155.52 MHz Frequency Synthesizer
AD809
a
FEATURES
Frequency Synthesis to 155.52 MHz
19.44 MHz or 9.72 MHz Input
Reference Signal Select Mux
Single Supply Operation: +5 V or –5.2 V
Output Jitter: 2.0 Degrees RMS
Low Power: 90 mW
10 KH ECL/PECL Compatible Output
10 KH ECL/PECL/TTL/CMOS Compatible Input
Package: 16-Pin Narrow 150 Mil SOIC
155.52 Mbps ports. The AD809 can be applied to create the transmit bit clock for one or more ports.
An input signal multiplexer supports loop-timed applications
where a 155.52 MHz transmit bit clock is recovered from the
155.52 Mbps received data.
The low jitter VCO, low power and wide operating temperature
range make the device suitable for generating a 155.52 MHz bit
clock for SONET/SDH/Fiber in the Loop systems.
The device has a low cost, on-chip VCO that locks to either
8× or 16× the frequency at the 19.44 MHz or 9.72 MHz input.
No external components are needed for frequency synthesis; however, the user can adjust loop dynamics through selection of a
damping factor capacitor whose value determines loop damping.
PRODUCT DESCRIPTION
The AD809 provides a 155.52 MHz ECL/PECL output clock from
either a 19.44 MHz or a 9.72 MHz TTL/CMOS/ECL/PECL reference frequency. The AD809 functionality supports a distributed
timing architecture, allowing a backplane or PCB 19.44 MHz or
9.72 MHz timing reference signal to be distributed to multiple
The AD809 design guarantees that the clock output frequency
will drift low (by roughly 20%) in the absence of a signal at the
input.
The AD809 consumes 90 mW and operates from a single power
supply at either +5 V or –5.2 V.
FUNCTIONAL BLOCK DIAGRAM
CF1 CF2
7
(19.44MHz CLKIN 13
OR
9.72MHz) CLKINN 12
AUTO
SELECT
PFD
8
LOOP
FILTER
VCO
BW
ADJUST
TTL/CMOSIN 10
AUTO SELECT
DIVIDE BY 8/16
AD809
PECLIN 2
(155MHz)
PECLINN 1
MUX 15
MUX
5
CLKOUT
4
CLKOUTN
(155MHz
PECL
OUTPUT)
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700
World Wide Web Site: http://www.analog.com
Fax: 617/326-8703
© Analog Devices, Inc., 1997
AD809–SPECIFICATIONS (T = T
A
Parameter
MIN
to TMAX, VS = VMIN to VMAX, CD = 22 nF, unless otherwise noted)
Condition
Min
TRACKING AND CAPTURE RANGE
×8 Synthesis
×16 Synthesis
19.42
9.71
OUTPUT JITTER
×8 Synthesis
×16 Synthesis
1.6
1.6
CD = 5.6 nF (ζ = 5)
CD = 22 nF (ζ = 10)
200
0.08
0.02
1
JITTER TRANSFER
Bandwidth
Peaking
DUTY CYCLE TOLERANCE
INPUT VOLTAGE LEVELS
PECL
Input Logic High, VIH
Input Logic Low, VIL
TTL
Input Logic High, VIH
Input Logic Low, VIL
Typ
Units
19.46
9.73
MHz
MHz
2.9
2.9
Degrees RMS
Degrees RMS
kHz
dB
dB
×8 or ×16 Synthesis
Output Jitter ≤ 2.9 Degrees RMS
15
85
%
@ CLKIN/N and
PECLIN/N Inputs
3.8
3.1
VCC
3.6
Volts
Volts
@ TTL/CMOSIN
and MUX Inputs
2.0
0.8
Volts
Volts
OUTPUT VOLTAGE LEVELS
PECL
Output Logic High, VOH
Output Logic Low, VOL
Referenced to VCC
SYMMETRY (Duty Cycle)
×8 Synthesis or
×16 Synthesis
OUTPUT RISE/FALL TIMES 1.5
Rise Time (tR)
Fall Time (tF)
20%–80%
80%–20%
POWER SUPPLY VOLTAGE
VMIN to VMAX
–1.2
–2.0
–1.0
–1.8
–0.7
–1.7
Volts
Volts
46
52
62
%
%
1.1
1.1
1.5
1.5
ns
ns
5.5
Volts
26
mA
+85
°C
4.5
POWER SUPPLY CURRENT
OPERATING TEMPERATURE RANGE
Max
17
TMIN to TMAX
–40
NOTES
1
Device design is guaranteed for operation over Capture Ranges and Tracking Ranges, however the device has wider capture and tracking ranges
(for both ×8 and ×16 synthesis).
