Advanced instrumentation 2006-2011
Outline of talk:
 Introduction (groups, competences, projects underway,
infrastructure, related projects)
 Four sub-projects:
1.
R&D for future silicon systems
2.
The Norwegian technical student program at CERN
3.
Support for an Industry Liaison with extended responsibilities
related to Technology Transfer and recruitment
4.
Participation in the CLIC accelerator R&D at CERN
 Summary
Instrumentation for the future
1
Advanced instrumentation 2006-2011
Background :
 Traditionally around half of the students in the Norwegian program are
instrumentation students – true also during LEP running due to the RDn programs at
CERN
 Group competences and infrastructure; see next slides
 International projects underway (SLHC, CMB at FAIR, ILC, medical imaging); also in
next slides
 In additon to having a very solid scientific program at LHC; to have more Norwegian
CERN users at all levels must be the main goal for next period (this is also to be kept
in mind for the ”physics” projects)
 The following subprojects are essential for our CERN exploitation:
 We now have around 10 technical students at CERN – program led by Jens Vigen with
financial contributions from the Norwegian Research Council, with additional contributions
from the Universities and University Collegues sending the students (Bergen, NTNU, SørTrøndelag mostly)
 We have temporarily an ILO (ex technical student from NTNU with one year background in
the Technology Transfer area at CERN) covering several areas of interest for the general
Norwegian CERN exploitation
 A student is interested in carrying out a ph.d projects in accelerator physics (CERN has
asked for in-kind contributions to CLIC R&D) .... this person is finishing his Fellowship in
ATLAS (Toroid system)
Instrumentation for the future
2
Recent/on-going activities relevant for the future
Five major technology activities related to CERN :

Construction of silicon modules for ATLAS (UiB - Stugu, UiO – Stapnes/Dorholt, SINTEF earlier - Avseth, HiG at
some level - Wroldsen). Key effort from the electronics and mechanical workshops in Oslo, partly true also for
workshops at UiB


PHOS detector for ALICE (UiB - Klovning, UiO - Skaali, AME earlier - Hansen) – note that AME and their
technology development was strongly linked to CERN in 1980’ies for LEP


Ongoing
Construction of cryogenics tanks for ATLAS (NTNU-Owren, SB-verksted-Hansen, UiO partly-Stapnes) –
technology transfer NTNU/SINTEF to SB-verksted, and reference contract with CERN


Ongoing
High Level Trigger development for ALICE (UiB-Rohrich and Ullaland, HiB-Helstrup, UiO-Skaali and Tveter) – high
rates and high data-flow into readout and primary ”analysis” stage


Completed successfully
Completed succesfully
RD50 (UiO – Svensson and SINTEF) – important and interesting R&D work for the future linked to new facilities
in Gaustadbekkdalen

Onging and very important
Here you find all skills needed to construct any detector system, including readout and datahandling ...
___________________________________________________________________________________________________
Important note – worth mentioning in other talks (for a different audience) than this:
This overview does not include ”the other half” of the Norwegian CERN activities related to physics studies, simulation
of physics processes and detectors, pattern recognition, data-analysis, GRID, computing methods, statistical methods
etc, etc ..... I refer to the talks earlier today
Instrumentation for the future
3
RD50 - Radiation hard semiconductor devices for very
high luminosity colliders
57 institutes
(43 from EU)
>250 scientists
Particle Detectors – research lines @ UiO/PE
• Defect and impurity engineering of high-resistivity Si
• New materials; primarily silicon carbide (SiC)
• Three-dimensional detector structures
Jan-04
MRL (Oslo, Aug-2003) – 5000 m2
Equipment:
•
Characterization laboratories, etc
•
Electrical measurements; Probe station, C-V, DLTS,
ADSPEC/TSCAP (20- 106 Hz) (cryostats 10-700 K,
uniaxial stress), Laplace-&O-DLTS
•
Optical measurements; PL, interferometry, inverse
photoemission
•
Scanning Nanoprobe -scopy (AFM, SSRM, TUNA,
SCM); Foparken
•
SIMS & surface profilometer
•
MEMS-lab; etching, optical microscopes, etc
MeV ion accelerator at UiO/MRL
Ion implantation and RBS-analysis
SIMS
instrument at
UiO/MRL
National Electrostatics Corporation, 1 MV terminal voltage
Instrumentation for the future
5
Electron microscope for e-beam lithography
at UiO
Equipment – Status
Clean Room (Synthesis,
processing and
characterization)
o Processing equipment (RTP, furnaces,
evaporation, bonder, ....);
o ALCVD-lab
o Electron beam lithography (JEOL
6400F+ Raith-kit)
(FUN/NanoMAT)
o MeV implanter & Rutherford
Backscattering Spectrometry (RBS)
o Equipment from old SINTEF-lab is
expected in late 2004 (early 2005)
o
JEOL model: JSM-6400F + ELPHI Quantum (Raith)
Instrumentation for the future
6
SINTEF R&D for CERN projects:
 Partner (important) in infrastructure buildup in Gaustadbekkdalen – their
sensor lab has been moved to same facilities

