High Temperature, Low Drift,
Micropower 2.5 V Reference
ADR225
Data Sheet
PIN CONFIGURATION
Extreme high temperature operation
−40°C to +210°C, 8-lead FLATPACK
−40°C to +175°C, 8-lead SOIC
Temperature coefficient
40 ppm/°C, 8-lead FLATPACK
10 ppm/°C, 8-lead SOIC
High output current: 10 mA
Low supply current: 50 µA maximum
Initial accuracy: ±0.4% (±10 mV maximum), 8-lead SOIC
Low dropout voltage
Wide supply range: 3.3 V to 16 V
8
NC
VS 2
ADR225
7
NC
NC 3
TOP VIEW
(Not to Scale)
6
OUTPUT
5
NC
NC 1
GND 4
NOTES
1. NC = NO CONNECT. DO NOT
CONNECT TO THIS PIN.
11525-001
FEATURES
Figure 1. Pin Configuration for SOIC and FLATPACK Packages
APPLICATIONS
Down-hole drilling and instrumentation
Avionics
Heavy industrial
High temperature environments
GENERAL DESCRIPTION
The ADR225 is a precision 2.5 V band gap voltage reference
specified for a high temperature operation of 175°C and 210°C.
It uses a micropower core topology and laser trimming of highly
stable, thin film resistors to achieve a temperature coefficient of
30 ppm/°C (maximum) up to 175°C and an initial accuracy of 0.4%
(±10 mV maximum). A maximum operating current of 50 µA
and a low dropout voltage allow the ADR225 to function very
well in battery-powered equipment.
The ADR225 voltage reference is offered in an 8-lead SOIC
package with an operating temperature range of −40°C to +175°C.
Rev. B
It is also available in an 8-lead ceramic flat pack (FLATPACK)
with an operating temperature range of −40°C to +210°C. Both
devices are designed for robustness at extreme temperatures
and are qualified for 1000 hours of operation at the maximum
temperature rating.
The ADR225 is a member of a growing series of high temperature
qualified products offered by Analog Devices, Inc. For a complete
selection table of the available high temperature products, see
the high temperature product list and qualification data available
at www.analog.com/hightemp.
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©2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADR225
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Predicted Lifetime vs. Operating Temperature .........................4
Applications ....................................................................................... 1
Thermal Resistance .......................................................................4
Pin Configuration ............................................................................. 1
ESD Caution...................................................................................4
General Description ......................................................................... 1
Typical Performance Characteristics ..............................................5
Revision History ............................................................................... 2
Theory of Operation .........................................................................9
Specifications..................................................................................... 3
Basic Voltage Reference Connections ........................................9
Electrical Characteristics ............................................................. 3
Outline Dimensions ....................................................................... 10
Absolute Maximum Ratings............................................................ 4
Ordering Guide .......................................................................... 10
REVISION HISTORY
11/13—Rev. A to Rev. B
Change to Features Section ............................................................. 1
Added Caption to Figure 1 .............................................................. 1
Changes to Table 1 ............................................................................ 3
Added Figure 6, Figure 7, Figure 8, Figure 12, Figure 13,
Figure 14, Figure 18, and Figure 19; Renumbered
Sequentially ....................................................................................... 5
9/13—Rev. 0 to Rev. A
Changes to Data Sheet Title and Added Wide Supply Range: 3.3 V
to 16 V to Features Section .............................................................. 1
Changed Supply Voltage from −0.3 V to +15 V to −0.3 V to
+18 V; Table 2 .................................................................................... 4
7/13—Revision 0: Initial Version
Rev. B | Page 2 of 12
Data Sheet
ADR225
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
VS = 3.3 V, VOUT = 2.5 V, TMIN < TA < TMAX, unless otherwise noted.
Table 1.
