2002 International Conference on Electronics Packaging (ICEP)
JIEP/ IMAPS Japan, IEEE CPMT Japan Chapter
Dai-ichi Hotel Seafort, Tokyo, Japan
April 17-19, 2002
Techniques and Tools for
Product-Specific Analysis Templates
Towards Enhanced CAD-CAE Interoperability for
Simulation-Based Design and Related Topics
http://eislab.gatech.edu/pubs/conferences/2002-jiep-icep-peak/
Russell Peak
Senior Researcher
Manufacturing Research Center
Georgia Tech
Abstract
http://eislab.gatech.edu/pubs/conferences/2002-jiep-icep-peak/
Techniques and Tools for Product-Specific Analysis Templates
Towards Enhanced CAD-CAE Interoperability for Simulation-Based Design and Related Topics
Design engineers are becoming increasingly aware of “analysis template” pockets that exist in their product
domain. For example, thermal resistance and interconnect reliability analysis are common templates for
electronic chip packages, while tire-roadway templates exist to verify handling, durability, and slip requirements.
Such templates may be captured as paper-based notes and design standards, as well as loosely structured
spreadsheets and electronic workbooks. Often, however, they are not articulated in any persistent form.
Some CAD/E software vendors are offering pre-packaged analysis template catalogs like the above; however,
they are typically dependent on a specific toolset and do not present design-analysis idealization associativity to
the user. Thus, it is difficult to adapt, extend, or transfer analysis template knowledge. As noted in places like the
2001 International Technology Roadmap for Semiconductors (ITRS), domain- and tool-independent techniques
and related standards are necessary.
This paper overviews infrastructure needs and emerging analysis template theory and methodology that addresses
such issues. Patterns that naturally exist in between traditional CAD and CAE models are summarized, along
with their embodiment in a knowledge representation known as constrained objects. Industrial applications for
airframe structural analysis, circuit board thermomechanical analysis, and chip package thermal resistance
analysis are noted.
This approach enhances knowledge capture, modularity, and reusability, as well as improves automation (e.g.,
decreasing total simulation cycle time by 75%). The object patterns also identify where best to apply information
technologies like STEP, XML, CORBA/SOAP, and web services. We believe further benefits are possible if
these patterns are combined with other efforts to enable ubiquitous analysis template technology. Trends and
needs towards this end are discussed, including analogies with electronics like JEDEC package standards and
mechanical subsystems.
2
Nomenclature



ABB
AMCOM
APM
CAD
CAE
CBAM
COB
COI
COS
CORBA
DAI
EIS
ESB
FEA
FTT
GUI
IIOP
MRA
ORB
OMG
PWA
PWB
SBD
SBE
SME
SMM
ProAM
PSI
STEP
VTMB
XAI
XCP
XFW
XPWAB
ABB-SMM transformation
idealization relation between design and analysis attributes
APM-ABB associativity linkage indicating usage of one or more i
analysis building block
U. S. Army Aviation and Missile Command
analyzable product model
computer aided design
computer aided engineering
context-based analysis model
constrained object
constrained object instance
constrained object structure
common ORB architecture
design-analysis integration
engineering information systems
engineering service bureau
finite element analysis
fixed topology template
graphical user interface
Internet inter-ORB protocol
multi-representation architecture
object request broker
Object Management Group, www.omg.com
printed wiring assembly (a PWB populated with components)
printed wiring board
simulation-based design
simulation-based engineering
small-to-medium sized enterprise (small business)
solution method model
Product Data-Driven Analysis in a Missile Supply Chain (ProAM) project (AMCOM)
Product Simulation Integration project (Boeing)
Standard for the Exchange of Product Model Data (ISO 10303).
variable topology multi-body
X-analysis integration (X= design, mfg., etc.)
XaiTools ChipPackage™
XaiTools FrameWork™
XaiTools PWA-B™
3
Contents





Motivation
Introduction to Information Modeling and
Knowledge Representation
Analysis Template Applications
International Collaboration on Engineering
Frameworks
Recommended Solution Approach
4
Motivation: Product Challenges
Trend towards complex multi-disciplinary systems
Demanding End User Applications
MEMS devices
http://www.zuken.com/solutions_board.asp
3D interconnects
Source: www.ansys.com
5
Motivation: Engineering Tool Challenges
2001 International Technology Roadmap for Semiconductors (ITRS)
http://public.itrs.net/Files/2001ITRS/Home.htm

