input Voltage (V)
3.5
4
4.5
5
Input Voltage (V)
5.5
Figure 45. Input Quiescent Current
vs Input Voltage Ship Mode
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2.5
3
3.5
4
4.5
5
Input Voltage (V)
C054
IN = Sourcemeter configured as voltage source and measuring
current
OUT = open; EN1 = high; EN2 = x
Thermal stream provided temperature variation
16
4.5
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as current source to increasingly
sink current until V(OUT) < VOUT - 100 mV
Thermal stream provided temperature variation
330
Maximum Output Current (mA)
3.0
Input Voltage (V)
Figure 41. Output Voltage vs Temperature, VOUT = 1.3 V
Input Quiescent Current (nA)
2.5
C020
5.5
C055
IN = Sourcemeter configured as voltage source and measuring
current
OUT = open; EN1 = EN2 = low
Thermal stream provided temperature variation
Figure 46. Input Quiescent Current
vs Input Voltage Standby Mode
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100
Major Switching Frequency (kHz)
Input Quiescent Current (nA)
1,000
TA = 85oC
800
600
TA = 0oC
TA = 25oC
400
200
TA = -40oC
80
70
60
50
40
20
VIN
= 2.5 V
V
IN = 2.45 V
VIN
3.0VV
V
IN ==3.0
10
VIN
3.6VV
V
IN ==4.2
30
VIN
4.2VV
V
IN ==5.5
0
0
2
2.5
3
3.5
4
4.5
5
0
5.5
Input Voltage (V)
20
40
60
80
100 120 140 160 180 200
Output Current (mA)
C053
IN = Sourcemeter configured as voltage source and measuring
current
OUT = sourcemeter configured as voltage source > VOUT to
prevent switching
Thermal stream provided temperature variation
C049
IN = Sourcemeter configured as voltage source
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Figure 47. Input Quiescent Current
vs Input Voltage Active Mode
Figure 48. Major Switching Frequency vs Output Current
70
120
110
IO = 100 mA
100
Output Voltage Ripple (mV)
Major Switching Frequency (kHz)
90
90
80
IO = 5 mA
70
60
50
IO = 10 mA
40
30
IO = 50 mA
IO = 500 PA
20
10
0
60
50
40
30
VIN
= 2.5 V
V
IN = 2.45 V
20
VIN
3.0VV
V
IN ==3.0
10
VIN
3.6VV
V
IN ==4.2
VIN
4.2VV
V
IN ==5.5
0
2.1
2.6
3.1
3.6
4.1
4.6
5.1
0
Input Voltage (V)
20
40
60
C051
80
100 120 140 160 180 200
Output Current (mA)
IN = Sourcemeter configured as voltage source
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
C050
IN = Sourcemeter configured as voltage source
OUT = sourcemeter configured as current source to sink current
and VCOMP > VOUT
Scope probe with small ground lead used to measure ripple
across COUT
Figure 50. Output Voltage Ripple vs Output Current
Figure 49. Major Switching Frequency vs Input Voltage
80
Output Voltage Ripple (mV)
70
60
IO = 100 mA
IO = 5 mA IO = 10 mA
50
40
30
IO = 50 mA
20
10
IO = 500 PA
0
2.1
2.6
3.1
3.6
4.1
4.6
5.1
Input Voltage (V)
C052
IN = Sourcemeter configured as voltage source
OUT = sourcemeter configured as current source to sink current and VCOMP > VOUT
Scope probe with small ground lead used to measure ripple across COUT
Figure 51. Output Voltage Ripple vs Input Voltage
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9 Detailed Description
9.1 Overview
The TPS6273x family provides a highly integrated ultra low power buck converter solution that is well suited for
meeting the special needs of ultra-low power applications such as energy harvesting. The TPS6273x provides
the system with an externally programmable regulated supply in order to preserve the overall efficiency of the
power-management stage compared to a linear step down converter. This regulator is intended to step-down the
voltage from an energy storage element such as a battery or super capacitor in order to supply the rail to lowvoltage electronics. The regulated output has been optimized to provide high efficiency across low-output
currents (<10 µA) to high currents (200 mA).
