Matched Monolithic Quad Transistor
MAT14
Low offset voltage: 400 µV maximum
High current gain: 300 minimum
Excellent current gain match: 4% maximum
Low voltage noise density at 100 Hz, 1 mA
3 nV/√Hz maximum
Excellent log conformance
Bulk resistance (rBE) = 0.6 Ω maximum
Guaranteed matching for all transistors
PIN CONFIGURATION
C1 1
14
C4
B1 2
13
B4
12
E4
E1 3
MAT14
TOP VIEW
11 SUB
(Not to Scale)
10 E3
E2 5
9 B3
B2 6
SUB 4
C2 7
8
C3
09045-001
FEATURES
Figure 1.
APPLICATIONS
Low noise op amp front end
Current mirror and current sink/source
Low noise instrumentation amplifiers
Voltage controlled attenuators
Log amplifiers
GENERAL DESCRIPTION
The MAT14 is a quad monolithic NPN transistor that offers
excellent parametric matching for precision amplifier and
nonlinear circuit applications. Performance characteristics
of the MAT14 include high gain (300 minimum) over a wide
range of collector current, low noise (3 nV/√Hz maximum at
100 Hz, IC = 1 mA), and excellent logarithmic conformance.
The MAT14 also features a low offset voltage of 100 µV typical
and tight current gain matching to within 4%. Each transistor of
the MAT14 is individually tested to data sheet specifications.
For matching parameters (offset voltage, input offset current,
and gain match), each of the dual transistor combinations are
verified to meet stated limits. Device performance is guaranteed
at an ambient temperature of 25°C and over the industrial temperature range.
The long-term stability of matching parameters is guaranteed
by the protection diodes across the base emitter junction of
each transistor. These diodes prevent degradation of beta and
matching characteristics due to reverse bias, base emitter current.
The superior logarithmic conformance and accurate matching
characteristics of the MAT14 make it an excellent choice for use
in log and antilog circuits. The MAT14 is an ideal choice in
applications where low noise and high gain are required.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
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Tel: 781.329.4700
Fax: 781.461.3113
©2010 Analog Devices, Inc. All rights reserved.
MAT14
TABLE OF CONTENTS
Features .............................................................................................. 1
Thermal Resistance .......................................................................4
Applications ....................................................................................... 1
ESD Caution...................................................................................4
Pin Configuration ............................................................................. 1
Typical Performance Characteristics ..............................................5
General Description ......................................................................... 1
Theory of Operation .........................................................................8
Revision History ............................................................................... 2
Applications Information .............................................................8
Specifications..................................................................................... 3
Outline Dimensions ..........................................................................9
Electrical Characteristics ............................................................. 3
Ordering Guide .............................................................................9
Absolute Maximum Ratings ............................................................ 4
REVISION HISTORY
12/10—Rev. 0 to Rev. A
Changes to General Description .................................................... 1
Changes to Operating Temperature Range in Table 2 ................. 4
Updated Outline Dimensions ......................................................... 9
Changes to Ordering Guide ............................................................ 9
10/10—Revision 0: Initial Version
Rev. A | Page 2 of 12
MAT14
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
TA = 25°C, unless otherwise specified.
Table 1.
Parameter
DC AND AC CHARACTERISTICS
Current Gain
Symbol
Test Conditions/Comments
hFE
10 µA ≤ IC ≤ 1 mA
0 V ≤ VCB ≤ 30 V 1
−40°C ≤ TA ≤ +85°C
IC = 100 µA2
0 V ≤ VCB ≤ 30 V
IC = 1 mA, VCB = 03
fO = 10 Hz
fO = 100 Hz
fO = 1 kHz
10 µA ≤ IC ≤ 1 mA4
0 V ≤ VCB ≤ 30 V
−40°C ≤ TA ≤ +85°C
0 V ≤ VCB ≤ 30 V4
10 µA ≤ IC ≤ 1 mA
10 µA ≤ IC ≤ 1 mA4, VCB = 0 V
−40°C ≤ TA ≤ +85°C
IC = 100 µA, VCB = 0 V
IC = 10 µA
−40°C ≤ TA ≤ +85°C
IC = 1 mA, VCE = 10 V
Current Gain Match
ΔhFE
Noise Voltage Density
eN
Offset Voltage
Offset Voltage Change vs. VCB Change
Offset Voltage Change vs. IC Change
Offset Voltage Drift
VOS
ΔVOS/ΔVCB
ΔVOS/ΔIC
ΔVOS/ΔT
Breakdown Voltage
BVCEO
Gain-Bandwidth Product
Collector Leakage Current
Base
fT
ICBO
Substrate
ICS
Emitter
ICES
Input Current
Bias
IB
Offset
IOS
Offset Drift
ΔIOS/ΔT
Collector Saturation Voltage
Output Capacitance
Bulk Resistance
Input Capacitance
VCE(SAT)
COBO
rBE
CEBO
Min
Typ
Max
Unit
300
200
600
500
1
4
%
2
1.8
1.8
4
3
3
nV/√Hz
nV/√Hz
nV/√Hz
100
120
400
520
µV
μV
100
10
200
50
µV
µV
0.4
2
300
µV/°C
V
V
MHz
VCB = 40 V
−40°C ≤TA ≤ +85°C
VCS = 40 V
−40°C ≤ TA ≤ +85°C
VCE = 40 V
−40°C ≤ TA ≤ +85°C
5
0.5
0.5
0.7
3
5
pA
nA
nA
nA
nA
nA
IC = 100 µA, 0 V ≤ VCB ≤ 30 V
−40°C ≤ TA ≤ +85°C
IC = 100 µA, VCB = 0 V
−40°C ≤ TA ≤ +85°C
IC = 100 µA
−40°C ≤ TA ≤ +85°C
IC = 1 mA, IB = 100 µA
VCB = 15 V, IE5 = 0, f = 1 MHz
10 µA ≤ IC ≤ 10 mA,VCB = 0 V6
VCB = 15 V, IE = 0, f = 1 MHz
165
200
2
8
1
Current gain measured at IC = 10 µA, 100 µA, and 1 mA.