Design Sharing and Reuse
– Tool interoperability
– Standard IC information model
– Integration of multi-vendor and internal design
technology
– Reduction of integration cost

Simulation module integration
– Seamless integration of simulation modules
– Interplay of modules to enhance design effectiveness
6
Advances Needed in Engineering Frameworks
2001 International Technology Roadmap for Semiconductors (ITRS)
http://public.itrs.net/Files/2001ITRS/Home.htm
7
Analogy
Physical Integration Modules  Model Integration Frameworks
Design System Architecture
Stacked Fine-Pitch BGA
www.shinko.co.jp
System-On-a-Package (SOP)
Wafer Level Packaging
RF, Digital, Analog, Optical, MEMS
www.prc.gatech.edu
2001 ITRS
Multidisciplinary challenges require innovative solution approaches
8
Interoperability
Seamless communication between people, their models, and their tools.

Requires techniques beyond traditional engineering
– Information models
» Abstract data types
» Object-oriented languages (UML, STEP Express, …)
– Knowledge representation
» Constraint graphs, rules, …
– Web/Internet computing
» Middleware, agents, mobility, …

Emerging field: engineering information methods
– Analogous to CAD and FEA methods
9
Contents





Motivation
Introduction to Information Modeling and
Knowledge Representation
Analysis Template Applications
International Collaboration on Engineering
Frameworks
Recommended Solution Approach
10
“Collaborative Modeling” vs. “Tool Usage”
Existing Tools
Tool A1
...
Tool An
Content
Coverage Gaps
Product Model
- integrated information model
- knowledge representation
Integration
Gaps
11
Example Information Model in Express (ISO 10303-11)
spring system tutorial
SCHEMA spring_systems;
ENTITY spring;
undeformed_length : REAL;
spring_constant : REAL;
start : REAL;
end0 : REAL;
length0 : REAL;
total_elongation : REAL;
force : REAL;
END_ENTITY;
ENTITY two_spring_system;
spring1 : spring;
spring2 : spring;
deformation1 : REAL;
deformation2 : REAL;
load : REAL;
END_ENTITY;
L
L
Lo
F
x1
x2
k
F
deformed state
k1
k2
P
u1
u2
END_SCHEMA;
12
Instance Model and Example Application
spring system tutorial
Fragment from an instance model - (a.k.a. Part 21 “STEP File” - ISO 10303-21)
#1=TWO_SPRING_SYSTEM(#2,#3,1.81,3.48,10.0);
#2=SPRING(8.0,5.5,0.0,9.81,9.81,1.81,10.0);
#3=SPRING(8.0,6.0,9.8,19.48,9.66,1.66,10.0);
13
PWB Stackup
Design &
Analysis Tool
14
Application-Oriented Information Model - Express-G notation
PWB Stackup Design & Analysis Tool
15
Contents





Motivation
Introduction to Information Modeling and
Knowledge Representation
Analysis Template Applications
International Collaboration on Engineering
Frameworks
Recommended Solution Approach
16
Analysis Template Catalog:
Chip Package Simulation
thermal, hydro(moisture), fluid dynamics(molding), mechanical and electrical behaviors

PakSi-TM and PakSi-E tools
http://www.icepak.com/prod/paksi/ as of 10/2001

Chip package-specific behaviors:
thermal resistance, popcorning, die cracking, delaminating, warpage & coplanarity,
solder joint fatigue, molding, parasitic parameters extraction, and signal integrity
17
Analysis Template Methodology &
X-Analysis Integration Objectives (X=Design, Mfg., etc.)




