A Battery Powered Near Infrared (NIR) Camera for the MIT
HelioDome
by
Keith M. Molina
SUBMITTED TO THE DEPARTMENT OF MECHANICAL ENGINEERING IN
PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF
BACHELOR OF SCIENCE IN MECHANICAL ENGINEERING
AT THE
MASSACHUSETTS INSTITUTE OF TECHNOLOGY
JUNE 2008
02008 Keith M. Molina. All rights reserved.
The author hereby grants to MIT permission to reproduce
and to distribute publicly paper and electronic
copies of this thesis document in whole or in part
in any medium now known or hereafter created.
Signature of Author:
Depa
Cment of Mechanical Engineering
May 9,2008
Certified by:
Dr. Warilyne Andersen
Assistant Professor of Building Technology
Thesis Supervisor
Accepted by:
MASSACHUS
NOOS I
OF TECHNOLOGy
AUG 1R2008
LIBRARIES
John H. Lienhard V
roessor of Mechanical Engineering
Chairman, Undergraduate Thesis Committee
E
ARCHAVE
A Battery Powered Near Infrared (NIR) Camera for the MIT
HelioDome
by
Keith M. Molina
Submitted to the Department of Mechanical Engineering
On May 9, 2008 in Partial Fulfillment of the
Requirements for the Degree of Bachelor of Science in
Mechanical Engineering
Abstract
Research in advanced fenestration systems has led to the development of the Heliodome
project at the Massachusetts Institute of Technology Daylighting Laboratory. The MIT
Heliodome project is dedicated to goniophotometry and the assessment of bidirectional
photometric properties of light- (or heat-)redirecting facade systems by using digital
cameras as multiple-points photosensors, that cover the visible and near infrared portions
of the sunlight spectrum.
Two cameras are used in this device: a charge couple device (CCD) camera using silicon
detectors and a near infrared (NIR) camera using InGaAs sensors. Both cameras are
mounted to a table which has two degrees of rotational freedom, altitude and azimuth.
Using the rotating table and cameras in combination with an ellipsoidal dome, which is
coated with a semi-transparent specula coating, allows a time-efficient and continuous
measurement of bidirectional transmission (or reflection) density functions (BTDFs or
BRDFs).
This thesis seeks to enhance current Heliodome operations by developing a portable
power source for the NIR camera. A portable power system has been designed and
constructed to operate the NIR camera during measurement sessions. The portable power
system allows the rotating table to rotate completely free of constraints caused by weight,
imbalance, power and light path obstruction issues. This contribution to the Heliodome
project provides the user with more reliable data and relief from disorderly setup.
Thesis Supervisor: Dr. Marilyne Andersen, Assistant Professor of Building Technology
Acknowledgements
Special thanks to my thesis supervisor, Dr. Marilyne Andersen, for her support and
guidance in the development of this thesis and prior research done in the undergraduate
research opportunities program.
Many thanks to my colleagues in the bat cave, Javier Burgos, Danh Vo, Jason Ku and
Samuel Kronick for their advice on various design problems in mechanical and electrical
engineering methods.
A big thanks to Marc P. Hansen, applications engineer at Sensors Unlimited for his help
with the NIR camera and acquisition of related circuit diagrams and spec sheets.
I would also like to thank my friends and family for their support in my endeavors and
their patience with my dedication to work.
This work was jointly supported by the Massachusetts Institute of Technology and the
National Science Foundation under Grant No. 0533269. Any opinions, findings and
conclusions or recommendations expressed in this material are those of the author(s) and
do not necessarily reflect the views of the National Science Foundation (NSF).
Table of Contents
1
Introduction
6
1.1
Natural Light and Us
6
1.2
Going Green
6
1.3
Advanced Fenestration Technology
7
2
The MIT HelioDome Project
2.1
Main Components
2.1.1
2.1.2
2.1.3
Table
Illumination System
Cameras
2.2
Equipment Concerns
2.2.1
Rotating Table Design
2.2.2
Weight and Balance
2.2.3
Camera Placement
2.2.4
Power Issues
7
8
8
9
10
11
11
12
12
12
3
Near Infrared (NIR) Camera: Issues and Constraints
3.1.1
Existing Equipment and Camera Setup
3.1.2
Power Supply Concerns
3.1.3
Possible Solutions to Power Concerns
13
13
14
15
4
Design and Development of Battery Powered NIR Camera System
16
4.1
5
Portable Operation
4.2
Circuit Design
4.2.1
Existing Power Supply Design
4.2.2
Switching from AC to DC
4.2.3
DC to DC Converter Design
4.2.4
Circuit Testing
4.2.5
Overall Circuit Architecture
4.2.6
Circuit Housing
16
17
19
20
21
22
23
4.3
Battery System
4.3.1
Battery System Testing
24
25
4.4
Table Incorporation
4.4.1
System Arrangement and Integration
25
25
System Operation
26
5.1
Operating Specifications
27
5.2
Original System to New System Comparison
27
6
7
16
Conclusion
27
6.1
Achievements
27
6.2
Further Investigation
28
6.3
Applications
28
Appendix
7.1
HelioDome Illumination System
30
30
7.1.1
7.1.2
7.1.3
7.1.4
8
Filter Wheel System
Beam Shaper
Light Source Support
Illumination Positioning System
30
33
34
35
7.2
Front Panel
36
7.3
HTC-1500
37
7.4
Temperature Controller Interfacing
50
7.5
Linear Voltage Regulators
7.5.1
LM2937
7.5.2
LM2940
51
51
64
7.6
82
Switching Regulator
Bibliography
99
1 Introduction
Recently, in the field of architecture, an effort to redesign lighting systems and
fenestration systems has become a main focus. New strategies to light entire buildings
using mainly natural light are being developed as well as new materials that capture light
energy to heat and cool structures. This will not only save energy otherwise consumed
by fixtures and lamps, it also has major effects on humans psychologically and
physiologically. This is why much effort is being put into the development of these
systems and it is essential for architects and engineers to understand how light can be
manipulated using different designs and materials.
1.1 Natural Light and Us
Numerous studies have been conducted to better understand the effects of natural light on
humans. Evidence shows that light in general has vast psychological and physiological
effects on humans. An experiment done with human subjects showed that people are
drawn to areas that provide good lighting conditions such as daylight [Rea, 2000].
Serotonin, a neurotransmitter, has long been used to treat depression and aggressive
behavior and has recently been discovered to have a direct correlation to luminosity of a
given day [Bjorksten et al., 2005]. Insufficient exposure to natural light can also have
adverse effects on the human body's ability to produce vitamin D which is essential to
the uptake of calcium, a nutrient that helps to strengthen bones [Raymond and Adler,
2005].
1.2 Going Green
It has also become a necessity to design "green" structures that leave less of a footprint
on our environment by reducing the amount of energy it uses to operate. Lighting and
heating or cooling are the main sources of energy consumption in buildings and as
structures get increasingly larger with new construction technology, so does the energy
consumption. With current lighting systems and fenestration designs, the cost of lighting
and heating using conventional fixtures and heating elements accounts for 30% to 40% of
non-residential buildings' yearly energy costs [Scartezzini, 2003].
By studying the
abilities of different fenestration materials, efficient use of lighting can be achieved and
used for the reduction of energy costs.
1.3 Advanced Fenestration Technology
With new technology in construction comes new design in fenestration. Over the past
two decades more and more efforts are being spent in analyzing the ways in which
fenestration can be manipulated for daylighting purposes.
These smart fenestration
systems are designed to redirect sunlight and daylight to the areas of rooms farthest away
from the windows and control the amount of heat and light let in depending on changing
sun angles and weather conditions over the year. Therefore, the combined angular and
spectral control of solar energy and visible light becomes the main function of these
advanced fenestration systems, aiming for maximal heat and light benefits in buildings
that incorporate these smart systems [Gayeski, 2007].
2 The MIT HelioDome Project
The MIT HelioDome is a project dedicated to the study of materials and coatings used in
such advanced fenestration technologies. It has two functions: the first is a video-based
goniophotometer which measures the properties of various materials and coatings; and
the second is a sun-course simulator which directs a beam of light to simulate the sun's
course for any day and location. When a model-sized building is placed on the table it
acts as a sun-course simulator by rotating or tilting the table to reproduce the effect of
sunlight throughout a single day. The second function is designed to aid architectural
students attending or visiting MIT to better understand the shading and lighting
techniques they are incorporating into their building designs.
When used as a
goniophotometer, a mirror coated ellipsoidal dome is placed over two holes (the focal
points of the ellipsoid) that bore through the rotating table. Light passes through the
investigated material secured to one focal point while a camera collects data through the
other focal point [Andersen et al, 2005].
Goniophotometry is the measurement of light intensity as a function of angle. The goal
of the HelioDome is to measure Bi-directional Transmission (or Reflection) Distribution
Functions, more conveniently called BTDFs (or BRDFs). These functions describe the
way light is distributed spatially after passing through the material under investigation.
Establishing these functions for new materials will lead to further incorporation into
building simulation programs and other computer aided design methods engineers and
architects use in their design process.
As a sun-course simulator students can see how their materials actually work in its
physical environment.
The beam of light directed at the rotating table reflects and
transmits through windows while taller structures block the light casting shadows over
parts of the model. Here, the organization of the fenestration and its walls are critical and
students can make better judgments on how to best orchestrate their designs. Glare is
also a big factor when designing a building, especially when it is used for office space.
This can be solved by good overall architectural design as well as through the use of
special glare reducing materials.
2.1 Main Components
The Heliodome project at MIT has had much progress since its inception in 2004. A dark
room located in one of MIT's basement labs harbors advanced optical equipment used in
the Heliodome's program of study. Scheduled to be a useable workspace by the fall of
2008 the project has brought together students and faculty from many disciplines and
backgrounds all in the pursuit of the Heliodome's success. Two major equipment groups
of the project are a table which can rotate in both the azimuth and altitude axis and the
optical sensors (or cameras). The cameras are the main measurement instruments in the
project and the basis of this thesis project. Another equipment group is the filter wheel,
beam shaper and Hydrargyrum medium-arc iodide (HMI) lamp which is organized on a
wheeled carriage called the illumination system.
2.1.1 Table
The table built specifically for the MIT Heliodome project was designed and constructed
by Dean M. Ljubicic as a senior thesis project [Ljubicic, 2005]. The main features of his
design are aluminum framing and an aluminum honeycomb table. The table is driven by
two motors and rotates on a system of ball bearings for smooth movement between
positions. The main octagonal-shaped hole in the center of the table incorporates several
plates that allow clamping of the materials being investigated. When not in use, a flat
plate is placed over the hole so that models can be clamped to the center of the table. The
smaller, circular, hole near the edge of the center hole is where the cameras are placed to
take data when the table is used as a goniophotometer. All of these attributes can be seen
in figure 1.
Figure 1. The MIT HelioDome table with two degrees of freedom, azimuth and altitude.
It uses two motors to rotate and the main circular section is constructed of honeycomb
aluminum for its low mass and high strength. The framing and supports are made of
aluminum box extrusions. (Photo courtesy of Prof. Marilyne Andersen)
2.1.2
Illumination System
The light source is an HMI lamp which mimics light produced by the sun [Browne,
2006]. A series of optical filters are housed in a filter wheel system that rotates in front of
the HMI lamp [Koch, 2007]. As part of the illumination system a beam shaper, whose
role is to block unwanted light from the HMI lamp caused by the rotation of the table in
the altitude direction is placed in front of the filter wheel system and HMI lamp [Browne,
2006]. These three components are housed in a custom-designed positioning system that
was designed and constructed by the author. A detailed description of the positioning
system and the filter wheel to whose construction the author was also involved is
provided in the Appendix in section 7.1.
2.1.3 Cameras
The MIT Heliodome project uses two cameras. The first is a charge coupled device
(CCD) camera covering the visible range and the beginning of the near infrared. The
second camera is an Indium Gallium Arsenide (InGaAs) camera covering a range of 900
to 1700 nm in the near infrared and for the purposes of this paper will now be called the
NIR camera. This is only used in goniophotometer mode and can typically be used to
estimate the amount of solar heat gains in winter months versus summer months. The
CCD and NIR cameras were selected to span the wavelengths over which the spectral
power distribution of solar radiation is most significant.
Both the visible and near
infrared spectrums are spanned using these cameras and information gathered from the
cameras can be used to design a smart fenestration system.
Figure2. The Charge Couple Device (CCD) camera with firewire cable.
Figure3. The Near Infrared (NIR) camera with universal power supply, plug and power
cable.
The main focus of this thesis is to improve the NIR camera's effectiveness in the
Heliodome project.
2.2 Equipment Concerns
For seamless operation the table and cameras must observe specific guidelines which
were worked into the table design. In this section an overview of the guidelines dictating
the table operations and camera placements are given.
2.2.1 Rotating Table Design
The existing table has the following functional requirements which must not be
compromised [Ljubicic, 2005]. First, the table must rotate 3600 in the horizontal rotation
axis in relation to the ground (altitude); Second, the vertical rotation axis must rotate 3600
in relation to a vertical axis normal to the ground (azimuth); Third, the maximal load
must not exceed 400 Newtons; Fourth, no hardware can hinder the incoming light in
BT(R)DF mode from the top or bottom of the sample and; Fifth, the device should
require minimal maintenance and setting up. These parameters must be kept and will be
referred back to in later sections to make sure there are no obstructions to the table
function.
2.2.2 Weight and Balance
As a standalone unit the rotating table works seamlessly and when something is placed on
the table for both the video-goni0photometer function and the sun-course simulator, the
movements of the table must also be seamless. Some concerns that have risen since the
use of the table with actual ellipsoids and large scale models are imbalance due to weight
distribution. Though the table's motors are strong enough to hold a position even though
a large mass is on the table it is important that an object attached to the table has its
center of mass near the center of the table. If this is not possible then a counterweight
must be attached to the table, not exceeding the table load limits. This is essential to the
smooth movements of the table to its various positions.
2.2.3
Camera Placement
The cameras are secured to the table so that the lens fits through a small circular hole as
mentioned in a previous section. This small circular hole is the focal point of the
ellipsoid dome placed on the table when used as a goniophotometer. When light is
shown through the focal point at the center of the table all the light distributed in the
dome is reflected to the camera's lens which is strategically placed at the other focal
point. By covering the center hole with a material specimen and shining a light through,
the camera detects the amount of visible (using the CCD camera) or near infrared (using
the NIR camera) light transmitted and a BT(R)DF is generated by computer software.
Only one camera can be placed on the table at a time and is secured using an "L-shaped"
metal brace and machine screws [Ljubicic, 2005]. The camera is oriented so that the lens
is parallel to the table therefore situating it's length perpendicular to the table. The NIR
camera is 15.8cm in length and protrudes 13.3cm out of the plane of the table and
supporting struts.
2.2.4 Power Issues
The CCD camera can be powered by either an AC adapter that can be plugged into a wall
outlet or by a universal serial bus (USB) connection on a personal computer. The NIR
camera, on the other hand, is electrified by a power supply which must be plugged into an
AC outlet supplying 120V. When the NIR camera is used for goniophotometry, the
wiring for the camera and power supply obstructs both axis of the table's rotation. Also,
the power supply that must supply the power to the camera is very large and must be
suspended on the under the table during operation. This often leads to cumbersome set
up and obstruction of the light's path to the focal point located at the center of the table.
Problems concerning the table's rotation as well as managing the bulky power supply
were the main motivations for the formulation of this thesis and for designing a portable
power solution for the NIR camera.
3 Near Infrared (NIR) Camera: Issues and Constraints
The NIR camera is designed by Sensors Unlimited, Inc. and its full name is SU3201.7RT Indium Gallium Arsenide Near Infrared Camera. It is a compact versatile imaging
tool designed for laboratory and field use and has an optical sensitivity range of 1.Ojpm to
1.7pm. It has dimensions 15.8 x 10.2
x 10.2 cm not including the lens whose
SENSORS UNLIMITED, INC.
I
EXT
O
type of lens used. Figure 4 shows a
GE
terminals located on a panel opposite
IR
T F
± A A
LC
TRIGGER IN
TIME
•
EiE
O
J
length and diameter varies with the
I
DN
I
diagram of the camera's connection
the lens.
Figure4. SU320-1.2RT back panel.
For this project, only the POWER/TEC
port is affected which is the camera's
connection to the main power suptlv.
3.1.1 Existing Equipment and Camera Setup
The SU320-1.7RT NIR camera comes complete with a universal power supply and
power cable. Power is provided via a 12-pin Hirose connector on the back panel. This
supplies power both for the camera functions and for the thermoelectric cooler in the
focal plane array. The power supply must be plugged into a 95-220V AC outlet and it's
dimensions are 16.5 x 11.4 x 8.9cm.
The NIR camera is attached to the table via L-shaped bracket as mentioned in a previous
section. The power supply must be suspended from the table to allow for maximum table
rotation without crossing the power cable and plug. This is achieved by securing the
power supply in a nylon pouch and tying the pouch to the table using straps. Figure 5
snows the existing equipment and
camera setup in relation to the
table.
Figure 5. Existing table setup with
L-shaped bracket, camera focal
point and center focal point. The L
bracket supports both the CCD and
NIR cameras in goniophotometry.
The cameras are strategically place
at a focal point of the ellipsoid
domes
placed
on
the
table.
Material specimens are placed at
the center focal point and a light is
shown
through
the
material
specimen.
3.1.2 Power Supply Concerns
From the existing NIR camera setup it is not possible to rotate the full 3600 because the
power supply plug must be secured to a wall outlet which is not in the reference frame of
the rotating portion of the table.
Therefore, full rotation would tangle cords and
potentially disrupt table operation. The current maximum table rotation in the altitude
direction allowed when using the NIR camera is 1800 from the initial vertical position.
The maximum table rotation in the azimuth direction allowed when using the NIR
camera is 3300 respective to its starting position. This is in direct contradiction with the
first and second functional requirements of the table design which is to have 3600 of table
rotation on both axis. Another concern is the obstruction of the light's path to the center
of the table (a focal point of the ellipsoid). During table rotation, the current setup tends
to cross the path of the light. Extra care must be taken to make sure that the pouch,
straps, or cables do not cross the path of light often making it difficult to operate the
camera and table simultaneously.
3.1.3 Possible Solutions to Power Concerns
Issues concerning the electrification of the NIR camera are the main driving force for this
project. After brainstorming several options for a portable power solution to the NIR
camera the idea for a battery-powered NIR camera was decided upon.
Another option that was explored was to place an AC outlet within the frame of reference
of the camera and power supply so that free rotation could be achieved. Although the
idea of an AC outlet on the table had potential, safety concerns came into play because
the only way power could be placed on the rotating table would be via slip disks which
are bare copper disks spanning the circumference of the table. These bare copper disks
would be electrified with 120V of AC power, a potential risk to those operating the table
and camera.
The idea for a battery-powered NIR camera came from Professor Marilyne Andersen,
who thought it would be easier to achieve within the time frame allotted for this project.
After delving deeper into the capacity for powering an NIR camera with batteries alone it
was thought a good fit for the Heliodome project.
4 Design and Development of Battery Powered NIR Camera
System
The design and development of the battery powered NIR camera system incorporates
three main phases: building the circuit, choosing a battery system and attaching the entire
system to the rotating table.
