16-Bit, 65 MSPS,
1.8 V Analog-to-Digital Converter
AD9266-EP
Enhanced Product
FEATURES
FUNCTIONAL BLOCK DIAGRAM
1.8 V analog supply operation
1.8 V to 3.3 V output supply
SNR
77.6 dBFS at 9.7 MHz input
76.4 dBFS at 70 MHz input
SFDR
94 dBc at 9.7 MHz input
93 dBc at 70 MHz input
Low power
111 mW at 65 MSPS
Differential input with 700 MHz bandwidth
On-chip voltage reference and sample-and-hold circuit
2 V p-p differential analog input
DNL = −0.5/+1.0 LSB
Interleaved data output for reduced pin-count interface
Serial port control options
Offset binary, Gray code, or twos complement data format
Optional clock duty cycle stabilizer
Integer 1 to 8 input clock divider
Built-in selectable digital test pattern generation
Energy-saving power-down modes
Data clock output (DCO) with programmable clock and
data alignment
AVDD
Supports defense and aerospace applications (AQEC standard)
Military temperature range (−55°C to +125°C)
Controlled manufacturing baseline
Enhanced product change notification
Qualification data available on request
APPLICATIONS
Communications
Diversity radio systems
Multimode digital receivers
GSM, EDGE, W-CDMA, LTE, CDMA2000, WiMAX, TD-SCDMA
Smart antenna systems
Battery-powered instruments
Handheld scope meters
Portable medical imaging
Ultrasound
Radar/LIDAR
PET/SPECT imaging
Rev. B
RBIAS
SPI
AD9266-EP
PROGRAMMING DATA
VIN+
ADC
CORE
VIN–
DRVDD
CMOS
OUTPUT BUFFER
VCM
OR
D15_D14
8
VREF
D1_D0
DCO
SENSE
REF
SELECT
DUTY CYCLE
STABILIZER
MODE
CONTROLS
PDWN DFS MODE
CLK+ CLK–
10476-001
DIVIDE
1 TO 8
Figure 1.
PRODUCT HIGHLIGHTS
1.
2.
3.
ENHANCED PRODUCT FEATURES
SDIO SCLK CSB
AGND
4.
The AD9266-EP operates from a single 1.8 V analog power
supply and features a separate digital output driver supply
to accommodate 1.8 V to 3.3 V logic families.
The sample-and-hold circuit maintains excellent performance
at high input frequencies and is designed for low cost, low
power, and ease of use.
A standard serial port interface supports various product
features and functions, such as data output formatting,
internal clock divider, power-down, DCO and data output
(D15_D14 to D1_D0) timing and offset adjustments, and
voltage reference modes.
The AD9266-EP is packaged in a 32-lead RoHS-compliant
LFCSP that is pin compatible with the AD9609 10-bit
ADC, the AD9629 12-bit ADC, and the AD9649 14-bit
ADC, enabling a simple migration path between 10-bit and
16-bit converters sampling at 65 MSPS.
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2012–2016 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
AD9266-EP
Enhanced Product
TABLE OF CONTENTS
Features .............................................................................................. 1
Digital Specifications ....................................................................6
Enhanced Product Features ............................................................ 1
Switching Specifications ...............................................................7
Applications ....................................................................................... 1
Timing Specifications ...................................................................8
Functional Block Diagram .............................................................. 1
Absolute Maximum Ratings ............................................................9
Product Highlights ........................................................................... 1
Thermal Characteristics ...............................................................9
Revision History ............................................................................... 2
ESD Caution...................................................................................9
General Description ......................................................................... 3
Pin Configuration and Function Descriptions........................... 10
Specifications..................................................................................... 4
Outline Dimensions ....................................................................... 11
DC Specifications ......................................................................... 4
Ordering Guide .......................................................................... 11
AC Specifications.......................................................................... 5
REVISION HISTORY
3/16—Rev. A to Rev. B
Change to Product Highlights ........................................................ 1
Changes to General Description .................................................... 3
Change to Pipeline Delay (Latency) Parameter, Table 4 ............. 7
Changes to Figure 3 and Table 8 ................................................... 10
1/12—Revision 0: Initial Version
7/12—Rev. 0 to Rev. A
Changes to Resolution Parameter, Table 1 and Note 3, Table 1 ........ 4
Rev. B | Page 2 of 12
Enhanced Product
AD9266-EP
GENERAL DESCRIPTION
The AD9266-EP is a monolithic, single-channel 1.8 V supply,
16-bit, 65 MSPS analog-to-digital converter (ADC). It features a
high performance sample-and-hold circuit and on-chip voltage
reference.
