Lecture #26 OUTLINE • Modern BJT Structures – Poly-Si emitter – Heterojunction bipolar transistor (HBT) • Charge control model • Base transit time Reading: Finish Chapter 11, 12.2 Spring 2007 EE130 Lecture 26, Slide 1 Modern BJT Structure B P+polySi E N+ polySi p+ P base N collector Deep trench C P+polySi + p Shallow trench + N subcollector P substrate • Narrow base • n+ poly-Si emitter • Self-aligned p+ poly-Si base contacts • Lightly-doped collector • Heavily-doped epitaxial subcollector • Shallow trenches and deep trenches filled with SiO2 for electrical isolation Spring 2007 EE130 Lecture 26, Slide 2 N+ Deep trench Polycrystalline-Silicon (Poly-Si) Emitter • bdc is larger for a poly-Si emitter BJT as compared with an all-crystalline emitter BJT, due to reduced dpE(x)/dx at the edge of the emitter depletion region Continuity of hole current in emitter dpE1 dpE 2 qDE1 qDE 2 dx dx dpE1 DE 2 dpE 2 E 2 dpE 2 dx DE1 dx E1 dx (1 poly - Si; 2 Si) Spring 2007 EE130 Lecture 26, Slide 3 Emitter Gummel Number w/ Poly-Si Emitter 2 2 ni N E ni N E (WE ) dx 2 WE , poly 2 ni E DE ni E (WE ) DE WE GE 0 WE 0 ni N E ni N E (WE ) dx 2 2 ni E DE ni E (WE ) S p 2 2 where Sp DEpoly/WEpoly is the surface recombination velocity 2 ni WE 1 For a uniformly doped emitter, GE N E 2 niE DE S p qni A qVEB / kT IB e 1 GE 2 Spring 2007 EE130 Lecture 26, Slide 4 Emitter Band Gap Narrowing 2 niB N E b dc 2 niE N B To achieve large bdc, NE is typically very large, so that band gap narrowing (Lecture 8, Slide 5) is significant. n N c N v e 2 iE EGE / kT niE2 ni2 e EGE / kT Spring 2007 Nc Nve ( EG EGE ) / kT EGE is negligible for NE < 1E18/cm3 N = 1018 cm-3: EG = 35 meV N = 1019 cm-3: EG = 75 meV EE130 Lecture 26, Slide 5 Narrow Band Gap (SiGe) Base 2 niB N E b dc 2 niE N B To improve bdc, we can increase niB by using a base material (Si1-xGex) that has a smaller band gap • for x = 0.2, EGB is 0.1eV Note that this allows a large bdc to be achieved with large NB (even >NE), which is advantageous for • reducing base resistance • increasing Early voltage (VA) Spring 2007 EE130 Lecture 26, Slide 6 EXAMPLE: Emitter Band Gap Narrowing If DB = 3DE , WE = 3WB , NB = 1018 cm-3, and niB2 = ni2, find bdc for (a) NE = 1019 cm-3, (b) NE = 1020 cm-3, and (c) NE = 1019 cm-3 and a Si1-xGex base with EgB = 60 meV (a) At NE = 1019 cm-3, EgE 35 meV niE2 ni2e EgE / kT ni2e35meV / 26meV 3.8ni2 1019 ni2 DBWE N E ni2 b dc 9 18 23.6 2 2 DEWB N B niE 10 3.8ni (b) At NE = 1020cm-3, EgE 160 meV: niE2 ni2 e160meV / 26meV 470ni2 10 20 ni2 DBWE N E ni2 b dc 9 18 1.9 DEWB N B niE2 10 470ni2 (c) niB2 ni2e Spring 2007 EgB / kT ni2e60meV / 26meV 10ni2 EE130 Lecture 26, Slide 7 b F 236 Charge Control Model A PNP BJT biased in the forward-active mode has excess minority-carrier charge QB stored in the quasi-neutral base: pB ( x, t ) pB (0, t )1 Wx qAWpB (0, t ) QB qA pB ( x, t )dx 2 0 W dQB In steady state, 0 dt Spring 2007 iB EE130 Lecture 26, Slide 8 dQB QB iB dt B QB B Base Transit Time, t p B ( x, t ) iC qADB x x W qADB p B (0, t ) W qAWpB (0, t ) QB 2 2 DB QB QB iC 2 W t W2 t 2 DB • time required for minority carriers to diffuse across the base • sets the switching speed limit of the transistor Spring 2007 EE130 Lecture 26, Slide 9 Relationship between B and t iB iC QB B QB B b dc t t • The time required for one minority carrier to recombine in the base is much longer than the time it takes for a minority carrier to cross the quasi-neutral base region. Spring 2007 EE130 Lecture 26, Slide 10 Drift Transistor: Built-in Base Field The base transit time can be reduced by building into the base an electric field that aids the flow of minority carriers. • Fixed EgB , NB decreases from emitter end to collector end. E B - C Ec Ef Ev • Fixed NB , EgB decreases from emitter end to collector end. E - B C Ec Ef Ev Spring 2007 EE130 Lecture 26, Slide 11 1 dEC E q dx EXAMPLE: Drift Transistor • Given an npn BJT with W=0.1m and NB=1017cm-3 (n=800cm2/Vs), find t and estimate the base electric field required to reduce t 2 5 2 W 10 cm t 2 ps 2 2 DB 20.026V 800cm / V s W v drift Spring 2007 W n t 10 5 cm 6kV / cm 2 12 n t 800cm / V s 2 10 s W EE130 Lecture 26, Slide 12