The TPS6273x integrates an optimized hysteretic controller for low-power applications. The internal circuitry uses
a time-based sampling system to reduce the average quiescent current.
9.2 Functional Block Diagram
IN
VSS
SW
Buck
Controller
TPS6273x Functional Block
Diagram
VIN > UV?
OUT
EN2
VOUT_SET
VIN_OK
VIN_OK_SET
+
Input Threshold Control
UV
OK
+
Vref
Nano-Power Management
and Reference Generation
Vref
VIN_UV
EN1
VRDIV
9.3 Feature Description
9.3.1 Step-Down (Buck) Converter Operation
The buck regulator in the TPS6273x takes input power from VIN, steps it down and provides a regulated voltage
at the OUT pin. It employs pulse frequency modulation (PFM) control to regulate the voltage close to the desired
reference voltage. The reference voltage is set by the user programmed resistor divider. The current through the
inductor is controlled through internal current sense circuitry. The peak current in the inductor is controlled to
maintain high efficiency of the converter across a wide input current range. The TPS62736 converter delivers an
average output current of 50mA with a peak inductor current of 100 mA. The TPS62737 converter delivers an
average output current of 200 mA with a peak inductor current of 370 mA. The buck regulator is disabled when
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Feature Description (continued)
the voltage on VIN reaches the UVLO condition. The UVLO level is continuously monitored. The buck regulator
continues to operate in pass (100% duty cycle) mode, passing the input voltage to the output, as long as VIN is
greater than UVLO and less than VIN minus IOUT times RDS(on) of the high-side FET (that is, VIN – IOUT x RDS(on)HS). In order to save power from being dissipated through other ICs on this supply rail while allowing for a faster
wake up time, the buck regulator can be enabled and disabled through the EN2 pin for systems that desire to
completely turn off the regulated output.
9.3.2 Programming OUT Regulation Voltage and VIN_OK
To set the proper output-regulation voltage and input voltage power-good comparator, the external resistors must
be carefully selected. Figure 62 illustrates an application diagram which uses the minimal resistor count for
setting both VOUT and VIN_OK. Note that VBIAS is nominally 1.21 V per the electrical specification table.
Referring to Figure 52, the OUT DC set point is given by Equation 1.
æ R + R 2 + R3 ö
VOUT = VBIAS ç 1
÷
è R1 + R2 ø
(1)
The VIN_OK setting is given by Equation 2.
æ R + R 2 + R3 ö
VIN _ OK = VBIAS ç 1
÷
R1
è
ø
(2)
The sum of the resistors is recommended to be no greater than 13 MΩ, that is, RSUM = R1 + R2 + R3 = 13 MΩ.
Due to the sampling operation of the output resistors, lowering RSUM only increases quiescent current slightly as
can be seen in Figure 22. Higher resistors may result in poor output voltage regulation and/or input voltage
power-good threshold accuracies due to noise pickup through the high-impedance pins or reduction of effective
resistance due to parasitic resistance created from board assembly residue. See Layout for more details.
If it is preferred to separate the VOUT and VIN_OK resistor strings, two separate strings of resistors could be
used as shown in Figure 62. The OUT DC set point is then given by Equation 3.
æ R + R4 ö
VOUT = VBIAS ç 3
÷
è R4 ø
(3)
The VIN_OK setting is then given by Equation 4.
æ R + R2 ö
VIN _ OK = VBIAS ç 1
÷
è R1 ø
(4)
If it is preferred to disable the VIN_OK setting, the VIN_OK_SET pin can be tied to VIN. To set VOUT in this
configuration, use Equation 3. To tighten the DC set point accuracy, use external resistors with better than 1%
resistor tolerance. Because output voltage ripple has a large effect on input line regulation and the output load
regulation, using a larger output capacitor will improve both line and load regulation.