 RD-20, CERN 1992-1994
 Dev.of High Resolution Si Strip Detectors for Exp.at High Luminosity at the
LHC
 RD-48 (ROSE), CERN 1996-2000
 Radiation Hardening of Silicon Detectors
 RD-50, CERN 2002 -
Collaboration with UiO
 Development of Radiation Hard Semiconductor Devices for Very High
Luminosity Colliders
 SINTEF very interested in 3D sensors (Andreas Werner) and this
project; preparing a SFI application where 3D sensors is one sub-project.
Instrumentation for the future
7
Advanced instrumentation – projects underway

New R&D period underway internationally (traditionally the periods where the CERN technology
exchange is the most interesting for us):
 For LHC upgrades (CMS and ATLAS have now R&D SG for upgrades with timescale 2014 ± 2 years
 The detector technology close to the interaction point needs new development (in fact, the IDs will be
completely replaced).
 The ATLAS B-layer is foreseen to be replaced in 2012 and new sensors, more integrated approached,
”deeper” sub-micron, new power schemes will need to be developed.
Driven by this plot, but also
by lifetime of IR quads 700 fb-1
 For linear collider detectors several R&D projects are ongoing and a conseptual design reports are foreseen
by end 06-07 for accelerators and detectors:
https://wiki.lepp.cornell.edu/wws/bin/view/Projects/WebHome
 Increased CERN R&D for medical systems over the next decade (EU projects), and Norwegian activities at
CERN related to Technology Transfer agreements and medical instrumentations
 For heavy ions see later
Instrumentation for the future
8
LHC detector changes
ID changes
 In the current ATLAS/CMS trackers a factor ten
luminosity increase would imply that the detectors
die within months, and/or become useless due to
increased occupancy creating problems for the
tracking, and/or going beyond the acceptable
readout rates.
 This applies to both PIXEL and Strip systems in
ATLAS and CMS. The TRT in ATLAS will have an
occupancy which approaches 100% and cannot be
used.
 An other way of saying this is that the current
technologies, with important new developments
could work at a factor 3 higher radius.
 So we are looking at a full silicon tracker (the
best current example is CMS)
TRT barrel
SCT barrel
TRT endcap A+B
TRT endcap C
SCT endcap
Pixels
Instrumentation for the future
9
LHC detector upgrade
Elements of new IDs ?
Cost comparison for fixed volume
30.00
(65 $/chip)
$/chip
25.00
20.00
025
013 unscaled
15.00
013 1/2
10.00
013 1/4
013 1/8
5.00
10,000
50,000
100,000
200,000
500,000
 Electronics in DSM work well, parts already tested to 100 MRad (and
more but not powered), ie 0.13um or 0.09um processes can do the job
(CMOS or SiGe) - and costs are quite reasonable
 The lowest layers need special attention – even more true for
sensors (make replaceable?)
 Yield/costs; ATLAS PIXEL chip has around 80% yield, production
costs promising (but prototyping costs large – one iteration
assumed in plot on the left)
Volume required
10,000e
5000e
 Sensors: main issues are :
 Reverse currents rise.
 Trapping increases.
 Bulk type inverts to effectively p-type – depletion voltage increase.
 Consider to use p type bulk material to operate more effectively underdepleted, collection electrons (less trapping)
 For example: A conservative target for SLHC short strips would be
survival of ~2 ×1015 cm-2 1MeV neutron equivalent, with S/N > 10
 For PIXEL area more difficult, replaceable or 3D type (see RD50
studies for 1016 cm-2 1MeV neutron equivalent sensors)
 Both CMS and ATLAS have very good experience with sensor production
and quality in current experiments
 For the innermost layer(s) special measures or replaceable system need
to be considered – most significant R&D area
Important R&D area: Very significant improvements in power distribution (serial powering or rad hard
DC/DC) needed
Instrumentation for the future
10
Advanced instrumentation – projects underway

