University seminar series at Stanford on "Bio-applications of Nanotechnologies" Japanese Industry’s Vision and Recent Activities of Nanotechnologies 18 April 2002 Michiharu Nakamura Chairman, Sub-committee on Nano-Technology Committee on Industrial Technology KEIDANREN 日立の概要 Reform of Japanese social systems The Government - is trying to recover from the current recession - is trying to promote structural reform by introducing deregulation, privatization of national agencies, etc. - recognizes that “Science and Technology” is one of the main driving forces for economic growth and the progress of society Universities Large companies - are also introducing new management systems All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. To enhance science and technology in Japan 日立の概要 The Council for Science and Technology Policy was established in Jan. 2001 to play a role of a source of wisdom to support the Prime Minister. “The 2nd Science and Technology Basic Plan” - allocates S&T resources with the highest priority given to (1) Life Sciences, Health and Medical Treatment (2) Information and Telecommunications (3) Environmental Science (4) Nanotechnology and Materials (5) Others: New energy sources, manufacturing technologies, social infrastructure, new frontier science All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. universities’ pioneering works on nano-technologies Japanese 日立の概要 1.Prof. Ryogo Kubo (1962) (J. Phys. Soc. Jpn. 17 (1962) 975) Discovery of “Kubo-effect” in sub-micron size metals New physics for nano-scale metal/semiconductor “Coulomb-blockade effect” “SET” 2.Prof. Ryoji Ueda (1970`s) New physics for ultra fine particles Direct observation of structural changes in ultra-fine particles (ERATO: Hayashi project) 3.Prof. Norio Taniguchi (1974) Inroduced the concept of nanotechnologies at ICPE 4.Prof. Hiroyuki Sakaki (1975~) Artificially fabricated semiconductor nano-structures, such as ultra-thin films, quantum wires, quantum boxes All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. Carbon nanotube Discovered by Dr. Sumio Iijima (1991) New science fields in physics and chemistry has been established - Semiconductor/metal transition - Higher conductance than metals - Large magnetic resistance Progress in fabrication technologies (Under the permission of Mr. Sone, NEC) All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. R&D strategy for nano-technology in Japan n-Plan 21 proposed by KEIDANREN (2001.3.27) - Create technical innovations in IT, Biotechnology, Energy/environment, and materials - Focus R&D resources more effectively to expand impact on industry and society Flagship Projects Challenge to the Future Projects Exploratory Research All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. R&D strategy for nano-technology in Japan Flagship Projects R&D focused on practical applications and industrialization of them within 5 to 10 years Examples Next-generation semiconductor technology ASUKA (2001 - 5 years) MIRAI (2001 - 7 years) HALUKA (2001 - 3 years) 100 - 70 nm 70 - 50 nm Terabit-class information storage technology New devices for Peta-b/s communication All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. R&D strategy for nano-technology in Japan Challenge to the Future Projects R&D to create revolutionary fundamental technologies to support industry Examples New materials by controlling nano-structures Medical/healthcare by fusing biotechnology and nano-systems Measurement with accuracy below nm scale Nano-scale fabrication Simulation All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. R&D strategy for nano-technology in Japan Exploratory Research In-depth research of nano-scale particles and nano-structure materials Examples New physics New chemistry New science New theories and methods of analysis and simulation All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. What is nonotechnology? 10 1 mm Magnetic/Optical disks Top down Semiconductor devices To make Breakthrough by Nanotechnology Red Brick Wall 10 8 6 4 Protein molecule 2 DNA Bottom up Fusion 10 1 nm Hydrogen atom 0.1 nm 10 10 100 nm 10 nm 10 1970 1980 1990 2000 Number of atoms/bit Fabrication size 10 mm 1 2010 All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. Nano-technology for IT and Electronics Application Field IT and Electronics ・Electronic Devices ・Magnetic Devices ・Optical Devices Environment and Energy Examples: ・Mobile Computer ・Information Storage with 103 Times Larger Capacity ・Broad-Band Internet ・Sheet Display ・Quantum Computer Health and Welfare New Materials Revolutionary improvement in material properties Nanotechnology as the fundamentals Measurement, Control, fabrication and Simulation in atomic / molecular-level scale All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. 