A differential clock input with a selectable internal 1-to-8 divide
ratio controls all internal conversion cycles. An optional duty cycle
stabilizer (DCS) compensates for wide variations in the clock duty
cycle while maintaining excellent overall ADC performance.
The product uses multistage differential pipeline architecture
with output error correction logic to provide 16-bit accuracy at
65 MSPS data rates and to guarantee no missing codes over the
full operating temperature range.
The interleaved digital output data is presented in offset binary,
gray code, or twos complement format. A data clock output (DCO)
is provided to ensure proper latch timing with receiving logic.
CMOS levels from 1.8 V through 3.3 V are supported.
The ADC contains several features designed to maximize
flexibility and minimize system cost, such as programmable
clock and data alignment and programmable digital test pattern
generation. The available digital test patterns include built-in
deterministic and pseudorandom patterns, along with custom
user-defined test patterns entered via the serial port interface (SPI).
The AD9266-EP is available in a 32-lead RoHS compliant LFCSP
and is specified over the −55°C to +125°C temperature range.
Additional application and technical information can be found
in the AD9266 data sheet.
Rev. B | Page 3 of 12
AD9266-EP
Enhanced Product
SPECIFICATIONS
DC SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, DCS disabled, unless otherwise noted.
Table 1.
Parameter
RESOLUTION
ACCURACY
No Missing Codes
Offset Error
Gain Error 1
Differential Nonlinearity (DNL) 2
Integral Nonlinearity (INL)2
TEMPERATURE DRIFT
Offset Error
INTERNAL VOLTAGE REFERENCE
Output Voltage (1 V Mode)
Load Regulation Error at 1.0 mA
INPUT-REFERRED NOISE
VREF = 1.0 V
ANALOG INPUT
Input Span, VREF = 1.0 V
Input Capacitance 3
Input Common-Mode Voltage
Input Common-Mode Range
REFERENCE INPUT RESISTANCE
POWER SUPPLIES
Supply Voltage
AVDD
DRVDD
Supply Current
IAVDD2
IDRVDD2 (1.8 V)
IDRVDD2 (3.3 V)
POWER CONSUMPTION
DC Input
Sine Wave Input2 (DRVDD = 1.8 V)
Sine Wave Input2 (DRVDD = 3.3 V)
Standby Power 4
Power-Down Power
Temp
Full
Typ
Max
Unit
Bits
Full
Full
25°C
Full
25°C
Full
25°C
Guaranteed
+0.05
−1.3
±0.30
±2.6
% FSR
% FSR
LSB
LSB
LSB
LSB
Full
±2
ppm/°C
Full
25°C
Min
16
−0.9/+1.7
−0.5/+1.0
±6.5
0.983
0.995
2
1.007
V
mV
25°C
2.8
LSB rms
25°C
25°C
25°C
Full
Full
2
6.5
0.9
V p-p
pF
V
V
kΩ
Full
Full
0.5
1.3
7.5
1.7
1.7
1.8
1.9
3.6
V
V
Full
25°C
25°C
56.3
5.2
9.3
62.2
mA
mA
mA
25°C
Full
25°C
25°C
25°C
107
111
132
44
0.5
122
Measured with 1.0 V external reference.
Measured with a 10 MHz input frequency at rated sample rate, full-scale sine wave, with approximately 5 pF loading on each output bit.
3
Input capacitance refers to the effective capacitance between the differential inputs.
4
Standby power is measured with a dc input and the CLK active.
1
2
Rev. B | Page 4 of 12
mW
mW
mW
mW
mW
Enhanced Product
AD9266-EP
AC SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, DCS disabled, unless otherwise noted.
