Rail-to-Rail, Very Fast, 2.5 V to 5.5 V, Single-Supply LVDS Comparators / ADCMP604

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Rail-to-Rail, Very Fast, 2.5 V to 5.5 V,
Single-Supply LVDS Comparators
ADCMP604/ADCMP605
Data Sheet
FUNCTIONAL BLOCK DIAGRAM
Fully specified rail to rail at VCCI = 2.5 V to 5.5 V
Input common-mode voltage from −0.2 V to VCCI + 0.2 V
Low glitch LVDS-compatible output stage
1.6 ns propagation delay
37 mW at 2.5 V
Shutdown pin
Single-pin control for programmable hysteresis and latch
Power supply rejection > 60 dB
−40°C to +125°C operation
VCCO
(ADCMP605 ONLY)
VCCI
VP NONINVERTING
INPUT
Q OUTPUT
ADCMP604/
ADCMP605
LVDS
Q OUTPUT
VN INVERTING
INPUT
LE/HYS INPUT
APPLICATIONS
SDN INPUT
(ADCMP605
ONLY)
05916-001
FEATURES
Figure 1.
High speed instrumentation
Clock and data signal restoration
Logic level shifting or translation
Pulse spectroscopy
High speed line receivers
Threshold detection
Peak and zero-crossing detectors
High speed trigger circuitry
Pulse-width modulators
Current-/voltage-controlled oscillators
Automatic test equipment (ATE)
GENERAL DESCRIPTION
The ADCMP604/ADCMP605 are very fast comparators fabricated
on the Analog Devices, Inc. proprietary XFCB2 process. These
comparators are exceptionally versatile and easy to use. Features
include an input range from VEE − 0.5 V to VCCI + 0.2 V, low noise,
LVDS-compatible output drivers, and TTL/CMOS latch inputs
with adjustable hysteresis and/or shut-down inputs.
A flexible power supply scheme allows the devices to operate
with a single 2.5 V positive supply and a −0.5 V to +2.7 V input
signal range up to a 5.5 V positive supply with a −0.5 V to +5.7 V
input signal range. Split input/output supplies, with no sequencing
restrictions on the ADCMP605, support a wide input signal
range with greatly reduced power consumption.
The devices offer 1.5 ns propagation delays with 1 ps rms
random jitter (RJ). Overdrive and slew rate dispersion are
typically less than 50 ps.
The LVDS-compatible output stage is designed to drive any
standard LVDS input. The comparator input stage offers robust
protection against large input overdrive, and the outputs do not
phase reverse when the valid input signal range is exceeded. High
speed latch and programmable hysteresis features are also provided
in a unique single-pin control option.
The ADCMP604 is available in a 6-lead SC70 package, and the
ADCMP605 is available in a 12-lead LFCSP.
Rev. C
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ADCMP604/ADCMP605
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications Information .............................................................. 10
Applications ....................................................................................... 1
Power/Ground Layout and Bypassing ..................................... 10
Functional Block Diagram .............................................................. 1
LVDS-Compatible Output Stage .............................................. 10
General Description ......................................................................... 1
Using/Disabling the Latch Feature........................................... 10
Revision History ............................................................................... 2
Optimizing Performance........................................................... 10
Specifications..................................................................................... 3
Comparator Propagation Delay Dispersion ........................... 11
Electrical Characteristics ............................................................. 3
Comparator Hysteresis .............................................................. 11
Timing Information ......................................................................... 5
Crossover Bias Points ................................................................. 12
Absolute Maximum Ratings............................................................ 6
Minimum Input Slew Rate Requirement ................................ 12
Thermal Resistance ...................................................................... 6
Typical Application Circuits ......................................................... 13
ESD Caution .................................................................................. 6
Outline Dimensions ....................................................................... 14
Pin Configurations and Function Descriptions ........................... 7
Ordering Guide .......................................................................... 14
Typical Performance Characteristics ............................................. 8
REVISION HISTORY
1/15—Rev. B to Rev. C
Changes to Figure 4 .......................................................................... 7
Change to Figure 16 Caption .......................................................... 9
Updated Outline Dimensions ....................................................... 14
Changes to Ordering Guide .......................................................... 14
11/14—Rev. A to Rev. B
Changes to Figure 4 and Table 6 ..................................................... 7
Changes to Figure 15 and Figure 16 ............................................... 9
Updated Outline Dimensions ....................................................... 14
Changes to Ordering Guide .......................................................... 14
8/07—Rev. 0 to Rev. A
Changes to Features and General Description ..............................1
Changes to Electrical Characteristics Section ...............................3
Changes to Table 3.............................................................................6
Changes to Layout .............................................................................7
Changes to Figure 8 ...........................................................................8
Changes to Figure 14.........................................................................9
Changes to Power/Ground Layout and Bypassing Section, and
Using/Disabling the Latch Feature Section ................................. 10
Changes to Comparator Hysteresis Section ................................ 11
Changes to Crossover Bias Points Section .................................. 12
Changes to Ordering Guide .......................................................... 14
10/06—Revision 0: Initial Version
Rev. C | Page 2 of 14
Data Sheet
ADCMP604/ADCMP605
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
VCCI = VCCO = 2.5 V, TA = −40°C to +125°C, typical at TA = 25 °C, unless otherwise noted.