Goal:
Improve engineering processes via analysis templates
with enhanced CAx-CAE interoperability
Challenges (Gaps):
– Idealizations & Heterogeneous Transformations
– Diversity: Information, Behaviors, Disciplines, Fidelity,
Feature Levels, CAD/CAE Methods & Tools, …
– Multi-Directional Associativity:
DesignAnalysis, Analysis  Analysis
Focus:
Capture analysis template knowledge
for modular, regular design usage
Approach:
Multi-Representation Architecture (MRA)
using Constrained Objects (COBs)
18
X-Analysis Integration Techniques
for CAD-CAE Interoperability
http://eislab.gatech.edu/tools/XaiTools/
a. Multi-Representation Architecture (MRA)
3
Analyzable
Product Model
Design Model
4 Context-Based Analysis Model
2 Analysis Building Block
1 Solution Method Model
CBAM
ABB
Solder
Joint
material
body 1
body4
Solder Joint
Solder Joint Plane Strain Model
4 CBAM
C
L

h1
base: Alumina
Epoxy
ABBSMM
PWB
body3
APM ABB
core: FR4
Plane Strain Bodies System
2 ABB

 total height, h c
Component
Solder
Joint
T0
Component
 linear-elastic model
 primary structural
SMM
APM ABB
Analysis Model
PWA Component Occurrence
3 APM
APM
Printed Wiring Assembly (PWA)
Component
b. Explicit Design-Analysis Associativity
body 1
body 4
body
body 2
body 2
PWB
Printed Wiring Board (PWB)
Design Tools
4 CBAM
Analysis Module Catalogs
Analysis Procedures

3 APM
sj
solder joint
shear strain
range

Lc
total height
hc
primary structural material
T0
linear-elastic model
length 2 +
total thickness
Product
Model
1.25
[1.1]
Physical Behavior Research,
Know-How, Design Handbooks, ...
Commercial
Design Tools
(Module Usage)
Selected Module
Solder Joint Deformation Model
pwb
Commercial
Analysis Tools
primary structural material
solder
hs
linear-elastic model
rectangle
solder joint
ECAD
Idealization/
Defeaturization
Component
Solder Joint
[1.1]
detailed shape
[1.2]
linear-elastic model
[2.1]
Ts
average
Ansys
CAE
PWB
APM  CBAM  ABB SMM
Tc
Ls
[1.2]
bilinear-elastoplastic model
[2.2]
MCAD
Plane Strain
Bodies System
(Module Creation)
component
1 SMM
deformation model
Fine-Grained Associativity
approximate maximum
inter-solder joint distance
component
occurrence
c
ABB SMM
2 ABB
Ubiquitization
Ubiquitous Analysis
3
plane strain bodyi , i = 1...4
geometryi
materiali (E,  ,  )
Informal Associativity Diagram
Solution Tools
c. Analysis Module Creation Methodology
To
a
L1
h1
stress-strain
model 1
T1
L2
h2
stress-strain
model 2
T2
geometry model 3
stress-strain
model 3
T3
 xy, extreme, 3
T sj
 xy, extreme, sj
Constrained Object-based Analysis Module
Constraint Schematic View
Abaqus
19
COB-based Constraint Schematic
for Multi-Fidelity CAD-CAE Interoperability
Flap Link Benchmark Example
Design Tools
Analysis Building Blocks
(ABBs)
MCAD Tools
CATIA, I-DEAS*
Pro/E* , UG *, ...
Analysis Modules
of Diverse Behavior & Fidelity
(CBAMs)
Continuum ABBs:
y
Extensional Rod
Material Model ABB:
shear stress,

cte, 
 t  T

E
2(1  )

e
T
t


r4
area, A
T, ,  x
Extension
r3
r2
undeformed length, Lo
G
F
E, A, 
shear strain, 
r5

L
Lo
F
E
force, F
G
youngs modulus, E
poissons ratio, 
One D Linear
Elastic Model
(no shear)
reference temperature, To
1D Linear Elastic Model
L
material model
edb.r1
temperature, T
total elongation,L
r1
start, x1
shear modulus, G
linkage
y
temperature change,T

r4
thermal strain, t

e 
stress, E
Torsional Rod
T
One D Linear
Elastic Model
strain, 
r3
effective length, Leff
mode: shaft tension
Lo
material model
elastic strain, e
Flap Link Extensional Model
Extensional Rod
(isothermal)
al1
length, L
end, x2
r1
r2
E
material
T
G, r, ,  ,J
x
area, A
cross section
L
A
youngs modulus, E al3
reaction
condition
L
x2
al2
linear elastic model
Lo
x1
E