50nm CMOS technology 日立の概要 High Speed Performance SiO2 Spacer Gate SiN Si-sub. 1.4 Relative Speed CoSi2 1.2 Newly Developed Conventional 1.0 0.5 1.0 Voltage(V) 1.5 TEM photograph IEDM 2001 (Hitachi Central Research Lab.) All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. Experimentally 日立の概要 fabricated device Non-volatile memory cell with Si nano dots Gate length/width: 0.5/ 3μm Tunnel oxide thickness:7 nm 15nm Interlayer dielectric film: 0.1μm Si nano dots: diameter ~10nm T. Ishii et al., IEDM, 2000, p.305 All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. Semiconductor technology in the road map (ITRS 2000 Update Edition) Year Process Generation (nm) MPU Gate Length (nm) DRAM Scale (bit) Red Brick Wall 1999 2001 2004 180 130 90 120 90 65 256M 512M 1G 2008 60 40 6G Main Requirements to Achieve the Above Goal Alignment Accuracy(nm) 65 31 45 Pattern Deviation(nm) 13 9.0 6.3 Gate Insulation (nm) 1.9-2.5 1.5-1.9 1.2-1.5 k of Layer Insulation 3.5-4.0 2.7-3.5 1.6-2.2 2011 40 30 16G 2014 30 20 48G 26 18 13 4 3 2 0.8-1.2 0.6-0.8 0.5-0.6 1.5 <1.5 <1.5 Prospective technology in research exists. No prospective technology has been found yet. Nanotechnology Era Technological breakthrough is required. All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. Research and development targets Action in both Practical Technology Development and Analytical R&D Is Required to Establish System on Chip (SoC) Technology. ●High Permittivity (high-k) Gate Oxide Film and Its Processing Technology and Related Measurement and Analysis Technology ●Low Permittivity (low-k) Interlayer Insulation and Its Processing Technology and Related Measurement and Analysis Technology ●Lithography Mask and Related Measurement Technology ●New Device and Process Technology ●System Architecture All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. MOS devices (Goal: Planar MOS breakthrough) ・High-k Gate Insulation Material Development → U.S. and Europe are leading. Japan is launching Asuka Project. ・Novel Structure Devices → Research on Vertical MOS and SOI SiO2-Equivalent Gate Insulation Thickness (nm) Necessity of High-k Gate Insulation Film Development ~ 30 nm Gate Insulation < 2 nm 3.0 2.0 Source SiO2 1.0 0 Leak Current Suppression 1999 Drain New gate insulation film development is necessary. SiON, Si3N4, Al2O3 Metal Oxide κ ( 10-20) Pr2O3 ZrO2 HfO2 κ(>20) Metal Oxide 2002 2005 2008 2011 2014 (Year) All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. Memory density trend in memory devices 10 4 Areal Memory Density (Gb/in 2 ) 10 3 Near Field Optics Opto-Magnetism Thermal Fluctuation Limit 10 2 +100% a year 10 10-2 Optical Disk 1 10-3 10 -1 10 -2 10-1 Magnetic Disk 10-4 +30% a year 10 -3 10-4 10 -5 1970 +40% a year DRAM DVD-ROM Magnetic Disk Semiconductor Memory (DRAM) 1980 10-5 10-6 1mm Unit Memory Size 1990 2000 Areal Memory Density (Gb/mm2 ) 10 Perpendicular Atomic Magnetic Recording Manipulation (Conference Presentation) Patterned Media 1 10 -7 2010 (Year) All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. From longitudinal to perpendicular Longitudinal Shield layer GMR element Magnetic flux Perpendicular Single-pole-type writer Ring-type writer Auxiliary pole Main pole Recording layer Magnetic flux Under layer All Rights Reserved Copyright (C) (C) 2001 All Rights Reserved,Copyright 2002Hitachi, Hitachi,Ltd.Ltd. SPT/GMR-merged perpendicular head (Cross sectional view) Main Pole GMR Sensor ABS Coil Bottom Shield Auxiliary Pole / Upper Shield ■ SPT Writer Main pole : Tww = 250 nm PT= 400 nm Bs = 16 kG Aux. pole : PT = 2500 nm Bs = 10 kG ■ GMR reader Twr = 200 nm Gs = 80 nm Collaboration with Tohoku University and AIT partly carried out under the ASET program, NEDO All Rights Reserved Copyright (C) (C) 2001 All Rights Reserved,Copyright 2002Hitachi, Hitachi,Ltd.Ltd. Recorded bit patterns (MFM) 7.5×7.5μm All Rights Reserved Copyright (C) (C) 2001 All Rights Reserved,Copyright 2002Hitachi, Hitachi,Ltd.Ltd. Nano-glass material for optical memory Co3O4-Nano structure of Glass thin film (TEM photograph) Response and Refractive index shift by Laser irradiation Wave length:650nm Co3O4 Columnar nano-particles Δn/n=5.5% Amorphous grain(grass) 2.65 Laser intensity (mW) Refractive index n 2.75 2.55 4 irradiation ON OFF 2 0 -50 0 50 100 150 200 Number of particles :311 Mean Diameter r :13.3nm Deviation δ:3.97nm Variance δ/r :29.8% Pitch of each grain:1nm Elapsed time(nsec) Large refractive index shift is caused by interaction between nano-particles and amorphous grain(glass). 