Table 2.
Parameter 1
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
SIGNAL-TO-NOISE-AND-DISTORTION (SINAD)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
WORST SECOND OR THIRD HARMONIC
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
WORST OTHER (HARMONIC OR SPUR)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
TWO-TONE SFDR
fIN = 30.5 MHz (−7 dBFS), 32.5 MHz (−7 dBFS)
ANALOG INPUT BANDWIDTH
1
Temp
25°C
25°C
Full
25°C
25°C
25°C
Full
25°C
25°C
25°C
Full
25°C
Min
Typ
Max
77.6
77.4
dBFS
dBFS
dBFS
dBFS
76.5
76.4
77.4
77.2
dBFS
dBFS
dBFS
dBFS
76.0
76.3
12.6
12.5
Bits
Bits
Bits
Bits
12.3
12.4
25°C
25°C
Full
25°C
−94
−93
25°C
25°C
Full
25°C
94
93
Unit
−80
−93
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
80
93
25°C
25°C
Full
25°C
−92
−101
−98
dBc
dBc
dBc
dBc
25°C
25°C
90
700
dBc
MHz
−88
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions.
Rev. B | Page 5 of 12
AD9266-EP
Enhanced Product
DIGITAL SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, DCS disabled, unless otherwise noted.
Table 3.
Parameter
DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−)
Logic Compliance
Internal Common-Mode Bias
Differential Input Voltage
Input Voltage Range
High Level Input Current
Low Level Input Current
Input Resistance
Input Capacitance
LOGIC INPUTS (SCLK/DFS, MODE, SDIO/PDWN) 1
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Input Capacitance
LOGIC INPUTS (CSB) 2
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Input Capacitance
DIGITAL OUTPUTS
DRVDD = 3.3 V
High Level Output Voltage, IOH = 50 µA
High Level Output Voltage, IOH = 0.5 mA
Low Level Output Voltage, IOL = 1.6 mA
Low Level Output Voltage, IOL = 50 µA
DRVDD = 1.8 V
High Level Output Voltage, IOH = 50 µA
High Level Output Voltage, IOH = 0.5 mA
Low Level Output Voltage, IOL = 1.6 mA
Low Level Output Voltage, IOL = 50 µA
1
2
Temp
Full
Full
Full
Full
Full
Full
Full
Min
Typ
Max
Unit
3.6
AVDD + 0.2
+10
+10
12
V
V p-p
V
µA
µA
kΩ
pF
CMOS/LVDS/LVPECL
0.9
0.2
GND − 0.3
−10
−10
8
Full
Full
Full
Full
Full
Full
1.2
0
−50
−10
Full
Full
Full
Full
Full
Full
1.2
0
−10
40
Full
Full
Full
Full
3.29
3.25
Full
Full
Full
Full
1.79
1.75
10
4
DRVDD + 0.3
0.8
−75
+10
V
V
µA
µA
kΩ
pF
DRVDD + 0.3
0.8
+10
135
V
V
µA
µA
kΩ
pF
30
2
26
2
Internal 30 kΩ pull-down.
Internal 30 kΩ pull-up.
Rev. B | Page 6 of 12
0.2
0.05
V
V
V
V
0.2
0.05
V
V
V
V
Enhanced Product
AD9266-EP
SWITCHING SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, DCS disabled, unless otherwise noted.
Table 4.
Parameter
CLOCK INPUT PARAMETERS
Input Clock Rate
Conversion Rate1
CLK Period—Divide by 1 Mode (tCLK)
CLK Pulse Width High (tCH)
Aperture Delay (tA)
Aperture Uncertainty (Jitter, tJ)
DATA OUTPUT PARAMETERS
Data Propagation Delay (tPD)
DCO Propagation Delay (tDCO)
DCO to Data Skew (tSKEW)
Pipeline Delay (Latency)
Wake-Up Time2
Standby
OUT-OF-RANGE RECOVERY TIME
2
Min
Full
Full
Full
3
15.38
Typ
Max
Unit
520
65
Full
Full
7.69
1.0
0.1
MHz
MSPS
ns
ns
ns
ps rms
Full
Full
Full
Full
Full
Full
Full
3
3
0.1
8
350
300
2
ns
ns
ns
Cycles
μs
ns
Cycles
Conversion rate is the clock rate after the CLK divider.