4.1 PortableOperation
The idea of a battery powered NIR camera system involves removing the universal power
supply and power cable and replacing it with a battery system. This is not as easy as it
sounds because as mentioned above the power cable supplies not only power but also
regulates the temperature of the focal plane array located inside the NIR camera. This
means that the camera's focal plane array has a connection to the power supply via the
12-pin Hirose connection cable. Therefore two items are controlled by the power supply:
electrifying the camera and regulating the focal plane array temperature. A circuit must
be designed to not only supply the needed voltages to electrify the camera, but also
communicate with the focal plane array within the camera.
4.2 Circuit Design
The first phase of designing the battery powered NIR camera system is the circuit design.
The NIR camera connects to the power supply via a 12-pin Hirose connection cable.
Figure 6 shows a diagram of the 12-pin Hirose connector and its corresponding pin
numbers.
(a)
Figure 6. (a) Diagram of 12-pin Hirose connector which supplies the power to the
camera and controls the focal plane array. (b) Photo of 12-pin female Hirose connector
used in final circuit design.
Each pin corresponds to either a voltage (for electrifying the NIR camera) or a signal (for
controlling the focal plane array). The following table lists the pin and corresponding
functions.
Pin Number
Function Description
1
GROUND connects to threshold
2
(12V) provides -12V to system
3
GROUND connects to threshold
4
12V
provides +12V to system
5
GROUND connects to threshold
6
5V
provides +5V to system
7
TEC+ positive current feed
8
TEC- negative current feed
9
THERM- negative thermistor signal
10
THERM+ positive thermistor signal
11
--empty pin
12
--empty pin
Table 1. Pin numbers and corresponding functions. This information was taken from the
front panel assembly specification sheet '4120-0028 PSA front panel' shown in the
appendix under Front Panel.
All voltages listed in table 1 should be held constant for the camera to operate normally.
The focal plane array temperature is monitored by a thermistor located inside the camera
and is controlled by a temperature controller located inside the power supply. The pins
that control the focal plane array are pins 7 thru 10. These pins are connected to a
temperature controller which is in turn powered by its own +8V voltage, another voltage
to consider when designing and electrifying the circuit itself.
4.2.1 Existing Power Supply Design
The existing power supply is very large due to the massive amounts of converting that the
device must do. The power supply takes one AC voltage signal, converts it to a DC
voltage and then divides it among the pins that need a constant voltage and also a +8V
needed to electrify the temperature controller. The temperature controller used in the
power supply design is an HTC Series - Hybrid Temperature Controller designed and
manufactured by Wavelength Electronics. The HTC-1500 (see HTC-1500 in appendix
for specifications) achieves 0.001"C temperature stability and comes in a low profile
package with a 20-pin DIP connection. Figure 7 below shows a picture of the HTC1500.
Figure 7. Photo of HTC-1500
temperature controller designed and
manufactured by Wavelength
Electronics. The specification sheets for
this temperature controller are in the
Appendix (section 7.4).
A separate circuit is needed to operate
t e IT- 500V
coretly.
+1h
UH'•T
1"
1-
Forv
the
purposes of research, the needed circuit diagram was acquired from Sensors Unlimited.
This circuit diagram is detailed in the appendix under Temperature Controller Interfacing.
Table 2 shows the pin numbers and corresponding names and descriptions for the HTC1500.
PIN NAME
1
LIMIT -
2
LIMIT +
3
PID OUT
4
V REF OUT
5
COMMON
DESCRIPTION
Resistor value of 0 Q to 1M9 between pins 1 & 2 limits maximum
output current.
No resistor is necessary when operating at maximum HTC current
specification.
Short pins 2 & 3 for bipolar operation.
Install diode for unipolar operation (see page 6, step 1 for polarity)
3.675 Volt Reference < 50 ppm stability (15 ppm typical)
Measurement ground. Low current return used only with pins 6, 7 & 8.
Internally shorted to pin 10.
Temperature monitor. Buffered measurement of voltage across Sensor+
6 ACT T MONITOR&
Sensor -.
7 SET T MONITOR Setpoint monitor. Buffered measurement of the setpoint input (pin 8).
SETPOINT
INPUT
Remote setpoint voltage input. Input impedance = 1 MK2
9
V+
Supply voltage input: +5 V to +12 V.
10
GND
11
12
TEC +
TEC -
13
14
SENSOR +
15
RBIAS +
16
RBIAS -
17
RPROP +
18
RPROP -
19
20
C INT +
C INT -
SENSOR -
Contact Factory for higher voltage operation.
Power Supply Ground. Used with pin 9 for high current return.
TEC+ & TEC- supply current to the TE module. With NTC sensor,
connect TEC+ to
positive lead of TE module. With PTC sensors, connect TEC- to positive
lead of
TE module.
Asensor bias current will source from Sensor+ to Sensor- if a resistor is
tied
across RBIAS+ and RBIAS-. Connect a 10 kM resistor across Sensor+ &
Sensorwhen
using an AD590 temperature sensor. See page 6, step 4.
esistance between pins 15 & 16 selects sensor current from 1 pA to 10
Range is 0 11 to 1MQ.
Resistance between pins 17 & 18 selects Proportional Gain between 1 &
100.
Range is 0 Q to 495 kM.
Capacitance between pins 19 & 20 sets the Integral Time Constant
between
0 and 10 seconds. 0 seconds (OFF) = 1 MCI resistor
0.1 to 10 seconds = 0.1 gF to 10 gF.
Table 2. Pin descriptions for the hybrid temperature controller HTC-1500. This table
was taken directly from the HTC-1500 specifications sheet located in the appendix.
Also included in the power supply design is a red light emitting diode (LED) which
illuminates when power is supplied to the NIR camera. An on/off switch is also included
to control the input of power from the AC outlet. All of these power supply design
features were incorporated into the circuit although somewhat modified for the adaptation
of a battery system which supplies a DC voltage.
4.2.2 Switching from AC to DC
The existing power supply converts an AC voltage to a DC voltage and then distributes
the voltages where needed. It is simply an AC to DC converter and what this project is
trying to do is replace the power supply with a battery system which supplies a DC
voltage. Theoretically, this process involves taking the front end of the current power
supply design which is made up of transformers, removing them and then creating a
direct connection from the battery system to the various voltage pins.
conversion is made the circuit is called a DC to DC converter.
Once the
4.2.3 DC to DC Converter Design
The DC to DC converter portion of the circuit takes one DC voltage signal from a battery
and converts it to several different voltages necessary to electrify the NIR camera. Table
1 shows that pins 2, 4 and 6 needs voltages of -12V, +12V and +5V respectively. In
addition to the three voltages mentioned a voltage of +8V is needed to electrify the
temperature controller, pin 9 from Table 2. The DC to DC converter must supply four
different voltages to operate the camera successfully. This task is easy for the positive
voltages because the battery supplies one positive voltage which can then be converted to
other positive voltages via linear voltage regulators. It would be trivial to get -12V from
a battery if only negative voltages were required, but since the DC to DC converter must
supply both positive and negative voltages a different type of voltage regulator is needed.
The final DC to DC converter design incorporates three linear voltage regulators to
supply the positive voltages and one switching regulator to supply the negative voltage.
The linear voltage regulators selected for the +5V, +8V, and +12V are the LM2937ET,
LM2940T and LM2940CT linear voltage regulators from National Semiconductor
(specification sheets for the LM2937ET, LM2940T and LM2940CT are located in the
appendix under Linear Voltage Regulators). They each have three prongs and require
two capacitors each to operate. The +5V linear regulator requires an .1 microfarad
capacitor between its input terminal and ground while a 10 microfarad capacitor is
required between its output terminal and ground. Similarly both the +8V and +12V
linear regulators require a .47 microfarad capacitor and a 22 microfarad capacitor in the
same orientation. These linear regulators are of the same type used in the existing power
supply and are displayed in Figure 8.
Figure8. Photo of linear regulators. From
left to right: +5V LM2937ET, +8V
LM2940T, +12V LM2940CT. Specification
sheets for these regulators can be found in
the appendix under Linear Voltage
Regulators.
The switching regulator selected for the -12V is the PTN78000A from Texas
Instruments. This regulator has five pins and is adjustable. Table 3 shows the pin
numbers and its corresponding functions.
Pin
Function
Description
1
V OUT
The negative output voltage power node with respect to the GND node.
-
It is also the reference for the V OUT adjust control inputs.
The positive input voltage power node to the module, which is
referenced to common GND.
3
This pin is active and must be isolated from any electrical connection.
A 1%resistor must be placed between pin 1 and pin 4 to set the output
voltage of the module lower than -3V. If left open-circuit the output
to -3V. The temperature stability of the resistor should
4 V OUT ADJUST voltage defaults
-be 100ppm/ 0 C (or better). The set point range is -15V to -3V. The
standard resistor value for a number of common output voltages is
rovided in the application information.
5
GROUND
The common ground connection for the VI and VO power connections.
2
V IN
N/C
Table 3.
Pin numbers and its corresponding functions for PTN78000A from Texas
Instruments. This data is taken from the PTN78000A specification sheets located in the
appendix under switching regulator.
Figure 9. Photo of
PTN78000A, a switching
regulator used to generate a 12V for the DC to DC portion
of the circuit design. The
specification sheets for the
PTN78000A can be found in
the appendix under switching
regulator.
4.2.4 Circuit Testing
The completed circuit was tested using a lab power supply first using +15V
and then
+20V. It was found that with +15V the DC to DC converter portion
of the circuit would
supply erratic voltages instead of constant voltages which the NIR camera needs. With
+20V supplied from the power supply stable voltages were met and thus a +20V
requirement was set for the battery system explained in a later section. Table 4 shows the
voltages produced by the DC to DC converter.
Voltage Required (V) Measured Voltage (20V)
Pin
Pin Reference
2
Hirose connection
-12.0
-11.8
4
Hirose connection
12.0
12.1
6
Hirose connection
5.0
5.0
9
HTC-1500
8.0
8.0
Table 4. DC to DC converter voltages produced using +20V from power supply.
4.2.5 Overall Circuit Architecture
The circuit has two parts: the temperature controller portion for the HTC-1500 and the
DC to DC converter portion. The circuit fits on one bread board which is 16.5cm by
5.7cm and its height is 5.7cm due to the orientation of the HTC-1500. The two parts of
the circuit splits the bread board in half and the entire board is used allowing for
maximum flow of heat away from the HTC-1500 and the voltage regulators. This circuit
orientation is especially useful to the entry of the battery connection and the exit of the
power cable to the camera. The entire circuit is displayed in figure 10 below and is the
final circuit design for this project.
Figure10. Photo of circuit in plastic housing. The left half of the circuit contains all the
circuitry necessary to run the temperature controller. The right half of the circuit contains
the DC to DC converter which supplies the power necessary to run the camera and to
power the temperature controller.
4.2.6 Circuit Housing
To protect the circuit from its environment a plastic housing was built. The plastic
housing is a rectangular box with dimensions 19.1 x 8.3 x 7.0 cm. The housing includes
an on/off switch and a red LED for user convenience and has a female 12-pin Hirose
connector on one end for connection to the camera. On the end opposite the Hirose
connector there is a protective bushing for the battery cable. The circuit and housing
package weighs one kilogram.
(a)
(b)
Figure 11. (a) Photo of entire housing and circuitry from the 12-pin Hirose connection
end. (b) Photo of entire housing and circuitry from the battery wire bushing and
LED
end.
4.3 Battery System
The battery system consists of a battery which supplies one voltage signal and its charger.
Some requirements for the battery are that it has a high energy density and can supply a
positive twenty volts of DC power and one amp of current for four hours. The one amp
of current was determined by the NIR camera specifications which require one amp to
operate.
A battery with very high energy density helps to keep the mass of the battery system at a
minimum. Although lithium ion batteries have the highest rating for energy density it is
very costly and runs a high risk of spontaneous combustion. Lithium ion batteries also
require onboard monitors to keep from over-charging often leading to its high price. A
nickel metal hydride (NiMH) battery was chosen in the end for its manageable cost, easy
setup and smart charging. See figure 12 below for a photo of the battery chosen for the
system.
Figure12. Photo of NiMH battery used to electrify circuit and camera.
The NiMH battery is rated for 20V and 4200mAh. When discharging at a rate of 1A per
hour at 20V the NiMH battery lasts up to four hours meeting the requirements set for the
battery system. The battery has dimensions 18.4 x 8.9 x 2 cm and weighs 1.4 kg.
4.3.1 Battery System Testing
Initial testing of the entire circuit and battery system provides similar voltages and data as
taken when testing the circuit with a lab power supply. The following table displays the
voltages measured with the battery system in place of the lab power supply.
Voltage Required (V) Measured Voltage (20V)
Pin
Pin Reference
2
Hirose connection
-12.0
-11.8
4
Hirose connection
12.0
12.1
6
Hirose connection
5.0
5.0
9
HTC-1500
8.0
8.0
Table 5. DC to DC converter voltages produced using +20V from battery system.
4.4 Table Incorporation
The third task of this project was to attach the entire circuit and battery system to the
table without affecting the functional requirements of the table and then integrate it with
the NIR camera.
4.4.1 System Arrangement and Integration
The battery and circuit system weighs a total of 2.4kg. To keep the table in a balanced
state the decision was made to attach the battery and circuit system opposite the NIR
camera and corresponding mounting bracket. Since each component weighs about the
same they counter each others weight allowing the table to stay in balance when in
operation. The cable connecting the battery to the circuit is secured to the circuit box via
a Velcro strap. The cable connecting the circuit to the NIR camera is run along the main
struts of the table also using Velcro straps that are attached to the table permanently. The
battery and circuit system attaches to the table via glued on Velcro straps that loop
around the circuit and battery tightly. The Velcro straps allow the battery and circuit
system to virtually be in the plane of the table and out of the way of the light path to the
center of the table. The secure straps also keep the battery and circuit system snug
against the table so that it does not swing hindering the movements of the table. When
fully attached the battery and circuit system and included cables do not obstruct the light
path to the center of the table and also allows the table to rotate in both the altitude and
azimuth directions at its full potential (3600). The weight of the battery and circuit
system also meets the table requirements as it is about the same weight as the power
supply used in the original setup.
Figure 13. Photo of battery and circuit system setup.
The next steps to this project are to connect the NIR camera output cable to the table's
onboard laptop and test the system altogether.
5 System Operation
After arranging the battery and circuit system on the table and attaching it to
the table it
was time to test the system. The NIR camera worked seamlessly with the
new circuit just
as before and the table requirements were not obstructed.
5.1 Operating Specifications
The battery powered NIR camera operates for up to four hours on a fully charged battery.
This allows for the full use of the system for an entire session. The system can either be
removed from the table for charge as a whole or just the battery can be removed and
charged. With an extension cord, the battery can be charged while attached to the table.
Total charge time for a fully charged battery is about two hours and is charged via a
smart charger so that the cells can never be overcharged. System setup takes less than
three minutes not counting the time it takes to secure the NIR camera to the mounting
bracket.
5.2 Original System to New System Comparison
The new battery powered system works just as well as the original system which used the
AC powered power supply in terms of NIR camera operation. The new system is better
because it is now a portable device which allows the table to rotate freely in all directions
without hindrance from cables. Another feature that the new system has over the original
is the compact size of the battery and circuit system which snugly fits in the plane of the
table. Cables are also secured to the table so that they do not obstruct the light path to the
center of the table.
6 Conclusion
6.1 Achievements
This project attempted to develop a battery powered near infrared camera and was
successful in doing so. Development involved the design of a circuit, battery system and
incorporation into the existing architecture of a rotating table with two degrees of
freedom.
One limitation caused by the project is a time limit on the use of the NIR camera when
used portably, which is a function of the battery life. This limitation is acceptable
because the previous setup inhibited the table from rotating freely, a functional
requirement of the table design. The battery pack can be charged in two hours and lasts
up to four hours during full operation. This gives an average of one and a half sessions
using the camera per day.
Overall the project invoked many learning opportunities in circuit building and testing as
well as battery system selection. About 40% of the project involved research in electrical
engineering methods and testing; 40% incorporated mechanical engineering methods and
reasoning and; 20% involved manufacturing in hands on shop work.
6.2 Further Investigation
Optimization would be most urgent to complete in any further investigation of this
project. Possible benefits of optimization are a longer lasting battery system and a lighter
system if further battery research is completed.
For optimization of the DC to DC converter it is suggested that switching regulators
replace the existing linear voltage regulators because they are more efficient at converting
a large DC signal to a smaller DC signal, they give off less heat and are able to keep a
constant voltage with small variations compared to the linear type regulators. Although
switching regulators cost more upfront, big gains are made in efficiency allowing for a
longer battery life and a longer NIR camera session.
6.3 Applications
The battery powered NIR camera is a useful tool in that it allows the full rotation of the
rotating table in both the azimuth and altitude directions. To make the NIR camera
portable a circuit was designed to emulate the existing power supply and a battery system
replaced the power from the wall outlet. After doing all of this the NIR camera powered
up and was able to take pictures and capture video in the same manner as it originally
had. Therefore this project added value to the NIR camera system.
In the context of architectural advancement this paper has done little in that respect, but
in the context of the MIT HelioDome project this paper has created a new device
furthering the effectiveness of the project as a whole. With free rotation in the table as
opposed to the restricted rotation of the past, more angles can be explored in
goniophotometry allowing for more data acquisition. This information is then analyzed
and turned into BT(R)DF's which are useful to furthering advanced fenestration systems.
This portable technology has use in other fields not related to architecture. For instance,
an NIR camera with portable capabilities can be used in unmanned vehicles used by
rescue crews to take photos and capture video of hard to reach areas. Any type of
portable surveillance is possible using this technology. As with the Heliodome project,
portable technology like this can lead to more value-added projects in the future.
7 Appendix
7.1 HelioDome Illumination System
The author of this thesis entered the Heliodome project May 2007 as a participant in the
Undergraduate Research Opportunities Program. The author's specific tasks were to
calibrate the HelioDome illumination system by properly aligning a series of components
between the light source and the rotating table thanks to a positioning system that was
designed and constructed over the summer and fall sessions. An additional task included
building a filter wheel system designed by a previous student in the Heliodome project.
The Heliodome illumination system had provided experience in many aspects of
mechanical engineering. From drawing board to manufacture all mechanical engineering
methods were applied including engineering calculations, material choice and CAD
integration.
7.1.1 Filter Wheel System
A filtration device for selecting specific visible and NIR light wavelengths related to the
red, green, and blue sensitivity peaks of a CCD camera and the pixel response for a NIR
camera. This device functions with the Department of Architecture Daylighting Lab
goniophotometer to profile the complete reflection and transmission properties for sample
building materials (Koch 2007). This device was designed by Timothy Koch for his
thesis in the spring of 2007 and constructed by the author of this thesis in the summer of
2007. The following sections explain what
The parts of the filter wheel system include the filter wheel, filter holders, Geneva drive
and supporting frame:
Filter Wheel
The filter wheel, was designed to have 10 apertures for a total of 9 filters and one empty
aperture to act as a void. The material choice suggested was a lightweight plastic for
mass reduction and polyurethane was finally settled upon for its compressibility and ease
of machining. The size of the filter wheel
was too large to machine in MIT's
machine shop facilities so a redesign of the
filter wheel assembly was done. The filter
wheel was broken up in to smaller pieces
with a special joining design called
dovetails so that they could be fit together
like a puzzle and glued into its final form.