F

G
stress mos model
torque, Tr

polar moment of inertia, J

e
radius, r
T
t




Analysis Tools
(via SMMs)
Margin of Safety
(> case)
1D
allowable stress
allowable
General Math
Mathematica
Matlab*
MathCAD*
...
actual
MS
r3
undeformed length, Lo
r1
theta start, 1
theta end, 2
twist, 
inter_axis_length
linkage
Flap Link Plane Strain Model
deformation model
Parameterized
FEA Model
sleeve_1
w
r
L
ws1
sleeve_2
w
ts1
t
Legend
Tool Associativity
Object Re-use
t
2D
mode: tension
r
rs2
ws2
ux,max
ts2
x,max
rs2
shaft
cross_section:basic
wf
wf
tw
tw
tf
tf
material
E
name
E

linear_elastic_model

F
condition reaction
flap_link
allowable stress
effective_length
allowable inter axis length change
L
w
sleeve_1
B
ts2
ts1
t
r
s
w
sleeve_2
sleeve1
sleeve2
shaft
rib1
stress mos model
Margin of Safety
(> case)
allowable
allowable
actual
actual
MS
MS
R1
t
rib2
R1
r
ds1
R2
x
ds2
B
ux mos model
Margin of Safety
(> case)
x
shaft
cross_section
R3
wf
R4
tw
Leff
t1f
R6
R5
deformation model
t2f
Torsional Rod
critical_section
critical_detailed
wf
linkage
effective length, Leff
al1
Lo
tw
Materials Libraries
In-House, ...
Parts Libraries
In-House*, ...
rib_1
R7
t1f
h
t
rib_2
t2f
R2
critical_simple
wf
h
t
material
R8
tw
R3
E
name
stress_strain_model
linear_elastic
hw

tf
cte
area
R9
mode: shaft torsion
Torsion
area
b
R10
cross section:
effective ring
material
condition
polar moment of inertia, J
al2a
outer radius, ro
al2b
linear elastic model
reaction
allowable stress
R12
Analyzable Product Model
(APM)
* = Item not yet available in toolkit (all others have working examples)

1
R11
hw
b
twist mos model
Margin of Safety
(> case)
1D
allowable
shear modulus, G
al3
2
J
r

G

T
stress mos model
allowable
twist
Margin of Safety
(> case)
allowable
actual
actual
MS
MS
FEA
Ansys
Abaqus*
CATIA Elfini*
MSC Nastran*
MSC Patran*
...
Flap Link Torsional Model
20
An Introduction to X-Analysis Integration (XAI)
Short Course Outline
Part 1: Constrained Objects (COBs) Primer
– Nomenclature
Part 2: Multi-Representation Architecture (MRA) Primer
– Analysis Integration Challenges
– Overview of COB-based XAI
Part 3: Example Applications
» Airframe Structural Analysis (Boeing)
» Circuit Board Thermomechanical Analysis
(DoD, JPL/NASA)
» Chip Package Thermal Analysis (Shinko)
– Summary
Part 4: Advanced Topics & Current Research
21
Chip Package Products
Shinko
Quad Flat Packs (QFPs)
Plastic Ball Grid Array (PBGA) Packages
22
Flexible High Diversity Design-Analysis Integration
Electronic Packaging Examples: Chip Packages/Mounting
Shinko Electric Project: Phase 1 (completed 9/00)
Design Tools
y
L
L
Lo
F
material model
youngs modulus, E
mv6
cte, 
mv5
sr1
temperature, T
reference temperature, To
ts1
E
T  T  To
L
A
ts2
Shaft
Sleeve 2
smv1
ds1
area, A
r4
F

A
A
Leff
linkage
e

s
Sleeve 1
force, F
mv4
F
E, A, 
T, ,  x
One D Linear
Elastic Model
(no shear)
ds2
T
t


mv2
elastic strain, e
mv3
thermal strain, t
mv1
strain,
effective length, Leff
Prelim/APM Design Tool
XaiTools ChipPackage
start, x1
end, x2
cross section:
effective ring
r1
reaction
material
L  L  Lo
L  x2  x1
allowable
L
r3 ro
outer radius,
L
linear elastic model
allowable stress
twist mos model
Margin of Safety
(> case)
polar moment of inertia, J

r2
condition
Torsional Rod
stress,al1

temperature change,T
mode: shaft torsion
undeformed length, Lo
deformation model
al2a
al2b
shear modulus, G
al3
total elongation,L
length, L
Lo