For ALICE running after 2012, there are a number of running options, the relative importance of
which will depend on the initial results. Most probably this program will focus on rare probes and
thus require higher luminosity and/or faster detectors and readout chains.
 A high-granularity silicon pixel detector, which is radiation hard and can be read out at high rates, is
mandatory.

QCD matter at large baryon densities is not sufficiently explored, neither experimentally nor
theoretically. Nuclear reaction experiments at FAIR, the future facility at GSI (e.g. Compressed
Baryonic Matter - CBM experiment) aim at a detailed and comprehensive investigation of superdense baryonic matter. The research program includes the measurement of penetrating probes,
which escape essentially undistorted from the compressed nuclear collision zone. The planned
Compressed Baryonic Matter experiment at GSI is a natural follow-up of the ALICE program.
Important physics questions would include the production of heavy quarks in nuclear matter.
 Due to the low energies involved the rate would be low, and successful measurements would require high rate
collisions and triggers, and corresponding high-speed detectors and readout chains
So in both cases the following technologies/research fields are interesting:
 3D silicon pixel detectors have electrodes that go all the way through the bulk of the material.
This allows the electrodes to be positioned much closer together without the need to reduce the
thickness of the detector, and thus the active volume. The close positioning of the electrodes is
beneficial for both the full depletion voltage and charge collection efficiency. 3d detectors are
expected to be radiation tolerant.
 However, reading out the fine-granular pixels with high-speed requires the integration of
electronics component on the detector and the development of a new high-speed readout and onchip processing scheme in order to handle the huge data rate The DAQ concept will use selftriggered front-end electronics, where each particle hit is autonomously detected and the
measured hit parameters are stored with precise timestamps in large buffer pools.
Instrumentation for the future
11
Advanced instrumentation – CBM studies
Vertex tracker (possible example of specs) :
 700 μm material budget tolerable
 about 35 μm x 35 μm pixel size needed
 only a small part (50 cm2) is exposed to very
high doses replacing this part after a major D
run is feasible
 required dose and also interaction rate
depends on D0 efficiency thin detectors (100
μm) require significantly less than thick (700
μm) ones
 fast readout allowing clear event association
very valuable (at least)
THUS WANTED:
 thin (<700 μm)
 high resolution (σ ~ 10 μm)
 fast (best <100 ns)
 radiation tolerant (30, better >100 Mrad)
 self-triggered, high bandwidth FEE
Instrumentation for the future
12
International Research Training Group = Forskerskole
 ”Graduiertenkolleg” –
”Forskerskole”
 Starting date: 1.10.2004
 Successful meeting at UiB in April
with 30-40 participants, follow up now
in September in Heidelberg, next
meeting in Oslo in April
 Duration: 4.5 years –
extendable by 4.5 years
 Funding
 DFG: 12 stipends + running costs
 UiB, UiO, HiB:
a few stipends + 700 kNOK + ?
Instrumentation for the future
13
IRTG - participants
Instrumentation for the future
14
IRTG – research program
Development and Application of Intelligent Detectors
Includes
• physics simulation
• detector simulation
• detector construction, system integration
• readout design, development and operation
• trigger design, development and operation
• data handling and data management
• online data analysis
• offline data analysis
• GRID computing
Applies to
• Nuclear Physics
• High Energy Physics
• Space Physics
• Detector Physics
• Sensoric
• Microelectronics and Electronics
• Computer Engineering
• Computer Science
Instrumentation for the future
15
Looming in the background: Prototype cardiology CdZnTe camera (IDEAS),
and an X-ray camera (INTERON goal) – medical instrumentation
Instrumentation for the future
16
Advanced instrumentation – proposed strategy
Given the points discussed above the four sub-projects on page 1 have six main
goals:
 Join forces to develop challenging new silicon technology taking advantage
of knowledge base and new infrastructure in Norway
 Focus on basic technology development the first three years, related to