Figurel4. Photo of final filter wheel
design sectioned and glued together. The
dovetail design on the edges of the filter
wheel individual pieces fit mated with the
edges of other pieces completing a circular
filter wheel aPnemhlv
Filter Holders
The filter holders were circular rings of used to brace the different glass filters up against
the apertures of the filter wheel. Rubber bushings squeezed against the filters holding
them in place and protecting the filter from abrasive metals or plastic in the assembly.
The materials selected for the filter
holders were polyurethane for the rings
and neoprene for the rubber bushings.
Unlike the filter wheel, the filter holders
were small enough to be machined using
MIT facilities without a redesign.
Figure 15. Photo of filter holders and
filter wheel. The filter holders brace the
glass filters (not shown) against the
apertures of the filter wheel using
machine screws and neoprene bushings.
Geneva Drive
The function of the Geneva drive portion of the filter wheel system was to provide a
reliable mechanism to apply a delay while advancing between filter aperture while
rotating the filter wheel. There are two parts to the Geneva drive: the output wheel and
the drive wheel. Polyethylene plastic was selected for the material used in both the
output and drive wheels.
While making
manufacturing considerations, the same
issues arose with the output wheel as with
the filter wheel. A redesign was made and
again, dovetails were used to create the
puzzle effect and the output wheel was
glued into its final form. The drive wheel,
on the other hand, did not require a
redesign.
Figure16. Photo of Geneva drive. The
upper portion is the output wheel and the
lower portion displays the drive wheel.
Supporting Frame
To hold the filter wheel system altogether a supporting frame was designed and
construction.
Considerable redesign was made to the supporting frame due to
manufacturing issues and integration into a larger calibration system which was designed
simultaneously with the filter wheel system and discussed in Appendix section 7.1.4.
The material selected for the supporting frame was stainless steel due to its strength and
rigidity.
To add to the rigidity of the frame, L-shaped extrusions were selected and
screwed together using stainless steel machine nuts and bolts. An A-frame style design
was used to support a stainless steel rod which in turn supported the rotating filter wheel
and Geneva drive. Motors were mounted on the frame and connected to the Geneva
drive.
Figure 17. Filter wheel system including filter wheel, Geneva drive and supporting
frame. The supporting frame was made of stainless steel L extrusion and bolted together
using stainless steel nuts and bolts.
7.1.2 Beam Shaper
For the goniophotometer application, it is important that the apparent beam on the
material being characterized is the correct size. When the goniophotometer rotates on its
altitude axis, the apparent beam will expand, becoming ellipsoidal. Without intervention,
the apparent beam will °ood the surface of the goniophotometer when it is rotated to an
extreme angle (nearly parallel to the ground). The apparent beam will be the wrong size
unless something is put in its path to stop this excess light from reaching the table
(Browne 2006). A "beam shaper" was developed which stops this occurrence and the
author of this thesis construction a new supporting frame for it which was integrated in a
larger calibration system.
The beam shaper supporting frame was designed in much the same way as the supporting
frame for the filter wheel system. Stainless steel L extrusion and nuts and bolts were
used to create an A-frame which supported a platform housing the base of the beam
shaper.
(a
b
Figure 18. (a) Beam shaper on previous frame made of partical board. (b) Redesigned
frame using stainless steel L extrusion.
7.1.3 Light Source Support
The light source for the goniophotometer must mimic sunlight as closely as possible. It
must be collimated (up to 5± of spread- justification for this value is discussed later in
this section), have a color temperature similar to the sun (approximately 6,000 Kelvin),
have a spectral output similar to the sun, and be uniform in its emission such that all areas
are illuminated equally. An Hydragyrum medium-arc iodide (HMI) lamp was selected as
a light source for the goniophotometer (Browne 2006). To incorporate the HMI lamp
into the larger calibration system a light source
support was constructed using stainless steel L
extrusion and stainless steel nuts and bolts.
Figure 19. Light source support made of stainless
steel L extrusion. The three comers of the triangular
shape support the three legs of the HIM lamp tripod.
7.1.4 Illumination Positioning System
The purpose of the illumination position system was to develop a mechanism which
allows the easy replacement of the filter wheel system, beam shaper and light source into
the correct position for the goniophotometer setup.
The design of the positioning system includes a main rectangular frame made of stainless
steel L extrusion for its strength and rigidity. It is a large structure, but very low to the
ground because the filter wheel is very tall and must light up with the center of the table
about three feet off the ground. Caster wheels are included in the design to make the
rectangular frame mobile and easily removable from the rotating table.
The mobile
positioning system attaches
to the rotating table using Cclamps and the illumination
components are dropped into
the rectangular frame from
above.
Figure20. Illumination
Positioning System for MIT
HelioDome Project. The
device allows easy setup of
illumination system
components.
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Pin Descriptions
PIN
1
2
IMME
DESCRIPTION
LIMIT
LIMIT
-
+
Resistor
N
value
i
t
r
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of
0
0
to
1
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between
e
pins
ti
1
t
&
ma
2
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limits
meanum
HTC
output
t
current
ifi
ti
bipor opemation.
Short pins 2 &3 for
PI OUT
3
Install diode for
unipolur operetion (see page 6, step 1for
polarity)
(15 ppm typical)
VREFOUT
3.675 V'bt Reference
<50 ppm staity
.4
Measurement gound. Low current return used only wth pins 6,7 &8.
5
COMMON
Inteml sharted to pin 10.
Temperaure monior Buffered measuement of voltage across Sensor+ &
sensor
7 SET TMONITOR Selpit moto.
ered measurement of the seiint iput (pin 8).
inpeduace = 1 MW
8 SETPOINTIPUTf Remote setpoirt voltage input Input
Supply voltage input +5V to+12 V.
Contact Factory for hiher vltage operation.
high curret retum.
G
Power Suppiy Graund. Used wilh pin 9 for
10o
STEC+ & TEC- supply curent to the TE module With NTC sensor,connect TEC+ to
1positive lead of TE noduie. W•htPTC sensors, connect TEC- to posilive lead of
TE modue.
A senir bias current wil source ftrim Sensor+ to Sensor- if a resistor is tied
13
SENSOR+
Sacross R + and Rft-. Cnnect a 10 kQ resistor across Sensoar+ & Sensor14
SENSORwhen using an ADS90 mperalre sensor. See page 6,step 4.
Resistance between pins 15 16 selects sensor current from I pA to 10 mA.
15
R,+
Range is Dtol MEL
16
Re.Resistance between pins 17 & 18 selects Proportional Gain between 1& 100.
R.+
7
,, Range is 0 Q to 495 kQ.
18
Capacitance between pins 19 & 20 sets the Integral Tmne Const between
C +
19
D0and 10 seconds. 0 seconds (OFF) = 1 Mfresistor
C 20
0.1 to 10 seconds =0.1pF to 10pF.
Eectfcal Specifications
MODELIMMBER
HTC-1500
c
Temperature Control
Temp. aontrol Range
Short Term Stability, 1 r.
see note @
001C
<00
0
Long Term Stabity,24 hr.
TECOuput
Bipoer Ouput Cmnt Mednum
Bipolar
Oput Cuert, Typical
eg
ConmancemlgVop
Power
Maxinum Outpul
MxIJnm tIternal Powe Dissipaion
CurretLini Range (± 2% FS Accy)
O003 C
±1.SA@
±1.4to±1.5 A
HTC-3000
see note *
<0.001oC
<0003oC
±3.0A
2-6to±3.0 A
>±8V
>±8V
12W
9W
0 - 150DSmA
24W
9W
0 -3000 mA
+1.0A
+Sv
8
8W
9W
0- 1000mA
+2.OA
+8V
16 W
9W
0-2000 n
Resistive Heater Output
Ouut Current
Unipolar
Conmpance volge Mximnum
Mxinum Otpu Power
Maximum ItemerPower Dissipation
Cnreet Lrn Range (± 2% FS Accy) e
Control Loop
n Gain Range )
Pmportio
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Temperature Sensors
Sensor Cuzent Range
Resisive Se•nar Types
ICSenm" Types 0
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P,PI
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0 to10 seconds
RP,
11o 100
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I 1jAto 10 mA
Thernstor, RTDS
AD590, LM335
IpAtoO1 mA
Thenistor, RTDs
ADSK0, LM335
< 10%
r10%
0 Temperature Range depends n the physical load,
GeneralSpecifications
sensor type, input voltage, and TE module used.
Power Requiremnts ,
* Stability quoted for a typical 10 kQ thermistor at
+5V to+12VDC(+12.5VMAX)
1tooA sensing curent
Coct
f
highI
vrtaper
o aon
* Compliance voltage will vary depending on power Supply Currmt
supply voltages. Amaximan complance voltage of A
HTs Linit
Curretn
Setting
plus
200 mA @ V+
••s will be obtained with +12 vok input Aminimum Operating Temperature
compliance voltage of ± 2.0 V will be obtained wiat+5
Oto+50*C
Storage Temperature
Vinput. +6 V operato willfimitthe setpoint volage to
3.5 V.thus niing the temperature range of the HTC.
-40b+M50C
Connectors
* User configurable with external resistor.
-ospaag
2Dpinheade.er
9 User configurable with exte~al capacri.
* AD050 requires an external bras voltage and 10 k
ho toate accuracy
iso
Weight
* Without proper heatsinting, the output current
< 1.5
o
decreases as the T exceeds 75C.
Size
(HxWx D)
SIfthnsr.TE module, oasr diade
arecase ommn
0.34x 2.5r x 1.6" 8.S x 07 x 41 am]
the laserdode drifer and TE controller power supplies
Required Heatsink Capacity
5. CIW!3in
eac•other.
must beisolaed from
.A
- ...
. ... .........
MechanicalSpecifications
TOP VIEW
SIDE VIEW
2.
-I
A
if
or
;pano
-4--
6I
S'%.utciLPn
iTEI
-I-1-WrpFOCAR
1.1i2VpAu,
n-.-j-- oil-
M,
. S'6QM*-0lNO
* Use O.3ZtidinkPCBnmouting your HTC products simlarto the stylesuAd
an the vaatin barnd.
CAUTION: Do not bend any of the pins. Doing so may cause damage to
the internal circuits and will void the warranty.
HTC PCB
angm
la
Hea•,it n*•r T~dCObSd
"aaklainboar. Talestco poneft
.
....
Jl
t
.
asowa o
POWER SUPPLY AND NOISE
GROUNDING
The HTC Series Temperature Conroller is a linear controller
designed for stable, low noise operation. We recommend
using a regulated, linear supply for optimum performance.
Dependng on your requirements you may be able to use
a swiching power supply (Aswtching power supply will
affect noise and stabilit]
il
I
O
0
O
warr
The recormnended operating voltage is between +5 V and
+12 VDC. The voltage available to the thermoetect or
resistive heater is the *Compliance Voage." Compliance
voltage varies with the input voltage. A maximum
compliance voltage of 8 V will be obtained with +t2 V
input. Amiarnin voltage of 2 V wd be obtained with+5 V
input- Operating from +5V wl also tit the seipt voltage
range (0 to 3.5 VI, thus limiting the treperature range.
Higher input voltages can be used with special
consideration. For higher comprance voltage operatin
contact the factory to discuss your application.
.
Ou14
*dIYCW5,5
c
"~
ome
q'""**
Specia aention to grounding wiý assure safe operation.
Some manufacturers package devices with one lead of
the sensor or thermoelectric connected to the metal
encosure or in the case of laser diodes, the aser anode
or cathode.
A heasink is required to properly dissipate heat fro the
HTC mounting surface. Use a heatsk it at least a
&B*C i W 13 inch ra.g.
WARNING: Precautions should be take not to
earth ground pins 11, 12, or 13. If any of these
pins are earth grounded, then pins 5, 10, and 14
must be floating with respect to earth ground,
HTC Connection Diaaram
HTC Connection Diaoram
HTCoperation is sinfe. Just add a power supply, six passive components, your sensor and lhercelectric, and montor
the setpcnt and acoual temperatures. Ths diagram shows the most basic operation.. Details for each
'•mponentare on
pages 5 & i.
Set aret .ln tth
to 12
Z persuppl
0C
y
STIero
treasreTeirper e
A a Teiiperatire
I
i'rx(5
t~al
sis
Cmroirr
7Teperatire Seipni nor
0 e.iltp'uvo
,-MT,Mgmlir
Vontiq0"'
I
)J
is
~sso
s3rtwa
..
Se-t
Proprtl-r'adCar
Meteesti
1
'or
Set
7Te
1tr
,-Cnt it
S~I~~~Erseen
t ant
I: ectrics
7
o
ieee~ I3SW ecib'ss'i.
45±t.S
ira5.
n
's....
The Eight Steps to Using an HTC
Output Current Bias - Pins 2 &3
bmwPt
b
1
u
r
WC ensor)
Opn
Q2
mit+
W
OR
PID OUT
Thermistors are Negative Temperature
0"
or*"
Fcm
OR
Coefficient (NTC) sensors.
A
rthermstor's
resistance decreases with
increasing temperature.
RTDs and IC Sensors are Positive
Temperature Coefficient (PTC)
sensors. A PTC sensor's resistance
increases with increasing terperature.
3
Limit Output Current - Pins 1 & 2
rTC-3
HTC-15O
W TE
20k
45
R,.l
TFina
TE
20 k
-3
3
R-3
Adjoiwabl Enabae= pm
MalPam
Thmpyit
Disab
=
"lITd
4-
i-*
R,
3W
oirA
t
t,5A
t
1A
fTi3
EqiAws
tw
I'm C
lA
2A
3 A.
W
- t MD
R,
3.3
3.
133 k
N•2
use sibi reae rosers aerem
on pFe 1.
Sensor Bias Current - Pins 15 & 16
I.225:
Pan t
1ad
a?
Ra
i*aia
rflrPasnl
z
%L.•determines the amount of
current sourced to the sensor
IIattached
at pinat
s 1& 14. Thechart
C&indicates recommended cufents
for typical sensors When using a
:g
.
11
,
on
A
121i"
-o1 uA
1 A
voltage feedback sensor
as
an AD590), eavepins 15 & 6riaopen.
-122
I.
i1(suc
x
M
S•r•1MA
x
x
Sensor
'
-Pins 13 & 14
V~ually anry type of
tenmerature sensor
Treser
T orWL35
~
-<,-#3
mar4
t
a.l-
can be used with the HTC. It must
produce a feedback
age between
0.5 V an (V+minus 2 Vt. See Step
(R•a to set the amount of bias
to thesensor.
current
.V
-•____._
Proportional Gain - Pins 17 & 18
the gain of the system from 1to 100. A
proportional gain will have minimal
overshoot, but may take longer to settle in to
temperature. A small gain will have more
vewrshoot and nmry cause oscillations around
the setpoint temperature. For most applications,
Ssets
large
aL
-GAN
a gain of 33 works. Change the proportional
gain while the output is OFF
R0
-
Sntegrator Time Constant - Pins 19 &20
cF'
Coa
140.
17--1_01
>T
-
04
T
T
.
.
r1 Ms
_
0 (OFF
seco
secods
109seco
c ,,M
I r~n
1 0.
5 F
to F
C, sets the integral time constant of the system
from 0 to 10 seconds. Use a capacitor with
Dissipation Factor -less than 1% for best
performance. These typically include metalized
film polyester, polypropylene & some ceramic
capacitors. Recommended capacitor is
Panasonic # ECO-VIJID0JM. Capacitors with
Dissipation Factors > 1% (typically electrolytic,
tantalum, and ceramic) will cause drift in the
Integrator circuit. To disable the integrator use a 1
MWresistor across pins 19 & 20.
Temperature Setpoint - Pins 8 &5 (Pin 4 optional)
The setpoint temperature depends on the voltage
Sappled to pin 8 and your sensor The setpoint is
the voltage your sensor produces at the desired
temperature.
.Vo
Re sitance
t
Eas oUrret IuoopA
to a
Monter setpoint w*th aDVM
at pXis 7 & 5or acttal sensor
voltage across& pins & 5.
TE Module &Output Current Measurement - Pins 11 &12
...... .....
oup
ute
ITE modcule anu an amiUeter
iI
you want to monitor TE current Current flows
from positive to negative when the HTC is
coo ng wth an NTC temperature sensor
When using an LM335, AD590, RTD, or other
PTC sensor, reverse the polarity of the leads
Si.e.
connect thepositve lead ofthe TEmodule
to TEC-and the negat e lead of the TE nrodule
toTEC+).
OAA&.......
OPERATING PROCEDURES FOR HTC PCB
S
-I
C?
I
S
C?
I
HE alvso Board
To ns afflheHTC on the
Conguration Switfth-SW
I.Feed the HTC pins through te large open in the
Evaluation board so that the HTC pins are on the top
mounting tabs are
side of the Evaluation board and the
back side ofthe board. NOTE: Do not bend
against the
The Configuration Switch selecsthe OUTPUT MODE. LMT
RANGE. SETPOINTINPUT, and SENSOR BIAS CURRENT
Before applyng voltage to the HTC PCS. check the switch
seWtngs for proper onfturation.
the HTC p•.
The FACTORY DEFAULT settings are
2. Line up the heatsink holes behind the ITC and insert
the screws through the Evaluation board and HTO urn
into the heatsink holes.
3. Line up the HTC pins on the solder pads on the
Evaluation board and tghten the screws.
4. Solder the HTC pins to he solder pads. NOTE: Do not
exceed 600*F soldering temperature for more than
5 seconds on any pin.
SWI
Limit Range: Lowest (SWI:1 ON. SWI:2 OFF)
Bipolar Operation: (SWI:3ON. SW t:4 &5 OFF)
Onboard Trimpot Control: (SW1:6 ON)
100•IA Sensor Bias Current:
SW1:7, 9. &10 OFF. SW1:8 ON)
TerminlBlock
Wire your thermoelectne module (or resistive heater and
sensor via this 12 contact screw termmnal connector.
Connect an external seLpoint voltage input here, also.
Various other signals are available a other powts on the
PCB as well as on the lerminal b~Mck Actual and Se~point
monitors, Integrator Time Constant Capacitor, and Supply
Voltage..
tohe
We recommend using a mininum of 22 AW wre to
thermoelectric.
The following page details the switch setfings.
A i..ý
VU
LIMIT RANGECUTPUT MC-0
Asingle turn irmpIoK
(Ru) austs
the mnaromn Ouput current. Sicee
the resistance is not linear with
cumren halffull scal isat less than
IDOT
1M turn.
The HTC can be configured for
bipolaror nipolar operation The
position of switches 3, 4. and 5
detemnnine theoperang mode. See
page 6, step f-or a discussion of
NTC and PTC sensors.
The temperature setpoint can be
controlled by the onboard R
,
trimpot or with an external input
voltage on the terminal block
(SETPOINT INPUT). Switch position
6 detennines how the setpoint is
OUIVrmS- Im:s Im4 Ism
o
Switch positions I & 2 set the -ul
scaleW
vaue to one of three current
ranges. Select a range that includes
your maximun operating urrent
PBC
M OF OFzrk oF
UzrMWz
I~IL~±L5MZ4
0Ipa
.