Parameter
SUPPLY CURRENT
INITIAL ACCURACY 1
TEMPERATURE COEFFICIENT 2
REGULATION
Line Regulation
Load Regulation 3
VOLTAGE
Dropout Voltage
Noise Voltage
1
2
Symbol
ISY
VO
TCVOUT
Test Conditions/Comments
No load
IOUT = 0 mA
IOUT = 0 mA
8-Lead SOIC
−40°C ≤ TA ≤ +175°C
Min
Typ
Max
30
50
±2
±10
10
30
ΔVOUT/ΔVIN
ΔVOUT/ΔVLOAD
3.0 V ≤ VS ≤ 15 V, IOUT = 0 mA
VS = 5.0 V, 0 mA ≤ IOUT ≤ 10 mA
0.025
0.025
VS − VOUT
eN
ILOAD = 10 mA
0.1 Hz to 10 Hz
25
Unit
µA
mV
ppm/°C
0.25
0.25
1.5
1.5
mV/V
mV/mA
1.00
V
µV p-p
0.1
0.1
1.00
For proper operation, a 1 µF capacitor is required between the OUTPUT pin and the GND pin of the device.
TCVOUT is defined as the ratio of output change with temperature variation to the specified temperature range expressed in ppm/°C.
TCVOUT = (VMAX − VMIN)/VOUT(TMAX − TMIN)
3
8-Lead FLATPACK
−40°C ≤ TA ≤ +210°C
Min
Typ
Max
40
60
±5
±60
40
80
Load regulation specification includes the effect of self-heating.
Rev. B | Page 3 of 12
25
ADR225
Data Sheet
ABSOLUTE MAXIMUM RATINGS
100k
Table 2.
−40°C to +175°C
−40°C to +210°C
−40°C to +200°C
−40°C to +245°C
300°C
10k
1k
100
10
1
120
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PREDICTED LIFETIME vs. OPERATING
TEMPERATURE
Comprehensive reliability testing is performed on the ADR225.
Product lifetimes at extended operating temperature are obtained
using high temperature operating life (HTOL). Lifetimes are
predicted from the Arrhenius equation, taking into account
potential design and manufacturing failure mechanism
assumptions. HTOL is performed to JEDEC JESD22-A108. A
minimum of three wafer fab and assembly lots are processed
through HTOL at the maximum operating temperature.
Comprehensive reliability testing is performed on all Analog
Devices, Inc., high temperature (HT) products.
130
140
150
160
170
180
190
210
200
OPERATING TEMPERATURE (°C)
11525-021
Rating
−0.3 V to +18 V
−0.3 V to VS + 0.3 V
−65°C to +150°C
PREDICTED LIFETIME (Hours)
Parameter
Supply Voltage
OUTPUT to GND
Storage Temperature Range
Operating Temperature Range
8-Lead SOIC
8-Lead FLATPACK
Junction Temperature Range
8-Lead SOIC
8-Lead FLATPACK
Lead Temperature (Soldering 60 sec)
Figure 2. Predicted Lifetime vs. Operating Temperature
THERMAL RESISTANCE
θJA is specified for worst-case conditions; that is, θJA is specified
for the device soldered in the circuit board.
Table 3.
Package Type
8-Lead SOIC
8-Lead FLATPACK
ESD CAUTION
Rev. B | Page 4 of 12
θJA
121
100
θJC
43
15
Unit
°C/W
°C/W
Data Sheet
ADR225
TYPICAL PERFORMANCE CHARACTERISTICS
VS = 3.3 V, VOUT = 2.5 V, TMIN ≤ TA ≤ TMAX for 8-lead SOIC package, unless otherwise noted.