Wake-up time is dependent on the value of the decoupling capacitors.
tA
N–1
N
N+6
N+1
N+7
N+5
VIN
N+8
N+2
tCLK
N+3
CLK+
CLK–
tDCO
DCO
tSKEW
tSKEW
D1_D0
D1N–9
D0N–9
D1N–8
D0N–8
D1N–7
D0N–7
D1N–6
D0N–6
D15N–9 D14N–9 D15N–8 D14N–8
D15N–7
D14N–7 D15N–6 D14N–6
D1N–5
D0N–5
D1N–4
D0N–4
tPD
D15_D14
D15N–5 D14N–5
Figure 2. CMOS Output Data Timing
Rev. B | Page 7 of 12
D15N–4 D14N–4
10476-002
1
Temp
AD9266-EP
Enhanced Product
TIMING SPECIFICATIONS
Table 5.
Parameter
SPI TIMING REQUIREMENTS
tDS
tDH
tCLK
tS
tH
tHIGH
tLOW
tEN_SDIO
tDIS_SDIO
Test Conditions/Comments
Min
Setup time between the data and the rising edge of SCLK
Hold time between the data and the rising edge of SCLK
Period of the SCLK
Setup time between CSB and SCLK
Hold time between CSB and SCLK
SCLK pulse width high
SCLK pulse width low
Time required for the SDIO pin to switch from an input to an output
relative to the SCLK falling edge
Time required for the SDIO pin to switch from an output to an input
relative to the SCLK rising edge
2
2
40
2
2
10
10
10
ns
ns
ns
ns
ns
ns
ns
ns
10
ns
Rev. B | Page 8 of 12
Typ
Max
Unit
Enhanced Product
AD9266-EP
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 6.
Parameter
AVDD to AGND
DRVDD to AGND
VIN+, VIN− to AGND
CLK+, CLK− to AGND
VREF to AGND
SENSE to AGND
VCM to AGND
RBIAS to AGND
CSB to AGND
SCLK/DFS to AGND
SDIO/PDWN to AGND
MODE/OR to AGND
D1_D0 Through D15_D14 to AGND
DCO to AGND
Operating Temperature Range
(Ambient)
Maximum Junction Temperature
Under Bias
Storage Temperature Range
(Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−55°C to +125°C
The exposed paddle is the only ground connection for the chip.
The exposed paddle must be soldered to the AGND plane of the
circuit board. Soldering the exposed paddle to the board also
increases the reliability of the solder joints and maximizes the
thermal capability of the package.
150°C
Typical θJA is specified for a 4-layer printed circuit board (PCB)
with a solid ground plane. As shown in Table 7, airflow improves
heat dissipation, which reduces θJA. In addition, metal in direct
contact with the package leads from metal traces, through holes,
ground, and power planes reduces the θJA.
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Table 7. Thermal Resistance
Package Type
32-Lead LFCSP
5 mm × 5 mm
Airflow
Velocity
(m/sec)
0
1.0
2.5
θJA1, 2
37.1
32.4
29.1
θJC1, 3
3.1
θJB1, 4 ΨJT1, 2
20.7 0.3
0.5
0.8
Unit
°C/W
°C/W
°C/W
Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
1
2
ESD CAUTION
Rev. B | Page 9 of 12
AD9266-EP
Enhanced Product
32
31
30
29
28
27
26
25
AVDD
VIN+
VIN–
AVDD
RBIAS
VCM
SENSE
VREF
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
AD9266-EP
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
AVDD
MODE/OR
DCO
(MSB) D15_D14
D13_D12
D11_D10
D9_D8
D7_D6
NOTES
1. DNC = DO NOT CONNECT.
2. THE EXPOSED PADDLE IS THE ONLY GROUND CONNECTION
ON THE DEVICE. IT MUST BE SOLDERED TO THE ANALOG
GROUND OF THE PCB TO ENSURE PROPER FUNCTIONALITY,
HEAT DISSIPATION, NOISE, AND MECHANICAL STRENGTH.
