Micromechanics of macroelectronics Zhigang Suo Harvard University

advertisement
Micromechanics of macroelectronics
Zhigang Suo
Harvard University
Work with
Teng Li, Yong Xiang, Joost Vlassak (Harvard University)
Sigurd Wagner, Stephanie Lacour (Princeton University)
1
Displays
Sony e-Reader
2
Roll-to-roll printing Low cost, large area
3
Challenges to the mechanics of materials and structures
•Large structures
•Hybrid materials (organic/inorganic)
•Small features
Thin-film transistor (TFT)
Al
SiNx
(n+) a-Si:H
undoped a-Si:H
SiNx
Ti/Cr
Hermetic seal
Active device
Polymer substrate
defect
100 nm
180 nm
50 nm
100 nm
360 nm
100 nm
inorganic
polymer
4
How to make brittle materials flexible?
top
Thin substrate
Strain caused by bending
 top
c
Neutral plane
c 10μm
 
 10 3
R 10mm
R
Small flaws
Strain to cause fracture
c 


Ea
10 N/m
2

10
1011 N/m 2 10 6 m



5
Suo, Ma, Gleskova, Wagner Appl. Phys. Lett. 74, 1177-1179 (1999).
n / n0
Gleskova, Wagner, Suo Applied Physics Letters, 75, 3011 (1999)
High strain and fracture
Cracks
G
S D
a-Si thin-film transistor (TFT)
on polyimide substrate
1
0
TFT island
Compression
-3
-2
Tension
-1
0
1
Strain (%)
2
3
6
How to make stretchable circuits?
Most microelectronic materials fracture at small strains
(less than about 1%)
Polymer substrate
Islands, linked by interconnects
•Fracture at crossovers
•Fatigue of metals
•Small island size
Springs
•3D microfabrication
Hsu, Bhattacharya, Gleskova, Huang, Xi, Suo, Wagner, Sturm, APL 81, 1723 (2002).
7
Debonding and cracking
Cracks
G
S D
SiN island on Kapton substrate
Bhattacharya, Salomon, Wagner
J. Electrochm. Soc. 153, G259 (2006)
TFT island
a-Si thin-film transistor (TFT)
on Kapton substrate
Gleskova, Wagner, Suo Applied Physics Letters, 75, 3011 (1999)
8
Metal on polymer
Al, Cu, Au ~ 100nm
Kapton, Silicone
•Metal film deforms plastically (Ho, Kraft, Arzt, Spaepen…)
•What is the rupture strain of the metal film?
9
Ductile vs. brittle film
 Rupture by necking
metal film
 Rupture by breaking atomic bonds
ceramic film
metal film
ceramic film
polymer substrate
polymer substrate
10
FEM: large-amplitude perturbation
Free-standing
  0.023
Substrate-bonded
Long-wave perturbation
  0.8
Substrate-bonded
short-wave purturbation
=0.8
Conclusion from nonlinear analysis:
Substrate retards perturbation of ALL wavelengths.
Li, Huang, Suo, Lacour, Wagner, Mechanics of Materials 37, 261 (2005)
11
Al film on Kepton substrate
5000 Å Al film, 7 % Strain
Gage, Phanitsiri (2001)
Chiu, Leu, Ho, (1994)
Alaca, Saif, Sehitoglu (2002)
5000 Å Al film, 10 % Strain
Channel cracks start at ~2% strain
12
Possible causes for small rupture strains
of metal on polymer
• The film is brittle.
• The film debonds from the substrate.
• The substrate is too compliant.
13
Coupled
rupture and debond
Co-evolution:
necking and debonding
EE10.4 Thursday 2:30pm, Teng Li
Ductility of thin metal films on polymer substrates modulated by interfacial adhesion.
14
 max  5MPa
T22
Li, Suo, IJSS (2006)
T12
35%
35%
37.3%
37.3%
38%
38%
38.5%
38.5%
15
Effect of adhesion
100nm Cu /20nm C/ Kapton, strained to 6%
Xiang, Li, Suo, Vlassak,
APL 87, 161910 (2005)
16
100nm Cu /10nm Ti/Kapton, strained to 10%
170nm Cu /10nm Ti/ Kapton
strained to 30%
Xiang, Li, Suo, Vlassak, APL 87, 161910 (2005)
17
The effect of substrate stiffness
Esub = 2 MPa,  = 2.8%
Esub = 150 MPa,  = 37%
Esub = 300 MPa,  = 47%
18
Li, Huang, Suo, Lacour, Wagner, Appl. Phys. Lett. 85, 3435 (2004)
Au film on PDMS substrate
survives large elongation
Lacour, Wagner, Huang, Suo,, APL 82, 2404 (2003).
5.0
4.5
Au (25 nm)
4.0
3.5
R/Rinit
Cr (5 nm)
3.0
2.5
2.0
1.5
1.0
0.5
PDMS (1mm)
0.0
0
10
20
30
40
50
60
70
time (h)
•electron-beam evaporation
19
•101 cycles of elongation by 35%
Au film is cracked from the beginning, but…
a
b
1µm
As deposited
1µm
Lacour, Li, Chen, Wagner, Suo, APL 88, 204103 (2006).
c
stretching
direction
1st cycle to 35% strain
1µm
stretching
direction
101st cycle to 35% strain
20
Other Compliant Patterns
Y-shaped cracks
When pulled, the sheet elongates
by buckling
21
The importance of being compliant

L a
A
0.01
p u re
ne s
in-pla
tretch
1E-3
J/Ea
s tr e tc h
1E-4
a
-of-pla
nd o ut
ne b uc
kle
J c  Y h  109 Pa  108 m 

  11  6   104
Ea Ea  10 Pa  10 m 
1E-5
1E-6
1E-7
5
10
15
20
Engineering strain (%)
25
30
22
Serpentine:
a compliant pattern of a stiff material
Large elongation, small strain
A platform for devices
Top surface
Bottom surface
Li, Suo, Lacour, Wagner, JMR 20, 3274 (2005)
23
Summary
A stiff polymer substrate can retard necking in a
metal film.
A compliant polymer substrate can accommodate
large displacement of a patterned film.
24
Download