Table 1.
Parameter
DC INPUT CHARACTERISTICS
Voltage Range
Common-Mode Range
Differential Voltage
Offset Voltage
Bias Current
Offset Current
Capacitance
Resistance, Differential Mode
Resistance, Common Mode
Active Gain
Common-Mode Rejection Ratio
Hysteresis
LATCH ENABLE PIN CHARACTERISTICS
(ADCMP605 ONLY)
VIH
VIL
IIH
IIL
HYSTERESIS MODE AND TIMING (ADCMP605 ONLY)
Hysteresis Mode Bias Voltage
Minimum Resistor Value
Hysteresis Current
Latch Setup Time
Latch Hold Time
Latch-to-Output Delay
Latch Minimum Pulse Width
SHUTDOWN PIN CHARACTERISTICS (ADCMP605 ONLY)
VIH
VIL
IIH
IIL
Sleep Time
Wake-Up Time
DC OUTPUT CHARACTERISTICS
Differential Output Voltage Level
ΔVOD
Common-Mode Voltage
Peak-to-Peak Common-Mode Output
Symbol
Conditions
Min
VP, VN
VCCI = 2.5 V to 5.5 V
VCCI = 2.5 V to 5.5 V
VCCI = 2.5 V to 5.5 V
−0.5
−0.2
VOS
IP, IN
−5.0
−5.0
−2.0
±2
−0.1 V to VCCI
−0.5 V to VCCI + 0.5 V
200
100
1
750
370
62
VCCI = 2.5 V, VCCO = 2.5 V,
VCM = −0.2 V to +2.7 V
VCCI = 2.5 V, VCCO = 5.0 V
RHYS = ∞
50
Hysteresis is shut off
Latch mode guaranteed
VIH = VCCO + 0.2 V
VIL = 0.4 V
2.0
−0.2
−6
−0.1
Current sink −1 µA
Hysteresis = 120 mV
Hysteresis = 120 mV
VOD = 50 mV
VOD = 50 mV
VOD = 50 mV
VOD = 50 mV
1.145
30
−25
Comparator is operating
Shutdown guaranteed
VIH = VCCO
VIL = 0 V
10% output swing
VOD = 50 mV, output valid
VCCI = VCCO = 2.5 V to 5.0 V
(ADCMP604)
VCCO = 2.5 V to 5.0 V (ADCMP605)
RLOAD = 100 Ω
RLOAD = 100 Ω
RLOAD = 100 Ω
RLOAD = 100 Ω
2.0
−0.2
−6
CP, CN
AV
CMRR
tS
tH
tPLOH, tPLOL
tPL
tSD
tH
VOD
VOCI
VOC (p-p)
Typ
Rev. C | Page 3 of 14
Max
Unit
VCCI + 0.2
VCCI + 0.2
VCCI
+5.0
+5.0
+2.0
V
V
V
mV
µA
µA
pF
kΩ
kΩ
dB
dB
7500
4000
50
dB
mV
<0.1
+0.4
1.25
VCCO
+0.8
+6
+0.1
V
V
µA
mA
1.40
110
−8
V
kΩ
µA
ns
ns
ns
ns
VCCO
+0.6
+6
−0.1
V
V
µA
mA
ns
ns
445
50
1.375
50
mV
mV
V
mV
−2
2.7
20
24
+0.4
1.4
25
245
1.125
350
ADCMP604/ADCMP605
Parameter
AC PERFORMANCE 1
Rise Time/Fall Time
Propagation Delay
Propagation Delay Skew—Rising to Falling Transition
Propagation Delay Skew—Q to QB
Overdrive Dispersion
Common-Mode Dispersion
Input Bandwidth
Minimum Pulse Width