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +12 V
Input Voltage (Pin 12 or Pin 13) . . . . . . . . . . . . . . VCC + 0.6 V
Maximum Junction Temperature. . . . . . . . . . . . . . . . . +165°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C
ESD Rating (Human Body Model) . . . . . . . . . . . . . . . . 1500 V
“ON” TIME
tON
OUTPUT 50%
(PINS 4 & 5)
PERIOD
τ
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only; functional operation
of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics:
16-Pin Narrow Body SOIC Package: θJA = 110°C/W.
SYMMETRY = (100 × tON/τ)
Figure 1. Symmetry
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD809BR
AD809BR-REEL7
–40°C to +85°C
–40°C to +85°C
16-Pin Narrow Body SOIC
750 Pieces, 7" Reel
R-16A
R-16A
–2–
REV. A
AD809
Table I.
PIN DESCRIPTIONS
MUX Input
Input Selected
TTL “0”
TTL “1”
CLKIN/CLKINN
PECLIN/PECLINN
Pin
No. Mnemonic
Description
1
PECLINN
Differential 155 MHz Input
2
PECLIN
Differential 155 MHz Input
3
VCC2
Digital VCC for PECL Outputs
4
CLKOUTN
Differential 155 MHz Output
5
CLKOUT
Differential 155 MHz Output
Input Reference
AD809 Configuration
PECL/ECL Differential
Apply the valid PECL–level reference
frequency to Pins 13 and 12.
AD809 frequency synthesizer ignores
the input at Pin 10.
TTL/CMOS
Single-Ended
Apply the reference frequency to
Pin 10.
Connect Pins 13 and 12 to AVEE
(Pins 9 and 16). The AD809 senses
the common-mode signal at these pins
as less than valid PECL and selects the
TTL/CMOS input as active.
6
VCC1
Digital VCC for Internal Logic
7
CF1
Loop Damping Capacitor
8
CF2
Loop Damping Capacitor
9
AVEE
Analog VEE
10
TTL/CMOSIN TTL/CMOS Reference Clock Input
11
AVCC1
Analog VCC for PLL
12
CLKINN
PECL Differential Reference Clock Input
13
CLKIN
PECL Differential Reference Clock Input
14
AVCC2
Analog VCC for Input Stage
15
MUX
Input Signal Mux Control Input
16
VEE
Digital VEE
Table II. Applying a PECL/ECL or CMOS/TTL Reference
Input to the AD809
AD809 Phase Skew
The AD809 output is in phase with the input. The falling edge
at Pin 4, CLKOUTN, occurs 700 ps before the rising edge at
Pin 10, TTL/CMOSIN at 27°C. The phase skew remains relatively constant over temperature. Refer to Table III for phase
skew data.
PIN CONFIGURATION
PECLINN 1
PECLIN 2
VCC2 3
16 VEE
Table III. Phase Skew vs. Temperature
15 MUX
14 AVCC2
AD809
13 CLKIN
TOP VIEW
CLKOUT 5 (Not to Scale) 12 CLKINN
CLKOUTN 4
VCC1 6
11 AVCC1
CF1 7
10 TTL/CMOSIN
CF2 8
9 AVEE
Temperature
(8C)
Skew (CLKOUTN, Pin 4, Relative to
TTL/CMOSIN, Pin 10 Measured in
ps at Package Pins)
–35
–20
0
10
30
50
70
80
90
100
–1000
–950
–850
–750
–700
–600
–450
–450
–350
–250
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD809 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. A
–3–
WARNING!
