RIETI-METI-NEDO-AIST Symposium
"R&D Partnership under the Globalized Economy - Our Experience and the Future"
September 3, 2007
Challenges to “Eco-Innovation”
- Energy Saving and Beyond -
Michiharu Nakamura, Ph.D.
Fellow, Hitachi, Ltd.
Copyright
Copyright ©
© Hitachi,
Hitachi, Ltd.
Ltd. 2007.
2007. All
All Rights
Rights Reserved
Reserved
1
1. Energy Demand
and Energy Saving Policy
Copyright © Hitachi, Ltd. 2007. All Rights Reserved
1-1
Projection of Energy Demand
Middle
East
Asia
Latin
America
China
10,000
CIS*
5,000
0
1971
OECD
(Exc. Japan &
Korea)
2002 2010 2020
Transport
Industry
20,000
Power
Sector
10,000
2000
Energy Consumption of ICT in Japan
100
India
China
2000
w/o Energy Saving
80
60
40
with
Energy Saving
20
East Asia
0
0
1997
2010
(IEA/ World Energy Outlook 2004)
2020
2030
(IEA/ World Energy Outlook 2004)
(IEA/World Energy Outlook 2004)
South Asia
Residential
& Services
30,000
0
2030
Primary Energy Demand in Asia
4000
Other
40,000
CO2 Emission
MTon
15,000
Commonwealth of
Independent States
MToe
＊
Africa
Sectoral World CO2 Emission
TWh
Mega Ton of Oil Equivalent
World Primary Energy Demand
2000
2010
(MITSUI Knowledge Industry “ Research on the Evaluation of IT Influence
on Earth Environment” ( in Japanese) (2002))
Copyright © Hitachi, Ltd. 2007. All Rights Reserved
1-2
Innovation Stages of Japanese Electronics Industry
1950
1960
1970
1980
1990
Infant Age
2010
2020
9 Encouraging industryacademia-cooperation
9 Global Alliances in R&D
9 Upbringing of a talented
person of science and
technology
Technology
Introduction
Age
9 Transistors
9 Computers
9 Nuclear Power etc.
2000
Golden Age
Restructuring
Age
9 Domestic computers
Global &
9 Golden age of electronics research
Collaboration
Semiconductor ; Si,Compound,Amorphous
Age
Storage Device ; Magnetic,Optical 9 Turning point of MOT
Imaging Device : MOS,CCD
Death Valley
Poor technical strategy
for global competition
zThe Agency of Industrial Science & Technologies
Governmental
Activities
zThe Science & Technology Agency
zThe Council Science & Technology
zScience and Technology Basic Law
zJapanese Bayh-Dole Act
zCouncil for Science
and Technology Policy
Copyright © Hitachi, Ltd. 2007. All Rights Reserved
1-3
Eco-Innovation
Energy Saving Policy by METI
Sector
Challenges
Industry ・Super-combustion Technology
Consumer
・Energy-saving House Structure
・Energy-saving Equipments
Transport ・Intelligent Transport Systems
Common ・Power Devices for Automobiles
/ Basic
& Information Appliances
Energy Saving Action Plans
of Japanese Industries
Industry
Iron &
Steel
State-of-the-art
Energy-saving &
Eco-Innovation
Green
Technology -- Energy
Energy Saving
Saving &
& Beyond
Beyond --
Targets
･10% energy saving
in manufacturing processes
Chemical ･･10% reduction of energy
consumption rate
Paper
Cement
･Energy saving to the utmost
Electric
Power
･20% reduction
of CO2 emission rate
( 1997 ‘Nippon Keidanren’, i.e. Japan Business Federation)
Knowledge-based innovation
„ Multi-disciplinary technologies
„ Linkage of technologies and
art / social sciences
„
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1-4
Promotion for Eco-Innovation
(1) Sustainable Manufacturing
9 Maximizing resource recycling
9 Multi-step energy utilization
9 Developing substitute materials for rare metals
(2) Zero Emission Type Social Infrastructure
9 Super-efficient energy supply system
（Power Generation and Energy Storage)
9 Super-efficient energy transport system
(3) Sustainable Living
9 Renovation for rationale of environmental values
(4) Human-centric Innovations
9 KANSEI (Sensibility) and technology assimilation
(5) Software Tools for Eco-Innovations
9 e.g. Visualizing environmental loads through
whole supply chain
Comprehensive
Comprehensive Promotion
Promotion
by
by Government
Government
(toward
(toward 2025)
2025)
¾ Developments of
Novel Technologies
¾ Promotion of Their
Product Applications
¾ System Modification
e.g. Regulation &
Deregulation
(6) Global Collaboration
9 Innovation Roadmap, collaborative development
Copyright © Hitachi, Ltd. 2007. All Rights Reserved
1-5 Strategic Technologies in Energy Field
Reproduced from Roadmap of METI
Power Generation and Energy Storage
9 High Temperature Gas Turbine
9 A-PFBC (Advanced Pressurized Fluidized Bed Combustion Combined Cycle)
9 AHAT (Advanced Humid Air Turbine)
9 A-USC (Advanced Ultra Supercritical Steam Turbine)
9 IGCC (Integrated Coal Gasification Combined Cycle)
9 Lithium Ion Battery
9 Fuel Cell: SOFC (Solid Oxide Fuel Cell) / PEFC (Polymer Electrolyte Fuel Cell)
Energy Saving
9 Micro Plant System
