資訊人才在封裝測試業之角色
Ming-Cheng Sheng
ASEKH-IT
April 9, 2003
1
ASEKH-Test
Agenda
• IT Requirement for Assembly & Testing House
– Business Model
• ASEKH-Test IT Systems
–
–
–
–
CIM/MES
EIT
ERP
B2B
• The Role of IT
– Some Lessons from Our OJT
2
ASEKH-Test
半導體封裝製造價值鏈
Product Design
Front Eng
Design House
Fab
IC Design
Test
Program
Materials
Fab
Program
Development
3
Wafer
Bank
Wafer
Sort
Assembly
Probing Assembly
Wafer
Fab
Wafer
Sort
Die
Bank
Wafer Sort
Laser Repair
Assembly
Final Test
Final Test
Final
Test
Bin
Inventor
y
Final Test
Burn In
Top Mark
Lead Scan
Tape & Reel
Board Assembly
B/L Assembly
Board
Insertion &
Assembly
Board
Testing
Finished
Goods
Inventory
Warehousing
Drop Ship
ASEKH-Test
半導體封裝測試業產品生產流程
•
•
•
•
•
•
•
•
•
6
ASSEMBLY HOUSE (封裝廠)
晶粒切割 (Wafer Saw)
黏晶 (Die Attach)
焊線 (Wire bond)
封膠 (Molding)
化學處理 (電鍍/合成/酸洗..)
切腳成型 (Trim form)
印字 (Top Mark)
檢測 (Inspection)
ASEKH-Test
半導體封裝測試業產品生產流程
• TESTING HOUSE (測試廠)
•
•
•
•
晶圓測試 (Wafer Sort)
老化實驗 (Burn In)
最終測試 (Final Test)
外觀檢測 (V/M Inspection)
• B/L ASSEMBLY (板子組裝廠)
• 表面粘著 (Surface Mount Technology)
• 板子組裝 (PCB Module)
• PRODUCTION LINE (成品組裝廠)
• 最終產品 (Final Product)
7
ASEKH-Test
Process Flow Introduction
Incoming material
MES & Subsystem
Report & EDI
Outputs
Receiving
Process




Incoming Material Type:
Wafer from Fab.
70% Package from ASEK.
30% Package from other
Assembly House.






Process Flow
Wafer Sort
Final Test
Burn In (TDBI)
Lead Scan
T&R (Dry pack)





Outputs:
Summary
Wafer Map
Yield Report
QC Data
TESTING HOUSE Turn Key Business Solution
Wafer Sort
Operation
Calculation &
Analysis
• Wafer Incoming Inspection
• ESD & Grounding Protection
• Inkless Operation
• Wafer Mapping & Trace Form
• Wafer Sort Set Up Procedure
• In-Process Statistical Process Control
(SPC)
• Manufacturing Execution System
(MES) Lot Tracking & Reporting
• Probe Card Maintenance
 Clean & Calibration
 Preventive Maintenance
• In-Line Yield SPC Chart
• Stack Wafer Map
• Yield Report and Trend Chart
Charts & Controls
• Correlation Process Control
Wafer Sort Process Flow





Foundry





Wafer Sorting
Sorter capability
Sorter PM
Vacuum pen handling
N2 cabinet handling
IQA
Incoming Quality Gate
Loader/Unloader PM
Microscope handling
De-pack handling
Wafer V/M check
ID Sorting









CP
(1)
Wafer Map control
Data confirmation
Data transfer
Wafer Map
Circuit Probing
Prober PM and calibration
Set-up procedure and handling
Yield monitor
Probe mark and wafer V/M check
Data collection procedure
Wafer Sort Process Flow





Laser Repair
Fuse Cutting
ESI-9200/9300
Laser Trim








Wafer Baking
Oven PM and Calibration
Cassette transfer handling
Temp. and Time
definition
Visual Inspection
Inking
Wafer Inking
Prober PM and
calibration
Inking operation
Ink related specification
Ink check procedure
Bake