Current gain match (ΔhFE) defined as: ΔhFE = (100(ΔIB)(hFE min)/IC).
3
Sample tested.
4
Measured at IC = 10 µA and guaranteed by design over the specified range of IC.
5
See Table 2 for the emitter current rating.
6
Guaranteed by design.
2
Rev. A | Page 3 of 12
40
40
100
0.03
10
0.4
40
330
500
13
40
0.06
0.6
nA
nA
nA
nA
pA/°C
V
pF
Ω
pF
MAT14
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Parameter
Voltage
Collector-to-Base Voltage (BVCBO)
Collector-to-Emitter Voltage (BVCEO)
Collector-to-Collector Voltage (BVCC)
Emitter-to-Emitter Voltage (BVEE)
Current
Collector Current (IC)
Emitter Current (IE)
Temperature
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Rating
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
40 V
40 V
40 V
40 V
Package Type
14-Lead SOIC
Table 3. Thermal Resistance
ESD CAUTION
30 mA
30 mA
−65°C to +150°C
−40°C to +85°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. A | Page 4 of 12
θJA
115
θJC
36
Unit
°C/W
MAT14
700
680
660
640
620
600
580
560
540
520
500
480
460
440
420
400
380
360
340
320
300
0.001
0.70
BASE EMITTER-ON-VOLTAGE (V)
0.65
TA = 125°C
TA = 85°C
TA = 25°C
0.60
0.55
0.50
0.45
0.40
0.01
0.1
COLLECTOR CURRENT (mA)
1
0.30
0.001
100
10
INPUT RESISTANCE (MΩ)
VCB = 20V
VCB = 0V
0.1
0.01
–25
0
25
50
75
TEMPERATURE (°C)
100
125
150
0.001
0.001
Figure 3. Current Gain vs. Temperature
0.01
0.1
1
COLLECTOR CURRENT (mA)
10
Figure 6. Small Signal Input Resistance vs. Collector Current
1m
3.0
2.5
CONDUCTANCE ( )
0.1m
2.0
1.5
1.0
0.01m
1µ
NOISE = 100Hz
0.1µ
0.5
0
0
2
4
6
8
COLLECTOR CURRENT (IC)
10
12
0.01µ
1µ
Figure 4. Voltage Noise Density vs. Collector Current
0.01m
0.1m
1m
0.01
COLLECTOR CURRENT (A)
0.1
1
Figure 7. Small Signal Output Conductance vs. Collector Current
Rev. A | Page 5 of 12
09045-007
NOISE = 10Hz
09045-004
VOLTAGE NOISE DENSITY (nV/srtHz)
1
09045-006
700
680
660
640
620
600
580
560
540
520
500
480
460
440
420
400
380
360
340
320
300
–50
10
Figure 5. Base Emitter-On-Voltage vs. Collector Current
09045-003
CURRENT GAIN (β)
Figure 2. Current Gain vs. Collector Current
0.01
0.1
1
COLLECTOR CURRENT (mA)
09045-005
0.35
09045-002
CURRENT GAIN (β)
TYPICAL PERFORMANCE CHARACTERISTICS
MAT14
200
10
TOTAL NOISE (nV/√Hz)
SATURATION VOLTAGE (V)
160
1
TA = 125°C
0.1
120
100kΩ
80
10kΩ
40
TA = 85°C
TA = 25°C
1
10
COLLECTOR CURRENT (mA)
100
09045-008
0.1
0
0.001
Figure 8. Saturation Voltage vs. Collector Current
0.1
1
Figure 10. Total Noise vs. Collector Current
20
COLLECTOR-TO-BASE CAPACITANCE (pF)
100
10µA
10
1mA
18
16
14
12
10
8
6
4
2
1
10
100
1k
FREQUENCY (Hz)
Figure 9. Noise Voltage Density vs. Frequency
10k
0
1
2
3
4
5
6
7
8
COLLECTOR-TO-BASE VOLTAGE (V)
9
10
09045-011
0
1
09045-009
NOISE DENSITY (nV√Hz)
0.01
COLLECTOR CURRENT (mA)
09045-010
1kΩ
0.01
0.01
Figure 11. Collector-to-Base Capacitance vs. Collector-to-Base Voltage
Rev. A | Page 6 of 12
40
10
35
1
ICC CURRENT (nA)
30
25
20
15
0
1
2
3
4
5
6
7
8
9
10
COLLECTOR-TO-SUBSTRATE VOLTAGE (V)
0.001
25
1
0.1
75
100
125
09045-013
0.01
TEMPERATURE (°C)
100
Figure 14. Collector-to-Collector Leakage vs. Temperature
10
50
75
TEMPERATURE (°C)
Figure 12. Collector-to-Substrate Capacitance vs.