POWER SUPPLY
Input Supply Voltage Range
Output Supply Voltage Range
Positive Supply Differential (ADCMP605)
Positive Supply Current (ADCMP604)
Input Section Supply Current (ADCMP605)
Output Section Supply Current (ADCMP605)
Power Dissipation
Power Supply Rejection Ratio
Shutdown Mode ICCI
Shutdown Mode ICCO
1
Data Sheet
Symbol
Conditions
tR , tF
tPD
10% to 90%
VCCI = VCCO = 2.5 V to 5.0 V,
VOD = 50 mV
VCCI = VCCO = 2.5 V, VOD = 10 mV
VCCI = VCCO = 2.5 V to 5.0 V
VCCI = VCCO = 2.5 V to 5.0 V
10 mV < VOD < 125 mV
VCM = −0.2 V to VCCI + 0.2 V
tPINSKEW
PWMIN
VCCI
VCCO
VCCI − VCCO
VCCI − VCCO
IVCCI/VCCO
IVCCI
IVCCO
PD
PSRR
Min
VCCI = VCCO = 2.5 V to 5.0 V,
PWOUT = 90% of PWIN
Operating
Nonoperating
VCCI = VCCO = 2.5 V to 5.0 V
VCCI = 2.5 V to 5.5 V
VCCO = 2.5 V to 5.0 V
VCCI = VCCO = 2.5 V
VCCI = VCCO = 5.0 V
VCCI = VCCO = 2.5 V to 5.0 V
VCCI = VCCO = 2.5 V to 5.0 V
VCCI = VCCO = 2.5 V to 5.0 V
VIN = 100 mV square input at 50 MHz, VOD = 50 mV, VCM = 1.25 V, VCCI = VCCO = 2.5 V, unless otherwise noted.
Rev. C | Page 4 of 14
Typ
Max
600
1.6
ps
ns
3.0
70
70
1.6
250
500
1.3
ns
ps
ps
ns
ps
MHz
ns
2.5
2.5
−3
−5.0
15
1.6
15
37
95
5.5
5.0
+3
+5.0
21
3.0
23
55
120
−50
0.92
−30
Unit
1.1
+30
V
V
V
V
mA
mA
mA
mW
mW
dB
mA
µA
Data Sheet
ADCMP604/ADCMP605
TIMING INFORMATION
Figure 2 illustrates the ADCMP604/ADCMP605 latch timing relationships. Table 2 provides definitions of the terms shown in Figure 2.
1.1V
LATCH ENABLE
tS
tPL
tH
DIFFERENTIAL
INPUT VOLTAGE
VIN
VN ± VOS
VOD
tPLOH
tPDL
Q OUTPUT
50%
tF
tPDH
tPLOL
tR
05916-025
50%
Q OUTPUT
Figure 2. System Timing Diagram
Table 2. Timing Descriptions
Symbol
tPDH
Timing
Input-to-Output High Delay
tPDL
Input-to-Output Low Delay
tPLOH
Latch Enable-to-Output High Delay
tPLOL
Latch Enable-to-Output Low Delay
tH
Minimum Hold Time
tPL
tS
Minimum Latch Enable Pulse Width
Minimum Setup Time
tR
Output Rise Time
tF
Output Fall Time
VOD
Voltage Overdrive
Description
Propagation delay measured from the time the input signal crosses the reference
(± the input offset voltage) to the 50% point of an output low-to-high transition.