9 Information Equipment & System: Multi Processor / Sever / Network / Storage
9 High Efficiency Heat Pump
9 High Efficiency Lighting: LED / Organic EL
9 Hybrid & Electric Vehicle / FC Vehicle
9 Highly Insulated Airtight House and Building
9 Device: SiC / Spintronics / 3D-Device / Low Power HDD / Flexible Display
Copyright © Hitachi, Ltd. 2007. All Rights Reserved
2
2. New Challenges in Power Generation
& Energy Storage
Copyright © Hitachi, Ltd. 2007. All Rights Reserved
Generating Efficiency (%)
2-1
40
Micro Gas Turbine (MGT)
Humid Air:150 kW, Over 35%
Exhaust
Humidification Device
Combustor Intake
Dry Air:135 kW,34%
30
Regenerated
Heat Exchanger
First Generation MGT
20
10
100
Power（ｋW）
1000
Feature
Utilizing of Humid Air(HAT*& WAC**)
Application of Water-lubricated Bearing
(World First in Gas Turbine)
Generator
Turbine
３ｍ
Pilot Unit
Supported by NEDO
*HAT: Humid Air Turbine **WAC: Water Atomizing Inlet Air Cooling
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2-2
Class 700 ℃ A-USC* Plant System
*A-USC:Advanced Ultra Supercritical
Life Cycle CO2 Emission (g/kWh)
A
-USC Plant
A-USC
Plant System
System
CO
CO22 Reduction
Reduction
20%
25%
Reduction Reduction
1000
Boiler
High Temperature
High Pressure
Feed
Pump
Turbine
Condenser
A-USC Plant has the same System as that
of Existing Coal Fired Plant
Steam
Conditions
:
High Temperature
600 ℃→700 ℃
High Pressure
25 MPa→35 MPa
High Efficiency
40%→46%
Challenges
■Critical Design for Steam Conditions
■Heat/Pressure-resistant Materials
(Ni-base Superalloys)
CH４ Leak
CO２ Direct Emission
CO２ Indirect Emission
800
600
400
200
0
Existing
Coal Fired
Plant
A-USC A-USC Heavy Oil Crude Oil
10% Biomass Fired
Fired
Multi Fuel Plant
Plant
20-25% reduction of Existing Coal Fired Plant
Comparable to Oil-fired Plant
Energy
Energy Saving
Saving
(All Coal-fired Plants in Japan → A-USC Plants)
Reduction of 680,000 kl/year
Oil Equivalent in 2030
Supported by NEDO
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Applications of Li-ion Battery
2-3
Today
Notebook PC
Electric
Power Tool
Courtesy of East Japan Railway Company
copyright 2007 East Japan Railway Company
Cell-phone
Consumer
Products
Ensuring of Safety
& Reliability
Diesel Hybrid Train
Transportation
Emergency Power Source for
Wireless Base Station →
Large-scale Power Storage/
Electric-load Leveling
Energy Storage System for
Smoothing Grid Integration →
Plug-in Hybrid
Motor Vehicle
Supported by NEDO
Near Future
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2-4
SOFC* Co-generation System
*SOFC: Solid Oxide Fuel Cell
Class 20 kW and Heavy Duty
SOFC Co-generation System
Fuel
■ Target Specifications
9 Output Level: Class 20 kW both Electricity
and Heat
9 Power Generation Efficiency:40 %
9 Lasting: >40,000 hr
Cathode Surface
Combustion Burner
Future System
Power
SOFC
(Class 450 kW)
Regenerator
Compressor
Generator
CH4
Air Cold Air
Exhaust
Air
Turbine
(Class 150 kW)
Power Generation Efficiency : 60%
Class 5 kW
Sub Module
Class 5 kW
Sub Module
Class 600 kW SOFC-MGT** Hybrid System
(Industrial Power Generation)
**MGT:Micro Gas Turbine
Challenges
Anode Surface
Combustion Burner
Air
Cold Gas
CH4
Class 10 kW Module Structure
■ Durability Improvement
■ High-Power Stack
■ Cost Reduction
Supported by NEDO
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3
3. New Challenges in Energy Saving
Copyright © Hitachi, Ltd. 2007. All Rights Reserved
Microreactor
3-1
■ Conventional Batch Process
9
9
9
Reaction in Large Space
Heterogeneous Mixing
Limited Yield
■ Numbering-up of Microreactors
9
9
Same Reaction Mechanism as in Single
Microreactors
Less Time needed from Test-TubeScale R&D to Plant-Scale Production
A
Microreactor x 20
Maximum production
～72 ton/year
tank
B
>2m
1500 mm
■ Microreactor
9
9
9
Reaction in Small Space
Homogeneous Mixing
Higher Yield with lower energy
e.g. 58%(batch) 98%
(bromination of dimethyl phenol)
A
B
Numbering-up
■ Variation of Microreactors
20mm
Mixing
MEMS chip
Reaction
Emulsification Condensation
25μm
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3-2
Electric Power Saving (EPS) Data Center
„ User’s own computer to computers over the network
„ Evolution from mainframe to server to data center
„ Computer has become one component of EPS data center
Equipment
Mainframe
Open Server
Equipment +
Commercial
Application Software Software
PC Server
Blade Server
Module Server
（Pico Server)
Internet
Web Service
Web2.0, SaaS
Service
•Local cooling
•Modularized
servers, routers,
storage
•DC direct
power supply
Data Center
Copyright © Hitachi, Ltd. 2007. All Rights Reserved
3-3 Activities to Save Energy of ICT in U.S.