(2)
Wafer outing packing
Material storage
Cassette transfer handling
Sorter PM and operation
Shipping data preparation
Packing procedure
QA
Quality Gate
Loader/Unloader PM
Microscope handling
Wafer V/M check
CP data confirmation
and update
Pack



OQA
Outgoing
shipping gate
Packing material
check
Shipping data
Wafer Sort Capability
(1) Probing Temperature (℃ )
(2) In Line Pad Pitch (μm)
40
Industrial
Level
200
150
130
100
+200℃
50
150
Consumer
Level
45
60
Military
Level
25
0
50 um
available
70
80
90
-80
-80℃
-20
100
(um) 120
1992
1995
1998
2001
2004
1992
1995
1998
(4) Probing Wafer Size (inch)
(3) Wafer Thickness (mil)
5
12"
12"
10
15
15 mil
20
thickness
handling
2000
8"
26
6"
30
5"
(mil) 120
1992
1995
1998
2001
Year
2001
Year
4"~12"
are
available
on Q3'00
4"
4"
1992
1995
1998
2001
2004
Final Test
Operation
Calculation &
Analysis
Charts & Controls
• IC Incoming Inspection
• ESD & Grounding Protection
• In Process Visual Mechanical (V/M)
• Monitoring
• In Process Yield Monitor & Socket
• Cycle Time Control
• Final Test Set Up Procedure
• MES Lot Tracking & Reporting
• Load Board Maintenance


Clean & Calibration
Preventive Maintenance
• In-Line VM & Yield Control Chart
• Daily/Weekly/Monthly Yield
• Report and Trend Chart
Final Test Process Flow (1)



ASE & Other
Assembly House


Burn In Capability
BIB Design & Build
Auto Load/Unload
Test During Burn In.
Burn In Set Up Sheet
IQA





Incoming Quality Gate
Lead Scanning
Visual Eye Inspection
Incoming Data Check
Wafer Inspection
Capability
Burn In










Electrical QA Gate
AQL= 0.1%
QA Reject Handling
Procedure
Quality Report
Final Test
QA
Final Test
ESD & Grounding Protection
In Process V/M SPC Control
Bin Operation Control
Yield Control Procedure
Fast TAT and Cycle Time Control
TESTING HOUSE Turn Key Business Solution Provider
Final Test Process Flow (2)



Front End:
W/S, F/T, B/I


Lead Scan Capability
Copl. & Bend Lead
Stand Off / Skew
Ball Quality Inspect.
Visual Inspection
Top_mark




Top Mark Capability
Ink mark & Laser mark
Control by Set up
procedure / SOP/TCM/
Package from other
Assembly House.
Lead Scan










Tape & Reel Capability
Multi-Material Source
Kit Availability
Peel Strength SPC.
Drop Test Qualification
Bake
Bake Capability
Bake Temp: 125 C
Bake Hour: 8 Hrs
Window Time: 4Hrs
Real Time Bake Oven
Monitoring System
T&R





