Funding Perspectives for CyberPhysical Systems in Horizon 2020 Firenze, 13 December 2013 Werner Steinhögl Programme Officer- Complex Systems & Advanced Computing European Commission - DG CONNECT – A3 1 Horizon 2020: Three priorities 32% 22% Excellent science Industrial leadership Societal challenges 2 + EIT, JRC, Widening, SwfS 8% 38% Europe 2020 priorities Shared objectives and principles ICT ICT ICT ICT ICT ICT Tackling Societal Challenges Health, demographic change and wellbeing Food security, sustainable agriculture and the bio-based economy Secure, clean and efficient energy Smart, green and integrated transport Climate action, resource efficiency and raw materials Inclusive, innovative and reflective societies Secure Societies EIT JRC Simplified access Creating Industrial Leadership and Competitive Frameworks Leadership in enabling and industrial technologies ICT Nanotech., Materials, Manuf. and Processing Biotechnology Space Access to risk finance Innovation in SMEs ICT Excellence in the Science Base Frontier research (ERC) Future and Emerging Technologies (FET) Skills and career development (Marie Curie) Research infrastructures ICT ICT Common rules, toolkit of funding schemes 3 Dissemination & knowledge tranfer Coverage of the full innovation chain Societal challenges Industrial leadership Excellent science Basic Research Demonstration Technology R&D Prototyping 4 Large scale validation Pilots Market uptake Industrial Leadership - ICT 1. A new generation of components and systems: engineering of advanced embedded and resource efficient components and systems 2. Next generation computing: advanced and secure computing systems and technologies, including cloud computing 3. Future Internet: software, hardware, infrastructures, technologies and services 4. Content technologies and information management: ICT for digital content, cultural and creative industries 5. Advanced interfaces and robots: robotics and smart spaces 6. Micro- and nanoelectronics and photonics: key enabling technologies 5 Work Programme 2014/15 Embedded and CPS in LEIT-ICT - a Simple Map 2015 ~26M€ 2014 ~25M€ Manufacturing: Process (Chain) Optimisation (FoF1, FoF9) Platforms for Connected Smart Objects (ICT30) Smart Cyber-Physical Systems (ICT1) Customised low power Computing (ICT4) 2014 56 M€ 2015 57 M€ … … 2015 ~13M€ … Budgets are tentative and may change Largely following ARTEMIS-IA SRA ECSEL JTI … EFFRA SRA EPoSS IA SRA AENEAS SRA 6 ICT 1 – Smart Cyber-Physical Systems Objectives: new paradigms, concepts, platforms or tool-chains laying the foundation for future Cyber-Physical Systems Stakeholders: suppliers and users of CPS, tool and sub-system providers, system integrators, auditors/certification bodies and related academia and research institutes Possible activities: 1.Modelling and integration frameworks 2.Methods for smart, cooperative and open CPS 3.Connecting innovators across value chains: • Towards platforms and ecosystems • Bootstrap the establishment of European networks of Embedded Systems design centres ICT4 - Customised and low power computing Research and Development • Servers, micro-server and highly parallel embedded computing systems based on ultra-low power architectures • Cross-layer programming approaches to exploit the full potential of heterogeneous parallel architectures Innovation • Reference architectures and platforms across several sectors and application domains • Application experiments bringing together all actors along the value chain ICT 30 – IoT & Platforms for Connected Smart Objects Objectives: Create Platforms that integrate future generation of devices, embedded systems and networked technologies for a multiplicity of applications Stakeholders: Multidisciplinary: Internet/IoT, embedded systems,… Architectures supporting: • Dynamic configuration • Integrated smartness and connectivity • Self-organised, autonomous systems • Interoperable use cases and applications Activities: • Reference implementations, proof-of-concept • Demonstration & validation with innovative use scenarios FoF1 – Process optimisation of manufacturing assets Objectives (from a CPS perspective): Intra-plant: CPS-based process optimisation for adaptive/smart manufacturing • Need: Scalable CPS architectures that exploit simulation & modelling and advanced local control algorithms to optimise local decision making • Actions: development of methods for real time analysis, modelling and control to mimic and optimize manufacturing processes Extra-plant: Collaborative and agile manufacturing • Need: CPS/Cloud to master supply network complexity • Actions: development of collaborative tools that allow data sharing and synchronisation of business processes end-to-end across the supply chain For official reference, please refer to the final Work Programme text THANK YOU Werner.Steinhoegl@ec.europa.eu Horizon 2020 on the web http://ec.europa.eu/research/horizon2020/index_en.cfm ICT-objectives from Vilnius conference 2013 http://ec.europa.eu/digital-agenda/events/cf/ict2013/streamitems.cfm?id=228&by=227 Strategy: Digital Agenda for Europe – Components and Systems https://ec.europa.eu/digital-agenda/en/science-and-technology/components-systems