9.3.3 Nano-Power Management and Efficiency
The high efficiency of the TPS6273x is achieved through the proprietary Nano-Power management circuitry and
algorithm. This feature essentially samples and holds all references in order to reduce the average quiescent
current. That is, the internal circuitry is only active for a short period of time and then off for the remaining period
of time at the lowest feasible duty cycle. A portion of this feature can be observed in Figure 66 where the VRDIV
node is monitored. Here, the VRDIV node provides a connection to the input (larger voltage level) and generates
the output reference (lower-voltage level) for a short period of time. The divided down value of input voltage is
compared to VBIAS and the output voltage reference is sampled and held to get the VOUT_SET point.
Because this biases a resistor string, the current through these resistors is only active when the Nano-Power
management circuitry makes the connection — hence, reducing the overall quiescent current due to the
resistors. This process repeats every 64 ms. Similarly, the VIN_OK level is monitored every 64 ms, as shown in
Figure 55.
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Feature Description (continued)
The efficiency versus output current and efficiency versus input voltage are plotted for three different output
voltages for both the TPS62736 and TPS62737 devices in Typical Characteristics.
All data points were
captured by averaging the overall input current. This must be done, due to the periodic biasing scheme
implemented through the Nano-Power management circuitry. The input current efficiency data was gathered
using a source meter set to average over at least 25 samples and at the highest accuracy sampling rate. Each
data point takes a long period of time to gather in order to properly measure the resulting input current when
calculating the efficiency.
9.4 Device Functional Modes
9.4.1 Enable Controls
There are two enable pins implemented in the TPS6273x in order to maximize the flexibility of control for the
system. The EN1 pin is considered to be the chip enable. If EN1 is set to a 1 then the entire chip is placed into
ship mode. If EN1 is 0 then the chip is enabled. EN2 enables and disables the switching of the buck converter.
When EN2 is low, the internal circuitry remains ON and the VIN_OK indicator still functions. This can be used to
disable down-stream electronics in case of a low input-supply condition. When EN2 is 1, the buck converter
operates normally.
Table 3. Enable Functionality Table
EN1 PIN
EN2 PIN
0
0
Partial standby mode. Buck switching converter is off, but VIN_OK indication is on
FUNCTIONAL STATE
0
1
Buck mode and VIN_OK enabled
1
x
Full standby mode. Switching converter and VIN_OK indication is off (ship mode)
9.4.2 Startup Behavior
The TPS6273x has two startup responses: 1) from the ship-mode state (EN1 transitions from high to low), and 2)
from the standby state (EN2 transitions from low to high). The first startup response out of the ship-mode state
has the longest time duration due to the internal circuitry being disabled. This response is shown in Figure 70 for
the TPS62736 and Figure 60 for the TPS62737. The startup time takes approximately 100 ms due to the
internal Nano-Power management circuitry needing to complete the 64 ms sample and hold cycle.
Startup from the standby state is shown in Figure 71 for the TPS62736 and Figure 61 for the TPS62737. This
response is much faster due to the internal circuitry being pre-enabled. The startup time from this state is
entirely dependent on the size of the output capacitor. The larger the capacitor, the longer it will take to charge
during startup. The TPS6273x can startup into a prebiased output voltage.
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The TPS62736/7 are step down DC-DC converters. Their low quiescent currents make them ideal for battery
powered systems that are operated at low duty cycles in order to achieve low total power levels.
10.2 Typical Applications
10.2.1 TPS62737 3-Resistor Typical Application Circuit
TPS62737
IN
VIN
CIN1
CIN2
22PF
0.1PF
SW
L
10 PH
System Load
OUT
22PF
Buck
Controller
GPIO1
VIN_OK
GPIO2
EN1
GPIO2
EN2
COUT
VSS
Host
VRDIV
R3
R2
VOUT_SET
VIN_OK_SET
Nano-Power
Management
R1
Figure 52. TPS62737 3-Resistor Typical Application Circuit
10.2.1.1 Design Requirements
A 1.8-V, up to 200 mA regulated power rail is needed. The VIN_OK comparator should indicate when the input
voltage drops below 2.9 V. No large load transients are expected.