Propagation delay measured from the time the input signal crosses the reference
(± the input offset voltage) to the 50% point of an output high-to-low transition.
Propagation delay measured from the 50% point of the latch enable signal low-to-high
transition to the 50% point of an output low-to-high transition.
Propagation delay measured from the 50% point of the latch enable signal low-to-high
transition to the 50% point of an output high-to-low transition.
Minimum time after the negative transition of the latch enable signal that the input signal
must remain unchanged to be acquired and held at the outputs.
Minimum time that the latch enable signal must be high to acquire an input signal change.
Minimum time before the negative transition of the latch enable signal occurs that an
input signal change must be present to be acquired and held at the outputs.
Amount of time required to transition from a low to a high output as measured at the
20% and 80% points.
Amount of time required to transition from a high to a low output as measured at the
20% and 80% points.
Difference between the input voltages, VA and VB.
Rev. C | Page 5 of 14
ADCMP604/ADCMP605
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Parameter
Supply Voltages
Input Supply Voltage (VCCI to GND)
Output Supply Voltage (VCCO to GND)
Positive Supply Differential (VCCI − VCCO)
Input Voltages
Input Voltage
Differential Input Voltage
Maximum Input/Output Current
Shutdown Control Pin
Applied Voltage (SDN to GND)
Maximum Input/Output Current
Latch/Hysteresis Control Pin
Applied Voltage (HYS to GND)
Maximum Input/Output Current
Output Current
Temperature
Operating Temperature Range, Ambient
Operating Temperature, Junction
Storage Temperature Range
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Rating
−0.5 V to +6.0 V
−0.5 V to +6.0 V
−6.0 V to +6.0 V
Table 4. Thermal Resistance
−0.5 V to VCCI + 0.5 V
±(VCCI + 0.5 V)
±50 mA
−0.5 V to VCCO + 0.5 V
±50 mA
Package Type
6-Lead SC70 (KS-6)
12-Lead LFCSP_VQ (CP-12-1)
1
Measurement in still air.
ESD CAUTION
−0.5 V to VCCO + 0.5 V
±50 mA
±50 mA
−40°C to +125°C
150°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. C | Page 6 of 14
θJA1
426
62
Unit
°C/W
°C/W
Data Sheet
ADCMP604/ADCMP605
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Q 1
6
Q
5
VCCI /VCCO
4
VN
VEE
2
TOP VIEW
(Not to Scale)
VP 3
05916-002
ADCMP604
Figure 3. ADCMP604 Pin Configuration
Table 5. ADCMP604 Pin Function Descriptions (6-Lead SC70)
VCCO 1
VCCI 2
ADCMP605
TOP VIEW
(Not to Scale)
8 LE/HYS
VN 6
VP 4
7 SDN
VEE 5
VEE 3
9 VEE
NOTES
1. EXPOSED PAD. IF CONNECTED, THE
EPAD MUST BE CONNECTED TO VEE.
05916-003
VEE
VP
VN
VCCI/VCCO
Q
10 Q
2
3
4
5
6
Description
Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, VP, is greater than the
analog voltage at the inverting input, VN.
Negative Supply Voltage.
Noninverting Analog Input.
Inverting Analog Input.
Input Section Supply/Output Section Supply. VCCI and VCCO are shared pin.
Inverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the analog
voltage at the inverting input, VN.
11 VEE
Mnemonic
Q
12 Q
Pin No.
1
Figure 4. ADCMP605 Pin Configuration
Table 6. ADCMP605 Pin Function Descriptions (12-Lead LFCSP_WQ)
Pin No.
1
2
3, 5, 9, 11
4
6
7
8
10
Mnemonic
VCCO
VCCI
VEE
VP
VN
SDN
LE/HYS
Q
12
Q
Heat Sink Paddle
VEE
EPAD
Description
Output Section Supply.
Input Section Supply.
Negative Supply Voltages.
Noninverting Analog Input.
Inverting Analog Input.
Shutdown. Drive this pin low to shut down the device.
Latch/Hysteresis Control. Bias with resistor or current for hysteresis; drive low to latch.