1
2
Modular, Reusable
Template Libraries
J
r

G

T
stress mos model
allowable
twist
Margin of Safety
(> case)
allowable
actual
actual
MS
MS
Analyzable
Product Model
PWB DB
Analysis Modules (CBAMs)
of Diverse Behavior & Fidelity
Thermal
Resistance
Analysis Tools
XaiTools
General Math
ChipPackage
Mathematica
FEA
Ansys
3D
XaiTools
Materials DB*
Thermal
Stress
EBGA, PBGA, QFP
PKG

Basic
3D**
Chip
Cu
Ground
** = Demonstration module
Basic
Documentation
Automation
Authoring
MS Excel
23
COB-based Analysis Template
Typical Highly Automated Results
Analysis Module Tool
COB =
constrained
object
Auto-Created
FEA Inputs
(for Mesh Model)
FEA
Temperature
Distribution
Thermal Resistance
vs.
Air Flow Velocity
24
VTMB = variable topology multi-body technique [Koo, 2000]
Pilot & Initial Production Usage Results
Product Model-Driven Analysis


Reduced FEA modeling time > 10:1 (days/hours  minutes)
References
[1] Shinko 5/00 (in Koo, 2000)
Reduced simulation cycle > 75%
[2] Shinko evaluation 10/12/00
Analysis Model Creation Activity
With Traditional
Practice
With VTMB
Methodology*
Example
Create initial FEA model (QFP cases)
8-12 hours
10-20 minutes
QFP208PIN
Create initial FEA model (EBGA cases)
6-8 hours
10-20 minutes
EBGA352PIN
Create initial FEA model (PBGA cases)
8-10 hours
10-20 minutes
PBGA256PIN
Create variant - small topology change
0.3-6 hours
(10-20 minutes) - Moderate dimension change
(e.g., EBGA 600 heat sink size variations)
Create variant - moderate topology change
(6-8 hours)-
(10-20 minutes) - Add more features
(e.g., increase number of EBGA steps)
Create variant - large topology change


(6-8 hours)+
(10-20 minutes)or N/A
Add new types of features
(e.g., add steps to EBGA outer edges)
Enables greater analysis intensity  Better designs
Leverages XAI / CAD-CAE interoperability techniques
– Objects, Internet/web services, ubiquitization methodology, …
25
Analysis Template Merits


Provides methodology for bridging associativity gap
Multi-representation architecture (MRA)
& constrained objects (COBs):
– Address fundamental issues
» Explicit CAD-CAE associativity:
multi-fidelity, multi-directional, fine-grained
– Enable analysis template methodology  Flexibility & broad application

Increase quality, reduce costs, decrease time (ex. 75%):
» Capture engineering knowledge in a reusable form
» Reduce information inconsistencies
» Increase analysis intensity & effectiveness
26
Contents





Motivation
Introduction to Information Modeling and
Knowledge Representation
Analysis Template Applications
International Collaboration on Engineering
Frameworks
Recommended Solution Approach
27
Towards Greater Standards-Based Interoperability
Target Analogy with Electronics Systems


Today:
Next Steps:
- Monolithic software applications; Few interchangeable “parts”
- Identify other formal patterns and use cases
(natural subsystems / levels of “packaging”)
- Define standard architectures and interfaces among subsystems
Interconnect
Middleware
Generic Geometric Modeling Tools,
Math Tools, FEA Tools,
Requirements
& Function Tools, …
Printed
Circuit Assemblies
Assembly
Product-Specific
Simulation-Based
Design
Tools
Product
Enclosure
Die
APMs
CBAMs Part
Packaged
Extended
MRA
Printed Circuit
ABBs
Package
Substrate
Die
SMMs
Externally
Linkages to Other
Visible
Connectors
Life Cycle
Models
Adapted from Rockwell Collins Inc.
28
2002 NASA-ESA Workshop on
Aerospace Product Data Exchange
ESA/ESTEC, Noordwijk (ZH), The Netherlands
April 9-12, 2002
ISO 10303 series
Progress on Standards-Based
Engineering Frameworks that include STEP AP210
(Electronics), PDM Schema, and AP233 (Systems)
An Engineering Framework Interest Group (EFWIG) Overview
Russell Peak - Georgia Tech, Atlanta GA, USA
Mike Dickerson - JPL/NASA, Pasadena CA, USA
Lothar Klein - LKSoft, Kuenzell, Germany
Steve Waterbury - NASA-Goddard, Greenbelt MD, USA
Greg Smith - Boeing, Seattle WA, USA
Tom Thurman - Rockwell Collins, Cedar Rapids IA, USA
Jim U'Ren - JPL/NASA, Pasadena CA, USA
Ken Buchanan - ATI/PDES Inc., Charleston SC, USA
Scope of Engineering Framework Interest Group
A PDES Inc. Systems Engineering Subproject
http://eislab.gatech.edu/efwig/