2.56
2.510
2.505
2.54
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
2.55
2.500
2.53
2.52
2.51
2.495
2.50
2.49
11525-100
20 35 50 65 80 95 110 125 140 155 170
TEMPERATURE (°C)
–50
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
5
11525-004
2.490
–40 –25 –10
TEMPERATURE (°C)
Figure 6. Output Voltage (VOUT) vs. Temperature, FLATPACK Package
Figure 3. Output Voltage (VOUT) vs. Temperature
7
18
16
6
NUMBER OF UNITS
NUMBER OF UNITS
14
12
10
8
6
5
4
3
2
4
1
2
–18
–12
–6
0
6
12
18
24
30
TCVOUT (ppm/°C)
0
TCVOUT (ppm/°C)
Figure 4. TCVOUT Distribution, −40°C to +175°C
11525-101
–24
0
4
8
12
16
20
24
28
32
36
40
44
48
52
56
60
64
68
72
76
80
84
88
–30
11525-005
0
Figure 7. TCVOUT Distribution, −40°C to +210°C, FLATPACK Package
70
25
60
20
NUMBER OF PARTS
40
30
20
15
10
5
0
–0.5 –0.4 –0.3 –0.2 –0.1 0
0.1 0.2 0.3 0.4
OUTPUT VOLTAGE ACCURACY (%)
0.5
0.6
0
0
0.2 0.4 0.6
0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
OUTPUT VOLTAGE ACCURACY (%)
2.4
11525-102
10
11525-006
NUMBER OF PARTS
50
Figure 8. Output Voltage Accuracy at 210°C, FLATPACK Package
Figure 5. Output Voltage Accuracy at 175°C
Rev. B | Page 5 of 12
ADR225
Data Sheet
50
60
45
55
50
SUPPLY CURRENT (µA)
35
30
25
20
15
10
45
40
35
30
25
20
15
10
5
20 35 50 65 80 95 110 125 140 155 170
TEMPERATURE (°C)
–50
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
5
11525-007
5
0
–40 –25 –10
TEMPERATURE (°C)
Figure 9. Supply Current (ISY) vs. Temperature
11525-103
SUPPLY CURRENT (µA)
40
Figure 12. Supply Current (ISY) vs. Temperature, FLATPACK Package
0
50
–5
–50
LOAD REGULATION (ppm/mA)
LOAD REGULATION (ppm/mA)
0
–10
–15
–20
–25
–100
–150
–200
–250
–300
–350
–400
–450
TEMPERATURE (°C)
11525-104
TEMPERATURE (°C)
–500
–50
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
20 35 50 65 80 95 110 125 140 155 170
11525-009
–30
–40 –25 –10 5
Figure 13. Load Regulation vs. Temperature (ILOAD = 0 mA to 10 mA),
FLATPACK Package
Figure 10. Load Regulation vs. Temperature (ILOAD = 0 mA to 10 mA)
500
60
450
LINE REGULATION (ppm/V)
400
40
30
20
10
350
300
250
200
150
100
50
0
0
20
35
50
65
80
95 110 125 140 155 170
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 11. Line Regulation vs. Temperature
Figure 14. Line Regulation vs. Temperature, FLATPACK Package
Rev. B | Page 6 of 12
11525-105
5
–50
–50
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
–10
–40 –25 –10
11525-008
LINE REGULATION (ppm/V)
50
Data Sheet
1.0
ADR225
1.0
–40°C
+25°C
+175°C
0.9
0.8
DROPOUT VOLTAGE (V)
0.7
0.6
0.5
0.4
0.3
0.7
0.6
0.5
0.4
0.3
0.2
0.2
0.1
0.1
2
4
6
8
10
12
LOAD CURRENT (mA)
0
Figure 15. Dropout Voltage vs. Load Current (ILOAD)
0
2
4
6
8
10
12
LOAD CURRENT (mA)
11525-106
0
11525-010
DROPOUT VOLTAGE (V)
0.8
0
–40°C
+25°C
+210°C
0.9
Figure 18. Dropout Voltage vs. Load Current (ILOAD), FLATPACK Package
2.508
2.540
UNIT 1
UNIT 3
UNIT 5
2.535
2.506
OUTPUT VOLTAGE (V)
2.504
2.502
2.500
2.525
2.520
2.515
2.510
2.505
2.498
55
70
85
100
115
130
145
160
2.495
25
11525-011
2.496
40
175
TEMPERATURE (°C)
40
55
70
85
100 115 130 145 160 175 190 205
TEMPERATURE (°C)
Figure 16. Thermal Hysteresis, ILOAD = 0 mA