ESD SENSITIVE DEVICE
AD809
Maximum, Minimum and Typical Specifications
Typical Characteristic Curves
Specifications for every parameter are derived from statistical
analyses of data taken on multiple devices from multiple wafer
lots. Typical specifications are the mean of the distribution of
the data for that parameter. If a parameter has a maximum (or a
minimum), that value is calculated by adding to (or subtracting
from) the mean six times the standard deviation of the distribution. This procedure is intended to tolerate production variations: if the mean shifts by 1.5 standard deviations, the remaining
4.5 standard deviations still provide a failure rate of only 3.4
parts per million. For all tested parameters, the test limits are
guardbanded to account for tester variation to thus guarantee
that no device is shipped outside of data sheet
specifications.
AD809 FREQUENCY SYNTHESIZER
JITTER DISTRIBUTION MATRIX
75 DEVICES (3 LOTS)
[ECL, TTL] × [×8, ×16] × [RISE, FALL] × [+4.5V, +5.0V, +5.5V] × [–40°C, +25°C, +85°C]
1200
100
CUMULATIVE %
POPULATION – Devices
1000
90
THIS CHART DESCRIBES THE
AD809 OUTPUT JITTER
SPECIFICATION OVER MANY
CONDITIONS. THE DATA
REPRESENTED ARE TAKEN
WITH RESPECT TO THE RISING
AND FALLING EDGES, FOR
EACH FREQUENCY RANGE,
LOCKED TO EITHER TTL OR
ECL INPUT, OVER ALL
TEMPERATURE AND SUPPLY
CONDITIONS.
800
600
80
70
60
50
40
400
30
FREQUENCY
20
200
Capture and Tracking Range
CUMULATIVE – %
DEFINITION OF TERMS
10
This is the range of input data rates over which the AD809 will
remain in lock.
0
Jitter
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 More
RMS JITTER – Degrees
This is the dynamic displacement of digital signal edges from
their long term average positions, measured in degrees rms.
Jitter on the input clock causes jitter on the synthesized clock.
1.9
Output Jitter
1.8
This is the jitter on the synthesized clock (OUTPUT, OUTPUT),
in degrees rms.
1.7
RMS JITTER – Degrees
Figure 2. Jitter Histogram
Jitter Transfer
The AD809 exhibits a low-pass filter response to jitter applied
to its input data.
Bandwidth
This describes the frequency at which the AD809 attenuates
sinusoidal input jitter by 3 dB.
TA = +25°C
VCC = +5V
1.6
1.5
1.4
1.3
19.44MHz
9 72MHz
1.2
Peaking
1.1
This describes the maximum jitter gain of the AD809 in dB.
1.0
Damping Factor, z
Damping factor, ζ describes the compensation of the second order PLL. A larger value of ζ corresponds to more damping and
less peaking in the jitter transfer function.
0
10
20
30
40
50
60
70
INPUT DUTY CYCLE – %
80
90
100
Figure 3. Jitter vs. Input Duty Cycle
Duty Cycle Tolerance
The AD809 exhibits a duty cycle tolerance that is measured
by applying an input signal (nominal input frequency) with a
known duty cycle imbalance and measuring the ×8 or ×16
output frequency.
Symmetry-Recovered Clock Duty Cycle
Symmetry is calculated as (100× on time)/period, where on time
equals the time that the clock signal is greater than the midpoint
between its “0” level and its “1” level.
–4–
REV. A
AD809
USING THE AD809
Ground Planes
VCC1
Use of one ground plane for connections to both analog and
digital grounds is recommended.
Synthesizer Input
TTL/CMOSIN
2*ITTL
2*ITTL
80µA
OR
0µA
80µA
OR
0µA
Power Supply Connections
Use of a 10 µF capacitor between VCC and ground is recommended. Care should be taken to isolate the +5 V power trace
to VCC2 (Pin 3). The VCC2 pin is used inside the device to provide the CLKOUT/CLKOUTN signals.
500Ω
VEE
Use of a trace connecting Pin 14 and Pin 6 (AVCC2 and VCC1
respectively) is recommended. Use of 0.1 µF capacitors between
IC power supply and ground is recommended. Power supply
decoupling should take place as close to the IC as possible.