Inverting Output. Q is at Logic low if the analog voltage at the noninverting input, VP, is greater than the
analog voltage at the inverting input, VN, if the comparator is in compare mode.
Noninverting Output. Q is at Logic high if the analog voltage at the noninverting input, VP, is greater
than the analog voltage at the inverting input, VN, if the comparator is in compare mode.
The metallic back surface of the package is electrically connected to VEE. It can be left floating because
Pin 3, Pin 5, Pin 9, and Pin 11 provide adequate electrical connection. It can also be soldered to the
application board if improved thermal and/or mechanical stability is desired.
Exposed Pad. If connected, the EPAD must be connected to VEE.
Rev. C | Page 7 of 14
ADCMP604/ADCMP605
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
VCCI = VCCO = 2.5 V, TA = 25°C, unless otherwise noted.
800
1.60
600
1.50
400
1.40
VCC = 5.5V
200
OUTPUT (V)
0
–200
1.30
OUTPUT VCM
1.20
1.10
–400
OUTPUT LO
1.00
–600
1
0
2
3
4
LE/HYS PIN (V)
5
6
7
0.90
2.4
05916-010
–800
–1
2.9
3.4
3.9
4.4
VCCO (V)
4.9
5.4
5.9
05916-011
CURRENT (µA)
VCC = 2.5V
OUTPUT HI
Figure 8. LVDS Output Level vs. VCCO (V)
Figure 5. LE/HYS Pin Current vs. Voltage
200
850
150
800
750
VCC = 2.5V
VCC = 5.5V
RISE/FALL (ps)
CURRENT (µA)
100
50
0
–50
700
+125°C
650
600
+25°C
550
–40°C
500
–100
0
1
2
3
4
SDN PIN (V)
5
6
7
400
2.40
2.80
3.20
3.60
4.00 4.40
VCCO (V)
4.80
5.20
5.60
6.00
05916-007
–1
05916-006
450
–150
Figure 9. LVDS Output Rise/Fall Time vs. VCCO (V)
Figure 6. SDN Pin Current vs. Voltage
250
10
+125°C
8
+25°C
6
200
–40°C
HYSTERESIS (mV)
4
0
–2
–4
150
100
VCC = 2.5V
–6
50
–8
VCC = 5.5V
–0.5
0.0
2.0
1.0
1.5
0.5
VCM AT VCC = 2.5V
2.5
3.0
3.5
0
50
100
150
200
250
300
350
400
HYSTERESIS RESISTOR (kΩ)
Figure 10. Hysteresis vs. Hysteresis Resistor
Figure 7. Input Bias Current vs. Input Common-Mode Voltage
Rev. C | Page 8 of 14
450
500
05916-008
–10
–1.0
05916-009
IB (µA)
2
Data Sheet
ADCMP604/ADCMP605
350
0.44
+125°C
300
0.43
0.42
OUTPUT SWING (V)
HYSTERESIS (mV)
250
+25°C
200
150
100
0.41
0.40
0.39
0.38
–40°C
50
0
–2
–4
–6
–8
–10
–12
HYS PIN CURRENT (µA)
–14
–16
–18
0.36
2.4
Figure 11. Hysteresis vs. HYS Pin Current
3.4
4.4
VCCO (V)
05916-013
0
05916-012
0.37
5.4
Figure 14. LVDS Output Swing vs. VCCO (V)
3.5
1.425V
PROPAGATION DELAY (ns)
Q
3.0
2.5
2.0
PROPAGATION
DELAY
1.5
0
10
20
30
40
50
60
OVERDRIVE (mV)
70
80
90
100
925.0mV
Figure 12. Propagation Delay vs. Input Overdrive
2.000ns/DIV
05916-014
1.0
05916-004
Q
Figure 15. 50 MHz Output Voltage Waveform at VCCO = 2.5 V
1.6
1.543V
Q
PROPAGATION
DELAY RISE ns
DELAY (ns)
1.5
PROPAGATION
DELAY FALL ns
–0.2
0.2
0.6
1.0
1.4
1.8
VCM AT VCC (2.5V)
2.2
2.6
3.0
05916-005
Q
1.3
–0.6
1.043V
Figure 13. Propagation Delay vs. Input Common-Mode Voltage
2.000ns/DIV
05916-015
1.4
Figure 16. 50 MHz Output Voltage Waveform at VCCO = 5 V
Rev. C | Page 9 of 14
ADCMP604/ADCMP605
Data Sheet
APPLICATIONS INFORMATION
POWER/GROUND LAYOUT AND BYPASSING
LVDS-COMPATIBLE OUTPUT STAGE
The ADCMP604/ADCMP605 comparators are very high speed
devices. Despite the low noise output stage, it is essential to use
proper high speed design techniques to achieve the specified
performance. Because comparators are uncompensated amplifiers,
feedback in any phase relationship is likely to cause oscillations
or undesired hysteresis. The use of low impedance supply planes is
of critical importance particularly the output supply plane (VCCO)
and the ground plane (GND). Individual supply planes are
recommended as part of a multilayer board. Providing the
lowest inductance return path for switching currents ensures
the best possible performance in the target application.