50nm Micro-structure of nano-glass (By Naito, Hitachi) All Rights Reserved Copyright (C) (C) 2001 All Rights Reserved,Copyright 2002Hitachi, Hitachi,Ltd.Ltd. High-density optical memory based on new super-resolution film Improvement of Recording Density by using Super-Resolution Film ⇒ more than 1 Tb/in2 Blue laser beam Research targets Δn/n Superresolution film Target 20% nsec Present 5.5% 10nsec Recording layer Reflective layer Glass Substrate Response Time All Rights Reserved Copyright (C) 2002 Hitachi, Ltd. Nano-optical devices by photonic crystal Sharp bend of optical path Miniaturization of integrated optical circuit Controllability of light propagation speed based on coupling constant shift Efficient control of high speed light-pulse Optical field L Perfect band gap 2-D crystal Optical path by photonic crystal defect (J. D. Joannopoulous, Nature , 386, 143 (1997)) (K. Hosomi and T. Katsuyama, PECS3 (2001)) Towards gaining further optical property Demultiplexer based on micro-resonators λk Optical bend path Dispersion compensator based on coupling defect Multiplexer λ1・・λn λq Micro laser To receivers Modulater based on micro-resonators WDM Add/Drop module by photonic crystal - Miniaturized integrated optical circuit All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. Bio Nano-technology for Medical & Welfare Application Field Bio Nanotechnology ・Medical sensors ・Gene sensors ・DNA/Protain chips Example ・Highly sensitive analysis of cancer cell ・High speed DNA separation chip ・Protein chips for drug screening ・Drug delivery system ・Anesthesia by using remote micro-manipulator Environment and Energy IT, Electronics New Materials Revolutionary improvement in material properties Nanotechnology as the fundamentals Measurement, Control, fabrication and Simulation in atomic / molecular-level scale All Rights Reserved Copyright (C) (C) 2001 All Rights Reserved,Copyright 2002Hitachi, Hitachi,Ltd.Ltd. Era of proteome DNA: Life information Gene information 3 billion Gene 40k types ・・・・・GATCCGAGATGCATGACT・・・・・・ Cell 60 trillion Gene/Protein Function ・・・・・CTAGGCTCTACGTACTGA・・・・・・ Protein: Life phenomenon ・100k types ・interact each other Study on Protein Structure Genome-based drug Order-made medicine Gene Analysis & Proteomics All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd. Optical bio-sensing with cap-shaped Au nanoparticles 1 Reflection from nanoparticles SEM micrograph of the gold particle monolayer Intensity Intensity Incident Light (white) Wavelength Gold Particle (20nm) Reflected Light Wavelength Optical Near-Field Polymer Sphere (110nm) Gold Thin Film (20nm) Polymer Substrate Resonant absorption of light. The wavelength of the absorption maximum depends on the refractive index of the surrounding. Basic nano-tech.:Measurement・Simulation IT, Electronics Medical, Welfare Environment/ Energy New materials Revolutionary improvement in material properties electric・magnetic・optical・strength・thermal Basic Nanotechnology Atomic,Molecular scale measurement /control/fabrication /simulation ・Ultra high voltage SEM ・STM, AFM ・CD-SEM ・Nano-scale machining by self-organization ・Electron beam lithography ・Multi-scale simulation All Rights Reserved Copyright (C) (C) 2001 All Rights Reserved,Copyright 2002Hitachi, Hitachi,Ltd.Ltd. 1M Volt holography electron microscope Super high voltage electron microscope was developed. World record (49.8 pm) of resolution power for crystal lattice was achieved. 49.8 pm 49.8 pm 1MV Holography Electron Microscope 49.8 pm 0.1nm Left: Crystal lattice stripes of Au thin film, pitch of which is 49.8 pm, Light: the model of Au crystal unit lattice CREST/SORST、Collaboration with Univ. of Tokyo All Rights Reserved Copyright (C) (C) 2001 All Rights Reserved,Copyright 2002Hitachi, Hitachi,Ltd.Ltd. 日立の概要 Thank you. . . All Rights Reserved,Copyright (C) 2002 Hitachi,Ltd.