Refer to the schematic, Figure 5, for advised connections.
VCC1
7.5kΩ
Synthesizer Input
CLKIN/CLKINN
PECL INPUT
Transmission Lines
Use of 50 Ω transmission lines are recommended for PECL
inputs.
7.5kΩ
500Ω
ITTL
500Ω
40µA
40µA
Terminations
Termination resistors should be used for PECL input signals.
Metal, thick film, 1% tolerance resistors are recommended.
Termination resistors for the PECL input signals should be
placed as close as possible to the PECL input pins.
VEE
VCC2
Connections from the power supply to load resistors for input
and output signals should be individual, not daisy chained. This
will avoid crosstalk on these signals.
460Ω
460Ω
PLL Differential
Output Stage–
CLKOUT/CLKOUTN
Loop Damping Capacitor, C D
DIFFERENTIAL
OUTPUT
A ceramic capacitor may be used for the loop damping capacitor. A 22 nF capacitor provides a damping factor of 10.
2.6mA
VEE
Figure 4. Simplified Schematics
C1
0.1µF
J5
R6
3.65kΩ
J1 C2 0.1µF
ECL INN
JUMPER
W2
50Ω STRIP LINE
EQUAL LENGTH
R5
301Ω
R2
49.9Ω
R1
49.9Ω
2 PECLIN
J3 C4 0.1µF
C7
R7 100Ω
J4 C5 0.1µF
R8 100Ω
R16
301Ω
VEE 16
AVCC2 14
4 CLKOUTN
CLKIN 13
R17
3.65kΩ
JUMPER
W3
MUX 15
3 VCC2
5 CLKOUT
CLKOUT
C12
0.1µF
+5V
AD809
1 PECLINN
ECL IN
MUX
EXT
GND
16-PIN SOIC
SOLDERED TO BOARD
J2 C3 0.1µF
CLKOUTN
JUMPER
W1
R14
49.9Ω
C9
R15
49.9Ω C13 0.1µF
J6
C14 0.1µF
J7
C15 0.1µF
J8
CLKIN
CLKINN 12
CLKINN
R3
C6 100Ω
0.1µF
R4
100Ω
R11
154Ω
R12
154Ω
C8
TP1
CD
TP2
VECTOR PINS SPACED FOR THROUGH-HOLE
CAPACITOR ON VECTOR CUPS.
COMPONENT SHOWN FOR REFERENCE ONLY.
6 VCC1
AVCC1 11
7 CF1
TTL/CMOSIN 10
8 CF2
AVEE 9
C10
CMOS/TTL IN
R13
49.9Ω
GUARD RING
NOTE:
C7–C10 ARE 0.1µF BYPASS CAPACITORS
C11
10µF
TP3
+5V
RIGHT ANGLE SMA CONNECTOR
OUTER SHELL TO GND PLANE
TP4
GND
ALL RESISTORS ARE 1% 1/8 WATT SURFACE MOUNT
TPx
TEST POINTS ARE VECTOR PINS
Figure 5. Evaluation Board Schematic
REV. A
–5–
AD809
Figure 6. Evaluation Board: Component Side
Figure 7. Evaluation Board: Solder Side
–6–
REV. A
AD809
Figure 8. Evaluation Board: INT2
REV. A
–7–
AD809
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
16
C2045a–2–1/97
16-Lead Small Outline IC Package
(R-16A)
9
0.1574 (4.00)
0.1497 (3.80)
PIN 1
0.2440 (6.20)
0.2284 (5.80)
8
1
0.3937 (10.00)
0.3859 (9.80)
0.0196 (0.50)
x 45 °
0.0099 (0.25)
0.0688 (1.75)
0.0532 (1.35)
0.0500
(1.27)
BSC
0.0192 (0.49)
0.0138 (0.35)
0.0099 (0.25)
0.0075 (0.19)
8°
0°
0.0500 (1.27)
0.0160 (0.41)
PRINTED IN U.S.A.
0.0098 (0.25)
0.0040 (0.10)
–8–
REV. A