Specified propagation delay dispersion performance is only
achieved by keeping parasitic capacitive loads at or below the
specified minimums. The outputs of the ADCMP604 and
ADCMP605 are designed to directly drive any standard
LVDS-compatible input.
It is also important to adequately bypass the input and output
supplies. Multiple high quality 0.01 µF bypass capacitors should
be placed as close as possible to each of the VCCI and VCCO supply
pins and should be connected to the GND plane with redundant
vias. At least one of these should be placed to provide a physically
short return path for output currents flowing back from ground
to the VCCI pin and the VCCO pin. High frequency bypass capacitors
should be carefully selected for minimum inductance and ESR.
Parasitic layout inductance should also be strictly controlled to
maximize the effectiveness of the bypass at high frequencies.
If the package allows, and the input and output supplies have
been connected separately (VCCI ≠ VCCO), be sure to bypass each
of these supplies separately to the GND plane. Do not connect a
bypass capacitor between these supplies. It is recommended that
the GND plane separate the VCCI and VCCO planes when the
circuit board layout is designed to minimize coupling between
the two supplies to take advantage of the additional bypass
capacitance from each respective supply to the ground plane.
This enhances the performance when split input/output supplies
are used. If the input and output supplies are connected together
for single-supply operation (VCCI = VCCO), coupling between the
two supplies is unavoidable; however, careful board placement
can help keep output return currents away from the inputs.
USING/DISABLING THE LATCH FEATURE
The latch input is designed for maximum versatility. It can safely be
left floating or it can be driven low by any standard TTL/CMOS
device as a high speed latch. In addition, the pin can be operated as
a hysteresis control pin with a bias voltage of 1.25 V nominal and
an input resistance of approximately 70 kΩ. This allows the
comparator hysteresis to be easily controlled by either a resistor or
an inexpensive CMOS DAC. Driving this pin high or floating the
pin disables all hysteresis.
Hysteresis control and latch mode can be used together if an
open drain, an open collector, or a three-state driver is connected in
parallel to the hysteresis control resistor or current source.
Due to the programmable hysteresis feature, the logic threshold
of the latch pin is approximately 1.1 V, regardless of VCCO.
OPTIMIZING PERFORMANCE
As with any high speed comparator, proper design and layout
techniques are essential for obtaining the specified performance.
Stray capacitance, inductance, inductive power and ground
impedances, or other layout issues can severely limit performance
and often cause oscillation. Large discontinuities along input
and output transmission lines can also limit the specified
pulse-width dispersion performance. The source impedance
should be minimized as much as is practicable. High source
impedance, in combination with the parasitic input capacitance
of the comparator, causes an undesirable degradation in bandwidth
at the input, thus degrading the overall response. Thermal noise
from large resistances can easily cause extra jitter with slowly
slewing input signals. Higher impedances encourage undesired
coupling.
Rev. C | Page 10 of 14
Data Sheet
ADCMP604/ADCMP605
COMPARATOR PROPAGATION DELAY
DISPERSION
COMPARATOR HYSTERESIS
The ADCMP604/ADCMP605 comparators are designed to reduce
propagation delay dispersion over a wide input overdrive range
of 5 mV to VCCI − 1 V. Propagation delay dispersion is the variation
in propagation delay that results from a change in the degree of
overdrive or slew rate (how far or how fast the input signal is
driven past the switching threshold).