10.2.1.2 Detailed Design Procedure
The recommended 10-µH inductor (TOKO DFE252012C) and 22-µF input capacitor are used. Since no large
load transients are expected, the minimum 22-µF output capacitor is used. Had a large load transient been
expected, we would have sized the capacitor using ITRAN = COUT x ΔVOUT / ΔTIME where ΔVOUT is amount
of VOUT droop allowed for the time of the transient.
First set RSUM = R1 + R2 + R3 = 13 MΩ then solve Equation 2 for R1 = VBIAS x RSUM / VIN_OK = 1.21 V x
13 MΩ / 2.9 V = 5.42 MΩ → 5.49 MΩ as the closest 1 % resistor.
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Typical Applications (continued)
Then solve Equation 2 for R2 = VBIAS x RSUM / VOUT - R1 = 1.21 V x 13 MΩ / 1.8 V - 5.42 MΩ = 3.32 MΩ →
3.4 MΩ as the closest 1% resistor.
Finally R3 = RSUM - R1 - R2 = 13 MΩ - 5.42 MΩ - 3.32 MΩ = 4.26 MΩ → 4.32 MΩ as the closest 1% resistor.
These values yield VOUT = 1.79 V and VIN_OK threshold = 2.91 V.
If using 4 resistors, see Resistor Selection for guidance on sizing the resistors.
10.2.1.2.1 Inductor Selection
The internal-control circuitry is designed to control the switching behavior with a nominal inductance of 10 µH ±
20%. The saturation current of the inductor' should be at least 25% higher than the maximum cycle-by-cycle
current limit per the electrical specs table (ILIM) in order to account for load transients. Because this device is a
hysteretic controller, it is a naturally stable system (single order transfer function). However, the smaller the
inductor value is, the faster the switching currents are. The speed of the peak current detect circuit sets the
inductor of the TPS62736 lower bound to 4.7 µH. When using a 4.7 µH, the peak inductor current will increase
when compared to that of a 10-µH inductor. The steady-state operation with a 4.7-µH inductor with a 50-mA load
for the TPS62736 is shown in Figure 65.
A list of inductors recommended for this device is shown in Table 4.
Table 4. Recommended Inductors
INDUCTANCE (µH)
DIMENSIONS (mm)
PART NUMBER
10
2.0 x 2.5 x 1.2
DFE252012C-H-100M
MANUFACTURER
Toko
10
4.0 x 4.0 x 1.7
LPS4018-103M
Coilcraft
4.7 (TPS62736 only)
2.0 x 2.5 x 1.2
DFE252012R-H-4R7M
Toko
10.2.1.2.2 Output Capacitor Selection
The output capacitor is chosen based on transient response behavior and ripple magnitude. The lower the
capacitor value, the larger the ripple will become and the larger the droop will be in the case of a transient
response. It is recommended to use at least a 22-µF output capacitor for most applications.
10.2.1.2.3 Input Capacitor Selection
The bulk input capacitance is recommended to be a minimum of 4.7 µF ± 20% for the TPS62736 and 22 µF ±
20% for the TPS62737. This bulk capacitance is used to suppress the lower frequency transients produced by
the switching converter. There is no upper bound to the input-bulk capacitance. In addition, a high-frequency
bypass capacitor of 0.1 µF is recommended in parallel with the bulk capacitor. The high-frequency bypass is
used to suppress the high-frequency transients produced by the switching converter.
10.2.1.2.4 Resistor Selection
Equation 1 to Equation 4 are the equations for sizing the external resistors to set the VIN_OK threshold and
VOUT regulation value. The spreadsheet at SLVC489 can help size the external resistors.
10.2.1.3 Application Curves
See efficiency, line regulation, and load regulation curves at Figure 30, Figure 37, and Figure 36.