11525-107
2.500
Figure 19. Thermal Hysteresis, ILOAD = 0 mA, FLATPACK Package
VIN = 5V/DIV
CIN = COUT = 1µF
RL = 10kΩ
VIN = 2V/DIV
COUT = 1µF
NO LOAD
10V
5V
0V
1
VOUT = 1V/DIV
1
VOUT = 200mV/DIV
2
CH1 2V
B
W
CH2 1V
M100µs
A CH1
4.4V
CH1 5V
Figure 17. Power-On Response (see Figure 25)
B
W
CH2 200mV
M200µs
A CH1
7.3V
Figure 20. Line Transient Response (see Figure 25)
Rev. B | Page 7 of 12
11525-014
2
11525-013
OUTPUT VOLTAGE (V)
2.530
ADR225
Data Sheet
LOAD CURRENT
10.24
0mA
OUTPUT IMPEDANCE (Ω)
5.12
10mA
1
VOUT = 20mV/DIV
COUT = 1µF
2
2.56
1.28
0.64
0.32
0.16
0.08
0.04
CH2 20mV
M100µs
A CH1
1.32V
0.01
1
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
Figure 23. Output Impedance (ZOUT) vs. Frequency, CIN = COUT = 1 µF
Figure 21. Load Transient Response
–20
–40
–60
–80
–100
–120
10
100
1k
10k
100k
FREQUENCY (Hz)
1M
10M
11525-015
POWER SUPPLY REJECTION RATIO (dB)
0
Figure 22. Power Supply Rejection Ratio (PSRR) vs. Frequency, CLOAD = 1 µF
Rev. B | Page 8 of 12
11525-020
CH1 1V
11525-012
0.02
Data Sheet
ADR225
THEORY OF OPERATION
NC 1
VS
The circuit shown in Figure 24 is the basic configuration for the
ADR225. Note that a 10 µF and 0.1 µF bypass network on the input
and at least a 1 µF bypass capacitor on the output are required for
proper device operation. It is recommended that no connections
be made to Pin 1, Pin 3, Pin 5, Pin 7, and Pin 8.
10µF
0.1µF
8 NC
7 NC
2
NC 3
ADR225
6
4
OUTPUT
+ 1µF
TANT
5 NC
+
1µF
11525-002
BASIC VOLTAGE REFERENCE CONNECTIONS
NC = NO CONNECT.
Figure 24. Basic Voltage Reference Connections
V+
VCC
+5V
+5V
U1
ADR225
C2
0.1µF
GND
+ C3
1µF
C4
0.1µF
R3
2.5kΩ
+VS
AD8634
+IN A
+5V
–IN A
U3
AD8229
+IN
–5V
V–
–IN
R1
2.5kΩ
Figure 25. Typical High Temperature Resistance Temperature Detector (RTD) Signal Conditioning Circuit
Rev. B | Page 9 of 12
VOUT
RTD
–5V
–VS
11525-017
OUTPUT
+ C1
10µF
U2A
R2
2.5kΩ
VS
ADR225
Data Sheet
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
1
5
6.20 (0.2441)
5.80 (0.2284)
4
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0040)
1.75 (0.0688)
1.35 (0.0532)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
SEATING
PLANE
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
012407-A
8
4.00 (0.1574)
3.80 (0.1497)
Figure 26. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
1.00
0.260
0.255 SQ
0.250
0.195
0.190 SQ
0.185
1
0.155
0.150
0.145
8
4
0.012 R
TYP
0.006
0.005
0.004
0.035
TYP
0.019
0.017
0.015
5
TOP VIEW
0.05 TYP
IDEX
MARK
0.091
0.083
0.075
END VIEW
0.026 MIN
0.054
0.044
0.034
BOTTOM VIEW
0.024
0.007
MIN
SIDE VIEW
03-26-2013-A
0.053
0.050
0.047
0.175
Figure 27. 8-Lead Ceramic Flat Package [FLATPACK]
(F-8-2)
Dimensions shown in inches
ORDERING GUIDE
Model 1
ADR225HRZN
ADR225HFZ
1
Temperature Range
−40°C to +175°C
−40°C to +210°C
Package Description
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Ceramic Flat Package [FLATPACK]
Z = RoHS Compliant Part.
Rev. B | Page 10 of 12
Package Option
R-8
F-8-2
Data Sheet
ADR225
NOTES
Rev. B | Page 11 of 12
ADR225
Data Sheet
NOTES
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D11525-0-11/13(B)
Rev. B | Page 12 of 12