Propagation delay dispersion is a specification that becomes
important in high speed, time-critical applications, such as data
communications, automatic test and measurement, and
instrumentation. It is also important in event-driven applications,
such as pulse spectroscopy, nuclear instrumentation, and
medical imaging. Dispersion is defined as the variation in
propagation delay as the input overdrive conditions are changed
(see Figure 17 and Figure 18).
The addition of hysteresis to a comparator is often desirable in a
noisy environment, or when the differential input amplitudes
are relatively small or slow moving. The transfer function for a
comparator with hysteresis is shown in Figure 19. As the input
voltage approaches the threshold (0 V, in this example) from
below the threshold region in a positive direction, the comparator
switches from low to high when the input crosses +VH/2. The
new switching threshold becomes −VH/2. The comparator remains
in the high state until the threshold, −VH/2, is crossed from
below the threshold region in a negative direction. In this manner,
noise or feedback output signals centered on 0 V input cannot
cause the comparator to switch states unless it exceeds the region
bounded by ±VH/2.
OUTPUT
The ADCMP604/ADCMP605 dispersion is typically <1.6 ns as
the overdrive varies from 10 mV to 125 mV. This specification
applies to both positive and negative signals because each of the
ADCMP604 and ADCMP605 has substantially equal delays for
positive-going and negative-going inputs and very low output
skews.
VOH
VOL
–VH
2
INPUT VOLTAGE
10mV OVERDRIVE
05916-016
DISPERSION
Figure 17. Propagation Delay—Overdrive Dispersion
INPUT VOLTAGE
1V/ns
VN ± VOS
DISPERSION
05916-017
10V/ns
Q/Q OUTPUT
+VH
2
INPUT
Figure 19. Comparator Hysteresis Transfer Function
VN ± VOS
Q/Q OUTPUT
0V
05916-018
500mV OVERDRIVE
Figure 18. Propagation Delay—Slew Rate Dispersion
The customary technique for introducing hysteresis into a
comparator uses positive feedback from the output back to the
input. One limitation of this approach is that the amount of
hysteresis varies with the output logic levels, resulting in
hysteresis that is not symmetric about the threshold. The
external feedback network can also introduce significant
parasitics that reduce high speed performance and induce
oscillation in some cases.
The ADCMP605 comparator offers a programmable hysteresis
feature that significantly improves accuracy and stability.
Connecting an external pull-down resistor or a current source
from the LE/HYS pin to GND varies the amount of hysteresis in
a predictable and stable manner. Leaving the LE/HYS pin
disconnected or driving it high removes hysteresis. The
maximum hysteresis that can be applied using this pin is
approximately 160 mV. Figure 20 illustrates the amount of
hysteresis applied as a function of external resistor value. Figure 11
illustrates hysteresis as a function of current.
Rev. C | Page 11 of 14
ADCMP604/ADCMP605
Data Sheet
The hysteresis control pin appears as a 1.25 V bias voltage seen
through a series resistance of 70 kΩ ± 20% throughout the
hysteresis control range. The advantages of applying hysteresis
in this manner are improved accuracy, improved stability, reduced
component count, and maximum versatility. An external bypass
capacitor is not recommended on the HYS pin because it would
likely degrade the jitter performance of the device and impair the
latch function. As described in the Using/Disabling the Latch
Feature section, hysteresis control need not compromise the
latch function.
Rail-to-rail inputs of this type, in both op amps and comparators,
have a dual front-end design. Certain devices are active near the
VCCI rail and others are active near the VEE rail. At some
predetermined point in the common-mode range, a crossover
occurs. At this point, normally VCCI/2, the direction of the bias
current reverses and there are changes in measured offset
voltages and currents.
MINIMUM INPUT SLEW RATE REQUIREMENT
With the rated load capacitance and normal good PCB design
practice, as discussed in the Optimizing Performance section,
these comparators should be stable at any input slew rate with
no hysteresis. Broadband noise from the input stage is observed
in place of the violent chattering seen with most other high
speed comparators. With additional capacitive loading or poor
bypassing, oscillation is observed. This oscillation is due to the
high gain bandwidth of the comparator in combination with
feedback parasitics in the package and PCB. In many applications,
chattering is not harmful.