Pack
Pack & Drop Ship
Dry Pack
Pack MTL Design
Label Design &
Data Linking
Colorful Packing
System
TESTING HOUSE Turn Key Business Solution Provider
半導體封裝測試業產品生產流程
•
IC封裝測試業現場生產流程之特色
–
–
–
–
–
–
–
–
16
服務性質的製造業
特殊的出貨方式（Drop shipment service）
委測產品測試流程的多樣性
測試批的Hold 住現象，造成測試流程相依於測試結果
測試機台的跨機問題
客戶化之產品生產流程 (Subcon)
同時上線的IC 封裝產品形式多，批量多寡不一
須提供客戶現場即時生產資訊
ASEKH-Test
拆批
Manual splitting
Testing splitting
LOT.1
LOT.1
Test Split (for speed sort)
Split (for sub-lot)
Split
LOT.1
LOT.1
Split
Split
Split
Split
LOT.11
LOT.1A
LOT.12
LOT.1R
LOT.1B
RECP.01
17
RECP.02
RECP.03
RECP.04
RECP.05
RECP.06
ASEKH-Test
Yield Judgment & Handling
Pre-Test
IF
Pre-Test
$Yield > 90%
Test
IF
True
$Yield < 90%
$Yield
GT
90%
False
Test
Hold Inv
ELSE
Test 2
True
END_IF
ELSE
Hold Inv
$Yield
LT
90%
False
Test 2
Hold Inv
Hold Inv
END_IF
Burn In
Burn In
18
ASEKH-Test
MIS System Architecture
CRM
B2Bi,Virtual Factory(quick respond system),IRS,Standard report,KM
ERP
SD
FI/CO
PP
MM
QM
CIM
PT
SFC
EDC/SPC
Alarm
FA
PDM
Document Management
•Product Data
•Product Structure
Management
EC Management
OA
Workflow(HR,QA,CS,ENG)
E-mail
FTP
Document center
Web(intranet/internet)
Infrastructure
(1)
Common Business
Services Infrastructure
(virus,firewall)
19
(2)
Messaging
Information Distribution
Infrastructure
(EDI,e-mail,FTP,E-FAX)
(3)
Multimedia Content
and Network
Publishing Infrastructure
(HTML,JAVA,World
Wide Web,ASP)
MANAGEMENT
(4)
Network Infrastructure
(Internet,WAN,LAN
Intranet Extranet
VLAN,ISDN)
(5)
Interfacing
Infrastructure
(To:databases,
customers,and
applications)
ASEKH-Test
CIM Hardware Architecture
Report Server
CELL Server
18 GB HD*11 (Disk Array0+1)
Oracle Data 8.0.5(Rpt)
9.1 GB HD*4 (Disk Array5)
INTENCH AP
18 GBHD * 2
DB Backup
HSJ 50
10.12.20.6
CROSS
Reference
HSJ 50
HSZ 80
HSG 80
ASETRPT1
10.12.20.7
4.3 GB HD*20(Disk Array)
9GB HD *4
18GB HD *2
OpenVMS 7.1
C, DEC C++
FORTRAN 7.1-1
PROMIS 5.5
TIB/RV4.2
Report Gateway v2.2
9.1 GB HD*12 (Disk Array0+1)
ORACLE DB 8.0.5
9 GB HD* 4 (Mirror)
DB Backup
9 GB HD*2 (Mirror)
Redo Log & Rollback segment
9 GB HD*2(Mirror)
Archive Log
9 GB * 1 (Standalone)
Oracle Data (Webdb)
(Primary)
Alpha ES40-1
2GB RAM
18 GB*2 local HD
(OS,ORACLE)
PROMIS Server
(Secondary)
Alpha ES40-2
1GB RAM
18 GB*2 local HD
(OS,ORACLE)
(Primary)
Alpha ES40-1
2GB RAM
9.1GB*2 local
HD(OS)
ASETRPT2
10.12.20.9
ASE4
10.12.20.21
MEMOR
Y
CHANNE
L
(Secondary)
Alpha ES40-2
2GB RAM
9.1GB*2 local HD(OS)
ASE3
10.12.20.
31
(Primary)
Alpha 4100(5/400)1
2GB RAM
ASE1
10.12.20.2
DECNE
T
(Secondary)
Alpha 4100(5/400)-2
2GB RAM
ASE2
10.12.20.4
Gateway: 10.12.20.254
Mask:255.255.255.0
TCP/IP TIB/RV4.2
ASET-WS1
10.12.51.4
10.12.20.16
S/W Setup
Procedure
Server
P3 Xeon
700Hz /
1MB
NetServe
r LT
6000r
9.1G Hot
Swap X3
Storage: 18G Hot Swap X4
20
ASET-WS2
10.12.51.5
P3 Xeon
700Hz /
1MB
NetServer
LT 6000r
9.1G Hot
Swap X3
ASET-WS1
10.12.51.3
ASET-AP1
10.12.15.23
NetServer LC
II
P II 266Hz
160M ECC
SDRAM
18GB
X3,Ultra160
68
pin,10,000RP
M
ASET-AP
10.12.15.13
NetServer LC
II
P II 266Hz
160M ECC
SDRAM
9.1G
4.2G
MES_CELL_1
10.12.20.8
PIII-550*2
NT 4.0C
1GB RAM
9.1GB HDD
*3
Oracle 8.0.4
TIB/RV4.2
TP Server
Alarmsvr
DBsvr
VGS
TP Server
ASEKH-Test
CIM Current System
Architecture
VMS Server
MES Database(PROMIS)
Reporting Server Lot Information ,Recipe
Report
Client
雷射印表機
Reporting
Transaction