3D silicon sensors and new integration methods for sensors and
electronics.
 Include a large number of students, in silicon detector system research
using fully the link to “Forskerskole” students.
 Establish a new ILO and TT system where the focus is longer term and on
technology transfer and knowledge, via projects and human resources
spending time on CERN, in addition to the traditional CERN contract
follow up.
 Strengthen the technical students program, and co-ordinate training of
Norwegian students to provide an overall consistent environment for them
where there is increased contact between the students, Norwegian CERN
staff and researchers, and Norwegian Industries being involved in CERN
projects.
 Participate in CLIC accelerator research to have a minimal activity in
accelerator research, and also to answers CERN request for voluntary
contributions to CLIC.
Instrumentation for the future
17
Advanced instrumentation – R&D for future silicon systems
As mentioned the overall research objective is to produce and characterize 3D silicon sensors – and
to integrate transistors on the surface of these sensors.
The production and characterization of the 3D detector itself will be done in collaboration with the
MiNaLab in Oslo.
The key steps are:
 Formation of 3D structures
 Annealing and passivation of process induced defects in 3D structures
 Formation of p-n junctions in the 3D detector structures
 Characterisation of detector
The integrated electronics has to be added as a second processing round with an appropriate CMOS process.
 The main goals of the project are therefore (one iteration):
Design and processing of 3D sensors
In 2006
Design of electronics and evaluation
First half 2006
Integrate electronics readout, transistor structures
During 2006/early 2007
Evaluate in lab (3D sensors with test-electronics and During 2006, first half
integrated devices)
2007
Irradiation tests and evaluation of results
Towards end 2006 and
during 2007
Evaluation of results
Mid 2007
Instrumentation for the future
18
Schematics of 3D- and ordinary detector structures
 Proposed by S.I. Parker, C.J. Kenney and J. Segal (NIM A 395 (1997) 328)
 Called 3-D because, in contrast to silicon planar technology, have three
dimensional (3-D) electrodes penetrating the silicon substrate
 Important researches are now under investigation by a collaboration (not in
RD50) within Brunel Univ., Hawaii Univ., Stanford Univ. and CERN
depletion thickness depends on p+ and n+ electrode distance,
not on the substrate thickness  (1) can operate at very low
voltages or (2) can have a high doping for ultra-high radiation
hardness
Instrumentation for the future
19
Charge collection in 3D sensors
 lower collection length than planar technology
 lower charge collection time than planar technology
 higher charge collection efficiency
computer simulations of the charge
collection dynamics for planar and
3D detectors
Instrumentation for the future
20
Real 3D devices
a 3D detector structure:
a 3D structure grown at SINTEF:
15 m
200 m
4 m
Instrumentation for the future
21
Semi-conductor systems
Trends to be noted – deep sub micron
8192 pixel cells/die
13 millions transistors/die
5 dies /detector
Differential preamp
Power/die:0.8W
Pixel size:50 x 450 m
All processing functions on cell
ENC = 100 e- rms @ Cdet=0.1pF
Threshold mismatch:150 e- rms
Vdd=1.8V
Filtering: 2 conjugate complex poles
Beyond DSM processes (from CERN academic training) :
1.
2.
3.
4.
5.
6.
Is there an end to CMOS
Ultimate CMOS nanoscale technology
Introduction to mesoscopic physics
Quantum confinement, and electronic transport in nanowires
Quantum dots and Single Electron Tunneling (SET) Transistor
Nanoelectronic systems
Instrumentation for the future
22
CERN and semi-conductor systems
Trends to be noted – monolithic systems
 Motivation to develop a new pixel
detector
 Radiation hardness improvement
(leakage, reverse annealing issues)
 Decrease fabrication cost of pixel
detector
 Develop a thin pixel detector
 Easy fabrication of large area
devices
 Overcome readout limitation of
Imaging architecture DEPFET MAPS
Hybrid pixel
 Concepts of silicon pixel detectors in
HEP(CCD excluded)
 1st Hybrid silicon pixel
 2nd DEPFET Monolithic on high
resistivity substrate, bulk or SOI
 3rd MAPS Monolithic on CMOS wafer
substrate
 4th concept not yet exploited
deposition of detector material film
on ASIC
DEPFET pixel
MAPS
Instrumentation for the future
23
Semi-conductor systems
Next steps

