M. S. RAMAIAH INSTITUTE OF TECHNOLOGY
BANGALORE
(Autonomous Institute, Affiliated to VTU)
M. Tech
Digital Electronics and Communication
SYLLABUS
(For 2014 – 2016 Batch)
I - IV Semester
Department of Electronics & Communication
M. S. Ramaiah Institute of Technology, Bangalore-54
(Autonomous Institute, Affiliated to VTU)
Department of Electronics and Communication Engineering
Faculty List
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Name of the Faculty
Dr. S Sethu Selvi
Prof. C R Raghunath
Prof. K. Giridhar
Prof. M S Srinivas
Dr. K. Indira
K. Manikantan
C. Manjunath
B. Sujatha
Dr. Maya V Karki
S. Lakshmi
V. Anandi
Dr. T D Senthil Kumar
Dr. Naga Ravikanth D
Dr.Raghuram Srinivasan
H. Mallika
A.R. Priyarenjini
S.L. Gangadharaiah
M. Nagabhushan
C G Raghavendra
Sadashiva V Chakrasali
C. Sharmila Suttur
Mamtha Mohan
V. Nuthan Prasad
Reshma Verma
Shreedarshan K
Lakshmi Srinivasan
Flory Francis
Sarala S M
Punya Prabha V
Suma K V
Jayashree S
Manjunath C Lakkannavar
Ms. Chitra M
Qualification
Ph.D
M.Tech
M.Tech
M.Tech
Ph.D
M E (Ph.D)
ME
M E (Ph.D)
Ph.D
M E (Ph.D)
M S (Ph.D)
Ph.D
Ph.D
Ph.D
M S (Ph.D)
M.Tech
M.Tech
M.Tech (Ph.D)
M.Tech (Ph.D)
M.Tech (Ph.D)
M.Tech (Ph.D)
M.Tech (Ph.D)
M.Tech (Ph.D)
M.Tech (Ph.D)
M.Tech (Ph.D)
M.Tech (Ph.D)
M.Tech
M.Tech
M.Tech (Ph.D)
M.Tech (Ph.D)
M.Sc
M.Tech
M.Tech
2
Designation
Professor & Head
Professor
Professor
Professor
Professor
Associate Professor
Associate Professor
Associate Professor
Associate Professor
Associate Professor
Associate Professor
Associate Professor
Associate Professor
Associate Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
Assistant Professor
I SEMESTER M. Tech (Digital Electronics & Communication)
L
T
Credit*
P
S
Advanced Mathematics
4
1
0
0
5
MDLC12
Advanced Digital Communication
4
1
0
0
5
3.
MDLC13
Digital System Design
4
0
1
0
5
4.
MDLC14
Mini-Project/Seminar – I
0
0
2
0
2
5.
Elective I
x
x
x
x
5
6.
Elective II
x
x
x
x
5
12+x
2+x
3+x
x
27
SI.
No.
Subject
Code
1.
MDLC11
2.
Subject
Total
Total
II SEMESTER M. Tech (Digital Electronics & Communication)
Subject
Code
Subject
L
T
Credit*
P
S
1.
MDLC21
Wireless and Mobile Communications
3
1
0
1
5
2.
MDLC22
Advanced DSP
4
0
1
0
5
3.
MDLC23
Mini-Project/Seminar – II
0
0
2
0
2
4.
Elective III
x
x
x
x
5
5.
Elective IV
x
x
x
x
5
6.
Elective V
x
x
x
x
5
7+x
1+x
3+x
1+x
27
SI.
No.
Total
Total
III SEMESTER M. Tech (Digital Electronics & Communication)
SI.
No.
Subject
Code
1.
MDLC31
2.
MDLC32
3.
L
T
Credit*
P
S
Project – Phase I
0
0
14
0
14
Elective VI
x
x
x
0
5
Elective VII
x
x
x
0
5
x
x
14+x
0
24
Subject
Total
Total
IV SEMESTER M. Tech (Digital Electronics & Communication)
SI.
No.
Subject
Code
1.
MDLC41
Subject
Project – Phase II
Total
*
L: Lecture, T: Tutorial, P: Practical, S: Self Study
3
L
T
Credit*
P
S
0
0
22
0
22
0
0
22
0
22
Total
LIST OF ELECTIVES:
The student is required to take 35 credits from the given list of electives.
L
T
Credit*
P
S
Error Control Coding
3
1
0
1
5
MDLCE02
Design of Electronic Systems
3
1
0
1
5
3.
MDLCE03
FPGA based System Design
4
0
1
0
5
4.
MDLCE04
Digital Signal Compression
3
0
1
1
5
5.
MDLCE05
Advances in VLSI Design
4
0
1
0
5
6.
MDLCE06
Micro and Smart Systems
Technology
4
0
1
0
5
7.
MDLCE07
Advanced Embedded Systems
4
0
1
0
5
8.
MDLCE08
Image and Video Processing
4
0
1
0
5
9.
MDLCE09
ARM Processors
4
0
1
0
5
10.
MDLCE10
CMOS VLSI Design
4
0
1
0
5
11.
MDLCE11
ASIC Design
4
0
1
0
5
12.
MDLCE12
RF and Microwave Circuit Design
4
1
0
0
5
13.
MDLCE13
Optical Communication and
Networking
4
1
0
0
5
SI.
No.
Subject
Code
Subject
1.
MDLCE01
2.
Subject Areas
I
II
Core Courses
15
10
Electives
10
15
Seminar
02
02
Project Work
Semester
Load
27
27
III
IV
10
Total
Range
Suggested
(VTU)
25
15 – 25
20
35
25 – 35
30
04
03 – 05
05
33 – 50
45
14
22
36
24
22
100
4
Total
ADVANCED MATHEMATICS
Subject Code: MDLC11
Prerequisites: Nil
Credits: 4:1:0:0
Course Objectives:









To model given electronic circuit using differential equation.
To understand different standard distributions.
Analyze the statistical characteristics of random variables.
To find the joint density function and analyze the statistical characters of joint pdf.
Apply arithmetic operations on vectors and matrices including inversion and determinants.
Apply row reduction method to solve systems of linear equations.
Analyze basic terminology of Linear Algebra in Euclidean spaces including Linear
independence, spanning, basis, rank and null space.
Employ Eigen values and Eigen vectors to diagonalise a matrix.
Demonstrate projections and orthogonality among Euclidean vectors including GramSchmidt orthonormalization process and orthogonality matrices.
UNIT – I
Random Variables: Introduction to probability, repeated trails, random variables, distribution
and density functions, mean and variance, moments and characteristic functions.
Pairs of Random Variables: Joint distribution and density functions, conditional distributions,
covariance and correlation coefficient, conditional mean and conditional variances.
UNIT – II
Solving Linear Equations: Introduction, geometry of linear equations, Gaussian elimination,
matrix notation, inverses.
Vector Spaces: Vector spaces and subspaces, linear independence, basis and dimension, linear
transformation.
UNIT – III
Orthogonality: Orthogonal vectors and subspaces, projections, orthogonal bases and Gram –
Schmidt orthogonalization. Eigen values, Eigen vectors and diagonalization, Symmetric Matrices
and quadratic forms and SVD.
UNIT – IV
Graph Theory: Introduction, Isomorphism, connected graphs, disconnected graphs, trees, cut
sets, vector spaces of graphs, electrical network analysis by graph theory.
UNIT – V
Linear Programming: Introduction, Formulation of the problem, graphical method, some
exceptional cases, canonical and standard forms of LPP, simplex method, artificial variable
technique.
References:
1. B. S. Grewal, “Higher Engineering Mathematics”, Khanna Publishers, 40 th edition, 2007.
2. Athanasios Papoulis and S. Unnikrishna Pillai, “Probability, Random Variables and
Stochastic Processes”, Fourth Edition, MGH, 2002.
3. Strang. G, “Linear Algebra and its Applications”, 3 rd Edition, Thomson Learning, 1988.
4. David C. Lay, “Linear Algebra and its Applications”, 3rd Edition, Pearson Education, 2003.
5. Suresh Chandra, Jayadeva and Aparna Mehra, “Numerical Optimization with Applications”,
Narosa Publishing House.
5
6. Hwei P. Hsu, “Theory and Problems of Probability, Random Variables, and Random
Processes”, Schaum's Outline, TMH, 1996.
Course Outcomes:
1.
2.
3.
4.
5.
6.
7.
Analyze electronic circuit using differential equations.
Apply in detection and estimation of signals.
Apply for channel modeling.
Apply for noise modeling.
Apply in adaptive filters.
Apply in various communication applications.
Apply linear systems in Economics, business, balancing chemical equations, and
determining currents in a network
8. Apply linear transformation in computer graphics
9. Apply Eigen values and Eigen vectors in discrete dynamical system describing the
population of a city
10. Solve a system described by differential equations
11. Solve inconsistent systems using Least square method
12. Employ least square method to fit data points close to a curve
13. Apply Quadratic forms in constrained optimization
6
ADVANCED DIGITAL COMMUNICATION
Subject Code: MDLC12
Prerequisites: Digital Communication
Credits: 4:1:0:0
Course Objectives:










Represent digitally modulated signals and characterize narrowband signals and systems
Compare spectral characteristics of digitally modulated signals
Design modulation and detection methods for communication over an additive white
Gaussian noise channel
Evaluate error rate performance and channel bandwidth for the various digital signaling
techniques
Analyze the problem of demodulation of signals corrupted by intersymbol interference
Evaluate performance of optimum and suboptimum equalization methods
Understand adaptive channel equalization with LMS and RLS algorithms
Analyze blind equalization algorithms
Appreciate different spread spectrum signals and systems
Evaluate performance of communication through Rayleigh and Nakagami fading channels
UNIT – I
Characterization of Communication Signals and Systems: Representation of band pass
signals and systems, representation and spectral characteristics of digitally modulated signals.
Optimum Receivers for AWGN Channel: Optimum receiver, performance of optimum
receiver for memoryless modulation, optimum receiver for signals with random phase in AWGN
channel
UNIT – II
Communication through Band Limited Linear Filter Channels: Optimum receiver for
channels with ISI and AWGN, Linear equalization, Decision feedback equalization, reduced
complexity ML detectors, Iterative equalization and decoding, Turbo equalization.
UNIT – III
Adaptive Equalization: Adaptive linear equalizer, adaptive decision feedback equalizer,
adaptive equalization of Trellis- coded signals, Recursive least squares algorithms for adaptive
equalization, self recovering (blind) equalization.
UNIT – IV
Spread Spectrum Signals for Digital Communication: Model of Spread Spectrum Digital
Communication System, Direct Sequence Spread Spectrum Signals, Frequency-Hopped Spread
Spectrum Signals, CDMA, time-hopping SS, Synchronization of SS systems.
UNIT – V
Digital Communication Through Fading Multi-Path Channels: Characterization of fading
multi-path channels, the effect of signal characteristics on the choice of a channel model,
frequency-nonselective, slowly fading channel, diversity techniques for fading multi-path
channels, Digital signaling over a frequency-selective, slowly fading channel, multiple antenna
systems.
7
References:
1. John G. Proakis, “Digital Communications”, 4 th Edition, McGraw Hill, 2001.
2. Simon Haykin, “Digital Communications”, John Wiley and Sons,
3. Bernard Sklar, “Digital Communications - Fundamentals and Applications”, 2nd Edition,
Pearson Education (Asia) Pvt. Ltd, 2001.
4. Andrew J. Viterbi, “CDMA: Principles of Spread Spectrum Communications”, Prentice Hall,
USA, 1995.
8
DIGITAL SYSTEM DESIGN
Subject Code: MDLC13
Prerequisites: Digital Circuits
Credits: 4:0:1:0
UNIT 1
Introduction: Microelectronics, semiconductor technologies and circuit taxonomy,
Microelectronic design styles, computer aided synthesis and optimization. Boolean algebra and
Applications, Hardware Modeling Languages, distinctive features, Structural hardware language,
Behavioral hardware language, HDLs used for synthesis, Introduction to VHDL, Entities and
Architectures, Creating Combinational and Sequential logic.
UNIT 2
Verilog: Introduction to Verilog, Modules and Ports, Gate-Level Modeling, Dataflow Modeling,
Behavioral Modeling
UNIT 3
Two level combinational logic optimization: Logic optimization, principles, operation on two
level logic covers, algorithms for logic minimization, symbolic minimization and encoding
property, minimization of Boolean relations.
UNIT 4
Multiple level combinational optimizations: Models and transformations for combinational
networks, algebraic model, Synthesis of testable network, algorithm for delay evaluation and
optimization, rule based system for logic optimization.
Sequential circuit optimization: Sequential circuit optimization using state based models,
sequential circuit optimization using network models.
UNIT 5
Schedule Algorithms: A model for scheduling problems, Scheduling with resource and without
resource constraints, Scheduling algorithms for extended sequencing models, Scheduling Pipe
lined circuits.
Cell library binding: Problem formulation and analysis, algorithms for library binding, specific
problems and algorithms for library binding (lookup table FPGAs and Antifuse based FPGAs),
rule based library binding.
Laboratory
Write the HDL code for the following combinational and sequential circuits
1. Logic gates
2. 2 to 4 decoder
3. 8 to 3 encoder (with priority and without priority)
4. Devise a minimal-length binary code to represent the state of a phone: n work, dial-tone,
dialing, busy, connected, disconnected, and ringing
5. Test the circuit diagram for multiplexer that selects among four sources of data, each of
which is encoded with three bits. The circuit should be implemented using 4 to 1
multiplexer.
6. 8 to 1 multiplexer, demultiplexer, comparator
7. 4 bit binary to gray converter
8. Develop a circuit of a 4-bit Gray code to unsigned binary converter and implement using a
combinational ROM.
9. Full adder using different modeling styles
10. ALU
11. Flip-flops(SR, D, JK, T)
9
12. Binary, BCD counters and any sequence counters
13. Write Boolean equation for a BCD decoder, that is, a decoder that has a BCD code word as
input and that has outputs y0 through y9. Draw a circuit that uses AND and OR gates and
inverters to implement the decoder.
14. Design a circuit that has an input ,a transmit clock and an NRZ serial data signal and that
generates a manchester encoded serial data signal as output
References:
1. Giovanni De Micheli, “Synthesis and Optimization of Digital Circuits" Tata McGraw-Hill,
2003.
2. Srinivas Devadas, Abhijit Ghosh, and Kurt Keutzer, “Logic Synthesis,” McGraw-Hill, USA,
1994.
3. Kevin Skahill, “VHDL for Programmable Logic”, Pearson Education, 2000.
4. Samir Palnitkar “Verilog HDL”, Pearson Education, 2005.
5. Zvi Kohavi, “Switching and Finite Automata Theory”, 2nd Edition, Tata McGraw Hill Edition
10
WIRELESS AND MOBILE COMMUNICATION
Subject Code: MDLC21
Prerequisites: Digital Communication
Credits: 3:0:1:1
Course objectives:









Understand the cellular concept in mobile communication.
Apply the cellular concept to improve capacity in cellular systems with limited radio
spectrum.
Understand the principle of radio wave propagation in free space.
Appreciate the significance of radio wave propagation in different propagation models.
Understand the principle of impulse response model of a multi-path channel.
Distinguish different types of small scale fading in multi-path channel.
Appreciate the concepts of different diversity techniques.
Apply antenna diversity concept to improve the wireless channel capacity and diversity
gain.
Appreciate the importance of GSM and CDMA in 2G and 3G mobile communication.
UNIT – I
Basics of Mobile Communication: Introduction to Wireless Communication, Evolution and
generations of cellular networks, Comparison of Common wireless communication systems,
Cellular concept: Frequency reuse, Channel assignment Strategies, Handoff Strategies, Cochannel interference and system capacity, Adjacent channel interference, Trunking and GOS,
Capacity improvement techniques: Cell splitting, Sectoring and microcell zone concept.
UNIT – II
Mobile Radio Propagation: Large scale propagation models: Introduction to Free Space
Propagation model, Relating power and electric field, Two Ray Ground Reflection model,
Outdoor propagation models, Indoor propagation models.
UNIT – III
Small Scale Fading and Multipath: Introduction, Factors influencing small scale fading,
Doppler shift, Impulse response model, Small scale multipath measurements, Parameters of
mobile multipath channel, Types of small scale fading.
UNIT – IV
Equalization and Diversity Techniques: Diversity techniques: time, frequency, polarization
and angle diversity. RAKE Receiver, Antenna diversity: Receive diversity – Single input multiple
outputs (SIMO), Transmit diversity – Multiple input single output (MISO), 2×2 Multiple Input
Multiple output (MIMO) schemes – Space Time Block Codes, Equalization: Introduction, linear
and non-linear equalizers, adaptive equalization.
UNIT – V
Mobile and Wireless Network Standards: Wireless Standards: IEEE 802.11 a and b and
Personal Area Network (PAN), Mobile standards: GSM, IS-95 and CDMA-2000.
Self Study: Basic propagation mechanisms – Reflection, Diffraction, Scattering, Large scale and
Small Scale Path loss Models, Propagation Mechanism, Multiple Access Techniques, physical
layer of 802.11 standard and PAN (OFDM, DSSS and FHSS).
11
References:
1. Theodore S. Rappaport, “Wireless Communications: Principles and Practice”, 2nd Edition,
Pearson Education, 2002.
2. David Tse, P. Vishwanath, “Fundamentals of Wireless Communication”, Cambridge, 2006.
3. Vijay K. Garg, “IS-95 CDMA and CDMA 2000,” Pearson Education (Asia) Pte. Ltd, 2004.
Laboratory Experiments:
Assignment for the Laboratory work: NS2 Simulator (available FREE on the net)
1.
2.
3.
4.
5.
6.
Check for the transmission power in the wireless network.
Measure the losses in the channel.
Implement both indoor and outdoor propagation models.
Measure the performance analysis of different models.
Implement the CDMA model.
Measure the Latency, BW and efficiency of the given wireless model.
Course Outcomes:
1. Employ cellular concept in mobile communication systems.
2. Analyze the significance of improving capacity in cellular systems with limited radio
spectrum.
3. Employ the concept of radio wave propagation to calculate the link power budget.
4. Describe different propagation models in wireless communication.
5. Estimate the characteristics of a wireless multi-path channel.
6. Analyze the effects of small scale fading in multi-path channel.
7. Employ the concept of different diversity techniques to overcome the effect of small scale
multi-path propagation.
8. Employ an antenna diversity concept in high data rate wireless communication.
9. Describe the functional blocks of GSM architecture.
10. Classify different types of channels in IS-95 and CDMA 2000 standards.
12
ADVANCED DIGITAL SIGNAL PROCESSING
Subject Code: MDLC22
Prerequisites: Advanced Digital Signal Processing
Credits: 4:0:1:0
Course Objectives:
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
Apply signal processing algorithms for modeling discrete time signals
Estimate the power spectrum of a random process
Design optimum digital filters
Design and implement adaptive filters
Understand multirate signal processing and time frequency decomposition of signals
Recognize a wide variety of applications in speech and audio signal processing, image
processing, and digital communication
UNIT – I
Discrete-Time Random Processes: Random variables, Random processes, Filtering Random
processes, Spectral factorization, Special types of random processes.
UNIT – II
Signal Modeling: Least squares method, Pade approximation, Prony’s method, Finite data
records, Stochastic models.
UNIT – III
Spectrum Estimation: Nonparametric methods, Minimum variance spectrum estimation,
Maximum entropy method, Parametric methods, Frequency estimation, Principal components
frequency estimation.
UNIT – IV
Adaptive filters: FIR Wiener filter, FIR adaptive filters, Adaptive recursive filters, Recursive
least squares, Applications in noise and echo cancellation, Equalization.
UNIT – V
Multirate Digital Signal Processing: Introduction, Decimation by a factor D, interpolation by
a factor I, Sampling rate Conversion by a factor I/D, implementation of sampling rate
conversion, Multistage implementation of sampling rate conversion, sampling rate conversion of
band pass signals, sampling rate conversion by an arbitrary factor, Applications of multirate
signal processing Digital Filter banks, Two Channel Quadrature Mirror Filter banks, M-Channel
QMF bank
Introduction to Time Frequency Expansion: STFT, Gabor Transform, Wavelet Transform,
Recursive Multiresolution Decomposition.
Laboratory:
Implementation in MATLAB
1. Probability distribution and density functions, mean, variance, autocorrelation
2. White noise, power spectrum, ARMA(2,2), AR(1), AR(2), MA(4) processes
3. Pade approximation, Prony’s method, Shank’s method, autocorrelation method, covariance
method
4. Periodogram, modified Periodogram, Bartlett’s method, Welch’s method, Blackman-Tukey
method, minimum variance method, maximum entropy method
13
5. Pisarenko harmonic decomposition, MUSIC algorithm, Eigenvector method, Minimum norm
algorithm, Principal components frequency estimation
6. LMS algorithm, normalized LMS, RLS algorithm, noise cancellation, channel equalization
7. Multirate signal processing and wavelet transforms
References:
1. Monson H. Hayes, “Statistical Signal Processing and Modeling”, John Wiley, 1996
2. J. G. Proakis, D. K. Manolakis, “Digital Signal Processing”, Third Edition, Prentice Hall,
1995.
3. B. Widrow, S. Stearns, “Adaptive Signal Processing”, Prentice Hall, 1985.
Course Outcomes:
1. Employ random processes and its classification through examples like ARMA and harmonic
processes
2. Derive the correlation and power spectrum of the output random process when a random
process is filtered by a LTI system
3. Model deterministic and random time domain signal using Pade’s approximation, Prony’s
method, autocorrelation and covariance methods
4. Implement signal modeling methods for different deterministic and random signals and
compare their modeling error and speed
5. Estimate the power spectrum of random processes using parametric and non-parametric
methods
6. Compare spectrum estimation methods based on variability, resolution, and Figure of
Merit.
7. Estimate the frequency of the harmonic processes
8. Understand adaptive filters and LMS algorithm
9. Derive the different performance measures of the LMS algorithm and understand its
variants
10. Demonstrate applications like echo cancellation, channel equalization, linear prediction,
noise cancellation and filtering in communication
11. Understand decimation, interpolation and sampling rate conversion
12. Derive time frequency expansion and understand its application in wavelet transform
14
ELECTIVES
ERROR CONTROL CODING
Subject Code: MDLCE01
Prerequisites: Information Theory & Coding
Credits: 3:1:0:1
Course Objectives:










Illustrate the error detection and correction capabilities of linear block codes.
Apply the concept of RM codes for designing data storage systems.
Design Golay codes for error control in communication systems and space communication
programs.
Apply random error correction and burst error correcting cyclic codes and to design error
trapping decoding systems.
Appreciate binary BCH and non binary BCH code (RS Codes) and design & develop
decoding algorithm for BCH codes such as Berlekamp’s iterative algorithm.
Employ the Chien’s search algorithm and Euclid algorithm for RS codes, frequency domain
decoding algorithm.
Distinguish between finite geometry codes, majority logic codes and cyclic majority logic
decodable codes (one step and two step).
Show how convolutional encodes can be represented using state diagram, tree diagram,
and trellis diagram.
Use efficient decoding methods such as Viterbi algorithm, maximum likelihood decoding
algorithm, and stack algorithm.
Appreciate the application of convolutional codes and low-density parity check codes to
digital transmission over telephone, satellite and radio channels
UNIT – I
Introduction to Algebra: Groups, Fields, Binary Field Arithmetic, Construction of Galois Field
GF (2m) and example of construction of GF (24) using primitive polynomial, Computation using
GF (2m) Arithmetic – Solution of simultaneous equations and quadratic equations, Vector space,
Properties, Linearly independent vectors, inner product, Row space, Sub space.
UNIT – II
Linear Block Codes: Generator and Parity check Matrices, Encoding circuits, Syndrome and
Error Detection, Minimum Distance Considerations, Error detecting and Error correcting
capabilities, Hamming Codes – (7, 4), (12, 8), (15, 11), Reed – Muller codes, (24, 12) Golay
code.
UNIT – III
Cyclic Codes: Introduction, Generator and Parity check Polynomials, Encoding using
Multiplication circuits, Systematic Cyclic codes – Encoding using Feedback shift register circuits,
Generator matrix for Cyclic codes, Syndrome computation and Error detection, Meggitt decoder,
(23, 12) Golay code.
UNIT – IV
BCH Codes: Binary primitive BCH codes, Decoding procedures, Implementation of Galois field
Arithmetic, Implementation of Error correction, BCH codes, The Berlekamp - Massey Algorithm.
Non-binary BCH Codes: Non-binary BCH codes, q-ary linear block codes, Primitive BCH codes
over GF(q), Reed-Solomon codes, Decoding of non-binary BCH codes.
UNIT – V
Convolutional and Burst Error Correcting Codes: Encoding of Convolutional codes,
Structural properties, Distance properties, Viterbi Decoding Algorithm for decoding, Soft –
15
output Viterbi Algorithm, Stack decoding, Fano sequential decoding algorithms, Majority logic
decoding, Low density parity check codes (LDPC) and LDPC convolutional codes.
Self Study:
Basic properties of GF(2m), example of construction of GF (2 5) using primitive polynomial,
Standard array and Syndrome decoding of linear block codes, Decoding circuits, Product and
interleaved codes, Error trapping decoding, Cyclic Hamming codes, Shortened cyclic codes,
Decoding of RS codes, Burst and random error correcting codes, concept of interleaving
References:
1. Shu Lin, Daniel J. Costello, Jr. “Error Control Coding” Pearson/Prentice Hall, Second
Edition, 2004.
2. Blahut, R.E. “Theory and Practice of Error Control Codes” Addison Wesley, 1984
3. J. Viterbi, J. K. Omura, “Principles of Digital Communication and Coding”, Dover
Publications, 2009.
16
DESIGN OF ELECTRONIC SYSTEMS
Subject Code: MDLCE02
Prerequisites: Electronic Circuits
Credits: 3:1:0:1
Course Objectives:





Design an electronic system meeting customer requirement
Select transmission lines optimizing various parameters
Illustrate importance of packaging technology and MCM
Analyze impact of PCB selection on system
Design radar system in terms of its transmitter power, receiver noise figure, frequency of
operation and antenna gain for a given target
UNIT – I
Overview of design of electronic systems: Evolution and importance of design of electronics
system, Impact of global competition & innovation on system design, Broad classification of
systems as consumer, professional, aerospace & defense: salient differences.
UNIT – II
Transmission lines and antennas: Optimizing the selection process of coaxial, planar and
wave guides, with respect to impedance, frequency of operation, system design consideration
for selection of antennas in terms of its performance parameters with respect to reflector
antennas, phased array antennas, advantages and disadvantages.
UNIT – III
Packaging & interconnection technology: Introduction & overview of micro electronics
packaging & its influence on system performance & cost, Packaging hierarchy, Driving force on
packaging technology, MCM definition & classification, their advantages in systems.
UNIT – IV
PCB Technologies: Importance of PCB laminates in electronic systems, Classification of
laminates and their construction details, Processes of selection of PCB laminate in electronic
systems, multilayer laminates and their salient features affecting systems.
UNIT – V
Case studies on radar system design: Introduction: Integration of Radar Pulses, Radar cross
section of Targets, Transmitter Power, Pulse Repetition Frequency, system losses, overview of
system consideration during the design of radar.
Self Study
Various Standards and their importance: ISO, ISI, JSS, Overview and classification of
transmission lines, Transmission line power handling capacity and VSWR, lumped element
model of transmission line. Overview of MIC: thick and thin film circuits, and MMIC’s,
importance of microwave integrated circuits in electronic systems, PCB fabrication,
Photolithographic technique, Introduction to Radar, Radar equation, Probabilities of Detection
and False alarm.
NOTE: The course will have an industrial visit and a mini project.
17
References:
1.
2.
3.
4.
Merrill. I. Skolnik, “Introduction to Radar Systems”, Tata McGraw Hill, 3rd Edition, 2001.
Rao R Tum Mala, “Fundamentals of Microsystems Packaging”, McGraw Hill, NY 2001.
William D Brown, “Advanced Electronic Packaging”, IEEE Press, 1999.
Current literature from Journals & Conference proceedings.
18
FPGA BASED SYSTEM DESIGN
Subject Code: MDLCE03
Prerequisites: Digital System Design
Credits: 4:0:1:0
Course Objectives:








Use and illustrate the complete design flow (synthesis, place and route, floor
planning,
timing analysis, etc.) required to implement complex designs
Appraise VLSI chip manufacturing process.
Appreciate differences in FPGA architectures and how these affect circuit design.
Learn how to use the VHDL hardware description language to simulate and synthesis
digital circuit system.
Implement digital circuits with FPGA using CAD tools and optimize with respect to speed,
power consumption and gate count.
Dramatize specific algorithms utilized in placement and routing
Adapt the concept of behavioral design and design methodologies
Illustrate the concept platform of FPGA and multi FPGA systems
UNIT – I
FPGA Based Systems: Digital design & FPGA’s, FPGA based system design.
VLSI Technology: Introduction, manufacturing process, transistor processes, CMOS logic
gates, wires, Packages and Pads.
UNIT – II
FPGA Fabrics: Introduction, FPGA Architecture, SRAM based FPGA's, permanently programmed
FPGA's, Chip I/O, circuit design of FPGA fabrics, Architecture of FPGA fabrics.
UNIT – III
Combinational Logic: Introduction, logic design process, combinational network delay, power
and energy optimization, arithmetic logic, logic implementation for FPGA's, physical design for
FPGA's.
UNIT – IV
Sequential Machines: Introduction, The Sequential Machine design process, Sequential design
styles, performance analysis, power optimization.
UNIT – V
Architecture: Introduction, behavioral design, design methodologies, design example.
Large scale systems: Introduction, platform FPGA's, multi-FPGA systems, novel Architectures.
Laboratory
Simulation (with test bench) and synthesis of the following verilog codes
1.
2.
3.
4.
5.
6.
7.
Parallel Adder
Look ahead adder
Carry skip adder
Array multiplier
ASAP Schedule
ALAP Schedule
Barrel shifter
19
References:
1.
2.
3.
4.
5.
6.
Wayne Wolf, “FPGA based System Design”, Pearson Education, 2005.
Michael D Ciletti, “Advanced Digital Design with Verilog HDL”, Pearson Education, 2005.
Samir Palnitkar, “Verilog HDL”, Pearson Education, 2005.
J Bhaskar, “A Verilog HDL Primer”, 2nd Edition, B S Publications, 2007.
Kevin Skahill, “VHDL for Programmable Logic”, Pearson Education, 2004.
Wayne Wolf, “Modern VLSI Design”, Pearson Education, 2002.
Course Outcomes:
1. Be capable of using commercial CAD tools to design and simulate digital circuits
2. Produce system and FPGA designs using designed flows based on good practice
3. Produce HDL code for FPGA designs and verify system performance using an FPGA
development kit.
4. Design and verify a complex system using FPGAs to meet specified
speed/power/size
requirements.
5. Design and verify the performance of an FPGA with specified input/output requirements
20
DIGITAL SIGNAL COMPRESSION
Subject Code: MDLCE04
Prerequisites: Nil
Credits: 3:0:1:1
Course Objectives:







Appreciate the significance of data compression in real world.
Differentiate between lossy and lossless compression methods.
Illustrate different lossy and lossless compression methods.
Apply compression methods to different data types which include audio, text and images.
Categorize some audio compression and image compression standards.
Adapt different video compression techniques.
Study different video compression standards like H.261, H.264, MPEG-1, MPEG-2, MPEG-4
and MPEG-7.
UNIT – I
Lossless Compression: Comparison between lossy and lossless compression, Derivation of
average information, Models, Uniquely Decodable codes,
Prefix codes, Kraft McMillan
Inequality, Huffman coding, Adaptive Huffman coding, Applications of Huffman coding.
UNIT – II
Arithmetic coding and Dictionary Techniques: Algorithm implementation, Dictionary
Techniques, Static Dictionary, Adaptive Dictionary, Applications of Arithmetic Coding, Bi-level
image compression, Applications of Dictionary techniques, Predictive coding, Prediction with
partial match, The Burrow Wheeler Transform, Run-length coding
UNIT – III
Lossy Compression: Conditional entropy, average mutual information, Differential entropy,
Rate distortion criteria, Scalar quantization: Uniform quantization, Adaptive quantization, Nonuniform quantization and entropy coded quantization. Vector quantization: LBG algorithm, Tree
structured VQ, Structured VQ, Differential encoding: Prediction in DPCM, Adaptive DPCM, Delta
Modulation
UNIT – IV
Transform Coding: Transforms – KLT, DCT, DST, DWHT, Quantization and coding Applications
to image compression: JPEG, Applications to audio and image compression, Video compression.
UNIT – V
Video Compression: Motion compensation, Video signal representation, Algorithms for video
conferencing & videophones – H.261, H. 263, Asymmetric applications – MPEG 1, MPEG 2.
Self Study
Golomb codes, Rice codes, Tunstall codes, CALIC, JPEG-LS, JBIG2, T.4, T.6, Speech coding –
G7.26, EZW, SPHIT, JPEG 2000, MPEG 4, MPEG 7, Packet video, H.264
Laboratory
Implementation in MATLAB or C
1.
2.
3.
4.
5.
Huffman, Arithmetic, LZW coding
Uniform quantization, Non-uniform quantization, Vector quantization
DPCM, Delta modulation
Wavelet image compression
Video compression, motion estimation and detection
21
References:
1. K. Sayood, “Introduction to Data Compression," Harcourt India Pvt. Ltd. & Morgan
Kaufmann Publishers, 1996.
2. N. Jayant and P. Noll, “Digital Coding of Waveforms: Principles and Applications to Speech
and Video,” Prentice Hall, USA, 1984.
3. D. Salomon,” Data Compression: The Complete Reference,” Springer, 2000.
4. Z. Li and M.S. Drew, “Fundamentals of Multimedia,” Pearson Education (Asia) Pte. Ltd.,
2004.
Course Outcomes:
1.
2.
3.
4.
5.
Explain the importance of data compression.
Code and decode text using Huffman, arithmetic and dictionary based methods.
Implement the image compression standards JPEG and JPEG 2000.
Implement audio compression schemes using predictive coding.
Implement different video compression standards
22
ADVANCES IN VLSI DESIGN
Subject Code: MDLEC05
Prerequisites: Digital Circuits
Credits: 4:0:1:0
Course Objectives:







Appreciate the importance of CMOS and BiCMOS technologies
Understand the operation of MESFET, MODFET, MIS Structure and MOSFET
Understand the various concepts like short channel effects and challenges in CMOS
Technology.
Discuss the importance of super buffer and steering logic
Discuss the evolutionary advances beyond CMOS.
Design digital circuit using pass transistor, NMOS/PMOS transistors.
Understand the concepts of structured design, regularity, modularity, locality, CMOS chip
design options, Programmable logic and Interconnects.
UNIT – 1
Review of MOS Circuits: MOS and CMOS static plots, switches, comparison between CMOS
and BI – CMOS, MESFETS: MESFET and MODFET operations, quantitative description of
MESFETS, MIS Structures and MOSFETS: MIS systems in equilibrium, under bias, small signal
operation of MESFETS and MOSFETS
UNIT – 2
Short Channel Effects and Challenges to CMOS: Short channel effects, scaling theory,
processing challenges to further CMOS miniaturization Beyond CMOS: Evolutionary advances
beyond CMOS, carbon nano tubes, conventional vs. tactile computing, computing, molecular
and biological computing Mole electronics-molecular diode and diode- diode logic, Defect
tolerant computing,
UNIT – 3
Super Buffers, Bi-CMOS and Steering Logic: Introduction, RC delay lines, super buffers- An
NMOS super buffer, tri state super buffer and pad drivers, CMOS super buffers, Dynamic ratio
less inverters, large capacitive loads, pass logic, designing of transistor logic, General functional
blocks - NMOS and CMOS functional blocks.
UNIT – 4
Special Circuit Layouts and Technology Mapping: Introduction, Talley circuits, NANDNAND, NOR- NOR, and AOI Logic, NMOS, CMOS Multiplexers, Barrel shifter, Wire routing and
module layout.
UNIT – 5
System Design: CMOS design methods, structured design methods, Strategies encompassing
hierarchy, regularity, modularity & locality, CMOS Chip design Options, programmable logic,
Programmable inter connect, programmable structure, Gate arrays standard cell approach, Full
custom Design.
References:
1. Kevin F Brenan “Introduction to Semi Conductor Devices”, Cambridge University Press,
First Edition, 2005.
23
2. Eugene D Fabricius “Introduction to VLSI Design”, McGraw-Hill International Publication,
1990.
3. D. A. Pucknell, K. Eshraghian, “Basic VLSI Design”, PHI, 1995.
4. Wayne Wolf, “Modern VLSI Design”, Pearson Education, Second Edition, 2002.
Course Outcomes:
1. Understand the fundamentals and operation of MESFET, MODFET, MIS structure and
MOSFET.
2. Design a digital circuit using CMOS logic such as Talley circuit, NAND-NAND, NOR-NOR,
AOI Logic
3. Understand the concept of RC dealy lines, super buffers, Large Capacitive Loads with
respect to CMOS VLSI.
4. Analyze performance issues and the inherent trade-offs involved in system design (i.e.
power vs. speed).
5. Able to explain the concept of Carbon Nanotubes, Molecular and Biological Computing,
Defect Tolerant Computing, Programmable Logic
24
MICRO AND SMART SYSTEMS TECHNOLOGY
Subject Code: MDLCE06
Prerequisites: Solid State Devices and Technology
Credits: 4:0:1:0
Course Objectives:










Learn about basics and typical applications of microsystems
Illustrate scaling laws
Appraise the principles of microsensors and microactuators
Illustrate the various principles of operations of mems transducers
Analyze coupled domain aspects
Learn basic electrostatics and its applications in MEMS sensors and actuators
Categorize different RF MEMS applications
Familiarize oneself with atleast one MEMS CAD tool
Learn about ways to fabricate a MEMS device
Appraise the packaging needs for a MEMS device
UNIT – I
Introduction to MEMS: Historical background of Micro Electro Mechanical Systems, Feynman’s
vision, Multi-disciplinary aspects, Application areas, Scaling Laws in miniaturization, scaling in
geometry, electrostatics, electromagnetic, electricity and heat transfer.
UNIT – II
Micro and Smart Devices and Systems: Principles and Materials: Transduction Principles
in MEMS Sensors: Microsensors – thermal, radiation, mechanical, magnetic and bio-sensors,
Actuators: Different actuation mechanisms - silicon capacitive accelerometer, piezo-resistive
pressure sensor, blood analyzer, conductometric gas sensor, silicon micro-mirror arrays, piezoelectric based inkjet print head, electrostatic comb-drive and magnetic micro relay, portable
clinical analyzer, active noise control.
UNIT – III
Mechanical Concepts: Mechanical concepts, stress and strain, Flexural beam bending analysis
under Simple loading conditions analysis of beams under simple loading, torsional deflections,
residual stresses and stress gradient Resonant frequency and quality factor, Coupled domain
concepts.
UNIT – IV
Electrical and Electronics aspects: Electrostatics, Coupled Electro mechanics, stability and
Pull-in phenomenon, Practical signal conditioning Circuits for Microsystems, RF MEMS Switches,
varactors, phased arrays, tuned filters. Micromirror array for control and switching in optical
communication, Modeling using CAD Tools (Intellisuite).
UNIT – V
Micromanufacturing and Material Processing: Silicon wafer processing, lithography, thinfilm deposition, etching (wet and dry), wafer-bonding, and metallization, Silicon
micromachining: surface, bulk, LIGA process, bonding based process flows.
Integration and Packaging of Microelectromechanical Systems: Integration of
microelectronics and micro devices at wafer and chip levels, Microelectronic packaging: wire and
ball bonding, flip-chip, Microsystem packaging examples.
25
References:
1. G. K. Ananthasuresh, K. J. Vinoy, S. Gopalakrishnan, K. N. Bhat, V. K. Aatre, “Micro and
Smart Systems”, Wiley India, 2010.
2. T R Hsu, “MEMS and Microsystems Design and Manufacturing”, Tata McGraw Hill, 2 nd
Edition, 2008.
3. Chang Liu, “Foundations of MEMS”, Pearson International Edition, 2006.
4. S. D. Senturia, “Micro System Design”, Springer International Edition, 2001.
26
ADVANCED EMBEDDED SYSTEMS
Subject Code: MDLCE07
Prerequisites: Nil
Credits: 4:0:1:0
Course Objectives:












Learn the basic building blocks of a typical embedded system
Differentiate between MP, MC, RISC and CISC Processors, Harvard and Von Neumann
Processor Architecture, Big- Endian and Little- Endian type of Memory Organization
Learn about different Memory types - ROM, PROM, EEPROM, FLASH
Understand the basic role of sensors and actuators
Explain the different communication interfaces like I2C, SPI, UART, 1-Wire, Parallel Bus
Describe the different embedded system components like Reset circuit, Brown out
Protection, RTC and WDT
Appreciate the characteristics and the important quality attributes of the
embedded
system
Learn about the hardware and software Co-Design approach for embedded system
development
Understand the different computational models used in embedded system design
Explain different design approaches and languages for embedded firmware development
Appreciate the Architectural Features of advanced microcontroller MSP 430
Describe different on chip Peripheral/Functional units in MSP 430 like Timers, Comparator,
ADC and DAC
UNIT – I
Introduction to Typical Embedded System : Embedded systems vs general computers,
History of embedded systems, Classification of embedded systems, Application areas of ES,
Typical Embedded System: Core of the embedded system, µP vs µC, RISC vs CISC, Harvard
vs Von-Neumann processor architecture, Big Endian vs Little Endian processors / Controller load
store operation and instruction pipelining, Application Specific Integrated Circuits,
Programmable Logic Devices, Memory ROM, Masked ROM, PROM / OTP, EEPROM, FLASH, RAM:
SRAM, DRAM, NVRAM, Memory selection for ES, Sensors and Actuators: The I/O Subsystem
LED, 7-segment LED display, Opto couplers, Stepper Motor, Relay, Piezo Buzzer, Push button
switch, keyboard, Programmable Peripheral Interface (PPI) , Communication Interface: On
board communication interfaces: I2C Bus, SPI Bus, UART, 1-Wire Interface, Parallel Interface,
External Communication Interfaces: RS232C and RS485, USB, IEEE 1394 (Fire Wire). Infra-Red
(IrDA), Blue Tooth, Wifi, Zigbee, General Packet Radio Service
Embedded Firmware, Other embedded system components; Reset, Brown out protection circuit,
Oscillator unit, Real Time Click (RTC), Watch Dog Timer, Characteristics of an embedded
system, Quality attributes of an embedded system
UNIT – II
Embedded Systems – Application and Domain Specific: Washing Machine – Application
specific ES, Automotive – Domain specific examples of ES, Automotive communication buses:
CAN Bus, Local Interconnect Network (LIN) Bus, Media Oriented System Transport (MOST) Bus
Hardware Software Co-Design and Program Modeling: Fundamental issues in the H/W,
S/W Co-Design Computational models in the embedded design: Data Flow-Graph/Diagram
(DFG) Model, Control Data Flow Graph / Diagram (CDFG), State machine model with examples.
Sequential program model, concurrent/communicating process model, unified modeling
language (WML) UML building blocks, UML Tools, Hardware and Software trade-offs, typical
embedded product design and development approach
27
UNIT – III
Embedded Firmware Design and Development: Embedded firmware design approaches, Super
loop based approaches, Embedded O/S based approach, Embedded firmware development
languages, Assembly language based development, High level language based development,
Programming in embedded-C, Embedded system development environment
Embedded System Development Environment: Integrated development environment (IDE),
Overview of IDE’s for ES development, types of files generated on cross compilation,
Disassembler / Decomplier, Simulators, Emulator, and Debugging, Target Hardware Debugging,
Boundary Scan
UNIT – IV
Introduction to TI MSP 430 and its Architecture: Functional block diagram of
MSP430F2003 pin-out configuration, Memory, CPU, Addressing Modes, Constant generator and
embedded instructions, Instruction set, Examples, Clock System, Digitally controlled oscillator,
Interrupts and Low power model, Interrupt service Routines (ISRs), Low power model of
operation
UNIT – V
Digital Input, Output and Displays: Digital Input and Output: Parallel Ports, Digital Inputs,
Digital Outputs, Liquid Crystal Displays, Timers: Watch Dog Timer, basic Timer_1, Timer_A,
Measurement in the Captane Mode
Mixed Signal Systems: Analog Input and Output: Comparator_A, Analog to Digital
Conversion. General issues, ADC 10 Successive Approximation Amplifiers, Internal Operational
Amplifiers, Digital to Analog Conversion
List of Experiments
1. Interfacing MSP430 Board to PC and HyperTerminal
2. LED Blinking
3. 7-Segment Display, Display Alpha-Numeric Characters
4. Scrolling Display
5. Up/Down Counter
6. Stepper Motor Interface with Sensors
7. Pressure Sensor Interface
8. Accelerometer Interface
9. Temperature Sensor Interface
10. Interface with an External Color LCD Display(Graphic Display)
11. Keyboard Interface
12. Use of Interrupts through Push Button Switch
13. Wireless Connectivity using NORDIC NRF24L01-Wireless Transceiver
References:
1. Shibu. K. V. “Introduction to Embedded Systems”, Tata McGraw Hill Education Private Ltd.
2009.
2. John H. Davies, “MSP430 Microcontroller Basics”, Elsevier Ltd., 2008.
3. Rajkamal, “Embedded Systems, Architecture, Programming and Design”, Tata McGraw
Hill Education Pvt., Ltd., 2009
4. Frank Vahid, Tony Givargis, “Embedded System Design - A Unified Hardware/ Software
Introduction”, John Wiley & Sons, 2002
28
Course Outcomes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
Explain building blocks of a typical embedded system
Describe different memory types
Appreciate different communication interfaces like I2C, SPI, UART etc,
Understand embedded hardware and software co-design
Learn computational models like data flow graph/diagram (DFG) Model, control data
flow graph/diagram (CDFG), state machine model used in embedded system design
Describe different approaches for embedded system firmware design
Explain architectural features and the pin configuration of MSP 430F2003, instruction set and other
advanced features.
Understand digital inputs outputs, ports, timers, WDT,
Describe mixed signal mode of operation and use of comparator, ADC and DAC
Use Vision version 3 / Code Composer Studio IDE for embedded software development, simulation
and debugging
Use different types of files like List File, Object File, Hex File etc.
29
IMAGE AND VIDEO PROCESSING
Subject Code: MDLCE08
Prerequisites: Signal Processing
Credits: 4:0:1:0
Course Objectives:






Review the basics of two dimensional signal processing
Interpret two dimensional sampling theory, quantization and convolution
Distinguish between different image enhancement algorithms
Appraise 2-D filtering and image restoration
Study different feature extraction and pattern classification methods
Illustrate basics of digital video
UNIT – I
Introduction to 2D systems: 2D systems, Mathematical preliminaries – Fourier Transform, Z
Transform, Optical & Modulation transfer function, Matrix theory, Random signals, Discrete
Random fields, Spectral density function, 2D sampling theory, Limitations in sampling &
reconstruction, Quantization, Optimal quantizer, Compander, Visual quantization.
UNIT – II
Image Transforms: Introduction, 2D orthogonal & unitary transforms, Properties of unitary
transforms, DFT, DCT, DST, Hadamard, Haar, Slant, KLT, SVD transform.
UNIT – III
Image Enhancement: Point operations, Histogram modeling, spatial operations, Transform
operations, Multi-spectral image enhancement, false color and Pseudo-color, Color Image
enhancement.
UNIT – IV
Image
Filtering and Restoration: Image observation models, Inverse & Wiener filtering,
Fourier Domain filters, Smoothing splines and interpolation, Least squares filters, generalized
inverse, SVD and Iterative methods, Maximum entropy restoration, Bayesian methods,
Coordinate transformation & geometric correction, Blind de-convolution.
UNIT – V
Image Analysis, Computer Vision and Video Processing: Spatial feature extraction,
Transform features, Edge detection, Boundary Extraction, Boundary representation, Region
representation, Moment representation, Structure, Shape features, Texture, Scene matching &
detection, Image segmentation, Classification Techniques. Representation of Digital Video –
Analog and digital video, Models for time-varying images, time-space sampling, conversion
between sampling structures.
Laboratory
Implementation in MATLAB
1. Image Sampling and Quantization.
2. Contrast enhancement, Histogram equalization, Histogram specification, Edge detection.
3. Image filtering- LPF, HPF, BPF and Transforms.
4. Reading, displaying and processing video.
5. Background subtraction, motion detection
6. Content based image retrieval, Object classification and tracking
30
References:
1. A. K. Jain, “Fundamentals of Digital Image Processing," Pearson Education (Asia) Pte.
Ltd./Prentice Hall of India, 2004.
2. M. Sonka, V. Hlavac, R. Boyle, “Image Processing, Analysis and Machine Vision,” Third
Edition, Thomson – Brooks Cole, 1999.
3. Z. Li and M.S. Drew, “Fundamentals of Multimedia,” Pearson Education (Asia) Pte. Ltd.,
2004.
4. R. C. Gonzalez and R. E. Woods, “Digital Image Processing,” 3rd edition, Pearson Education
(Asia) Pte. Ltd/Prentice Hall of India, 2009.
5. William K. Pratt, “Digital Image Processing,” Wiley Interscience, 2007.
6. M. Tekalp, “Digital Video Processing,” Prentice Hall, USA, 1995.
Course Outcomes:
1.
2.
3.
4.
5.
6.
Analyze the effect of sampling and quantization on an N x N image
Apply and compare various image enhancement techniques on an image
Design a face recognition system using K-L transform
Develop motion detection based security monitoring system
Employ K means algorithm to segment a given image
Implement a character recognition system
31
ARM PROCESSORS
Subject Code: MDLCE09
Prerequisites: Nil
Credits: 4:0:1:0
Course Objectives:






Apprehend the ARM design philosophy, design rules, ARM based embedded system
hardware and software components
Demonstrate the ARM processor core fundamentals, ARM data flow diagram, register
organization, Program Status Register, ARM Processor modes, Pipeline architecture, IVT,
ARM processor families, various ISAs
Apprehend and use ARM instruction set classes, data processing, branch, load – store
Instructions, SWI, PSR instructions, ARM V5E ISA extensions
Implement ARM Thumb Instruction Set, ARM – Thumb Interworking, Load – Store
operations, Stack operations
Appraise exceptions and interrupt handling Schemes and different types of interrupt
handlers
Illustrate the firmware for ARM Systems, Boot Loader, ARM Firmware suite, Red hat Red
boot, Sand stone Directory and Code structure
UNIT – I
ARM Embedded Systems: Introduction to ARM Processors, RISC Design philosophy, RISC
and CISC architectures, ARM Design philosophy, ARM Instruction Set features for Embedded
Systems, Embedded
System Hardware, Example of an ARM – based Embedded Micro
controller, ARM Bus Technology, AMBA Bus Protocol, Memory Hierarchy, Memory width and
Types, Peripherals: Memory controllers, interrupt controllers, Embedded System Software,
Initialization Code, Operating System, Applications.
UNIT – II
ARM Processor Fundamentals: ARM Processor core Dataflow Model, Registers, Current
Program Status Register, Processor Modes, Banked Registers, ARM and Thumb States,
Instruction Set features, Interrupt Masks, Condition Flags, Conditional Execution, Pipe Line
mechanism, Pipe Line Execution Characteristics, Exceptions, Interrupts and the Vector Table,
Core Extensions, Cache and Tightly Coupled Memory, Memory Management, Coprocessors,
ARM architecture Revisions, ARM Nomenclature, ARM Processor Families, ARM 7, ARM 9, ARM
10, ARM 11 Families and their attributes, Specialized Processors.
UNIT – III
Introduction to the ARM Instruction Set: ARM Instruction Set Mnemonics, Syntax and their
description, ARM Instruction Classes, Data Processing Instructions, MOVE Instructions, Barrel
Shifter, Barrel Shifter Operations, Arithmetic Instructions, Logical Instructions, Comparison and
Test Instructions, Multiply Instructions, Branch Instructions, Load – Store Instructions, Single –
Register Transfer, Single – Register Load – Store Addressing Modes, Multiple - Register
Transfer, Examples, Stack Operations, Addressing Modes for Stack Operations, Swap
Instruction, Software Interrupt Instruction, PSR - Instructions, Coprocessor Instructions,
Coprocessor - 15 Instruction Syntax, Loading Constants, ARM V5E Extensions, Count Leading
Zeros Instruction, Saturated Arithmetic, ARM V5E Multiply Instructions, Conditional Execution.
32
UNIT – IV
Introduction to the THUMB Instruction Set: Thumb Instruction Set Mnemonics, Thumb
Register usage, ARM – THUMB Interworking, Branch Instructions, Data Processing Instructions,
Single – Register Load – Store Instructions, Multiple - Register Load – Store Instructions, Stack
- Instructions, Software Interrupt Instruction.
UNIT – V
Exception and Interrupt Handling: Exception Handling, ARM Processor Exceptions and
Modes, Exception Priorities, Link Register Offsets, Interrupts, Interrupt Latency, IRQ AND FIQ
Exceptions, Basic Interrupt Stack Design and Implementation, Interrupt Handling Schemes, Non
nested Interrupt Handler, Non nested Interrupt Handler.
Firmware for ARM based embedded systems: Firmware and Boot Loader, ARM Firmware
Suite, Red Hat Red Boot, Example: Sand Stone, Sand Stone Directory Lay out, Code Structure.
Laboratory
1. What is the maximum size of the immediate value that can be specified in the MOVS Rd, N
Instruction when it uses immediate addressing mode for ‘N’.
2. How do you load a 32 bit constant (Immediate value) into a register R0 using ARM
instructions.
3. Write ARM program / Instructions
a. To reverse the 32 bit data stored in a memory location X and store the result at
memory location Y.
b. To count leading zeros in a 32 bit data.
c. To count leading one’s in a 32 bit data.
d. To count trailing zero’s and
e. To count trailing one’s.
4. Implement the following operations using ARM Instructions.
a. Increment a Register.
b. Decrement a Register.
c. To obtain one’s complement.
d. To obtain 2’s complement.
e. To clear all the flags and to SET Interrupt masks in CPSR.
f. Call Function.
g. Return Function.
h. To switch the Processor state from ARM state to Java state.
5. Transfer 40 bytes from memory location starting from X to memory location starting from Y.
6. Program for
a. Multiplication of 2, 32 bit unsigned numbers to obtain 32 bit result.
b. Multiplication of 2, 32 bit unsigned numbers to obtain 64 bit result.
7. Program for multiplication of 2, 32 bit signed numbers to obtain 64 bit result.
8. 64 bit result of 0XFFFFFFFF x 0XFFFFFFFF using signed multiplication and unsigned
multiplication.
References:
1. Andrew N. Sloss, Dominic Symes, Chris Wright, “ARM System Developer’s Guide –
Designing and Optimizing System Software”, Morgan Kaufmann, 2004.
2. ARM Architecture Reference Manual
Course Outcomes:
1. Distinguish between the CISC and RISC architectures of processors
2. Describe and highlight the ARM design philosophy and design rules
3. Identify and describe the functions of ARM embedded hardware and software components
33
4. Describe and justify the ARM Instruction Set features, Instruction Execution/Data flow
diagram, Register banks, and Program Status Register format
5. Describe the ARM Nomenclature and identify the various ARM processor families, their ISA
and architecture features
6. Distinguish between various ARM Instruction classes and write ARM assembly instruction
formats
7. Identify and use ARM instructions for writing assembly level programs
8. Implement, analyze and debug ARM assembly level programs
9. Describe and analyze Thumb Instruction set formats, Thumb Instructions and their usage,
and write Thumb Instruction programs
10. Develop the awareness about the exception and interrupt handling schemes and different
types of Interrupt Handlers, and Firmware for ARM Systems
34
CMOS VLSI DESIGN
Subject Code: MDLCE10
Prerequisites: Nil
Credits: 4:0:1:0
Course Objectives:






Understand the fundamental concepts of modern CMOS VLSI design.
Learn the design of complex and high performance CMOS systems from system level to
circuit level.
Describe IC fabrication process
Analyze and design CMOS digital gates at the transistor level
Understand various concepts like interconnect, Propagation delay or power in digital CMOS
circuits.
Design medium complexity digital CMOS circuits.
UNIT – 1
MOS Transistor Theory: nMOS/ pMOS transistor, Threshold voltage equation, Body effect,
MOS Device design equation, Subthreshold region, Channel Length modulation, mobility
variation, Tunneling, Punch Through, Hot electron effect, MOS models, small signal AC
characteristics,, CMOS Inverter, βn/βp ratio, noise margin, static load MOS inverters, differential
inverter, Transmission gate, Tristate Inverter, BiCMOS inverter
UNIT – 2
CMOS Process Technology: Lambda Based Design rules, scaling factor, Semiconductor
Technology Overview, Basic CMOS Technology, p well/n well/twin well process, Current CMOS
enhancement (oxide isolation, LDD, Refractory gate, multilayer interconnect, circuit elements,
resistor, capacitor, interconnects, sheet resistance and standard unit capacitance concepts,
delay unit time, Inverter delays, Driving capacitive loads, Propagate delays, MOS Mask layer,
stick diagram, design rules and layout, symbolic diagram, mask feints, scaling of MOS Circuits.
UNIT – 3
Basics of Digital CMOS Design: Combinational MOS logic circuits-introduction, CMOS Logic
circuits with MOS load, CMOS Logic circuits, Complex Logic circuits, Transmission Gate,
Sequential MOS Logic circuits-Introduction, Behavior of bistable elements, SR Latch circuit,
clocked latch and Flip flop circuits, CMOS D Latch and triggered Flip flop, Dynamic Logic circuits:
Introduction, Principles of pass transistor circuits, voltage bootstrapping, synchronous dynamic
circuits techniques, Dynamic CMOS circuit techniques
UNIT – 4
CMOS Analog Design: Introduction, Single amplifier, differential amplifier, Current mirror,
Bandgap References, cross operational amplifier
UNIT – 5
Dynamic CMOS and Clocking: Introduction, advantages of CMOS over NMOS, CMOS/SOS
Technology, CMOS/Bulk Technology, Latch up in bulk CMOS, Static CMOS Design, Domino
CMOS structure and design, charge sharing, clocking-clock generation, clock distribution,
clocked storage elements
References:
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1. Neil Weste and K Eshragian, “Principles of CMOS VLSI Design: A system perspective”, 2nd
edition, Pearson Education (Asia) Pvt Ltd, 2000.
2. Wayne Wolf, “Modern VLSI design: system on silicon”, Pearson Education, 2nd edition, 1998.
3. Douglas A Pucknell, Kamran Eshragian, “Basic VLSI Design”, PHI 3rd Edition, 1994
4. Sung Mo Kang & Yosuf Leblebici, “CMOS Digital Integrated Circuits: Analysis and Design”,
McGraw-Hill, Third Edition, 2002.
5. Behzad Razavi, “Design of Analog CMOS Integrated Circuits”, TMH, 2007.
Course Outcomes:
1. Analyze the CMOS layout levels, how the design layers are used in the process sequence,
and resulting device structures
2. Implement digital logic designs of various types (i.e. combinational logic and sequential
logic).
3. Analyze performance issues and the inherent trade-offs involved in system design (i.e.
power vs. speed).
4. Complete a moderately complex design project involved with data path operators, data
registers, serial/parallel conversion, clocking/timing details and feedback.
5. Identify the interactions between process parameters, device
structures, circuit
performance, and system design
6. Able to explain the purpose and applications of CMOS technology
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ASIC DESIGN
Subject Code: MDLCE11
Prerequisites: Nil
Credits: 4:0:1:0
Course Objectives:






Be productive members of an industrial ASIC design team
Implement projects involving digital circuits using ASIC techniques and synthesis
Understand ASIC life cycle
Develop team work skills
Discuss full custom, and Semi-custom design using ASIC flow
Understand the concept of ASIC construction, floor planning and placement and routing
UNIT – 1
Introduction: Full custom with ASIC, Semi custom ASIC’s, standard cell based ASIC, Gate
array based ASIC, channeled gate array, channel less gate array, structured gate array,
Programmable logic device, FPGA Design Flow, ASIC cell libraries
UNIT – 2
Data Logic Cells: Data path elements, Adders, Multipliers, Arithmetic operators, I/O Cell, Cell
compilers
ASIC Library Design: Logical effort, practicing delay, logical area and logical efficiency, logical
paths, multi stage cells, optimum delay, optimum no of stages, library cell design
UNIT – 3
Low Level Design Entry: Schematic entry, Hierarchical design, cell library, Names, Schematic,
Icons and symbols, Nets, Schematic entry for ASIC’S, Connections, vectored instances and
buses, edit in place attributes, Netlist, screener, Back annotation
UNIT – 4
Programmable ASIC: Programmable ASIC logic cell, ASIC I/O cell.
Brief Introduction to Low Level Design Language: An introduction to EDIF, PLA Tools, an
introduction to CFI design representation, Half gate ASIC, Introduction to synthesis and
simulation.
UNIT – 5
ASIC Construction Floor Planning and Placement and Routing: Physical Design, CAD
Tools, System Partitioning, Estimating ASIC Size, Partitioning methods, Floor Planning Tools,
I/O and power planning, clock planning, Placement algorithms, iterative placement
improvement, Time driven placement methods, Physical Design flow global routing, local
routing, Detail routing, Special routing, circuit extraction and DRC
References:
1. M J S Smith, “Application Specific Integrated Circuits”, Pearson Education, 2003.
2. Jose E France, Yannis Tsividis, “Design of Analog–Digital VLSI Circuits for
Telecommunication and Signal processing”, Prentice Hall, 1994.
3. Malcolm R Haskard, Lan C May, “Analog VLSI Design – NMOS and CMOS”, Prentice Hall,
1998.
4. Mohammed Ismail and Terri Fiez, “Analog VLSI Signal and Information Processing”,
McGraw Hill, 1994.
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Course Outcomes:
1. Practice and demonstrate critical thinking
2. Understand the requirements and translate them to high level design language
3. Understand the capabilities and limitations of CMOS logic and adjust designs to best use
CMOS ASIC Technologies
4. Demonstrate common ASIC team rules and articulate the purpose of such rules
5. Demonstrate an ability to use industry synthesis tools to achieve desired project objectives
6. Demonstrate an understanding of module interfaces, pipelining, design for test, and test
pattern generation
7. Modify designs to achieve performance objectives.
8. Perform an ASIC design from requirements to timing verification.
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RF AND MICROWAVE CIRCUIT DESIGN
Subject Code: MDLCE12
Prerequisites: Nil
Credits: 4:1:0:0
Course Objectives:




Familiarize with RF and Microwaves easily and effectively.
Understand the RF and Microwave concepts and their applications.
Strengthen knowledge about characterization of two-port networks at RF and microwaves
using S-parameters
Design simple RF and Microwave Integrated Circuits.
UNIT – I
Wave Propagation in Networks: Introduction to RF/Microwave concepts and applications, RF
electronics concepts, Fundamental concepts in wave propagation, circuit representations of two
port RF/MW networks
UNIT – II
Passive Circuit Design: The Smith Chart, Application of the Smith Chart in distributed and
lumped element circuit applications, Design of matching networks.
UNIT – III
Basic Considerations in Active Networks: Stability consideration in active networks, gain
considerations in amplifiers, noise considerations in active networks.
UNIT – IV
Active Networks: Linear and nonlinear design: RF/MW Amplifiers Small Signal Design, Large
Signal Design, RF/MW Oscillator Design
UNIT – V
Active Networks: RF/MW Frequency Conversion: Rectifier and Detector Design, Mixer Design,
RF/MW Control Circuit Design, RF/MW Integrated circuit design.
References:
1. Matthew M. Radmanesh, “Radio Frequency and Microwave Electronics Illustrated”,
Pearson Education (Asia) Pvt. Ltd., 2004.
2. Reinhold Ludwig and Pavel Bretchko, “RF Circuit Design: Theory and Applications”,
Pearson Education (Asia) Pvt Ltd., 2004.
Course Outcomes:
1. Derive and discuss RF and Microwave active circuit concepts such as amplifiers, oscillators
etc.
2. Apply the RF and Microwave concepts in the design of frequency converters, matching
networks, distributed and lumped element circuit applications.
3. Familiarize with the use of the Smith Chart to simplify analysis of complex design
problems
4. Understand the concepts of control circuits in RF and microwave systems
5. Discuss linear and non-linear small-signal and large-signal amplifier design and RF/MW
oscillator design
6. Analyze RF and Microwave Integrated Circuits with reference to Frequency Conversion,
Rectifier and Detector, Circulators, Gyrators and Isolators.
7. Understand the novel use of “Live Math” in RF/MW circuit analysis and design.
39
OPTICAL COMMUNICATION AND NETWORKING
Subject Code: MDLCE13
Prerequisites: Nil
Credits: 4:1:0:0
Course Objectives:






Learn the basic elements of optical fiber propagation and components
Understand the different modulation and demodulation techniques
communication
Learn the various transmitter and receiver models
Describe different optical layers
Learn the basic WDM network elements
Study the various network management and management frameworks
for
optical
UNIT - I
Introduction: Propagation of signals in optical fiber, different losses, nonlinear effects,
solitons, optical sources, detectors.
Optical Components: Couplers,
interferometers, amplifiers.
isolators,
circulators,
multiplexers,
filters,
gratings,
UNIT - II
Modulation — Demodulation: Formats, ideal receivers, Practical detection receivers, Optical
preamplifier, Noise considerations, Bit error rates, Coherent detection.
UNIT – III
Transmission System Engineering: System model, Power Penalty, Transmitter, Receiver,
Different optical amplifiers, Dispersion.
Optical Networks: Client layers of optical layer, SONET/SDH, multiplexing, layers, frame
structure, ATM functions, adaptation layers, Quality of service and flow control, ESCON, HIPPI.
UNIT – IV
WDM Network Elements: Optical line terminal optical line amplifiers, optical cross connectors,
WDM network design, cost trade offs, LTD and RWA problems, Routing and wavelength
assignment, wavelength conversion, statistical dimensioning model.
UNIT – V
Control and Management: Network management functions, management frame work,
Information model, management protocols, layers within optical layer performance and fault
management, impact of transparency, BER measurement, optical trace, Alarm management,
configuration management.
REFERENCES:
1.
2.
3.
4.
Rajiv Ramaswami, Kumar N Sivarajan, “Optical Networks”, M. Kauffman Publishers, 2000.
John M. Senior, “Optical Fiber Communications”, Pearson Edition, 2000.
Gerd Keiser, “Optical Fiber Communication”, MGH, 1991.
G. P. Agarawal, “Fiber Optics Communication Systems”, John Wiley, New York, 1997
40
5. P. E. Green, “Optical Networks”, Prentice Hall, 1994.
Course Outcomes:
1. Identify the main parameters of optical fibre communication, and the performance of
optical communications systems.
2. Analyse the equations that explain the modulation of an optical carrier.
3. Determine the various parameters of an optical transmitter and receiver.
4. Identify the different type of networking configurations that may be used in an optical
network and analyse how component selection effects network design
5. Design a basic optical communication system and analyse how its performance would be
affected by the various components used in the system design.
6. Implement a wavelength division multiplexed systems and formulate how altering the
parameters of the components used would change system capacity.
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