.Setup
.Track In
.Maintenance
.Data collected
.Track Out
Data Collection
.Wafer Map
.Bin Summary
.SPC Data
.UPH
Prober
GUI
Client
Handler
Shunt-Box
.WIP Data
.Yield Data
.Cycle Time
.Output
.Performance
FT Cell Server
WS Cell Server
MES Cell Server
PT,Setup,Maintenance, Test Result,SPC Wafer Map
Probe Data
Configuration Table Data,UPH data Raw Data
Auto Data Collection System
21
ASEKH-Test
CIM Future
System Architecture
VMS Server
MES Database(PROMIS)
Reporting Server Lot Information ,Recipe
Report
Client
雷射印表機
Reporting
Transaction
.Setup
.Track In
.Maintenance
.Data collected
.Track Out
Data Collection
.Wafer Map
.Bin Summary
.SPC Data
.UPH
EAP Cell Server
.Recipe download
Data Collection
.Engineering data
.Equipment data
GUI
Client
Tester
Tester
Handler
Auto Data Collection System
22
Prober
Setup M/C
Shunt-Box
.WIP Data
.Yield Data
.Cycle Time
.Output
.Performance
FT Cell Server
WS Cell Server
MES Cell Server
PT,Setup,Maintenance, Test Result,SPC Wafer Map
Probe Data
Configuration Table Data,UPH data Raw Data
ASEKH-Test
CIM F/E Framework
Layer 3
Planning
layer
(ERP/SCM)
Layer 2
Execute
layer
Planning
data
Shop floor
data
CIM
server
WS
Online
FT
Online
Yield
Management
EMS
SPC
RMS
EDA
Server
FAB
Resource
Management
(MES)
WS
File
Server
Layer 1
WS
AP
Server
LAN
EDC
Server
Summary
data
Panel PC
LAN
Program
download
Tester
Workstation
Shunt Box
Control
layer
SECS
Automation
TTL/GPIB
(PC/EPQ)
GPIB
23
Prober
Tester
Handler
ASEKH-Test
CIM B/E Framework
Layer 3
Planning
layer
(ERP/SCM)
Layer 2
Execute
layer
(MES)
Planning
data
Shop floor
data
CIM
server
WS
Online
FT
Online
SPC
File
Server
EMS
Management
SPC
RMS
FAB
Resource
Management
SPC
Database
LAN
LAN
Layer 1
Yield
EDC
Server
Panel PC
LAN
SPC
Control
layer
Automation
LAN
summary
Upload
Job
download
Flag
File
RS-232
Job
download
LAN
Temp.
monitor
SPC
summary
Flag
File
Upload
(PC/EPQ)
24
Scanner
Marking
Bake
T&R
ASEKH-Test
ASET Engineering Information System Relation Diagram
PCS
PEDB
TEV
APQP
MM(BOM)
Color
Packing
F/E MES B/E
ERP/SCM
Spec
Setup
procedure
BIMS
BCS
B/I
Oven
monitor
Setup
Matrix
Spare
board
Correlation
sample
H/W
config.
Tooling
[Product Testing
Engineer]
Asset Control Diagram
[Testing Engineering
Control Center]
TECC
CUSTOMER
PTE
Verify
Incoming
Send Back
Tester
Production
Engineering Use
Repair
PM
L/B Repair
Room
26
MFG
Control Center
ASEKH-Test
Glance at Setup Procedure
Device Name
IBM610*
Lead Count
256
IB-HP1-001-P*
PKG
BGA
Version
Insertion Test Program
FT1
tmb610_ft1
QA1
tmb610_qa1
Tooling Info.
Test Time Hold Yield
1.1
90
1.1
100
Bin#
1
2
Status
Good
Fail
Remark
Pass
O/S
Serial#
Tester Code
Customer Code
S/W Bin information
27
ASEKH-Test
SCM
ERP/FRP
H/W
Tooling
Logistic
FT/WS/BI
setup procedure BI MFG
Disposition
Tooling
oven
MM
•Matrix
•MFG/LB
•BCS
•Disposition
•BI oven
•Spare board
•Correlation
•Tools
•PM
•Test prgm mgem.
•H/W config.
PDM
• SPEC
• PCS
• EC
• APQP
• TEV
• PEDB
• FT/WS/BI
Spec
TEV
(BOM/color
MBOM ENG
Routing
packing
• Routing
E
Yield/Setup
RBOM
I
S
PEDB
SPEC
Color packing
MES
FT/WS/BI
setup procedure
MFG
Capability of PDM
•
•
•
•
•
•
•
29
New Version Control
Event Alert
APQP / EC Monitor
Internet Approval Available
Better Turn-key Service
Collaboration Mechanism
Efficiency Manufacturing
ASEKH-Test
(Current ERP System Architecture)
TDRP
ASRS
Label