Start 3D sensor development – can start now – will join forces/collaborate with US
groups through ATLAS R&D projects

Evaluate electronics/readout components to integrate, methods to do it, and partner
for carrying out the electronics development – this project is less developed than the
first

Support and readout electronics, preparation for irradiations, etc can start right
away too

So basically this project can start immediately as soon as we have a funding base
agreed
Instrumentation for the future
24
Advanced instrumentation – Technical Students
 The Norwegian Technical student
program is currently very successful
and we wish to continue it. The
ambitions are to keep it at the level of
10-12 students yearly. From an initial
investment of support for 3-4 months
the students are typically extended by
CERN to 12 months, and even 14
months in some cases. The monthly
cost is 3414 CHF, i.e 17750 NOK.
 The two Norwegian CERN staff
members who have been doing most of
the work have been Jens Vigen and
Nils Høimyr, and they are willing to
continue to promote the program. Jens
Vigen will lead the sub-project.
 Contract signed in 2005 on the right
Name
Start
Institutio
n
Support
CERN
Rune Andresen
16.01.05
NTNU
4
8
Håvard Bjerke
01.01.05
NTNU
4
3
Andreas Braathen
16.01.05
NTNU
4
8
Martin
Bugge
Jensen
01.03.05
NTNU
3
9
Magnus Lieng
16.01.05
NTNU
4
8
Thomas Johansen
16.04.05
HiB
3
9
Øyvind Østlund
01.05.05
HiB
0
12
Stian Erlend Førde
16.06.05
HiB
4
8
Camilla Stenersen
01.05.05
HiB
3
5
Christian Bråten
01.01.05
HiST
4
4
Thomas Rognmo
01.01.05
HiST
3
3
Edel Roedsjøsæther
01.01.05
HiST
3
9
Theodor Torgersen
01.07.05
HiST
0
12
Martin Handzus
16.01.05
HiM
3
9
Instrumentation for the future
25
Advanced instrumentation – ILO
Based on the experiences from 2005 and a project study carried out by the Norwegian Research Council the following
job-description seems appropriate to covers these tasks:
Work as the Norwegian Industry Liaison Officer (ILO)
 Identify tenders at CERN that can be relevant for Norwegian companies and contact these companies
 Give support to the companies which want to receive an invitation to tender
 Participate in the negotiation between CERN and companies when this is needed
 Keep an active relationship with the technical department and the Norwegian staff at CERN to get Norwegian
companies involved in the requirement specification process in forthcoming projects
 Attend to Norwegian technology and trade shows to promote CERN as a potential buyer of products and services
Work as the Norwegian Technology Transfer Officer (TTO)
 Identify technologies developed at CERN which can be interesting for Norwegian companies
 Carry through marked researches for Norway on these technologies and contact the relevant companies
 Attempt to get Norwegian companies, research institutions and university into relevant pre-competitive R&D
collaborations at CERN
 Attend to Norwegian technology and trade shows to promote CERN technology
Work as an employment contact
 Function as a contact person for Norwegian CERN job applicants and for the Norwegian employment service
(AETAT)
 Contribute in the recruitment and promotion work of CERN at Norwegian universities and university colleges with
the purpose of increasing the number of students and scientist at CERN and increase the interest for in general
Establish, maintain and update a Norwegian webpage about CERN
 Collect information from all the scattering webpages concerning CERN and streamline the information
 Information should be focused towards job applicants, students, researchers and the industry.
 Establish a transparent PTT (Project Tracking WEB system used at CERN) follow up of all parts of this project.
This work will be carried out as a contract placed by this project. The contract will be annual, renewable up to 3 years
Instrumentation for the future
26
Advanced instrumentation – accelerator physics