W
±h1W
o Z
SENCIRRAS CURRENT~
Q-M5A
-1A-
a-1A
On
I 0-l2A I Off
a-1.a IA-A
I OFF
I
GIOFFChoosing the crect bias unrrent for your sensor is inmportant Based on
O
or
If you want to accurately measure
the output current to the TE module.
hook up an ammrneter in series with
the TE module as described on page
7. slep S of the manual.
the resistance vs. temperature characeristics of your senso. select a bias
current that gives you a voltage feedback greater than 025 V and two volts
less Ihan V+.
I5n
Icuular
mI
wS I 5": I
sew forc
w12A
lnfl
IOs
ion^
onr
on
OFF
oOFF
OFF
IOFF I
OFF
OFN
o F
aFF
Oar
On
m
Cr
C"
I ar
OFF
oFF
FF
a"
neMa naVmieoenosD
&Ths5albs
towoos roeaacs
On
I OFF
aRTo
I
a#ms
Begin with apropciftnal gain of 33 (Jackory debult)~. The temperature
ADC voltage can be applied via the
vs. time response of your system can be optimizted for overshoot andud
ferminal block connections labeled
sedding time by aaijjsft thWe
Rw thipot between 10 and 00. Iincreasingi
the gain wigI
darnpen #*outpQut (lonager seffinag time. less oversihoot). For V+andGN. USEONLYONEINPUTI
to supply power to the HTCPCB.
morce
hiornuillion on FID conrtrollers, request Technicnal
Note #201
Opkkddrqi~l
Theman~celechic: To~e~mwa~tuare
Control System-
A tpF capacitor is mounted on the PCB as shown aid will give you a one
second integrator time constant By adding capacitance across the C+
and C,,- inputs on the terminal bock, you can increase the integrator tirne
constant See page 7. step 0 for more information. Use only capacitors
with a dissipation factor less than 1%. For more information on PID
controllers, request Technical Mote TN-TC01 - Optimizing Thermoelectric
Temperature Control Systems.
With a DVM connected to MONITOR + and COMMON. toggle the
Measurement Select Switch to measure SET T (setpoint temperalre) or
ACT T (actual temperafture I these test points are not used. SET T and
ACT T can be measured via the ACT T and SET T MONITORs (referenced
to COMMON} on the terminal block.
. ........
.-
_11
This switch enables or disables the
DC voltage from either the
PWRPAK-5V input
:conector the
terminal b&ockconnections labeled
V÷ and GND. The green LED will
light when power is applied toihe
HTCOPCB and he switch s "ON'0.
When DC power is applied to the
HTCPCB. the output current can be
enabled or disabled by toggling this
switeh.
'· --- -- - ~ -
IN
. Ill------·-----------------..
--
--
---
,.-
I
HTC.-1500: 1 HTC-3000
t
-.:;~u~ `Ab~?
rg~
.i,
,,
bV8O
NOIIVI2An3 5;H.,
NOTES FOR OPERATING WITH RESISTIVE HEATERS
Operating the HTC with resist:eheeters is very similario operatin the HTC w
withehrmceleetic modules. Use low
resistance heaters (<25 ) ifor mauivma power outlput Resistances greater than 100 0 ma lint the output voltage.
and thedore power. slowing down. temperAtre changes.
Follow the operating instructions for themnleectics on pages 8 &7
aih
these changes:
I. The outpt cunrrent maximum is reduced to I Awuih the HTC-i500 and 2A with the HTC-3000. Calculate he IMIT
OUTPUT resistance with these equabons•
2TC-1500
k
IMS
TC-30D
20k
6123
'weS1
~tn
-r
2. Attachte esisivehealerto Pins 11&12 (TEC+ &TEC-).
3. Depending on your selection o NTC orPTC sensor, attach a blocking diode as show n page S. step 1. DO NOT
OPERATE INBIPOLAR MODE WITH RESISTWE HEATERS.
NOTE: Coeact the facory for voltage operatin above +12 V.
secanentiseSurns
sqpat or feel•r.
operatefhin:e+5V
lb+I21VDC poferqupfy
Upffepfre
Teperanu
e&A"wae
r
*era
wM).
Caoal Terperab Seetpoint
4
A
1Wn
ace-
restmctrianpot orJSenriWoIwte
.ne
teas.
WMg14@*
befaven 1anm
t
$Z.
W.t
fIlgrater TfRE Canmurt
WW4*FSlSOSKSSMS
er
~eland
10 seowrds
SkM.*i~
No"
WAS.d~k
S1
caW.Sa
*** rz~Pur~r*
rIns 131 14
S'wtnro-
9
Appliation
Notes
m
Monitor Calibration Circuit
A sIa Set may be present S
or 7*
pketthe actual
meassng p5 &W
otpuLt Ad ils aut Inremove aty
offset.
TN-TCOf
COMUM
SETT
R
m an
Optimizing
Thermeeflenri
Temperature Control
Systems
CALOMAITED
AE PSIT
M0Mr~TR
Technical Note TN-TC0I detas selecting, integrating ,
and opqtiizing the components of a temperature control
system. For your free copy, cal Technical Support at
(400) 587-4910.
USING THE HTC WITH A CONNECTOR
The HTC leads are meant to solder knto a circuit board If you want to use a connector, we recommend the
following:
Molex PartNumber
10-11-2203
08-55-0120
Description
Molex Crimp Terminal Housing 20 pin (High P ssWum)
Moles Crimp Tenrinal 7870 (Hth Pressure)
Molex Crimp Termnal Housing 20 pin (High Pressure)
(only 6 pins shown)
Moiex Part Number 8-55-0129
Lx W= DA44"
x 0.7("
(It2 r• n x 1.93 mm)
20 pin Molex Pan Number. 10-11-2203
L x W = 2.OT x 51' (d1.3 mmx 12.9 ram)
........
Molex Crimp Termrnal 7879 (High Pressure)
for mee size 22 - 30 AWG. Select Gold P~lati
-. ,&AA
-,
CUSTOMER SERVICE & WARRANTY
ifyou have any questions or comnents, please call our technical staffat (40) 587-4910. Our hours are 8: a.m.
o5O00
p.m.MT.
Wavelength Electronis warrants this product for 90 days against defects inmaterials and workmanship when
used within published speoiications. This warranty extends only to purchaser and not to users of purchasers C
products. If Wavelength receives written notice of such defects during the warranty perio•d wewill ither repair
r a
replace produts which proe tobe defective. Wavelenglh makes no warrant concerning the Ilness or suitability
of
products for
its
a particular use or purpose, therefore, itis purchase's responsibilty to thoroughly test any product and
independently conclude its sasfactory perfomance inpurchasers application. No other warranty exists either
expressed or implied. and consequenial damages are specifically etluded. Wavelength Electronics resenrves the right ,
to change eicuiry and specifications wihout notification tany time
.Al
pmroducts retuned must be accompanied by a Return Material Authoriation (RMA) number obtained from the '
Customer Service Depadment Returned product will not be accepted for cedi o replacement without our penission. C
Transportation charges or postage must be prepaid. A retumrned products must show invoice number and dale and
reason -Ir
rebsm.
Wavelength Electmic
s, Ic., P O Box 65, Bozeman, MT 59771
Phone(406) 587-4910, Fax (406)567-4911
emas:sales eteamwvlengt com, WEB wwws.tearnw
.ngthcom
_0%It.n
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X
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cr
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Pspriat
ary t-o Seson
Unlimitod,
Inc.
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I*
7.5 Linear Voltage Regulators
7.5.1 LM2937
AuguSt 201
SNa
tional
Semiconductor
Co
CD
LM2937
500 mA Low Dropout Regulal
co
•
two-batery jumps and up Io +ow/-soV load
General Description
dump transienf, Familiar regulao featurs such as short
The LW 37 is a positi voltge reulator capable of sup- circuit and themal shutdown protction are also built in
pyirg upto SRmAof lod curren. The use ofa PNPpo*er
trseistr provides a low dropout voltage characteristic. With
a Ied cuent of 0 rnAthe minimum input to ulput voltage Features
diferential reqdred for the ou utto remain in regulation is " Fuly spciied for operation over -40 to +125'0
Otypicsly
O5V (IV guaranteed maximum over the ull oper- a Oulpcuurent inemces of 500 mA
ating temperature range), Special circuitry has been icor- SOutput trnimd for
5% tolerance under all operating
prated to mrniz te quiescent current to typioally only
corditions
10 mA with a full 00 mA load currnt when the iput to
Typical dropout vdotage of 0.5V at full rated load curent
cutput voltage dierr isgreater than 3V
Wide output capacitor ESR rarge, up to Sn
The LM297 requires an output bypss capacitor for stabilInternal shortt circuit and
whemsi
overoad protection
ity As with mt low dropout regulators, the ESR of this
Reverse battery protection
capacitor remains a critical design parameter but the
OVY
ir transint
ection
LMI297 indcludee pecial onpensation dciritry that relaxes
Mirror image insertion protection
ESR requirrments, The LM2937 is stable for al ESR below
3. This allows the use of low ESR chip capacitors.
Ideally sited for autcomtive applications, the LMŽas7 will
protect itself and any load drtry rom reverse baltery
Connection Diagrams
TO-220 Plastic Pckage
SOT-223 Plasic Package
l~
Front View
IP -ria
Ima
Front View
TO-23s Surface-Mount Package
Side View
Top View
%iiinnducra Capornicn
Nuihnal Surionductr
02OO~
020065
NaJironal
Corpor~aico
~G211~9)
C-O 1290
wwwnolrnatccm
wwwnr•ti-natcc
0311
r3
O'
0
Ordering Information
Pacage
Temperature
Part Number
Packagng Marking
LMe37ES-5,o
LM2s37ES-5.o
Transport Media
NSC Drawing
Rail
TS3B
Range
TO-263
-4CoC sT,
s 125sC
500 Units Tape aid Reel
LM237ESX-5.O
LM2937ES-8.o
LM2937ESX-ao.0
UM2937ES-10
LM237ESX-O
LM2937ES-12
LM2•37ESX-12
LM237ES-1i5
LM2937ESX-15
TO-220
SOT-223
wwwnatinakocm
-40C ~T s 125G
-40C s Tj 985C
LM29s7ES-8.
LM2937ES-10
LM237ES-12
M2-37ES-15
Rail
500 Units Tape and Reel
Rail
o Urnit Tape and Reel
Rail
500 Units Tape and Reel
Rail
Units Tape and Reel
_5_
LM237ET-5,0
LM2937ET-80
LM2937ET-10
LM2937ET-&O
LM2937ET-a.0
LM2937ET-10
Rail
Rail
Rail
LM2s37ET-12
LMaNSET-12
Rail
LM2937ET-15
LMa2937MP-5.0
LM29371MPX-5R
LM2037IP-,O
LM2dtIMPX-Bo
LM2g37lMP-io
LM297tMPX-10
LM2t37tMP-12
LM2-37WMPX-12
LUM29371MP-15
LM237MPX-15
LM2937ET-15
L718
Rail
1k Unit Tape and Ree
2k Urits Tape and Reel
1k Uniets Tape and Res
2k Urits Tape and Reel
1k Urits Tape and Reel
2k Units Tape and Reel
1k Urits Tape and Reel
2k Uits Tape and Reel
k Uits Tape and Reel
2k Units Tape and Ree
L72B
L738
78
78
T
MP4A
Absolute Maximum Ratings (Note 1)
TO-28 (10 seconds)
If MiXita•Aerospace specified device are required,
o Sal"ecOffocea
pese contact the Ntional Sawmilon
80T-223 (Vapor Phase, 60 second)
80T-223 (Infred, 1S seconds)
ESD Suceptiblity (Note 3)
Distibutlrs for avalability and specifications.
Input Voltage
coninuous
26V
COV
Internally Lmited
1501C
-65'C to +150
~C
-%WeC
Transient (t• 100 ms)
Inteal Power Dissipation (Ncte 21
Maximum Junction Temperatur
Strage Temperature Range
TO-220 (o seconads)
2.3o'
215'C
2kV
Operating Conditions (Note)
Ternperatue Range (Note 2)
LM2w97ET, LM2937ES
LM29es7MP
T, s125*C
-40"C sT, s8~5C
-4C
Mawxim
Input Vol"ge
26V
Electrical Characteristics
V,, = V~,+ BV, (Note 4) l uT..= 500 mA for the TO-220 and TO-263 packages, Iu.,.=40mA forthe SOT-228 package, CoGr = 10 pF unress chenhise indicated. Boldface aits apply over thf entire operating temperatwe range of the
iniaed devic, aftll
oter pecificains a for TA = T, = 25G,
Output Vo
Paramweter
Ouput Voltage
5V
OUT)
Condin
5 mA s 1ý ; ar.
Typ
5.00
Typ
o00
5.15
s_
+
c
Load Regulation
= 5 MA
SIurT
5 mA - l]u
1,ourL,.
5
so50
Otiseent Current
(Vw,
+ 2V) s Vs 28V,
2
o10
+ 54,
1o
22v.0 10
150
240
v. =
V
26V,
Units
Typ
Limit
9.70
9.50
V(Min)
1000
10.30
10.50oo
V(Max)
V(Max)
SAO
50
2V
Umit
7,76
7.10
&24
15
Line Regulation
1iV
SV
Limit
4B55
4.75
V(Min)
80
30
100
rnV(Max)
8
0
10
100
mV(Max)
2
10
2
10tomA(Max)
20
10
20
24
rnA(Max)
=
OuTr Iourr-mu
Oulput Noise
Voltage
10 Hz-loo kHz
lCU = 5 A
Lorng Term Stabilty
100 Hrs.
20
Dropout Voltege
aT = loui-..
0.5
1.0
0.5
1,0
Q5
1.0
V(Max)
= 50 mA
110
10
250
0.&
110
1.0
250
110
1.0
250
mV0••xs)
0.6
0.6
A(Min)
0O
75
So
75
60
V(Min)
24
V(Min)
-80
-15
V(Min)
-75
-50
V(Min )
'ou
Short-circuit Current
Peek Line Transient
Voltage
t < 100 Mis RL = 100W
75
Maxmum Operf6onal
Input Voltage
Revere DC
Input Voltage
Revese Transiernt
Input VoltageI
32
26
Va, -0.6V, RL = 1OC
-1
300
-1i5
40
26
_-_
pVme
-15
nWV
I
t, < 1 mns,R, = 1CX)
-75
-50
-75
-50
www.rnalrcl.ccm
Electrical Characteristics
V,N= Vju + 5V,(Note 4) Lou, = 500 mA for fh TO-220 and TO-26 paages, Iu..=400rmA for h SOT-223 package, C , = 10 pF uress ot•erwise indicated Boldtace imit appy over the entire operating tempeatue range of the
indicted device, all dher specikicns are for TA= T, = 25•
2VV
V
Output Voltage (u)
Pareter
Output Vdotage
5 mA
Conditions
l~
,
u
Typ
12.00
Unit
Umit
11 64
11.40
Typ
15.O0
12.36
12.60
Line Regulation
(our +
2,1)
VN
5V,
Limit
14,55
14.25
V (Min)
V(Min)
1SA5
15.75
V(Max)
V(Max)
3
120
45
150
mV(Max)
12
2
10
15
2
150
10
mVfMax)
mA(Max)
10
20
10
20
nA(Max)
lour = 5 mA
ur..T
.
5 nA S o,
(Vour + 2 S VI
N 26V,
lur= 5 mA
ViN = (Vur + 5V)o
Lom Regulation
QuiecetrCuren
,ouT =
Output Noise
Volage
JOUTm._
10 Hz-10 Wz
=
5 mA
1o,.
1000 Hri
lOUT
= icU
1ou,= 50 mA
Long Tesm
Stability
Dropout Votage
Short-Circuit Cunrrent
Peak Line
i< Trarnient
Voltage
Operali•al
Mamimosr
360
44
0.5
110
1.0
75
100 ms R = 1000
450
pVr
56
0.5
110
1.0
75
1.0
250
0.6
60
mV
1.0
250
0.6
26
Irp~t Voltage
VW
oi
T - --
RL
=
-. 0
1005K
-30
-15
_
t,< 1 as R, =
I
q
-75
-0
26
V(Min)
-15
V(Min)
-- 0
V(Min
_
_
Reierse DC
Input
Voltage
Reverse Treaent
Irput Voltage
60
V(Max)
mV(Max)
A(Min)
V(Min)
-_
-75
_
__
I
dorota"pywen oraSir to deiat
ip•cticathr
Ieta 1: Absoke MaATni Ra• sInrl•~ia Ul bwpiwhcth dm tot1hdwIcermy,ocur Ei•lcutl
OFeattg Conarmb
ctlde cf Hlenroted
jundlc tamperahur ir
125
Is
the ma•inum
T4A.
where
i25
is
Pw"
any
anrrti
tempmarak
d4ssleIftn
a
pov*w
maAurin
albKt1~K~
Note2: Thv
tratumSr u wil diteabme
themalresistfmoe.I Its di8pation isaieed.t MSdiw
4rea4ftumert
8kisth
TAk to antiar&teanrndum, 0r,
CPeretbn,
serdvan
Forthe LMW, the
to
LDM2
M
A
g
lo
Mh
tirmnl
rIas abovyehOC,
6 not
r appý if Mediailmparwhrte
MeteocMal pictiatne W
1250Car"
iorei TO.220piap 7f M tr tiheTO.-23paacke.wid 174. M'tor tfW T-223padha. Whorused
,s6CW,
ltf0l
ark thermialam
1
1ito TO-2
twhalresistanri
heoteak
camnoD-tlart
ofS
3TA
wCIthe
reoSitaS
Ex
is
at unsum out. LM83p
srt-se
withaholatIit,
s•
•
acoppr
ara thm;i~ corrotad 1I the padoge
to P.C.board
ithe
re mr
rianee c~nbe recald by h•re•Pstg
uno4
ar 20T-223packagr
rnkkqi).
i
ibnn
'rint•rmaln
Appkaoltn HItr ruer
throtlo- 1.5 k,1
Noteat ESD rartinqib04 on thehmnm b0dyr•dl,100pFdisi•w
rarm.
pasnrmblc
Nc4o4 Ty•alaam arT, - 2'C wd rereger t nte Istfy
}rnkm~ea..r
wwmwAnakrlralorn
Typical Performance Characteristics
Dropout Voltage vs. Output Current
Dropout Votage va Temperature
A:Fl
aw
I
35
LI
16$
C~13
'4a
34
0
200
t30
~maI
R* 1C
410
, Q0
-40
4Q13 400
5D$1PL CJRPLNI
IEVRaNIX
11e
at'2gca
ofln
Output Voltage v& Temperature
Quiescent Current v. Temperature
20
-
too
4 . 410
. . ,
-
Ii
4,96
3
4
6;3
Itf
uiescent Curent vs. Input Voltage
lat1
Quiesent Current vs. Output Current
i-T-
''......................
_4L. _.............
....
: I..
a
..........r
-r
I
AC
Ii
'1
4
-*0'
7.
-
~: ~~ O2
0o
41
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Typical Performance Characteristics (tcurna
Lk. Transt Repons
Load Traelint Repone
JIM
.......
-ID
0
1
20
3%
40
SB 40
.. .. .........
....
0
-I
I
2
4
5
li
NE (10Q0 )
TIME(0t4
DS28
Appl Rmjuaon
10o
Io
Ikt
10k
Ou-pt I
1l0k
iN
10
1a00
-mpeiden
k
10k
100k
11M
ivOMuCYtr (H)
4 1=15
Medmum
Power
4Ieapalln
SO120)
Maimum Power
Dissop•a.