Shipping
Plan
Price
MES
PO
MM
E-PR
SAP/FI
HR
E-HR
PEDB
Invoice
Packing
AOL
Cost
Hold
Bank
Intranet
Bonus
TEV
Internet
FCST
CAR
By ASET
Package
Setup
Procedure
PT
Notes AP
GUI
Equ Time
Record
Extricity
SPEC
Spare
Parts
TSMC
Ship Instr.
TesterConfig
Tooling
MES Menu
Hold Lot
ERP Applications
SCM
Distribution
• Forecast
• PC Plan
• HR
• Bonus
• Program Version
Control System
• Cust. PO Control
• Quotation
• Pricing
• Shipping Notice
• Invoicing
• Packing List
• Labeling
31
Operation
• Finance
• Cost
• GUI
• Purchase
• Inventory Man.
• Bond
ASEKH-Test
ERP Capability
• Flexible PO/Pricing Control to meet
Customer requirement
• Flexible Shipping Doc to meet Customer req.
including : Invoice
Packing List
Inner box Label
Outer box Label
• Material Control
• Inventory Management
• Good AP/Report Version Control
32
ASEKH-Test
GRP Project Scope
Capacity Planning / Production Scheduling
SCM
Middleware
TIBCO
Quotation
Purchase
PR
•Material Control
•Purchase
Production Planning
Sales/Distribution
• Scheduling
• Material Planning
• Order Entry
• Pricing • Service
Quotation
PO
Production Order
Production Control
Wafer Sort
Final Test
ASSY
Wafer issue
ERP
(SAP)
Vendor
Receive
Finish Goods
Warehouse
Management
Inventory
Control
Pick / Pack
Shipping
發料記錄
RT
Invoice
Validate
Customer
Material/FG/Shipping
Records
Invoicing
invoice
invoice
Invoice
Finance/Costing
Payment
33
• GL
• AR
• AP
• Asset Management
• Budget/Cost Control
• Treasury
Payment
ASEKH-Test
Future System Architecture
Other
Notes AP
MM/QM
E-PUR
34
SD
AS/RS
IRS
FI/CO
Label
HR
PP
1.Setup Proc.
2.PEDB
3.Tooling ….
SCM
MES
1.借機管理
2.機台進出
ASEKH-Test
Future Capability
Data
Report
Data
As-is
Report
Data
Report
Report
Data
Report
Report
Data
Report
Data
• Utilization
• Configure
• Auto linkage
Report
To-be
Data
Data
Report
35
• Speed up
Cust. Req.
• Reduce
Manpower
ASEKH-Test
ASE B2B Architecture
Private Process
IC Industry
Supply Chain
ISE Lab
Extricity Alliance
RosettaNet
TXXX
ASEKH - Assembly
Extricity Alliance
ASE
Group
CXXX
ASEKH - Test
RosettaNet
Public Process
Public Process
IXXX
ASE - Korean
ASE - CL
RosettaNet
ExtricityHu
b
IXXX
RosettaNet
WXXX
ASE - Malaysia
ASEKH-Material
Private Process
36
Coverage
- Forecast
- Order Management
- Engineer Specification
- Manufacturing Information
- Inventory Management
-etc.
ASEKH-Test
RosettaNet PIPs Supported
PIP
Description
Supported
PIP 3D8 V01.00
Distribute Work In Process
2001
PIP 3B2 V01.00
Notify of Advance Shipment
2001
PIP 3A4 V02.00
Request Purchase Order
2001
PIP 3A7 V02.00
Notify of Purchase Order Acknowledgement
2001
PIP 3A8 V01.00
Request Purchase Order Change
2001
PIP 3A9 V01.00
Request Purchase Order Cancellation
2001
PIP 3C3
Notify of Invoice
2002 Q3
PIP 3C4
Notify of Invoice Reject
2002 Q3
PIP 7B5
Notify/Request Work Order
2002 Q4
PIP 7B6
Request Work Order Status
2002 Q4
37
ASEKH-Test
B2B BUSINESS PROCESS INTEGRATION
ASE Test
Customer
Business
Application
system
•Purchase order
•Forecast
•Shipping Instruction
•Eng. Spec
End_Customer
Business
Application
system
Business
Application
system
Internet
Internet
•PO confirmation
•S.O.D reply
•WIP / Inventory
•Yield Data, QC data
•Shipping documents
•Invoice
•Shipping documents
The data interchange would be performed by Extricity, FTP protocol.
38
ASEKH-Test
File Transfer Protocol