Collector-to-Substrate Voltage
0.001
25
50
Figure 13. Collector-to-Base Leakage vs. Temperature
Rev. A | Page 7 of 12
125
09045-014
5
0
ICBO CURRENT (nA)
0.1
0.01
10
09045-012
COLLECTOR-TO-SUBSTRATE CAPACITANCE (pF)
MAT14
MAT14
THEORY OF OPERATION
APPLICATIONS INFORMATION
these mirrors is reduced from that of the unity-gain source due
to base current errors but remains better than 2%.
To minimize coupling between devices, tie one of the substrate
pins (Pin 4 or Pin 11) to the most negative circuit potential.
Note that Pin 4 and Pin 11 are internally connected.
IOUT = 2(IREF )
IREF
Applications Current Sources
Q1
IREF
Q2
Q3
IOUT = IREF
Q4
09045-016
MAT14 can be used to implement a variety of high impedance
current mirrors as shown in Figure 15, Figure 16, and Figure 17.
These current mirrors can be used as biasing elements and load
devices for amplifier stages.
V–
Figure 16. Current Mirror, IOUT = 2(lREF)
Q1
Q2
Q3
Q4
IOUT = 1/2(IREF )
IREF
09045-015
Q1
V–
Q2
Q4
Q3
09045-017
Figure 15. Unity-Gain Current Mirror, IOUT = IREF
V–
The unity-gain current mirror shown in Figure 15 has an
accuracy of better than 1% and an output impedance of more
than 100 MΩ at 100 μA.
Figure 17. Current Mirror, IOUT = ½(IREF)
Figure 18 is a temperature independent current sink that has an
accuracy of better than 1% at an output current of 100 μA to 1 mA.
A Schottky diode acts as a clamp to ensure correct circuit startup at
power-on. Use 1% metal film type resistors in this circuit.
Figure 16 and Figure 17 each show a modified current mirror;
Figure 16 is designed for a current gain of two (2), and Figure 17
is designed for a current gain of one-half (½). The accuracy of
+15V
2
4
6
IOUT =
IOUT
R
10V
R
IOUT
IOUT
100pF
R
2
3
7
OP1177
6
2
1
3
6
7
5
9
8
13
10
14
MAT14
12
4
HP
5082-2811
R
R
R
–15V
Figure 18. Temperature Independent Current Sink, IOUT = 10 V/R
Rev. A | Page 8 of 12
R
09045-018
ADR01
MAT14
OUTLINE DIMENSIONS
8.75 (0.3445)
8.55 (0.3366)
8
14
1
7
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0039)
COPLANARITY
0.10
0.51 (0.0201)
0.31 (0.0122)
6.20 (0.2441)
5.80 (0.2283)
0.50 (0.0197)
0.25 (0.0098)
1.75 (0.0689)
1.35 (0.0531)
SEATING
PLANE
45°
8°
0°
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-012-AB
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
060606-A
4.00 (0.1575)
3.80 (0.1496)
Figure 19. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-14)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model1
MAT14ARZ
MAT14ARZ-R7
MAT14ARZ-RL
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
14-Lead Standard Small Outline Package [SOIC_N]
14-Lead Standard Small Outline Package [SOIC_N]
14-Lead Standard Small Outline Package [SOIC_N]
Z = RoHS Compliant Part.
Rev. A | Page 9 of 12
Package Option
R-14
R-14
R-14
MAT14
NOTES
Rev. A | Page 10 of 12
MAT14
NOTES
Rev. A | Page 11 of 12
MAT14
NOTES
©2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09045-0-12/10(A)
Rev. A | Page 12 of 12