J~LCI¶3546
on
(TO4W"Nei
2)
22
20
t-~*
-40
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...I ....L_~...~r
I5 wnlYriW
.
-4
-----i---------i--::-----cr
r ~t
~,~tf+tti
~r~w4444""441
t;
I
a
40 :00tSINcK
120
PtNDINE
oT MENAE (Re
-IC
AWICT T &RAu
t
L... ... J .......
0 10 20 30 45 ,0 60
A.. . A..
••
NJ
S 90 100
ANBICITTIaERiATUK (C0
Typical Performance Characteristics
(conuedt
Low Vottage Behavior
Low ValNge Behavior
,...I_-4....-
k412
T
T 73
4
C14TMAIi
04~I:'4
0~'
~ ~ ~
-
.-----
-
0
IC
41
N 131 04
Output at Voltage Extremes
Low Vottage Behavior
12I
30
31
0
(4
0
3
0
2B 13
0
18
-3
-j2
-20 -08
0
in
20
30
40
Output Capacitor ESR
Output at Voltage Extoemese
1A
820
4
3
v
-Mr
-J
-'0
-ja
2
13
%1t~
V3. 'k-.
NY
~
30
40
1301 230D 2333D 4333
233
4 4
-~~
4114L 11 l
r
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Typical Performance Characteristics (c~om
Peak Oput Cwrnt
i
1
V
-1
0
TlMPERATi
i (1C)
Typical Application
URE~ULAT
INP
REOULATED
OJTPUT
AiF
pmr stapplar cli dlara
ialuclad ma•e thm 3 hdiasr.m th.l
* FRaquble
iftm rglgt r
doam
u pmMlb
opesIng Impafe •a.ra) Mi boua•rldm
pFowlSrl-isMpfd
M
=Rayildr dlabI•~yCnmust bed•it W10
ta
- s.
as
EI, aofs upqlabr ma bam
suplalq
t ombl ramlanmaO,
-
ftfLntiLal mw
B
oet"l•~u
r. Tha
Application Hints
EXTERNAL CAPACITORS
The utput capacitor is critical to maintairing reglator stabilty and must meet th required condtions fr both ESR
(Equivalent Series Reistance) and mirium amount of capacitance.
MINIMUM CAPACITANCEThe minimusm output capactance required to maintain stabiity
is 10 pF (this value may be increased without limit).
Largervalues of utput capacitance will give inproed tranaient rponse.
E8R LIMITS:
The ESR of the output capacitor will cause lop instability if
it is too
*igh or too low The awoeptable arge of ESR plotted
versus load current is hown in the graph below ItisessentW ta t e output cait/or meet thes req•dren•nts,
or ocwlktions caninsult.
Output Capacitor ESR
F-I-T-f
4
It
7 71
'I
U
iip
Ve
we
C
C
4C' Ie
The figure bekw shows the vol
and curents which are
present in te circit as well as to formula for calculating
the power dissipated in th regulator
........
I1-
J
L I-
ft - CNn- Vour) IL4- Nit) IS
FIGURE 2 Power Diesipation Diagram
The net parameter which must be caculated isthe maximum alowable temperature rise T. (mrna This is calculated by using the foiad
T; (max• = TJmnax) - TA (max)
where Tj (max) is the mawrntmin allowable junction ternparature, which is 125W fr commercial
grade parts.
TA (max) is the maximrn ambient temperature
which will be encountered in the
application,
Using the calculated values for T,,m(x) and P,, the maximum allwable value fr the jection-to-ambient thermal
resistance,
JA can now be found:
GI.A =TR
FIGURE 1. ESR Urnits
It is imznaant to note that Jor mst capacitors ESARis
specified orly at room temperature. However, the desigrner
munt ensure that the ESR will stay inside the liNts sh~ n
oer the entire operatirt tarrprature range for the design.
For alinum electrolytic capacitofs, ESR will increase by
abut 3oX as t temperature is redued
to
-40oC, Thie tWpe. of capacibr is not well-sited r low teperature oseration.,
Scid tantalum capacitors hve a more stable ESR over
temperaure, but are me eensive than aklurinum elec
trolytics. A cot-effective approach someti
used is to
rallel an aluminum electrolytic with a sdid Tantalum, with
the total capacitance split abut 755%with the Anirm
as-ing
ti larg.er value.
If twbcapavtrs are paralleled, the effective ESR is the
paallel of the two individual vaes. The *fatter"ESR of the
Tantablum will keep the effective ESR Irrn risinrg as cpiiclv at
Lw trnperaturMs.
HEATSINKING
A heatsink may be reqtired dependiýg on the maximum
prar dissipetk. and maximum ambint temperature of to
appllation. Under all possible •eating coditos the juna
tion temperature must be itln the rarry specified undr
Absoute Maximum Ratings.
To determine if a eetk is require i
power d~sipated
by the regulator, P,, must be calculated.
(ma4ýPD
IMPORTANT Ifthe maximum allowable value for •,
is
founrd to be a SaW for te TO'-220 package, za Z.(for
the TO-23 package, or '174'W fIr the SOT-223 peckageno
•
eataink is neded since the package alone will
cissipate anoLh heat to satisfy these reqiirements
If th cabtulwd value for A falls belw these linits, a
heatsirk is required.
HEATSINKING TO-22D PACKAGE PARTS
The TOcan be attached to a typical heesirk, or secured toa r plane
a PC board i a copp plane is
to be used, te V8lus of
will1e
be t same as shown in
the r et sechti• for the TO-263
If a marufcrtured heatsink is to be selected, the value of
heatairlc-to-ambient thermal resistance, 0 pA must first be
calculated:
9
Where: 9•,
B-sq = dp-&y - B1-r
-
Oh-.o
is defined as the thermal reistance from the
jution to the surface o the case. Avalue of
•8-W can be as*umed for •q
for this
CoalCdation,
c between
c-j_ is defined as the thermal resitan~l
the case and the su
of th hatsink. The
value of ,ý will vry omna•t 1.5VWto
about 2.5*,ý (dependirng ci method of attacn-jnt, insulator, etc.). Ifthe e~actvalue is
unknown, 24 W Shouki be assured fr
www.rwtn5fnal.c
Application Hints (Continued)
When a vake for A is found using th equation shown,
a hbatsir* must be id ed
&Ita has Peate ta is ess tn
OrOquL to (6e number
8,-•)a is speciied numericaly lthe heetaink maruracturer
plos temperature riee
i ft cataklg, ao shown ina urte that
vs power dissipation for the heatsirk.
HEATSINKNG TO-26 AND SOT-22r PACKAGE PARTS
BAh th TO-263 (VS')and SOT-223 ('MP') packages use a
copper plane on the PCB and th. PCS itualf as a hea*tnk,
To optimize theat sinking ablity of the plane and PCB,
so•er the tab of the package o the plane,
the TO-26 the measured values of ,,
guse shows for
for different cpper area size uing a typical PCB wth
ounce oopperad no sodrinask over the cqWperra used
1 SQ INCHOF COPPER
-0 -21.•
D 2... T- 12T5
AMBCENT
TEWSERATLRS TA
frteq
Analrrg
FIGURE 4.Maximum Power Diipation vs. To for
the TO-•29a Package
Sa s~
V-
agure Sand R•uire
X,
show th information or the 80T-223
package RFiqm assurnes a e. of 74'W for 1 ounce
copper and 51CAV for 2 ounce copper and a maximur
junction temperature of +8!1.
~I
c-
3D ~--;-~--·-;~-~-----·-·--*----·---~Y--~
~b:
~
G~C · rt ::I~
FIGURE 5.,
vs Copper (I ounce) Area for the
TO-265 Package
ircreashg te copp' area teyond 1
As shown inthe figure,
square hih prrduoes very little improvement Itsf:ld also
tcs
ved tht theminimum value of 9,-,for the TO-s63
package mounted t a PCB is 32',W.
As a design ai, rgue 4 shrows the maýinium allowable
pcwr dissipation compared0 to ambiet tnperature for tie
and tie rax
Ais
uTO-s n ice assunh
mum junction temperature is 125 C).
vwwwnstionI•lcm
w
L
S
FIGURE s. OA_ vs Copper (2 ounce) Area for the
SOT-22 Package
Application Hints
(Connued)
SOT
23 e- TT
so5
-!0
aiEI
2
25
0
25
50
75
SOT-23 SOLDERING RECOMMENDATIONS
It
is not recommended IDuse hand soldering or wave soldceing to attach the rmal SOT-2 package to a,printed
circuit
board. The excesive temperatures invoved may
cause package cracking.
Either vapor phase or infrared reflow tecnique are prefened soldeing atlchment nmethod for th SOT-2a
packWa
100 1Ž5
FIGURE t Maximum Power Diastion va TA0, for
the SOT.-2
Package
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r~~fl~
m 62~.
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Ordw Nu.mb LbMET,
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LA92WNT4.0. LM27ET,1o. LUIET-4
or LthmlET-ia
WS Packag Nwnur TO3
c34a _t
iM1
TSM
f4wrl
5,12 or LMmES-1
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Physlcal Dimensions inwh
immelr) unes olem no•ed (ce)
Ca
-F
T T
t
SL
Li
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I
..
.......
SOT423 34uad lswUc Swce Mount Packqs
Ordr Number LMUa7MPl-Lo&, UL sitAW.-&. UMNAfWd1, LMWI3M2r
WLUM
u-15
us Pek:•. Numbur MPO4A
Nanl does not l
weay re
rab
rfm of ay
no tadrpes•rt ntmes are k#
decrft,
the rVght at any 8me wWou mlce to c esod drab circvUjby
ad spe cag
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LIFE StPPORT POLICY
NATNAL'S PRODUCTS ARE NOT AUWIORIZED FOR USE AS CRITICAL COMPONENTS IN IFE S
WPP
D-EVICES OR SYSTEMS
WITHOUr THE EXPRESS WRITTEN APPROVAL OF THE PRI7DT AND GENERAL CUNS0L OF NAMTIONAL SEMONwuCTOR
CORPORATION. As ased
hehen:
1. Lfe uippoft dlwk*s or ystemhawredevise of vywMs
2. A Cllcl cODrpcwet ts any
S
carpnent of a WIesupp•et
~, 4aare
US
r $P
urgicadWpt"nt Into the body, or
dmcse
orf jl9Wss whoeOahmID pkper can betreesonety
(U support •stI
or
prmpeuy used In
IMN,
and whose tal~eto
coudance
W
ItraWimro
rm Ron
qecte
p
to caLme toi
Mr use
Vs)tem, or ba ~ct
pcwted
inft 1about can be rewany epected to MW
In a •apr•liant tiry
e of te life
pport
W
W"alalp
oratenm
iwoe or
týote uset.
BANNED SUSTANCE COMPLANCE
Nenorm semi
swm
pS
c
fwracftue
produt ant useI pa"dg nfetes
n (CSP4-t 1IC ands
no 'aanned S&betens as defnead h CSP-0-11132.
Leaee prfcMlcS are R• ,Comnplant
senank
Uminadww
maknes
seAsonffbua
A ANmam
ctomw
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up•anwml~.o1r
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Cmaer n
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te Customwr Product
caon (CSP-9-It S and con
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Fair114iw3la•sps
ElaRt ).UaedbbadGngcaw
Ta a14539-7jsU
'u
63
7.5.2 LM2940
Jafnury 2007
eNational
r
M"
Semiconductor
LM2940/LM2940C
1A Low Dropout Regulator
General Description
The LM2s940Aa 40posivevotagereguilaorfeaturethe
ablity to ource 1A of output cuent wth adropout voltaps of
picaly IoSV and a marmum of 1V Ver lhe entire temperaSure range. Furhermore, a quiescent current reduaMtcir.
cult has been included which reduces the ground current
when thedirentl between he put volage and the otput
voltage exceeds approximately V. The qul•scent current
with 1A output cuwit and an input-oumpul dilcrentIal of 5V
is ther•ore only 0 nmAHIgher quiesoarc
currnts only eist
when the regud•or isin th dropout mode (VN - VOUTr
IV).
Designed
a.lso for vthicular applieao., the LM2g4o/
LM2940C and all regulated
t are prmtacted trom re
verse ballery instlallons or 2- Ubalte
jumps. Duing irM
transione, such as load dump when the input voltage can
momentarily exceed the specilled maximum operal•ng volt-
0
13
age, the rgulator w atomrnScaly shutAdown to protect both
the iMmauldrcuits and the load.The LMUM294GM40Ccmcnnot be humned by larnpoary mrior4mag Insertion. Faniler
regulator features such as short circut and thermal overload
potectlon are also provided
0o
Features
a DmpoutvolagetypjcaNyo.V 0lo= lA
m Outputc•lntin excess of A
Output voltage trimed before assembly
Revemrs haty protetlon
Internal short rctuitourent limit
Mirror imags Inselion protection
Pu Product Enhancement taed
C
pl
C
Typical Application
0
en*
m
Is
II
%is-s
*~mnme
.
bst
hmu
bas
li22 pF to maninftbf. May beIMuamn*e oundmoaih
to
*gu•islntngliwmn
uts. tutsmoseas posu. to
tmmpmmwhe
rang.
rguapi 1d thed
ESR isacet
cuawe.
•C
•t qtMulhlr. This apact. musit
be aind thesmmewenWug
Ordering Information
Temp
Range
5s.o
SLM2940CT-5O
ST
LM2940CS-5.0
OPtputVoltage
9
10
LM2940CT-9.0
LM2940CS-9.0
-
.0o
-
-9.0
-5.0
LM2Q4LD-5.0 LM294oLD-s.0
LM2040LD4.0 LM2940LD-10
12
LM204OCT12
LM2940CS-12
is
LM2940CT-15
LM2940CS-15
42
-15
LM294CLD-12
e
TO-220
LLP
1k
a
T Units
LM2940LD-15 Tape
and
Reel
-40*C
ST3<5
125C
Pac
LLP
LM24LX
-5.0
LM2
DX
-80
LM294OLDXXDX
-10
-9.0
LM2Q40LDX
-12
LM2940LDX
-15
LM2940T-12
LWM940S-12
LM2940SX-12
-
Uni
Tapand
Reel
LM2B4oT-9.o
LM24oT-e.
LM24oT-5.0
-40AC
-5
T, - LKM2940S-5.0
LM294oS-.0 LM2240S-0
125C LM2940SX-5.0 LM2940SX-8.0 LM240SX-O.0
NationS Semiociwiuclor
2~7 National
Co1poration
efmiconduor Coiposaton
0Oh
20O7
6822
e8s2
LM24T-1o
LI29OS-10
LM2040SX-10
TO-220
T
wwwnatomLccm
wwWfti••acom
Temp
Output Vedlavg
Peckag
5.o0
t0
9.0
10
12
15
LM29401MP-•50 LM2D40MP-8.0 LM204OIMP.0.0 UhWM204MP-10 LM2U4OWMP-12 LM2I401MP-15 80T-223
IM4OMIAPX LM29401MPX LM204DIMPX LM294OlMPX -4T-228
STa S L
lM2901MPX
LJ2940~MPX
8ar
-5.0
o.0
-0.0
-10
-12
-15
Rnge
Marking
I4B
Ls
ThM phlqeid me
LOEB
L.5B
Lu8
L70T
pprnM an
mCmgstuWs
poaene meftlap••
elpet mMltlt.
bmin
mT
SOETlu
kQ ObMN
O.
MlU-Aro Ordering Infonmmlon
Temperature
Ramg
-5'~C
LM294osoJs-es
50625-MgS701EA
Ouutput Volfpg
Ilto
12
I
1
LM2So4J-12SSf LJ294o-J4MBs3
0se.sa4010EA
4
A 5902-oS85010EA
1250C
5l2-O7OXA
-
A
82-8956701XA
aimn#yIuy
avea rga Paa. p•enp gTw
FrC
Imm almon
LM240WGS-12%113 LM294OWG5-15/889
mgUS
nme
J10A
I WG1SA
-,mn
-p:,ewnu
Connection Diagrams
TO220 (T)Platid Package
9SOT-22 (MP) -Led
mu
Front View
See N Packdge Number TO3B
le-Lead Dual-inMUne Palge(J)
,,-
t.
2
Nc- 2
-MC
Front View
See NS Package Number MPO4A
luI-Led Ceramic Surface-Mount Package(WG)
c-
2
Is
-NC
15 -ac
- 4
S
*M-NC
-a
9 O12-6
NC I
-No
NC- 9
9 -NC
NC- 4
MND- 5
NG-6
Paca
Top View
See NS Package Number JIA
13 -IC
1. - ND
it -0NO
aN -GC
Top View
See NS Pc~a Number WG leA
TO-283 (S)Surface-Mount Package
OUTPUT
7L
ii
Top View
m=:
Side View
See NS Package Number TSaR
Pin 2B Mon 7 aresMWeboAert lAP
Pin 5 and aeed to be iadtgelV a PCOB
bsrd
Top View
see S Packag Number LMCOMA
wrnaon0Molrn
Absolute
If
Maximum
MIHalyfAerospace
speelfled
the
contact
Ratings
devices
(Note
are
011ice?
hiffmhubwe fnr mmrrishEW nn onse·nsdnna
please
e
speallicallons
and
availabilty
rotubirtsiD
for
LM29408, J, WGT,T MP 5100
ms
WV
LM294OCS, T -<1 me
45V
Operating Conditions
Intemn*y
M~adurn
Junction Temperature
StoragmTe~mperatme Range
Teperature Range
LM2O4T., LM240S
-40CS TjS 125"C
oOC 5 Tj 5 125C
LM294OCT, LM24OCS
Liimlled
-4ooC 5 TA S esC
-a45C 5 T,~ 125oC
-40oC S T S 125•C
LM2OIMP
S0WC
-.•0C ST, S +11
50CC
Solderi3 g Tnperature (Note8)
TO-220o (T), Wuvo
TO-2s3 (B)
Ase 1)
Input Voltage
Itrnalt lPower Dissipation
(Note 2).