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200 mA
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IL
47.5 mV
VOUT
SW
2 V/div
VIN
VOUT
SW
1 ms/div
10 μs/div
V(IN) = 3.6 V bench power supply
R(OUT) = 100 kΩ
V(IN) = 3.6 V bench power supply
R(OUT) = 9 Ω
Figure 53. Steady State Operation
Figure 54. Steady State Operation
200 mA/div 200 mA/div
1.9 V 47.5 mV 190 mA
IL
50 mV/div
2V
SW
IL
200 mAV/div
50 mV
50 mV
VOUT
VIN
IL
VRDIV
IOUT
50 mV/div
2 V/div
2 V/div
VIN
VOUT
VIN-OK
VOUT
2 V/div
2 V/div
2 V/div
VSW
20 μs/div
100 ms/div
V(IN) = 3.6 V bench power supply + additional C(IN) = 100 uF
R(OUT) = open to 9 Ω to open
V(IN) = power amplifier ramped from 0 V to 5 V to 0 V
Figure 56. Load Transient Response
VOUT
50 mV/div
1 V/div
VSW
100 mA/div
IL
IOUT
1 V/div
200 mA/div
Figure 55. Power Management Response
VOUT
2 V/div
2 V/div
SW
5 μs/div
50 μs/div
V(IN) = 3.6 V -> 4.6 V -> 4.6 V from bench power supply
R(OUT) = 9 Ω
Figure 57. Line Transient Response
V(IN) = 4.0 V bench supply + additional C(IN) = 100 uF
VOUT resistors modified to provide 2.5 V
I(OUT) = 200 mA every 1 us
Figure 58. IR Pulse Transient Response
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EN1
2 V/div
2 V/div
SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
VOUT
VIN-OK
1 V/div
VIN-OK
2 V/div
1 V/div 1 V/div
1 V/div
VIN
VOUT
VSW
10 s/div
20 ms/div
V(IN) = power amplifier ramped from 0 V to 5 V to 0 V
EN1 = low; EN2 = high
V(IN) = 3.6 V bench power supply
EN2 = high; EN1 transitioned from high to low
R(OUT) = 1 kΩ
Figure 60. Ship-Mode Startup Behavior
EN2
VIN-OK
VOUT
VSW
2 V/div
1 V/div
2 V/div
2 V/div
Figure 59. Startup Behavior with Slow Ramping
VIN
200 μs/div
V(IN) = 3.6 V bench power supply
EN1 = low; EN2 transitioned from low to high
R(OUT) = 1 kΩ
Figure 61. Standby-Mode Startup Behavior
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10.2.2 TPS62736 4-Resistor Typical Application Circuit
TPS62736
IN
VIN
CIN1
CIN2
4.7PF
0.1PF
SW
L
10 PH
System Load
OUT
22PF
Buck
Controller
GPIO1
VIN_OK
GPIO2
EN1
GPIO2
EN2
COUT
VSS
Host
VRDIV
R3
VOUT_SET
R2
R4
VIN_OK_SET
Nano-Power
Management
R1
Figure 62. TPS62736 4-Resistor Typical Application Circuit
10.2.2.1 Design Requirements
A 2.5-V, up to 50-mA regulated power rail is needed. The VIN_OK comparator should indicate when the input
voltage drops below 2.9 V. No large load transients are expected.
10.2.2.2 Detailed Design Procedure
The recommended 10-µH inductor (TOKO DFE252012C) and 4.7-µF input capacitor are used. Since no large
load transients are expected, the minimum 22-µF output capacitor is used. Had a large load transient been
expected, we would have sized the capacitor using ITRAN = COUT x ΔVOUT / ΔTIME where ΔVOUT is amount
of VOUT droop allowed for the time of the transient.
First set RSUM = R1 + R2 = R3 + R4 = 13 MΩ then solve Equation 4 for R1 = VBIAS x RSUM / VIN_OK = 1.21
V x 13 MΩ / 2.9 V = 5.42 MΩ → 5.36 MΩ as the closest 1 % resistor.