The specific goal of this sub-project is to support a Norwegian activity, specifically a Ph.D grant,
with the goal of setting up a test beam line to prove the feasibility of the CLIC drive beam RF
power generation.
The compact linear collider study at CERN aims to develop the technology for an electronpositron linear collider with a centre-of-mass beam collision energy in the multi-TeV range. The
concept is based on a two-beam scheme in which the RF power to accelerate the main beam is not
produced by klystrons but rather by a low-energy, high-current drive beam. This drive beam is
generated centrally and transported to the main linacs. Here, it is sent through a sequence of
Power Extraction and Transfer Structures (PETS) in which the beam generates the RF power for
the main beam. This process leads to a strong deceleration of the drive beam, which in
conjunction with the high current and low energy could affect the beam stability and the power
production efficiency.
In order to test the feasibility of the drive-beam generation and RF power production, the CLIC
Test Facility 3 (CTF3) is under construction at CERN. It will also be used to benchmark the drive
beam stability in the decelerator and compare experimental results with theoretical simulations.
To this end, a Test Beam Line (TBL), which consists of a number of PETS, will be installed and
tested with beam to produce up to 5 TWatts of RF power.
The student will play a key role in the design of the TBL. He or she will model the beam conditions
for different options of the PETS and TBL lattice. This study should lead to a choice of a specific
PETS and lattice that allows to verify the predictions of the beam stability simulations. The work
therefore includes the specification of the instrumentation. It is planned to build and test a
prototype TBL PETS during the duration of the PhD project. CTF3 will run each year and provides
the opportunity of participation in the test program allowing the student to gain experience in
machine operation and the actual performance of the different hardware components.
The student needs to work in close collaboration with experts in different fields, in particular
accelerator operation, accelerator physics, beam diagnostics and RF.
Instrumentation for the future
27
Organisation
 This project will be run as four independent subprojects with the following
structure:
 Silicon part: UoO centrally: Ole Dorholt, MiNilab: Bengt Svensson, UoB: Kjetil
Ullaland.
 Techncial students: Jens Vigen.
 ILO: Steinar Stapnes executes the contracts in close co-operation with the
Norwegian Research Council (for detailed mandate, budget framework and
reporting)
 CLIC: Steinar Stapnes supervises Erik Adli.
 For the International Research Team: Dieter Roehrich and Bernhard Skaali will
act as main contacts at UoB and UoO, respectively.
 The people mentioned above, including the ILO and specific resource
persons as needed connected to the project, will formally meet at least
twice a year to review the status, plans and progress, and to co-ordinate
the efforts. In this process we will draw in people involved in the CERN
technology transfer program in order to support Norwegians activities and
industries taking part. One way to do this is steer a few technical students
at CERN into such project. All together aim of this project is create a
common meeting place for University researchers, and industry partners
involved in CERN related technologies and instrumentation projects.
 The project will be lead by Prof. Steinar Stapnes, UoO, and have as deputy
leader Prof. Kjetil Ullaland, UiB.
Instrumentation for the future
28
Participants
Not a closed
project: Welcome
and expert other
people to participate
Instrumentation for the future
29
Conclusions
 The overall project is well based given experience, expertise and
infrastructure
 The timing is good for R&D with respect to a number of future
projects
 We integrate all the technical CERN related projects to improve
communication and collaboration – something new in the Norwegian
programme
 The resources are currently too small to do enough concerning
integration of electronics – need to work with partners abroad and
plan this in more detail next
 Would benefit the project very significantly if we could find decent
support for Norwegian “Forskerskole” grants
Instrumentation for the future
30