39
1.FTP (File Transfer Protocol)
2.HTTPS (File upload Web server)
3.B2B (Platform Extricity)
4.E_mail:
5.Web Site
ASEKH-Test
Data Format
RosettaNet & XML are our preferred approach
Txt file (ASCII)
Most popular
 XML (DTD)
Data Type Definition, easy to de_code
 RosettaNet XML channel
Secured system environment
High system availability
 Flat File(Excel File)
Easy to use for end user
40
ASEKH-Test
CIM/ERP/SCM/PDM/CRM Integration
Customer/vendor
FTP
Mail
Customer/Vendor
CRM
QRS(Virtual Factory)
Marking
Sales
Service
EDI
Web-Service
B2Bi
XML Rosentanet
Data
Order
Customer
Mining
business Process
Customer Order
SD
Modeling
I R S
Data
Part
Mining
Customer
E-BOM->M-BOM
BOM
FI/CO
PP
For Casting
capacity
Capacity A Pie
TEV
Planning
E-Routing
M-Routing
Setup Matrix
Setup Procedure
Low Yield Disposition
PEDB
Constraint-Based
Supply
Planning
(capacity order) Scheduling
QM
WIP
Forcasting
TDRP
(Shipping/cost data )
F/G
&
Dispatching
EQP
status
CIM
K M
FA
MES
Order tracking
Management
EAP
F/T
Semi-Auto
Quality
Management
W/S
DCOP
SPC
SCP
PP
Scheduling
AMHS
Data
W/O
Actual order
Production Planning
forcast
MM
Purchase Part
Demand Planning
Purchase
TEV
PDM
SP
SCM
ERP
Work Flow
F/T & W/S
SFC
SFS
Cross Site
Plan
Site Plan
Detail
Plan
The Role of IT
• Service
– Passion
• Key on Process
Integration
– Communication
facilitator
– Conceptual
Modeling
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What IT Can Server for
You
• 以管理方式主導資訊流通和資訊科技的
應用‚來促進部門間的有效溝通
– 科技層面
• 開發和應用資訊科技‚來幫助人際溝通
– 經濟層面
• 成本低而效率高的方法
– 行為層面
• 改善個人‚組織的溝通意願與溝通方式‚來促進人
際間的有效溝通
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Our Policy and Challenge
• Win-Win-Win Policy
– You Pay Some but Win More
– I Pay Some and Win More, Also
– Our Customers Win, Our Mission
• Key Success Factors
– Best Practices
– Effective/Efficient Information Chain
– Learning and Improvement
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Q&A
Thanks for your attention.
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