Then R2 = RSUM - R1 = 13 MΩ - 5.42 MΩ = 7.58 MΩ → 7.5 MΩ as the closest 1% resistor.
Solve Equation 3 for R4 = VBIAS x RSUM / VOUT = 1.21 V x 13 MΩ / 2.5 V = 6.29 MΩ → 6.34 MΩ as the
closest 1% resistor.
Finally R3 = RSUM - R3 = 13 MΩ - 6.29 MΩ = 6.71 MΩ → 6.81 MΩ as the closest 1% resistor.
These values yield VOUT = 2.51 V and VIN_OK threshold = 2.90 V.
If using 3 resistors, see Resistor Selection for guidance on sizing the resistors.
10.2.2.3 Application Curves
See efficiency, load regulation and line regulation graphs at Figure 1, Figure 7 and Figure 8 respectively.
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2 V/div 10 mV/div 100 mA/div
VOUT-AC
SW
10 Ps/div
Figure 64. Steady State Operation
1 V/div
IL
1 V/div
1 V/div
VOUT-AC
SW
4 Ps/div
V(IN) = 3.0 V bench power supply
VOUT resistors changed to provide 1.8 V; L = 4.7 uH
R(OUT) = 100 kΩ
50 mA/div
VOUT-AC
40 ms/div
V(IN) = 3.0 V -> 5.0 V from bench power supply
R(OUT) = 50 Ω
Figure 67. Line Transient Response
VOUT
VRDIV
Figure 66. Sampling Waveform
20 mV/div
2 V/div
VIN
VIN
2 ms/div
V(IN) = 3.0 V bench power supply
Figure 65. Steady State Operation
10 mV/div
SW
IL
IOUT
50 mA/div
2 V/div 10 mV/div 100 mA/div
Figure 63. Steady State Operation
Submit Documentation Feedback
VOUT-AC
2 Ps/div
V(IN) = 3.0 V bench power supply
R(OUT) = 100 kΩ
V(IN) = 3.0 V bench power supply
R(OUT) = 50 Ω
26
IL
VOUT-AC
SW
5 V/div
2 V/div 10 mV/div 50 mA/div
IL
10 Ps/div
V(IN) = 4.0 V from bench power supply + additional CIN = 100
uF
R(OUT) = open - > 50 Ω
Figure 68. Load Transient Response
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
TPS62736, TPS62737
SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
2 V/div 2 V/div 2 V/div 5 V/div
2 V/div 100 mA/div
www.ti.com
IOUT
VOUT
2 V/div
SW
4 Ps/div
V(IN) = 4.0 V from bench power supply + additional CIN = 100
uF
I(OUT) = 200 mA every 1us
VIN_OK
VOUT
SW
20 ms/div
V(IN) = 4.0 V from bench power supply
VOUT resistors modified to provide 1.8 V
EN2 = high, EN1 transitioned high to low
Figure 69. IR Pulse Transient Response
2 V/div 2 V/div 2 V/div 5 V/div
EN1
Figure 70. Ship-Mode Startup Behavior
EN2
VIN_OK
VOUT
SW
400 Ps/div
V(IN) = 4.0 V from bench power supply
VOUT resistors modified to provide 1.8 V
EN1 = low, EN2 transitioned low to high
Figure 71. Standby-Mode Startup Behavior
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
Submit Documentation Feedback
27
TPS62736, TPS62737
SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
www.ti.com
11 Power Supply Recommendations
The TPS62736 / 7 ICs require a low impedance power source (e.g. battery, wall adapter) capable of providng
between 2.0 V and 5.5 V and up to 100 mA / 370 mA respectively. When the voltage at IN is less than or equal
to VOUT, the IC stops switching, turns on the high side FET and provides VOUT = VIN - ILOAD x RDS(on)HighSideFET.