20cC, 3so
237rC, 30S
2 kV
ESD usc•aptlity (Note 4)
required,
Sales
Sernloonductor
National
SOT-=a (MP)
LLP- (L.D)
a
LM2940J, LM204OWG
LM2S4OLD
2680C,,30ls
, 3os
Electrical Characteristics
Vff= V0 + SV, 0 = 1A,C = 22 pF,urnless otimwise sledfled Boldlace IImi apply over the ntir operating
nsapptY for T = Tj = 25"C.
range of thi Indcnated dsvle. AIow speal
OutputVoltage (V)
Parameter
Output Voltage
Line RFgulabion
Conditions
5 mA
1I5 1A
V0 + 2V
5m 2V,
2V,
sV
Typ
5.00
20
peratr
e
LM240O
Unlit
LM0ss4(VU
Limit
(Noa 6)
(Note 5)
L25V:5V 522V
4.5/4.75
48C54.75
5.15/5.25
5.155.25
50
4050
Typ
LMh40
ULmit
(Note 5)
Unite
LM24o4a
Limit
Units
(Note e)
S2V
t4V -VI•
800 7.76/T7A
7.70/7.0O Vum
8.24/8.40
8.24a.40
V,,"
20
80
50*/0
mVM,
55
W8010
80tiO0
mVAx
1000/1000
ma
10=,5 mA
Load Reglatio
output
Impedance
mA 51
- to0
A
LM2a40,LM240/883
LM2040C
35
35
100 mADC and
20 mAnas,
35a
501900
0/100
8so
o50
10001000
55
15/2
10
15920
15120
mAM
SOsO0
30
45160
50/60
mAKx
7001700
240
1000/1000
pV,.
fg= 120 Hz
Quiescent
Vo +2V 5 VINS 2OV,
Current
= 5 mA
LM2n40,LM294Cis83
LM2940C
V= V o + 5V,
Io= 1A
Output Noise
Voltage
Ripple Rejection
10o
Hz- 100 kHz,
10= 5 mA
fo= 120 Hz,1 V,,,
lo = 100 mA
LM2940
LM2940C
10
10
30
1520
15
45/*0
150
72
72
ae
66
60/54
60
fo= 1 ktHz,1 V, ,
dBuIN
54/48
54
0s50
X
54/4
dBMIN
1 = 5 mA
Long Term
Stabiity
Dropout Voltage
32
20
lo = 1A
Io = 100 mA
0.5
110
0.8/1.0
150/200
0.7/1.0
15i/200
0.5
110
mVi
1000 Hr
0.8/10
150(200
0.7/1.0
0.7/1
150/200
VMAx
mVMjx
I
www.nation.corn
Condiions
ParMetor
b
5v
wVoItg (V)
Output
Typ
LM240
Umit
LM2940ISS
Lmit
(Nol17)
Maimum Line
Ro= 1000
Transiot
tLM240,d
T
10oome
LM2940A8, T .20m
LM2940C, T5 1 ms
Reverse Polaty
Ro= 1000
DC Input VoWlag.
LWMrO, LM2040Mf3
LM2040C
Ro = 1oo
•Mr940, T S 100 ms
LM2b940&86, T 5 20 me
Reverse Polifty
Transimnt Input
VoltagP
_LM2940C,
TS 1 ma
19
1
75
0080
Typ
(Note 6)
(Not 5)
Short
Cir
Cunent
1.5
(Note 0)
(NOWl
5)
1.9
1.
75
60/0
55
45
-0
-90
-15/-15
-15
-75
-50/-I0
1 1.3
45
-30
-30
-15-1
-15
75
5
-W50/0
-15/-15
-451-45
-55
Am
40/0
40/40
55
Unit
Unit
L2a42040 L2940
Limit
Limit
-15/-15
V
V
-45)-45
-45/-S
Electrical Charactristics
VY = Vo+ 5V, i = 1A, Co = 22 pF, uniness ohenrwise specifed. Boldfac lnits apply overthe entire apersllng tempratu
oDhr specificln apply r Tr= Tj = 25"C.
rng. ofathMIndkicad ddona. AM
W
Output Volhwg()
Paramnlr
Conditions
Tp
lov
LM2•40
Limi
(Not. 5)
10.5V 5 V S 26sV
Typ
LM2940
Limit
(Not. )
•s25V
1I.OVS ,V
Output Voltage
5 mA
5 o 51A
9.00
8.7316.55
9.2719A5
10,.00
Line RAgulaton
Vo + 2V VIN- 26V,
20
90
20
100
00
60
90o150
go
e5
100/ieO
Load Rapguilaion
Output Impedance
Qiescen
CuRent
utput Noise
10=5 DmA
50 mA S
i 0 5 1A
LM240
LM29400
100 mADC and
20 mAms,
fo= 120 Hz
V +2V :5VI<
N 20V.
1 = 5 mA
LM2940
LM2B40C
= Vo + 5
VIN
= 1A
10 Hz - 100 kHz
Volage
10=5 mA
Ripple Raje•ion
fo= 120
www nliWnaom
VM
VAx
mVMAX
mV
15(20
15
45180
mE
10
1520
mAM x
30
300
45•60
mIAM
pV
_
, 1 V,,.,
lo = 100 mA
LM2940
LM2940C
Long Term
Stability
9,70/0.0o
10.30flto.
45
00
10
10
30
270
UnitsP
64
64
34
52s46
52
e3
30
51/45
dB•,
mV/
1 0 Hr
oVY
9V
Oiutp Volage (V)
LM2040
Paramter
Conditions
Typ
Limit
LM2940
Typ
(Noat 5)
Dropout Voltage
Short Crcut
Io = 1A
10 =o 100 mA
{NoI 7)
Units
Umit
(Note 5)
0.5
O.a1.0o
0.5
0,811.0
Vw
110
150W2
110
15 200
mVAW
1.9
1.8
1to
.
AtN
0M0
75
01•
VA
-30
-15-15
V
Cwuent
Maximum Line
Ro= 100
Transient
T5 100o ms
75
7LM240
Reverse Poladty
DC Input Voti
LM2940C
55
Ro = 00oo0
LM240
-30o
-151-15
LM240oC
-30
-15
45
Raverse Poarity
o = 100
Transi~at nput
Voltage
T s 100i m
LM2040
-
-75
LM2940C
-55
-45/-4
-
00--GO
0
N
VM-
Electrical Characteristics
VN = V, + 5V, 1 = A,Co = 22 pF, uness o
iseeth
spe•lled. Bokdffae ImlB apply over the entire opeating tmperature
range of the Indlcated devita.All otlier
lica~ apply for TA = T = 2T=
C.
Output Volge (Vo)
Pammer
Conditions
12V
Typ
LMa40
Limit
:(Note 5)
i•s.ev
Output Voltage
Line Regulation
5 MA -5 0 51A
VO + 2V 5 VN S 2OV,
1V
M4A
ULimit
Typ
(Note )
VIV s aV
12.00 11.64/11.40
12,30/12.0O
LM2SO
ULimit
LMzsooGVs
Umit
Unite
(Note 5)
(Note 6)
18.75V S VIV
S 26V
11,4/11,40 15.00 14.55/14.25
14.55M14.25
VMN
12.36112.0
15.4W15.75
95150
VyM
mVLU
x
1501240
mVX
20
120
751P20
55
55
120/200
120
12a1i90
20
15A.415.75
150
70
150
=0
=OrnA
Load Regulation
Output
Impedance
50 mA 0 5 1A
LM2940o, LM2940/3ea
LM29400C
100 mADC and
20 mAnrs,
go
1000(1000
100
1000(1000
m2
1•20
mAM
50t/
mA..x
fo = 120 Hz
Quiescent
Output Noise
Voltage
Vo +2V 5 V, -526V,
L2940, LMA2940/883
LM2940C
=
Vw = Vo + 5V, 10 1A
10
10
30
10 Hz - 100 -kHz,
o = 5 mA
3t0
15/20
15
45(l0
15A20
50t1o
10
30
100/1000
450
15
45140
1000/1000
pV
w~.ntional.com
68
Output Vollag (YVd
Condlti
Parameter
Typ
(Nota 5)
Ripple Rejection
o = 120 Hz, 1 V,
I,= 100 mA
LM2940
LM29400
e
w
Reverse Plardly
C Input
Vallege
(Note s)
LUM04CUUs
Lknit
(Notl 5)
(Nota
e)
52
48/42
•
N
mV0
1000 Hr
a8,
0.5
110
15(p200
(No 7)
1.
1.4
Ro = 1000
LIM240, TS 1iOms
75
06060
55
45
-o
-90
-15-15
-15
LM2g40, T- 100 ms
LM2040/i83, T 5 20 m
-75
-01-0o
LM2940C, T-51 ms
-55
-4-45
LM2940
, TS 20 m
LM240, T 1 ms
%R= iOan
LM2940, LMS2940hS
LM2o40C
urn
Units
d
04
5We
1l=1A
I1= 100 mA
Reverse Polarity
Transidnt Input
Voltage
Typ
LM2040
Umit
460
Long Term
Stability
Short C
Cuwent
Maxbnum Urw
Transient
LM2II94Ws
ULm
54/48
54
fo = 1kk 1 V.
OMDpout Voltag
•5V
12V
LM9U40
Umilt
0.7t1.0
150200
0.5
110
0.8/1,0
150/200
1.8
1,0
1.6
55
45
-30
-15
-55
-454-45
40/40
-1-15
0.7/1.0
15a200
VMA
mV:,
1.6f1.
AMN
40/40
V,
-r1-
V
-4-45
VMN
o=1000o
-45/-45
Thermal Performance
Themal Resistance
ti-Case, amt
Tha•mal Resistane
JUntCon-i~o·rllbh~it, OjV
3-Lead TO-220
3-Lead TO-203
3-Lead TO-220 (Note 2)
3-Lead TO7-2 (Note 2)
SOT-223(Note 2)
8-Lead L-P (Not, 2)
4
4
CC_
0o
so
174
35
Hote 1: AMreleke
Maftnu Rlnge NO
ae ns &i
ene whichdaneW I m dev~
any Yocur. operaeng olurdrms aM c~M wsue wrlhe devic
namcna~
bt o epcelo wigh not is gumesesed. For guaranted spealluafn and Weetcondlmne see ie ElecbnlEcharctea
No2t Th
TMematn are lem pwr ,wstlepelcn
aM
is IMr& Ot II KMrnm
'nw• nl iumrane. T.J 'tsjcn-•o.rnlentmemn
mrelatnce.
j,ý ni
hsamtdlentumpefa
lae. T,. na
iengl
WAemanBDeal pUer 4IsIpUa wN caMe =aOWse thetmpuinUSe.and I* regoisif ewI goInto Rmsal
Stduns. Tlevae ofa 6 (for devwse ••1ae wlhno.o
twe N IsWAWtr loe TO-Mpaeage,. OrC
W te To-aM padrae, and tW4oW fotf
sOT-229 pedrcag Thueefe ve eofO caMn
ereuced by using aMMent (PeeAcem ist i pic w e on
.eaelnh.
The value of
8ejr ite
tLP paclkge 0 splaicalydependeon PCoIracemar,
tlaeniatedl,.alhe nuseOer
•otle
and poewr
lea
paranme.
Ie
LLP~kge, reer to App1cado NoNte
A-1ll7. IRisracon
MWneed auMvl
HOaW:aisOWnE
JGEG
IojTCoEoC SucAMn
tOr
ritLdt (ShMD)
p
are roSn•Pb (STD) aiy.
re'nIen•rs
vMl••For
te•mil selancoe
blproWve
be p•ceduider tIe center peadeDnproeve t•ln
Mlaprlclg
pLcAiS endcendligns. tfleesuWamse
e
etated. the Veemperae and mis
oie 4t aSD rung ibtaed on Me lhvnan
body mnel 100too
pF dischurged trough is5 kG
Hoiast: Asile aeergeubaraeeat TJ - EV- r tutl8erldrype))or overt sLm
eerae rgawptem
p
re rengeci n Indcauddevoe (bol•lce tspe)
nlE
Alt is at T, -Tj - 2W•are t10%podwuon teed. AIs sea amfran•sFee·i es are gueavtleeadv onrslanuasl standed Stolslc
wtl
o•ty
meihods.
Noat :Alt
hif erguer•uned ITT - Tj - 25V y denaxrd tpe•ace)
•
or owesnaopeaag•
t
pemature range ia IndicatMed
device
(bodUc type).
AN
lse are M0%o
pflrcalntneld artware used b cattle outOg
rually mLus.
Hote?:
7Ouputcrant w MeMrsewaiwi Maesta rWmpeieu botuS
Uwit drop bom IA st** menses spedead Ltemperaure.
wwwnatioral•,or
Typical Performance Characteristics
Drpout Voltagp
Dropout Votage vs. Temperature
1.0
a 25tS
1*e --
D;B
d
S
0,8
0.7
---
a.
I
S
c
i-i
w
~
~I
r
r
K)
/
II
~
0
A
~
20
7L
.-
Oef
i
0,2
-·
~
400
Ilr
"I
600
S00
500 MA
100 MA
0,1
1000
-4D
0
OUTPUICURNRIT (mx)
40
&D
120
TEMPERATRE (OC)
sOM34
-ato
Quiescent Currentvs. Temperature
Output Voltage vs Temperature
-.
10
0
50
- -I I
I I
,5.DB
5.06
... .
5.D4-
4481
4,0
--
4.98
-.
040
-40
0
40
sD
120
0
t1 40
120
160
TiMPERAIVRE
(CC)
ItMPERATuRE()0
101
Quiescent Current
Quiescent Current
PO
v. , 1•v
0
5
10
15
20
25
30
35
0.2
0.4
0.8
D.s
I.0
.0A. CUARENT (A}
INPiUT
VOLTAGE (vy
smile
0s=1
wwwnaional.co'
Transient
Une
Transient Response
Respq#n
LiUnm
30
120
-ic
=0
-20
-30
-40
S:r
Load Truimlent Response
Load Trma et Response
I
-.
VO-1
15V
'4
'sy
16
a
o¥
-0 0
10 20 30
0
4e SD 60
o0
30
24
nTIME
()
mm
Low Voltage Behavior
Ripple Rel~ciaon
I;
-
riiI7
•== IA
10
2.50C
mlA
T4
1P0
100 Ik
0iok100k
IW
j
r
•
/
]
j, . I0 I--1 .0
1.0
$-
513
,0
FREOUENCV
(Hz)
INPUT
VOLTAGE
(V)
Low Voltage Behavior
Low Voltage Behavior
6
14
12
14 = 2.•C
0 2 4
4 5
10 12 14
NPUTVOLTAGE
(N1)
3
9
12
15
18
QNPUT
VOLTAGE
(V
e=rr
www.naionelrmm
Low Voltage Behavior
Law Voltge Behavior
is ý= 25W
Low=
0
Behavior
6
1
9
18
12E 15
0
2
INPUT VOLTAGE (W)
4 4
8 10 12
INPUT
VOLTAGE
(9)
14
Outputat Voltage Extreme
o
3
6
9
12
15
186
30 -20 -10
1
-30
20 3D 40
I
Outputat Volage Exdema
Output at Voage Extreme
20
20
16
0
INPUT
VOLTAGE
(V)
(v)
INPUTVOLTAGE
Rl
=
=
100A
-L L'BOA
i
-20 -to
0
t0
20
30
40
-30 -20 -0
0
11
20
30
40
M•PUT
VOLTAGE
(V)
(Y)
NPUTVOLTAGvE
AGEM
Wow
wwwa.ntionatomM 1
Output at Vdltag Exbrmes
Output at Vollp Extreme
20 -
20
II
=
16
100A
V0 - 10V
is
=-100A
12V
Vo
12
150
Y
a8
o
o
,,-s
-4
-30 -20 -10
0
10
30
20
-30 -20
40
INPUJ
VOLTAGE
(V)
-1 0a 10 20 30
INPUT
VOLTAGE
(M)
40
mu.1
Oulputat Volgo
Extremes
Output Capaitor ESR
25
Is
10
20
-30-20-10 a10
040
INPUTWVOLTAGE
(V)
400 600 800
o1TPVT CURRENF (mA)
0
200
1000
Output Imp.dance
Peak Output Current
0.00
41-e-
0.2
0.05
0.02
(i
-40
I
0
40
0S
120
IEMPERATURE (oC)
·
wwmwnaoallon
om
160
1 10 100 1k 10it 100k 141
FRQUEonY (Hi)
gaem
Mudamum Powr Diuipatlon (TO-220)
Maximum Power Dislipuon (80T-223)
al
22
INII
13l
EaTSI
I1
ad
12
10OC/W HEAT
SINK
S
S
60
NOHEATSI•K
0
10 20 30 0
54065 710
890100
AMBIENT
TEMPERATURE
(C)
0o 10 20 0 40 50 0 70 090 100
SAMME"
TEMPERATURE, TA C)
nSu
as.i
0
10 20 30 4050 so0 70 80 90 100
AMBIENT
TEMPERATURE
(0C)
am-r
www•netionelom
.
Equivalent Schematic Diagram
I
mim
ww.nainonm~coni
www
.nogonacorn
12
12
Application Information
EXTERNAL CAPACITORS
The output capactor is ali to marintaining regulator stability, and must meet the required contions forboth ESR
(Equivalent Series Resistance) and minimum amount of capaIolance.
MINIMUM CAPACITANCE:
The
output
pinimu
oapacitance required to maintain stability is 22pF (this value may be increased without Eit). Larger
vaikes of output capacitance will give improved transient response.
ESR UMITS::
The ESR of the output capacitor will cause loop instability i it
is too high or too low. The aceptable range of ESR plotted
versus load conent is shown inthe graph below. I••i asan-
dfit thatM ouput
oeassais m n esuft
teimperture must be with the range specified under Absolute Maximum FRlatings.
To dtermine if a heaink is required, the power dissipated
by the regulator, P, must be calculated.
The
1guer below shows the voltages and currents which are
present inthe circuit, as wal as t formulafor calculating the
power dissipated Inthe rgulator:
•ac
itor
me* Husers sqisant4 r
Pa -fn- Vaou) t +:t(V le
Output Capacitor ESR
W
FIGURE 2. Par•er
lpalian Diagrunam
The rnxt parameter whch must b calculatis the maximum
allowable tomperah•re ries. T~a .Thi is calate by uslag the formulat
an
'a
U
N4?T
S
'0
0
200
400
00
800o I000
OUTPUT
CUrRENT (mA)
where Tj~pg is the maximum allowable junc temperature, which is 12rC for commercial grade
parts.
TypM is the maximum ambient tamperatue which
will be encountered in the applcation.
Using the calculated values for TRA and Po, the maximum
allowable value for the junction•to-ambient thermal reletance. Nx, can now be found:
FIGURE 1. ESR Limits
it is important to note that for most capacitors. ESR is speifed only at room tmpemrature. However, the designer must
ensure thtthe ESR will sty inside the limfts shown over the
entire operaing temperature range for the design.
For aluminum elestrolytic capacit•s, ESR wil increase by
about 3oX as the temperature is reduced from 25•C to -40'
C.This type of capacitor is not well-suitd for low temperature
operation.
Solid tantalum capacitors have a. more stable ESR over temperature, but are more expensive than aluminum electrolytics. A cost-effective approach sometimes used is to parallel
an aluminum eletrolytic with a solid Tantalum, with tt total
capacance split about 75t25% with the Aluminum being the
larger value.
Iftwo capacitors are paralleled, the effective ESR is the paraliel of the two individual values, The ¶tattor" ESR of the
Tantalum will keep the effective ESR from rising as quickly at
low temperatures.
HEATSINKING
A heatsirkmay be required depending on the maximum powor dissipation and maximum ambient temperature of the application. Under all possible operating conditions, the junction
eA = TmuA / PD
IMPORTANT: If the maimum allowab•ie value for B is
found to be ? 53s0CM for the TO-220 package, 2 eo"CWfor
the TO-263 package, or - 174°0W for the SOT-•2 pacalone vwi
age, no heatsink is needed since the pak
dissipate enough heat to satisfy thes requirements.
If the calculated value for eo4falls below thems imits, a
heatsink is required.
HEATSINKING TO-220 PACKAGE PARTS
The TO-220 can be attached to a typical heatsink, or secured
to a copper plane on a PC board. Ifa copper plane is to be
used, the values of a will be the same as shown inthe net
section for the TO-2 6
If a manufactured heatsink is to be selected, the value of
heatsink-to-ambient thermal resistance, eg) , must first be
calculated:
004
Where: G9p.
=-
VA - 6"
- 0.-C
is defined as the thermal rsistanc from the
junction to the surface of the case, Avalue of
3*CW can be assumed for %.• for this calculation.