Activity
Data Center
Energy
Promoting body
U.S. Congress
Purpose
Promotion of energy efficient servers
(enacted : Dec. 2006)
Efficiency Act
Energy Star
EPA
Study & promotion of energy efficient servers,
PCs and data centers
Climate Savers
Google, Intel
Realization of energy efficient PCs, promoted
by manufacturers of PC and its components
(Jun. 2007)
Green Grid
AMD, HP, Sun,
IBM
NPO to Improve energy efficiency of data
center (Feb. 2007)
SPECpower
SPEC
Benchmark for evaluating the energy efficiency
for server class computers
Computing
Initiative
(discussion started: May 2006)
EPA : Environmental Protection Agency
NPO : Non-Profit Organization
SPEC : Standard Performance Evaluation Corporation
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4
4. Toward Eco-Innovations in ICT
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4-1
R&D Challenges for Nano-ICT
１．Focused investment in energy-saving Nano-ICT projects
9 “More Moore” and “More than Moore” type R&D
- Advanced CMOS, 3D System LSI, New Power Supply System, Optical Interconnection,
- Novel Magnetic Recording, Flexible Display Panel, Energy-Saving Manufacturing, etc.
9 Increasing R&D budget
２．Industry-university-government collaboration
for R&D on energy-saving Nano-ICT projects.
9 Improvement of Collaborative R&D Schemes (joint COE)
- Collaborative R&D centers for Si technology (More Moore) have been established.
- Nano-ICT R&D Platform for novel concept (More than Moore) is urgently needed.
Expected functions:
・R&D network hubs
・Comprehensive research from material to system
・Prototyping ability
・Training and global recruiting of researchers
３．Enactment and Implementation of guideline
on energy-saving ICT
9 Energy-saving goals and R&D Roadmaps
9 Incentive to R&D on energy-saving ICT
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4-2
Power Devices for Low Power Consumption
Negative Electrode
Chip
Memory Set
AC/DC
(29%)
CPU
(19%)
PCI
Card
Power Loss
caused by Electric
Energy Conversion
DC/DC
Disk
Drive
Fan
Current
Application of SiC and GaN
to Reduce Power Loss
EYP Mission Critical
Facilities & Intel, 2006
DC Power
Transmission
Power Consumption in a Server (450 W)
Thickness of Device
(Relative to Si)
Si
SiC
GaN
1.1
3.3
3.4
0.3
1
3.3
2.5
1/10
1/10
Wide-Gap Semiconductors
Bullet Train
Inverter
Power Rating (VA)
Breakdown Electric
Field Strength
(MV/cm)
SiC : Large Current
GaN：High Frequency
Si
Positive Electrode
(7%)
Band Gap (eV)
Conduction Loss (theoretical):1/300
Switching Loss:1/2
Optical
Thyristor
1M
IGBT
100k
10k
1k
Hybrid Car
SiC Motor Generator
Air Conditioner
GaN
Power IC
100
1k
Power
MOSFET
10k 100k
1M
Frequency(Hz)
Applications of SiC & GaN Power Device
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4-3
R&D on 3D-Device
■ 3D Packaging for Reduction of
I / F Power Consumption
Power Consumption (mW)
1000
2D Packaging
(WB, Off-Chip)
800
600
output
3D Packaging (SiP)
Ring
oscillator
Microbump
Through Si Electrode
PCIe
Off-chip
controller
Vref
+-
Triangular
wave
generator
DDR3
400
■ 3D Packaging Filter for Low
Cost Power （Prof. Sakurai, U. of Tokyo）
Inductive coupling
DDR2
Lower chip
200
DRAM
On-Chip
Coil
SoC
0
0
5
10
15
20
Band Width (GB/s)
25
3D Communication by Inductive Coupling
Multilayer Chip
(Filter Device)
Optical Module(Laser, Modulator)
Optical
Communication
Upper chip
ASIC/ASSP
Realization of
DC-DC
Power Supply
with 62% of
Conversion
Efficiency
RAM Chip
CPU
PKG Substrate
Substrate Chip
(Driver Circuit)
Board Substrate
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4-4
Optical Interconnection
■ Breakthrough technology to achieve power reduction in the information
explosion.