250
200
150
100
VCC = 2.5V
50
VCC = 5.5V
0
50
100
150
200
250
300
350
400
450
HYSTERESIS RESISTOR (kΩ)
500
05916-026
HYSTERESIS (mV)
CROSSOVER BIAS POINTS
Figure 20. Hysteresis vs. RHYS Control Resistor
Rev. C | Page 12 of 14
Data Sheet
ADCMP604/ADCMP605
TYPICAL APPLICATION CIRCUITS
2.5V TO 5V
2.5V
0.1µF
2kΩ
2kΩ
CMOS
OUTPUT
ADCMP604
ADCMP604
05916-019
INPUT
0.1µF
INPUT
1.25V
±50mV
LVDS
PWM
OUTPUT
Figure 21. Self-Biased, 50% Slicer
INPUT
1.25V
REF
2.5V TO 3.3V
10kΩ
10kΩ
ADCMP601
ADCMP604
100Ω
LVDS
82pF
05916-020
10kΩ
LE/HYS
100kΩ
Figure 22. LVDS to Repeater
05916-023
LVDS
Figure 25. Oscillator and Pulse-Width Modulator
2.5V TO 5V
2.5V TO 5V
ADCMP605
CONTROL
VOLTAGE
0V TO 2.5V
150kΩ
LE/HYS
150kΩ
Figure 23. Hysteresis Adjustment with Latch
10kΩ
ADCMP605
LVDS
OUTPUT
10kΩ
150kΩ
150kΩ
05916-022
LE/HYS
CONTROL
VOLTAGE
0V TO 2.5V
74AHC
1G07
HYSTERESIS
CURRENT
10kΩ
LE/HYS
Figure 26. Hysteresis Adjustment with Latch
2.5V
82pF
DIGITAL
INPUT
Figure 24. Voltage-Controlled Oscillator
Rev. C | Page 13 of 14
05916-024
74VHC
1G07
05916-021
DIGITAL
INPUT
ADCMP605
ADCMP604/ADCMP605
Data Sheet
OUTLINE DIMENSIONS
2.20
2.00
1.80
1.35
1.25
1.15
6
5
4
1
2
3
2.40
2.10
1.80
PIN 1
0.65 BSC
1.30 BSC
1.00
0.90
0.70
0.40
0.10
1.10
0.80
0.30
0.15
0.10 MAX
0.46
0.36
0.26
0.22
0.08
SEATING
PLANE
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-203-AB
Figure 27. 6-Lead Thin Shrink Small Outline Transistor Package [SC70]
(KS-6)
Dimensions shown in millimeters
PIN 1
INDICATOR
0.30
0.23
0.18
0.50
BSC
10
PIN 1
INDICATOR
12
1
9
EXPOSED
PAD
1.45
1.30 SQ
1.15
3
7
TOP VIEW
0.80
0.75
0.70
0.70
0.60
0.50
6
0.25 MIN
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
4
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WEED.
111808-A
3.10
3.00 SQ
2.90
Figure 28. 12-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADCMP604BKSZ-R2
ADCMP604BKSZ-REEL7
ADCMP604BKSZ-RL
EVAL-ADCMP604BKSZ
ADCMP605BCPZ-WP
ADCMP605BCPZ-R2
ADCMP605BCPZ-R7
EVAL-ADCMP605BCPZ
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
6-Lead Thin Shrink Small Outline Transistor Package [SC70]
6-Lead Thin Shrink Small Outline Transistor Package [SC70]
6-Lead Thin Shrink Small Outline Transistor Package [SC70]
Evaluation Board
12-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
12-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
12-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Evaluation Board
Z = RoHS Compliant Part
©2006–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05916-0-1/15(C)
Rev. C | Page 14 of 14
Package
Option
KS-6
KS-6
KS-6
Branding
G0Q
G0Q
G0Q
CP-12-4
CP-12-4
CP-12-4
G0K
G0K
G0K
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