. ..
is defined a the hermal resistance between
the cas and the surface of the heatiak, The
value of , wil
vary from about 1.5iCW to
about 2.ts51 (doponding on method of attadhnent, insulator, eta). Ifthe exact value is
uneknomu, 2MCW should be assrwnd forEc
COPPER
" " """ IOUNCE
o= a3eMr
14
When a value for 9E isfound using the equation shown,a
hassink ta be sao•lfe
orsqual to Iftsnwnber
huatt ase vate dos
h
less than
issp'eied numericaty by te healaink momanuar
9r"..
inte atalotg, or shown ina cur that plots temperature rise
vs power dwipabion for teheu
hL~tk
HEATSINKING T70-r PACKAGE PARTS
The TO-2= ("S")package uses a copper plane on the PCB
and the PCB tiffas ahealsn To optnize the hat sinklng
ability of the pldne andPCB, solder the tab of the package to
the plae.
Fgaws shows for the TO-2 the measured values of a
for diffent copper rea sizes using a typical PCOB lht
ounce copper ma
nidwsoldrnask
tri~meashi.
her
ie oappereamused
""INSPACAG
PCB MOUNTED
1$. INCH COPPER
40 -62
25 50
75 100 125
AMBUET TEMPEUATURE, TA, C)
FIGURE 4.Maxdnmm Paer Dislipation vs. TA for the
TO-
Package
HEATSINKHIG SOT-si PACKAGE PARTS
The 9ST-223 ('MP') packages use a copper plane on the
PCB and the PCB sae-ll
a heatsink. To optimize the heat
sinfing abity of the plane and PCB, solder the tab of the
package toftptne.
F~iur and Fipu 0 show he informaon for the 0T-223
package. F e a assumes a et, of 741WCM for 1 square
inch of 1 ounce copper and 51PW for I square inch of 2
ounce copper, with a rna*ium ambianttemp3r
(aT)
of
85" and a maximum junction temperature (T)of 1251C.
Fortechniques for improving the thenna rsisbance and powor dssipalon for the SOT-223 package, p~eas refer to ApplicatnNote AMI.028.
'"^
COPPER
FOL.
AEA (SOIN..)
170
FIGURE a. 1GA va Copper (1ounce) Area for the TO-23
Package
110
As shown inthe fj~re, Increas~ng the copper area byond 1
square inch produces very litle improvement itshould also
be observed that the minimum value of e.) for the TO-eas
package mounted to a PCB is 32*C ,.
As a design aid, Fqunre4 shows the maximum allowable powor dissipation compared to ambient temperature for the
TO-2s3 device. This assumes ac.)t of 35C/ for 1 square
inch of 1 o~ce copper and a m i•emjun dion temperature
(T) of 125cC.
I0
ao
so
COPPER
FOILAREA(SO. IN-)
FIGURE 5.e )vs.Copper(2 onmc)Area forwh SOT.22
Package
wwrwlnailwmLC
77
r
K
HEATIWNKING LLP PACKAGE PARTS
The value eJf orhe LLP package is speoacly depensent
on PCB trace are race material, and the number of layers
and thermal vi., it is recommended tat a minimum of a
thermalvis be placed under the entr pad to improve iher-
F
K
Mnal pedfrance.
l resistance and power diSipim for the LP package, pBlm refer t Application
Fortchr~ques for improving the the
o
Note AN-119E7.
4
•
0IM.EA.U
0
2
07
0
2
I.TA •,
FIGR
.MimmPmDIidm mTAf o
25 0 75 100 125
-25 0 .40
AMBIENL TTEMPERATURE, TA(MC)
FIGURE S. Muxram Power Diupstan vs. TA far the
SOT-E Padkge
15Vý
iru
15Aa
I78
Physical Dimensions
inches (mihimeters) unIt
otomwse noted
[]
it
J7QL_.~ I
LMC
mfl
ftt~~astitA1C
! .............
"I 'I,
S
4 10
oneaomsn
i
--
r
bm
NUEWM
3tand SOT-22 Package
NS Package Number MP04A
5
13
D0flOO
035O
P9
t-'-*9
-,
5
ZSbS SLA.aI4
1i Load Dual-tr-Lirn Package (J)
See NS Package Number JifA
www naleinorsaorn
79
U14I0t NGLAbWNS*ON4
0NCH
VALIASN I AN MIt usIWTes
vp
LOT, C 11ý----.^
aio·
~r
r:r ?Ile
·r:k-I
·~
II
U
a
eB1
.cra U*J I*Pit
1:4 Ici
~Pr
r·
·- ·~·xli~ p-*iif
gbit'~B
~oz~ n;
16 Lead Surface Mount Packap (WG)
SeoNS Package Number WGIlA
OA7 "0.,
-as 1
3-Lnad TO-220 Plastic Package (T)
NS Package Number TO0B
wwwkt0ioItOm
v
-J
-J
T-
4__
-A·is4-
Irx~n:
I~~
I~
Fi1
l1~IX
.-K..
i
UILPVr
34-Ld TO- Surface Mount Package (MP)
NS Package Number TSB
k------------T
. ..4. .
I
~j
,,r
-r fiC"
l~rxi
*I a ,-i: t·~i~s'ib
B-Load LLP
OrderN~umbr LM294O-l5.0, LM294OLD4O,
LM294oLD-.O LM2• LD-1O,
LM240OLD-12 or LM294OLD-15
NS Package Number LDCoRA
Ill-----·2I__L
wwwlnsuMerm.lmn
18
t
7.6 Switching Regulator
4TEXAS
PTN78000A
INSTRUMENTS
www.ti.com
S.TS2456-APRIL 20MS-REVSED JANUARY 2W006
1.5-A, WIDE-INPUT ADJUSTABLE BUCK-BOOST SWITCHING REGULATOR
APPUCATIONS
FEATURES
*
*
*
*
*
*
*
*
SGeneral-Purpose Idustrial Controls,
HVAC Systems. Test and Measurement.
Medical Instrumentation, AC/DC Adaptors.
Vehicles. Marine, and Avionics
1.5-A Output Current
Wide-Input Voltage
(7V to 29 V)
Wide-Output Voltage Adjust
(-15 V to -V)
High Efficiency (Up to 84%)
Output Current Limit
Overtemperature Shutdown
Operating Temperature: -40"C to W85C
Surface-Mount Package Available
DESCRIPTION
The PTN78000A is a series of high-efficiency, buck-boost integrated switching regulators (ISR), that represent
the third generation in the evolution of the PT-78NR0I0 series of products. In new designs, it should be
series of single in-line pin (SIP) products. The PTN78000A is smaller and
considered in place of the PT7BNRIO1
lighter than its predecessor, and has either similar or improved electrical performance characteristics. The
caseless, double-sided package also exhibits improved thermal characteristics, and is compatible with T 's
roadmap for RoHS and lead-free compliance.
Operating from a wide-input voltage range, the PTN78000A provides high-efficiency, positive-to-negative voltage
conversion for loads of up to 1.5 A. The output voltage is set using a single extemrnal resistor, and may be set to
any value within the range, -15 V to -3 V.
The PTN78000A has undervoltage lockout, and is suited to a wide variety of general-purpose applications that
operate off 12-V, 24-V, or tightly regulated 28-V dc power.
Mc
LII
-*ee th App
*a&tf
kanWaOn fo ecadrm m6ewnmeniantfln.
Ia , rsequd 1ba4ut1
S
t
outu
eb
Wwo to n -S
Sn tAg*Elt
hrtO
n
fa"vae
la.
rtant *e coneE.g availaity. :ancard wanty, a use rn trit
Please be awa'erethat an e
anoears at the end of thS data Meet
or pCnducts and didarners therWeto
Instruments senmco)ta
Dtsrc
rts:tn cate.
tt ertas?
DATA
PRSctrr t
P aucts co'tx rs ;erthctwcc or? the tenrs of he Texas
yrCtSnS
doe rot
l atrart? 'ct
iesumefs .
oeetj
etuie
t
Mttc
amp0rgS
apliatons of Texas
200S
5-2&6, Texas .esarunents Isoarported
-
JANUARY
2005-REVISED
SLTS245B-APHIL
SL:!
TFXAs
w
INSTRUMENTS
wwwAL~om
PTN78000A
2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PTN7B00A (Basic Model)
Output Voltage
-15 V to-3 V
Description
Pb - free and RollS Compatible
Package
osator
PTN78000AH
Horizntal TIH
Yes
EUS
PtN7800WAASMt
PTN7,5D0AAZ I)
Horizonta SMD
Horiontal SMD
No
Yes
EUT
EUT
Part Number
I
(1) Add aT suffix for tape and reel option on SMD packages.
(2) Standardoptn specifies Sn Pb solder ball material
(3) Lead (Pb) -free op&n specifies SnAg solder ball material
ABSOLUTE MAXIMUM RATINGS (
over operating free-air temperature rane Lnless otherwise noted
all voltages with respect to GND (pin 1),
PTN78000A uNT
TA
T.
Operating Iee-air temperature
Over V range
Wave solder temperature
Surace tenperature of module body
or pins (5 seconds)
Solder reow toeraure
Surace temerature of module body
orpin
Storage temperature
-40 to 05
Horizontal SMD (suffix
AH)
260
Horizontal SMID (suffix
235
AS)
Horizogal SMD (suffix 260
AZ)
-40 to 125
(1) Stresses bney-d those listed jnder absolute maximum ratings may caase permanent damage to the device. These are stress ratings
aoly, and functional neratiion tp!edevice at these or any other con
beod those dicated under recommended operating
condti
is not implied.
Exposure to absole-aximum-rated con .-ns for
extended eriods may affect dev-e reiabdbj.
RECOMMENDED OPERATING CONDITIONS
Vn,
TA
P
out voltage
Operatrrg free-air temperate
Output power
MIN
MAX
7
32- V0
-40
&5
9
IJNIT
V
4C
W
PACKAGE SPECIFICATIONS
PTN78000A (Suffix Al,AS. and AZ)
Weight
2 ,ramms
Ftlamailltv
Meets JL 94 V-0
Mechanical sock
Per Mil-STD-853D, Method 2032.3, 1 msni s1ne
Mechanical vora2tion
MP-STD-583D Method 200(7.2 20-20•0
530 G0
2-Hz
Horzont& SMD jsuffx AS & AZI
'11 Qjalificaton
~in~t
15 G '
PTN78000A
TExAs
#
INS•,UM•,E
www.fLiaoo
8LTS2468-APRIL 200-REVISED JANUARY 2006
ELECTRICAL CHARACTERISTICS
operating at 25C free-air temperature, V, = 12 V,V, = -5 V. 1o = Io (max)C = 100• F, C = 2x 4.7 pF. C
10
1=
otherwise noted)
PARAMETER
TEST CONDOTIOIS
Ounut ourreent
,
TA=
•C
natura oonvection airflow
Vo = -15V
MlN
0A1
V
Vo = -. v2
01
Input voage range
Over
range
O
omtvoltage
3oleranoe
T
A
-W'C to W65
Li~e regulatr
Ovr V,
7
170
Vo -
V
7
7
20
27
Va -3I3 V
7
28.7
vairaon
r2%
Z0.5%
rjar
Over I range
Lead reglatio
Total outp
vaoltage
inoaten smt pcirt
-40 < TA 55C
V
t load
.3%
7 VS Vs f32 V = 12 V, .
V, = 12 V, ~
E =
12 V,
V=12 Vx R,=
Ouri
• •tageripple
Curert li
threhaod
iol%[
V
o V• =-15 V
=1
= 2 kn, V. = -12 V
85%
84%
r = 28.7 krV VS = -6 V
2
82%
k Vc = -3.3 V
77%
2
V = --50 mV
Renvery irme
&atSlangfrequenzr
Urdervokae olout
Cl
E xte na irp
Co
Exhee
aca ria rc e
Over' Veand t rarges
440
550
6M0
cz
5
I5
YF
j94
'A
9
anio
Cerwrio
raý
TA
=-':oub332grcadbrig -
Ps
%Vo
,
CepreiQ
Equwiwaent
seriesr
ýe tbhtv
Caesulated
VTSF
_______________
A
1
rea
Caer
V...
312
200
Vrve
arfdershoot
uVLO
% VM
zed stepionrm50% to 10% Imax
lr
Trancret responre
Ft
-
-15
20-M*z barwidt
1Ao
mV
-O
Adj
rg ut oltageadusot
aumf
1.51
= 25'C
Temperaure viar
A
t5 oS
Vo =-16V
=
Set
0.75
01
V=-sV
UNIT
MAX
01
1
Vo = -3V
V0 =-33V
Vi
TYP
F (uness
yF
200
00 IF
fsotanc
noce-aminl
;O30
.44
____________
1e4 H
____
The maximum outopt c:rrent 1 5 A or the maxi-rr ou~tut
-i pwoer i S
:hv-r
v
e
.r
The maximum npu volta;e is Ited ad deinec :obe :22 - Vol[
volts
The set-paIrs vtage tolerae s affted by •
te todrarce a stab2.y of
- The slated i is Jnoondtiora•ty met R•s-has a
toleranwe of 1V rth 1- oprrC or better ten-ferature sta:lity,
A 103-pF electolytc ýpacitor anc two
- 4.7-- f arr• capa:~ors are re-uitred
acos Te i put V ard GNIh or prooer o•r:aton
Lcate the ceramic .oaacitare• :e to t-,e :odule.
10 pPF
of cptA capacitanoe i required fc,
proper
o eration See the apolicaton normaot n for Lterluidace.
This i t'he toal ES• f_oaaR e eetrc io nonceray oapaciance. Uoe 17 mn
tiý
as Te jr whei .~ng mw
E wSR
valtes
to calolaste.
PTN78000A
TExas
INSTrMENTS
www.ti.o0rn
PIN ASSIGNMENT
TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
LO
DESCRIPTION
The 9gatire output vokage power node with respect to the GND node. Itis also the reference for the
Vo,Adst control inputs.
The poaitive input voltage power node to the module whic is referenced to common GND..
This pin r active and must be isolated from any electrical comection.
A 1% resistor must be conected between pi 1 and pin 4 to sethe output voltage of the module lower
than -3 Vf eft openthe outpot voltage default to -3 V. The temerature stability of the resistor
should be 100 ppnC (or better). The set-po-nt range is -15 V to -3 V. The standard resistnr val•ue for
a number of common outpt volages is provided in the application iformaion.
The common ground connection for te V and V power connections.
Vo
1
0
V,
NC
2
3
I
Vo
GND
ust
I
5
10
# TUEiXS
INSTRMEii~n
B
2
ISTSAMB-APRR
TYPICAL CHARACTERISTICS (7-V INPUT)ra
EFfICOENCYY
OUTPUT CURRENT
e
43
"I
OUTPUT VOLTAGE RIPPLE
POWER DISSIPATION
OUTPUT CURRENT
OUTPUT GURRENT
1. Is
tO*0alpatCkmat-A
Figure 1..
TEMPERATURE DERATINGN
va
OUTPUT CURRENT
to -C00d Canal -A
Figure 4.
Figure 2.
TEMPERATURE DERATING
rsigun 3
TEMPERATURE DERATINIG
va
vaTPU
OUTPUT CURRENT
OUTPUT CURRENT
*
S-Or*Cmet•w*- A
Figure&.
t
s-Olla L4 -s
A
*,- Omp4Cwient-A
Figure .
The electrical characteriti data has been developed from actual product= tested at 25C. This data is codered typical for the
converter. Appes to Figure 1, Figure 2, and Figure 3.
The temperature derat~ng curves represent the onditiom at which internal components are at or below the mairuactumer' maxinanw
copper.
to a 100 mm x 100 mm, double-sided PCB wh 2 oz..
operating temperature. Derating limits apply to modules eoldered directly
For surface mount pakages, multiple visa(plad through hoas) are required to add thermal pahe to the power pins. Please reter
the merhara specification for more information Applie toFigure 4 .Figure 5 ,and Figure 6.
PTN78000A
WVM Ai
JAMMRY
amos
sse-samL2005-MBASED
20DB
1
TYPICAL CHARACTERISTICS (12-V INPUT)4
EFFICIENCY
ve
n
r
OUTPUT VOLTAGE RIPPLE
POWER DISSIPATION
OUTPUT CURRENT
OUTPUT CURRENT
ve
v•
OUTPUT CURRENT
S.
T I
.o
Y
W.
*6 Mm44V
Vp u4V
I
Figure 7.
TEMPERATURE DERATING
vUT
OUTPUT CURRENT
IS
*
1
he
b-OpcueLM-A
Figure,&
TEMPERATURE DERATING
TEMPERATURE DERATING
OUTPUT CURRENT
OUTPUT CURRENT
vs
vs
1oaparCWbus-A
figure 10.
t.O
%0-ac0*,wS-A
Figure 11.
rI
*
,51 5
uS
.
u
bl-outQrpts:-A
Figure 12.
The efecrical characteristic data has been develped torn actual producis tesed at 25C. This data is considered typical for the
convewer. Applies to Figure 7, Figure 8. and Figure 9.
The temperature derating curves represent t1e onditis atwhich inernal componer are at or below the manufacturet mainmum
operaing temperatures. Deraing limits apply to modulea soldered ddirecly to a 100-mm x 100-nvn. double-sided PC8 with 2 oz. copper
For surface mount padbkgea, muliple vias plated
throug holes) ae requied to add thermal paf t
tohe power pins. Peae refer to
the mechanical specificaon for more inormaion. Applis to Figure 10. Figure 11, and Figure 12
PTN78000A
wwwA.iom
JAMMARY
2005-REvisaD
struess-Asat
2005
TYPICAL CHARACTERISTICS (24-V INPUT)lM'
EFFICIENCY
vOUTPUT
OUTPUT CURRENT
OUTPUT VOLTAGE RIPPLE
vs
OUTPUT CURRENT
POWER DISSIPATION
vsT
OUTPUT CURRENT
0
I0 -OsaCW~
Figure 13.
-A
I1- G&*AmCOW04
-A
Figure 14.
R"
*A
.
12
15
ig-ApuACUmat-A
Figure 15.
TEMPERATURE DERATING
vsT
URR
OUTPUT CURRENT
Figure 16.
The earicaJ characteri t da•a haz been develo•ed fm auaJ products t•ed a 2a5'C. Th daxa ii or~Ered yoaial fdr the
converer. Appaee to Figur 13, Figure 4. ~ard ;re 15
!21 The temerature derating curves repree the oondite a: whd
~
~teal omponerts are at or bat
he man7,faturers f.2arm
2 oz. copper.
-ceratingtemperature. Crrating limits aofy to mod~e- socered directly to a 103-mrm x 1•0•-mn d.ce-sided •C• wýrh
or curface rount ackag. mul:iple vias (plat :hr-ugh hoes arerequired to add termal paths to the poer- ia.nsPea efer bto
ne meohar•ca spe,:ica~ia fcý'-ore in rmatn. Applien to F g-re 16
,1I
# TEXAS
PTN78000A
INSTRUMENTS
tWWA.tiOam
SLTS2MS-APHIL
2005-REVISED
JANUARY
2ans
APPLICATION INFORMATION
Adjusting the Output Voltage of the PTN78000A Wide-Oututpt Adjust Power Modules
General
A resistor must be connected directly between the Vo Adjust control (pin 4) and the output voltage (pin 7) to set
the output voltage lower than -3 V. The adjustment range is from -15 V to -3 V. If pin 4 is left open, the output
voltage defaults to the highest value, -3 V.