■ Consolidation of optical technology with digital / analog CMOS technology.
■ Si nano photonics is emerging technology.
Electronics/photonics
Consolidation
CMOS Integration Technology
Si Light Emitter
Module
Architecture
System
Application
Si Photonics in Chip
Optical WG
Ⅲ-ⅤLaser Device
Integration
Si emitter
Si/SiGe Photo
Detector
Optical Waveguide
Coupling
Si Waveguide
CMOS
Chip to Chip Optical
Interconnection
LD
PD
Digital Consumer
- digital TV, mobile, game
Industrial/Social
Systems
- robots, automobiles
Data Center
- server / router
Optical
Interconnection
Multi-layer Polymer WG
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4-5
Progress of Hard Disk Drive Tech.
Areal Density (Gb/in2)
Production
105
HDD using Perpendicular
Recording Tech.
104
Fundamental Principle Proposed
by Prof. S. Iwasaki (Tohoku U.)
in1977
102
100%/year
10
10-3
IBM RAMAC
(World’s First HDD)
ＭＲ* Head
Recording Bit
40nm
1.0”
60%/year 8 Giga Byte
Thin Film Head
Courtesy of International Business Machines Corporation,
copyright 1958 International Business Machines Corporation.
Nano Inprint
Tech.
25%/year
24”
5 Mega Byte
10-4
14”
1.2 Giga Byte
10-5
10-6
Perpendicular
ＧＭＲ** Head
1
10-2
Patterned Media
2.5”
160 Giga Byte
103
10-1
Thermal Assisted
1960
Supported by NEDO & MEXT
1970
1980
2.5”
60 Mega Byte
1990
2000
2010
* MR:MagnetoResistive
**GMR:Giant MR
2020
Year
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4-6
Development of Spintronics
Non-Volatile RAM for Reducing
Power Consumption of Mobile Equipment
MTJ
SL
WL
BL
WL
SL
SPRAM
(SPin-transfer torque RAM)
Standby Current
Of DRAM
1000
DRAM
800
1000
800
DRAM
600
400
600
SPRAM
RAM Size used
in Cellphone
400
SPRAM+DRAM
Standby Current
200
200
0
0
'07 '08 '09 '10 '11 '12 '13 '14 '15 '16
Year
Supported by MEXT
1200
Standby Current (µA)
BL
RAM Size used in Cellphone (MB)
1200
Reproduced from Nikkei Market Access Data
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4-7
R&D of Flexible Display
■Target : Large Area, Ultra Light, Ultra Thin,
Highly Flexible, Low Temperature Process
Mobility (cm2/Vs)
FPD (PDP, LCD)
Target
103
102
Organic
101
CRT
100
10-1
10-2
100
PDP (present)
LCD (present)
Weight (kg)
50
20
10
5
Oxides
a-Si
600 800
200
400
Process Temp. (℃)
Heaviest limit for wall-hanging FPD
without protection
per）
wa
il e to
llpa
mob
（
r
e
p
a
nic P Relationship between FPD
o
r
t
c
Ele
Screen Size and Weight (*)
2
1
0
poly-Si
20
40
60
80
Screen Size (inch)
100
120
（* : as of Apr. 2007, based on product catalogues)
Flexible Device
（Hand-Held～Wall Sized）
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4-8
Summary
1. For the sustainable development of the global society, a new
paradigm of innovation, Eco-Innovation, is designed and ongoing.
2. Eco-Innovation is aimed at creating socially important outcomes
based on the development and implementation of breakthrough
technologies and the fusion of technology and art / social sciences.
3. Eco-Innovation includes sustainable manufacturing system,
zero-emission-type social infrastructure and sustainable living.
4. In the era of information explosion, energy saving in ICT is critical.
Nano-ICT plays a key role. Establishment of global COE for novel
nano-ICT development and product incubation will be a countermeasure.
5. Global collaboration is a key for target setting, R&D efficiency improvement, and support for developing regions.
Copyright © Hitachi, Ltd. 2007. All Rights Reserved
Thank you for your attention.
Hitachi Central Research Laboratory
Copyright © Hitachi, Ltd. 2007. All Rights Reserved