10476-003
DNC
DNC
DNC
DNC
DRVDD
D1_D0 (LSB)
D3_D2
D5_D4
9
10
11
12
13
14
15
16
CLK+
CLK–
AVDD
CSB
SCLK/DFS
SDIO/PDWN
DNC
DNC
Figure 3. Pin Configuration
Table 8. Pin Function Descriptions
Pin No.
0
Mnemonic
EPAD
1, 2
3, 24, 29, 32
4
5
CLK+, CLK−
AVDD
CSB
SCLK/DFS
6
SDIO/PDWN
7 to 12
13
14 to 21
22
23
DNC
DRVDD
D1_D0 (LSB) to
(MSB) D15_D14
DCO
MODE/OR
25
26
27
28
30, 31
VREF
SENSE
VCM
RBIAS
VIN−, VIN+
Description
Exposed Paddle. The exposed paddle is the only ground connection on the device. It must be soldered to the
analog ground of the PCB to ensure proper functionality, heat dissipation, noise, and mechanical strength.
Differential Encode Clock for PECL, LVDS, or 1.8 V CMOS Inputs.
1.8 V Supply Pin for ADC Core Domain.
SPI Chip Select. Active low enable, 30 kΩ internal pull-up.
SPI Clock Input in SPI Mode (SCLK). 30 kΩ internal pull-down.
Data Format Select in Non SPI Mode (DFS). Static control of data output format. 30 kΩ internal pull-down.
DFS high = twos complement output; DFS low = offset binary output.
SPI Data Input/Output (SDIO). Bidirectional SPI data I/O with 30 kΩ internal pull-down.
Non-SPI Mode Power-Down (PDWN). Static control of chip power-down with 30 kΩ internal pull-down.
Do Not Connect.
1.8 V to 3.3 V Supply Pin for Output Driver Domain.
ADC Digital Outputs.
Data Clock Digital Output.
Chip Mode Select Input (MODE)/Out-of-Range Digital Output in SPI Mode (OR).
Default = out-of-range (OR) digital output (SPI Register 0x2A, Bit 0 = 1).
Option = chip mode select input (SPI Register 0x2A, Bit 0 = 0).
Chip power-down (SPI Register 0x08, Bits[7:5] = 100b).
Chip standby (SPI Register 0x08, Bits[7:5] = 101b).
Normal operation, output disabled (SPI Register 0x08, Bits[7:5] = 110b).
Normal operation, output enabled (SPI Register 0x08, Bits[7:5] = 111b).
Out-of-range (OR) digital output only in non-SPI mode.
1.0 V Voltage Reference Input/Output.
Reference Mode Selection.
Analog Output Voltage at Mid AVDD Supply. Sets common mode of the analog inputs.
Set Analog Current Bias. Connect to 10 kΩ (1% tolerance) resistor to ground.
ADC Analog Inputs.
Rev. B | Page 10 of 12
Enhanced Product
AD9266-EP
OUTLINE DIMENSIONS
0.30
0.25
0.18
32
25
1
24
0.50
BSC
*3.75
3.60 SQ
3.55
EXPOSED
PAD
17
TOP VIEW
0.80
0.75
0.70
0.50
0.40
0.30
8
16
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
PIN 1
INDICATOR
9
BOTTOM VIEW
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
*COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5
WITH EXCEPTION TO EXPOSED PAD DIMENSION.
08-16-2010-B
PIN 1
INDICATOR
5.10
5.00 SQ
4.90
Figure 4. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad (CP-32-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
AD9266TCPZ-65EP
AD9266TCPZRL7-65EP
1
Temperature Range
−55°C to +125°C
−55°C to +125°C
Package Description
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Z = RoHS Compliant Part.
Rev. B | Page 11 of 12
Package Option
CP-32-12
CP-32-12
AD9266-EP
Enhanced Product
NOTES
©2012–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10476-0-3/16(B)
Rev. B | Page 12 of 12