Table I gives the standard resistor value for a number of common voltages, and with the actual output voltage
that the value produces. For other output voltages, the resistor value can either be calculated using the following
formula, or simply selected from the range of values given in Table 2. Figure 17 shows the placement of the
required resistor.
R
=-54.9kQ
-5.62 k
125 V
RVo -3 V
Input Voltage Considerations
The PTN78000A is a buck-boost switching regulator. In order that the output remains in regulation, the input
voltage must not exceed the output by a maximum differential voltage.
For satisfactory performance. the maximum operating input voltage is (32 - )V0J) volts.
As an example, Table 1 gives the operating input voltage range for the common output bus voltages. In addition,
the Electrical Characteristics define the available output voltage adjust range for various input voltages.
Table 1. Standard Values of R•.Efor Common Output
Voltages
(Required)
-12 V
-5 V
-3,3 V
Rvr
(Standard Valne
2 in
Vo
0
-4.~97
V
-'2.00
V
-5.D0 V
221 in
--3,50 V
Vf Range
9 Vo 17 V
BVto2?V
Vto221V
9 V to 27 V
9 V w 28.7 V
G
I1l A 0.05-W ated resist.
may be Lae. The tolerance should be 1%, with a ter•oerature stability of 100 ppmI'C
(r
bette•. Place t•e resisor as close- to the regalator as posse. onnect thez res ar dire-Ay etween pina and 1
usng dedicated PCB traces.
I2) Never connee ~pacitor-s fom Vo Adit to eitheorGND or V, Any aoacite added to
t the Vo Adjust pn' aflects tne
istabi7Ay
Figure 17. Vo Adjust Resistor Placement
PTN78000A
TEXAS
INSTRUMENTS
mw~w M
SLT824B-APRIL 2S-REVISED JANUARY 2006
INSTRUMEN•
Table 2. Output Voltage Set-Point Resistor Values
Va Required
Ref
V, Required
ReW
V. Required
Rtk
-15. V
Fa
99
-11-9 V
209 ka
-8.8 V
821 kg
6S k6
6V
-149 V
1-7M
-11 8 V
218 ak
-3s
-14,8 V
1Sg
-117 V
1227 k~
-344V
-14 7 V
245-
-1.'t V
2.38 k
-82 V
758 k2
V4
-1 461
29
-t5
2.45 ka
-4& V
81
-14,5 V
347
-11A.4V
155 k
-7,8 V
8.O k2
-144 V
400P
-11.3 V
2.65 ki
-71 V
.30 ka
-1433 V
453
-11,21V
2.75 k2
-7.4 V
998 ko
-14,2 V
507 m
-111 V
2.82 k
-7,2 V
107 kM
-14.1 V
52
-11.0 V
2s98 k
-7.0 V
•1S k
-140V
81 O
-1 09
3107 ka
-64 V
12.4 ka.
V
678
-10•8 V
3.18 k
4-68 V
134 kc
-13.8 V
734
-107 V
3.29 kg
-. 4 V
14.8 k
-137 V
794 .
-8r
341
4ik
-e2 V
15.8 k
-138 V
e854
-1065 V
3.53 ka
-40-V
17ý3 km
-1f
V
V
.09kt~a
k
12
-104 V
3.65 ka
-58 V
18.9 ka
970a
-10.3 V
3.78k
--5,6 V
20.7 kL
-133 V
1.04 ka
-102 V
391 a
-64 V
22.9 k
-13.2 V
1.17 kI
-101 V
4.04 k
-5 2 V
25.6 kL
-131 V
1.18kk
--100 %
4.15 k
-5,0 V
28.7 km
-1130 V
1.24 ka
-9.9 v
33 k
-4/a V
32.5 kg
-129 V
1,3 k
-9.8 V
4.47 k.
-4
V
37.2
-12
V
13Sko
-•7 V
4.62 k
-44
V
43.4 ka
-13.5 V
-14
V
ka
-121 V
1A.4k-
4.78 ka
-4,2 V
516 k
-121 V
1.52 kg
-9.5 V
4.94 k
-40 V
8E30k,
-125 V
1 80 k
-4
5.10 k,
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-123 V
1.75 kg
-9.2V
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-3.4 V•
I
-112 V
1 84 km
-1
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183 ka
-32 V
338! i
-12.1 V
1.92
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-3. V
-12.0 V
2,00"k-
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OPEN
PTN780MA
SLTS2465-APRIL 2WS10-REV•SED
JANUARY 2006
I4 TxA•s
www.tni.om
CAPACITOR RECOMMENDATIONS FOR THE PTN78000 WIDE-OUTPUT
ADJUST POWER MODULES
Input Capacitor
The minimum requirements for the input bus is 100 pF of nonceramic capacitance and 9.4 pF (2 x 4.7 gF) of
ceramic capacitance, ineither an XSR or X7R temperature characteristic, and 100 pF of electrolytic capacitance.
Ceramic capacitors should be located within 0.5 inch (1,27 cm) of the regulators input pins. Electrolytic
capacitors should be used at the input in addition to the required ceramic capacitance. The minimum ripple
current rating for any nonceramic capacitance must be at least 250 mA rms. The ripple current rating of
electrolytic capacitors is a major consideration when they are used at the input. This ripple current requirement
can be reduced by placing more ceramic capacitors at the input, in addition to the minimum required 9.4 pF.
Tantalum capacitors are not recommended for use at the input bus, as none were found to meet the minimum
voltage rating of 2 x (maximum dc voltage + ac ripple). The 2x rating is standard practice for regular tantalum
capacitors to ensure reliability. Polymer-tantalum capacitors are more reliable and are available with a maximum
rating of typically 20 V. These can be used with input voltages up to 16 V.
Output Capacitor
The minimum capacitance required to ensure stability is a 100 pF. Either ceramic or electrolytic-type capacitors
can be used. The minimum ripple current rating for the nonceramic capacitance must be at least 200 mA rms.
The stability of the module and voltage tolerances is compromised if the capacitor is not placed near the output
bus pins. A high-quality, computer-grade electrolytic capacitor should be adequate. A ceramic capacitor can be
also be located within 0.5 inch (1,27 cmn)
of the output pin.
For applications with load transients (sudden changes in load current), the regulator response improves with
additional capacitance. Additional electrolytic capacitors should be located close to the load circuit. These
capacitors provide decoupling over the frequency range, 2 k4z to 150 kHz. Aluminum electrolytic capacitors are
suitable for ambient temperatures above O°C. For operation below O=C, tantalum or Os-Con-type capacitors are
recommended. When using one or more nonceramic: capacitors, the calculated equivalent ESR should be no
lower than 14 mO (17 mQ using the manufacturer's maximum ESR for a single capacitor). A list of recommended
capacitors and vendors are identified in Table 3.
Ceramic Capacitors
Above 150 kHz, the performance of aluminum electroltic capacitors becomes less effective. To further reduce
the reflected input ripple current, or the output transient response, multilayer ceramic capacitors must be added.
Ceramic capacitors have low ESR, and their resonant frequency is higher than the bandwidth of the regulator.
When placed at the output their combined ESR is not critical as long as the total value of ceramic capacitance
does not exceed 200 pF.
Tantalum Capacitors
Tantatum-type capacitors may be used at the output, and are recommended for applications where the ambient
operating temperature can be less than OC. The AVX TPS, Sprague 5930/594/595, and Kemet
T495 TS10;T520 capacitors series are suggested over many other tantalum types due to:
their rated surge, power
dissipation, and ripple current capabi•lty. As a caution, many general-purpose tantalum capacitors have
considerably higher ESR, reduced power dissipation, and lower ripple current capability. These capacitors are
also less reliable as they have lower power dissipation and surge current ratings. Tantalum capacitors that do not
have a stated ESR or surge current rating are not recommended for power applications. When specifying
Os-Con and polymer-tantalum capacitors for the output, the minimum ESR limit is encountered well before the
maximum capacitance value is reached.
Capacitor Table
The capacitor table, Table ,3,
identies the characteristics of capacitors from various vendors with acceptable
ESR and ripple current (rms) ratings. The recommended number of capacitors required at both the input and
output buses is dentified for each capacitor type. This is not an extensive capacitor list. Capacitors from other
vendors are avaable with comparable specificatiors. Those listed are for guidance. The rms rating and ESR (at
100 kkz) are critical parameters necessary to ensure both optimum regulator performance and long capacitor
life.
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SLTcS~lM-APlL 2LI-RsED JAWNR
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2006
Power-Up Charoetedutice
When configured per the standard application, the PTN7B000A power module produces a regulated output
voltage following the appcation of a valid input source voltage. During power up, internal soft-stut circuitry slows
the rate that the output voltage rises, thereby limiting the amount of in-rush current that can be drawn from the
input source. The soit-start circuitry introduces a short time delay (typically 5 ms - 10 ms) into the power-up
characteristic. This is from the point that a valid input source is recognized. Figure 18 shows the power-up
waveforms for a PTN7800DA, operating from a 12-V input and with the output voltage adjusted to --5 V. The
waveforms were measured with a 1.5-A resistive load.
S-ThesSamMir
Figure il.Power-Up Waveforms
Undervoltage Lockout
The undervoltage lockout (UVLO) circuit prevents the module from attempting to power up until the input voltage
is above the UVLO threshold. This prevents the module from drawing excessive current from the input source at
power up. Below the UVLO threshold, the module is held off.
Current Uimit Protection
The PTN78000 modules protect against load faults with a continuous current limit
characteristic. Under a load
fault condition, the output current cannot exceed the current limit value. Attempting to draw current that exceeds
the current limit value causes the module to progressively reduce its output voltage. Current is continuously
supplied to the fault until it is removed. On removal of the fault, the output voltage promptly recovers. When
limiting output current the regulator experiences higher power dissipation, which increases its temperature. If the
temperature increase is excessive, the module's overtemperature protection begins to periodically turn the output
voRtage comrnpletely off.
Overtemperature Protection
A thermal shutdown mechanism protects the module's internal circuitry against excessively high temperatures. A
rise in temperature may be the result of a drop in airtlow, a high ambient temperature, or a sustained current-Emit
condition. If the junction temperature of the internal control IC rises excessively, the module turns itself off,
reducing the output voltage to zero. The module instantly restarts when the sernsed temperature decreases by a
few degrees.
Note: Overtemperature protection is a last-resortmechanism to prevent damage to the module. It should not be
refied on as permanent protection against thermal stress. Always operate the module within its temperature
derated iimits, for the worst-case operatir~ conditions of outut current, ambient temperature, and airflow
Operatingthe module above these mtsJ albeitbelow the thermal shutdown temperature, reduces the long-term
refiabifity of the module.
12
4•TEXAS
STRUMENTS
PTN78000A
SLTS2465-APRIL 200-REViSED JANUARY 200M
Optional Input/Output Filters
Power modules include internal input and output ceramic capacitors in all their designs. However, some
applications require much lower levels of either input reflected or output ripple/noise. This application describes
various filters and design techniques found to be successful in reducing both input and output ripple/noise.
Input/Output Capacitors
The easiest way to reduce output ripple and noise is to add one or more 1-pF ceramic capacitors, such as C5
shown in Figure 19. Ceramic capacitors should be placed close to the output power terminals A single 4.7-pF
capacitor reduces the output ripple/noise by 10% to 30% for modules with a rated output current of less than 3 A.
(Note: C4 is recommended to improve the regulators transient response and does not reduce output ripple and
noise-)
Switching regulators draw current from the input line in pulses at their operating frequency. The amount of
reflected (input) ripple/noise generated is directly proportional to the equivalent source impedance of the power
source including the impedance of any input lines. The addition of C1, minimum 4.7-jF ceramic capacitor, near
the input power pins, reduces reflected conducted ripple/noise by 20% to 30%.
a
A
S..
See s~oe~ication for requýred value and type
auggested value and typeSee Apt•aton oformaon for
Figure 19. Adding High-Frequency Bypass Capacitors to the Input and Output
a Filters
if a further reduction in ripple/noise level is required for a application, higher order filters must be used. A a (pi)
filter, employing a ferrite bead (Fair-Rite Pt. No. 2673000701 or equwvale-t) in series with the input or output
terminals of the regulator reduces the ripple/noise by at least 20 db isee Figure 20 and Figure 21). In order for
le and noise ceramic capacitors are required. S(ee the Capacitor
the inductor to be effective inreduction of
Recommenda'tons for the PTN78000A for additional information on endors and component suggestions.)
These nductors plus ceramic capacitors form a excellent fif-er because of the rejection at the switching
frequen(cy (650 klz - 1 MHz). The placement of this filter is c-rtical. It must be located as close as possible to the
input or output pins to be effective. The ferrite bead is small (12,5 mm x 3 mrm) easy to use, low cost, and has
low dc resistance. Fair-Rite also manufactures a surface-mount bead (part number 2773021447), through hole
inductors can be used in place of the ferrite
(part number 2673000701) rated to 5 A.Altrnatively, 1-pH to 5-ýiuH
inductor bead.
PTnA000Aa
PTEXAS
wTmiENem
___I___ __~______ __~__ _~
SLTS2E4I-APiL.•,IrAU- D JANUAR 239
"aC)
A. See peikaionorrmqubd value ard ype..
R SeeAuppicamn k*n•maon•fr · uggested value and type.
C. Reoammended for appWatliaone ws load tran•ien•
Figure 20. Adding a Filters (los A)
4b
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Figure 21.
a-Fiter Attenuation vs.
Load Current
PACKAGE OPTION ADDENDUM
STEXAS
INSTRUMENTS
e
icCn=
I 1-Oct-2007
PACKAGING INFORMATION
Orderable Device
PTNTSODOAAH
Status'
t
ACTIVE
PTNT00COAAS
ACTNVE
PTN78000AAST
ACTIVE
PTNTBC'OAAZ
ACTIVE
PTN78000AAZT
ACTIVE
Package
Type
DIP MOD
Package
Drawing
EUS
ULE
Pins Package Eco Plan
Oty
5
56
Pb-Free
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Lead/Ball Finish
MSL Peak Temp
Cal Ti
N Afor Pkg Type
(RoHS)
DIP MOD
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DIP MOD
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5
49
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Call
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EUT
5
250
TB
Call Ti
CalI
TI
DIP MOD
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DIP MOD
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EUT
5
49
Call T
Level-3-2OC-1868 HR
EUT
5
250
Pb-Free
(RaHS}
Pb-Free
(RoHS;
Call Ti
Level-3-200C-1B8 HR
SThe marks•etistatus values are defined as follows:
ACTIVE: Prouct device recommnded for new designs.
LIFEBUY: T has announced that e deuice will be discc-tued, and a lifetl•e-buy period is in effect
NRND: Not recommenced for
new designs. Device s in p uctin to support
existing customersý bu TI
does not recommend usin
a new dsen.
PREVIEW: Deve has bee.- a-nounced but is not in pro~e c . Sarp-es may or may not be avaiable.
ed the production of ?hedevice.
OBSOLETE: TI has discon
hIts part in
SEco Plan - The planned co-friendy classifcati: Pb-Free RoHI . Pt-Free (RoHS Exermpt.,or Green jRoHS & no SEbr)- please •heck
http:,'/ww.ti.:ommprood:utonentfor toe latest availab l
aton and addtcnal prodct content detaids
TBD: Te Pb-Free.Green cvrs on plan has no:been define-.
Pb-Free (RoHS): Týis te is "Leai-Free" or "Pb-Free' mean semicondutor products :hat are comrpatible wt the cutent Ror-S equirements
foc
all 6 s.bstances, including therequreent that lea not excee-d 01 %by weight in homogeneous materv s. AWhere
designed to be soldered
at hit :emperatures, TI Pb-Free products are sutab;e 'or use specified leac-free processes.
Pb-Free (RoHS Exempt): This oponent has a oiS-3exerption for either 1) lead-based f -chip so der burps used between the die and
package or 2 lead-based die adnes ve sec beween the die and leofrafe. The component is otherese considered Pb-Free Ro-tS
c•1a3tible) as def-ed above.
Green (RoHS & no SbiEr): TI ef -es "Green" o mean Pb-Cree RcPHS:cmpatible:. ann free of Eromine EBran•t Anmirony Sb):based lame
or Sb do t exceeý 0.1%by neight h-romogeneous maer)
retardarts .Br
MSL Peak Tep.-- The foistle Sensiti:
k
temperature
Level
raI-ng
according to the JEDEC inustry stan-ard class
icaons,
and peak soder
Important Information and Disclaimer:The information provided on th s page represents T's knowledge and be.f as of the date that it
provide,. -Ibases its ktowledge and belief co information provided by tird car•ies, and makes no representatn.n cr warranty as to the
acwuracy of such information Effon7s areaerway to better integrate information from third partes. T has taken ano continus to take
aon
reoresentative a-d accurate information but may not have conducted destructive testing or chemical analys
reasonace steps to provide
incoming maters and chemas TI and TI supplers consaer zeral inforain to be propriear, and thus CAS numbers and other limited
nformation may not be availabe for release.
In no event sha T- liacit arnng out of suc•
annut:s
3n
ba5
to Custrer -
rmsa~n exceed t.elta prc.ase price of the TI ;artis •t issue in Itis doc.ument sold by TI
A!:denda.,-Page 1
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8 Bibliography
[Andersen, et al, 2005] M. Andersen, D. Ljubicic, C. Browne, S. Kleindienst, M.
Culpepper, An automated device to assess light redirectingpropertiesof materials and
perform sun course simulations: the Heliodome project, In Proceedings of the ISES 2005
Solar World Congress - Bringing Water to the World, Orlando, August 6-12, 2005.
[Bjorksten et al., 2005] Bjorksten, K., Bjerregaard, P., and Kripke, D. Suicides in the
midnight sun- a study ofseasonality in suicides in West Greenland,2005.
[Browne, 2006] Browne, C. Development of a light detection system for bidirectional
measurements over the solar spectrum and sun course simulations with scale models,
Massachusetts Institute of Technology, Master of Science in Building Technology
Thesis, 2006.
[Gayeski, 2007] Gayeski, N. New Methods for Measuring Spectral, Bi-directional
Transmission and Reflection using DigitalCameras, Massachusetts Institute of
Technology, Master of Science in Building Technology Thesis, 2007.
[Koch, 2007] Koch, T. Devicefor Selecting Lightwave Ranges via Computer Controlfor
Stuyding BuildingMaterialPropertiesvia Goniophotometer,Undergraduate Thesis,
Massachusetts Institute of Technology, Cambridge, 2007.
[Ljubicic, 2005] Ljubicic, D. Automated Supportfor ExperimentalApproaches in
DaylightingPerformanceAssessment, Undergraduate Thesis, Massachusetts Institute of
Technology, Cambridge, 2005.
[Raymond and Adler, 2005] Raymond, J. and Adler, J. A neglected nutrient: are
Americans dying from lack of vitamin D?, 2005.
[Rea, 2000] Rea, M. S. Lighting Handbook: reference & application.Illuminating
Society ofNorth America, New York, N.Y., 9 edition, 2000.
[Scartezzini, 2003] Scartezzini, J.L., Advances in Daylighting and Artificial Lighting,
Proceedings of Research in Building Physics, 2003.