12 Layout
12.1 Layout Guidelines
To minimize switching noise generation, the step-down converter (buck) power stage external components must
be carefully placed. The most critical external component for a buck power stage is its input capacitor. The bulk
input capacitor (CIN1) and high frequency decoupling capacitor (CIN2) must be placed as close as possible
between the power stage input (IN pin 1) and ground (VSS pin 12). Next, the inductor (L1) must be placed as
close as possible beween the switching node (SW pin 13) and the output voltage (OUT pin 11). Finally, the
output capacitor (COUT) should be placed as close as possible between the output voltage (OUT pin 11) and
GND (VSS pin 12). In the diagram below, the input and output capacitor grounds are connected to VSS pin 12
through vias to the bottom-layer ground plane of the PCB.
To minimize noise pickup by the high impedance voltage setting nodes (VIN_OK_SET pin 8 and VOUT_SET pin
9), the external resistors (R1, R2 and R3) should be placed so that the traces connecting the midpoints of the
string are as short as possible. In the diagram below, the connection to VOUT_SET is by a bottom layer trace.
The remaining pins are either NC pins, that should be connected to the PowerPAD™ as shown below, or digital
signals with minimal layout restrictions.
In order to maximize efficiency at light load, the use of voltage level setting resistors > 1 MΩ is recommended.
However, during board assembly, contaminants such as solder flux and even some board cleaning agents can
leave residue that may form parasitic resistors across the physical resistors and/or from one end of a resistor to
ground, especially in humid, fast airflow environments. This can result in the voltage regulation and threshold
levels changing significantly from those expected per the installed resistor values. Therefore, it is highly
recommended that no ground planes be poured near the voltage setting resistors. In addition, the boards must
be carefully cleaned, possibly rotated at least once during cleaning, and then rinsed with de-ionized water until
the ionic contamination of that water is well above 50 MΩ. If this is not feasible, then it is recommended that the
sum of the voltage setting resistors be reduced to at least 5 times below the measured ionic contamination.
12.2 Layout Example
VIAS to
GND PLANE
CIN1
VIAS to
GND PLANE
CIN1
VIAS to
GND PLANE
CIN2
CIN2
VIN
VIN
1
1
COUT
L1
VOUT
R3
R2
R1
VIA to
GND PLANE
Figure 72. Recommended Layout, TPS62736
28
Submit Documentation Feedback
COUT
L1
VOUT
R3
R2
R1
VIA to
GND PLANE
Figure 73. Recommended Layout, TPS62737
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
TPS62736, TPS62737
www.ti.com
SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014
13 Device and Documentation Support
13.1 Device Support
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 5. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS62736
Click here
Click here
Click here
Click here
Click here
TPS62737
Click here
Click here
Click here
Click here
Click here
13.3 Trademarks
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TPS62736 TPS62737
Submit Documentation Feedback
29
PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS62736RGYR
ACTIVE
VQFN
RGY
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
62736
TPS62736RGYT
ACTIVE
VQFN
RGY
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
62736
TPS62737RGYR
ACTIVE
VQFN
RGY
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-20 to 85
62737
TPS62737RGYT
ACTIVE
VQFN
RGY
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-20 to 85
62737
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Oct-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TPS62736RGYR
VQFN
RGY
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
330.0
12.4
3.75
3.75
1.15
8.0
12.0
Q1
TPS62736RGYT
VQFN
RGY
14
250
180.0
12.4
3.75
3.75
1.15
8.0
12.0
Q1
TPS62737RGYR
VQFN
RGY
14
3000
330.0
12.4
3.75
3.75
1.15
8.0
12.0
Q1
TPS62737RGYT
VQFN
RGY
14
250
180.0
12.4
3.75
3.75
1.15
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Oct-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS62736RGYR
VQFN
RGY
14
3000
367.0
367.0
35.0
TPS62736RGYT
VQFN
RGY
14
250
210.0
185.0
35.0
TPS62737RGYR
VQFN
RGY
14
3000
367.0
367.0
35.0
TPS62737RGYT
VQFN
RGY
14
250
210.0
185.0
35.0
Pack Materials-Page 2
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