EE 340
Introduction to IC Processing
Dept. of Electrical & Computer Engineering
Fall 2001/Bill Knowlton
EE 340 – Introdution to IC Processing : Syllabus
Instructor: Bill Knowlton, 202M MEC, 426-5705, BKnowlton@boisestate.edu
Office Hours: Monday, Friday 8:30am – 9:30am (or by appointment) – send email
Classroom, Date and Time: MEC 114, MWF; 12:40pm-1:30pm
Grading Policy: Approximately 8 to 10 problem sets (0%), 8 to 10 Quizzes (40%), 3
Exams (15% each), Final Exam (15%)
Course Website: http://coen.boisestate.edu/BKnowlton/
Prerequisites (classes listed or equivalent and their prerequisites as per 2000-2001
BSU Undergrad catalog): Physics 212 (can be taken concurrently), Chem. 111
Text Book: Silicon VLSI Technology: Fundamentals, Practice and Modeling, 1st edition,
by Plummer, Deal and griffin (Prentice Hall, 2001).
Course Description: This course is an introductory course in integrated circuit (IC)
processing. The course examines physical fundamental concepts (e.g.,
thermodynamics, materials properties and kinetics) and techniques (e.g.,
lithography, ion implantation, materials deposition) of fabrication IC devices and
circuits.
Course Content:
1. Introduction to Modern CMOS Technology
a. Historical perspective
b. Modern Perspective
c. Semiconductor physics
d. Semiconductor devices
2. Crystal Growth, Wafer Fabrication and Basic Materials Properties of Silicon
a. Crystallography
b. Czochralski growth
c. Float-zone growth
3. Semiconductor Manufacturing
a. Basic concepts
b. Manufacturing Methods and Equipment
c. Measurement Methods
4. Lithography
a. Basic concepts
b. Manufacturing Methods and Equipment
c. Measurement Methods
d. Models and Simulation (maybe)
e. Limitations
5. Introductory Thermodynamics
6. Introductory Kinetics
7. Thermal Oxidation
a. Basic concepts
b. Manufacturing Methods and Equipment
c. Measurement Methods
d. Models and Simulation (maybe)
e. Limitations
8. Dopant diffusion
a. Basic concepts
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EE 340
Introduction to IC Processing
Dept. of Electrical & Computer Engineering
Fall 2001/Bill Knowlton
b. Manufacturing Methods and Equipment
c. Measurement Methods
d. Models and Simulation (maybe)
e. Limitations
9. Ion Implantation
a. Basic concepts
b. Manufacturing Methods and Equipment
c. Measurement Methods
d. Models and Simulation (maybe)
e. Limitations
10. Thin film Deposition
a. Basic concepts
b. Manufacturing Methods and Equipment
c. Measurement Methods
d. Models and Simulation (maybe)
e. Limitations
11. Etching
a. Basic concepts
b. Manufacturing Methods and Equipment
c. Measurement Methods
d. Models and Simulation (maybe)
e. Limitations
12. Back-End Technology (maybe)
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