Interoperability in multi-disciplinary engineering
development environments
– Emphasis dimensions:
» Organizational Level: engineering group/department
» Domains: systems & s/w engineering, electromechanical, analysis
» Design stages: WIP designs at concept, preliminary, and detailed
stages
– Awareness of design interfaces to other life cycle phases:
» pursuit & order capture, mfg., operation/service, and disposal
An international consortium
for standards-based collaborative engineering
http://pdesinc.aticorp.org/
30
What is the context of Systems Engineering?
User/Owner/Operator
User/Owner/Operator
Management
Marketing
Acquisition Authority
Business Strategy
Management Info
Concept
RFP
Proposal
Contract
Management Info
Systems Engineering
Specifications
Digital
Chemical
Maintenance
Mechanical
Communications
2002-04 - Mike Dickerson, NASA-JPL
Civil
STEP
ISO SC4
Logistics
Controls
Electrical
UML
ISO SC7
Software
Engineering
Disciplines
Manufacture
31
Spacecraft Development Using ISO 10303 and Other Standards
Propulsion
Fluid Dynamics
• Standard:
• Standard: CFD
• Software • Status: In Development
• Boeing,
STEP-PRP
• Software:• Status: In Development
• ESA, EADS
Electrical Engineering
Cabling
• Standard: AP210
• Standard: AP212
• Software Mentor Graphics
• Status: Prototyped
• Rockwell, Boeing
• Software MentorGraphics
• Status: Prototyped
• Daimler-Chrysler, ProSTEP
Software Engineering
Optics
Mechanical Engineering
• Standard: NODIF
• Standard: AP203, AP214
• Software - TBD
• Minolta, Olympus
• Software Pro-E, Cadds, SolidWorks,
AutoCad, SDRC IDEAS, Unigraphics,
others
• Status: In Production
• Aerospace Industry Wide, Automotive
Industry
Structural Analysis
• Standard: AP209
•STEP-Tools, Boeing
2001-12-16 - Jim U’Ren, NASA-JPL
• Standard: AP233
• Software: MetaPhase, Windchill, Insync
• Status: In Production
• Lockheed Martin, EADS, BAE SYSTEMS,
Raytheon
• Software: Thermal Desktop, TRASYS
• Status: In Production
• ESA/ESTEC, NASA/JPL & Langely
•Software:: Gibbs,
•Status:: In Development / Prototyped
Systems Engineering
• Standard: STEP PDM Schema/AP232
• Standard: STEP-TAS
STEP-NC/AP224
• Software:Rational Rose, Argo, All-Together
• Status: In Production
• Industry-wide
PDM
Thermal Radiation Analysis
• Standard::
Development)
• Software: Statemate, Doors, Matrix-X,
Slate, Core, RTM
• Status: In development / Prototyped
• BAE SYSTEMS, EADS, NASA
• Software: MSC Patran, Thermal
Desktop
• Status: In Production
• Lockheed Martin, Electric Boat
Machining
• Standard::UML - (AP233 interface In
Inspection
• Standard: AP219
• Software: Technomatics, Brown,
eSharp
• Status: In Development
• NIST, CATIA, Boeing, Chrysler, AIAG
Life-Cycle Management
• Standard: PLCS
• Software: SAP
• Status: In Development
• BAE SYSTEMS, Boeing, Eurostep
File: SLIDE_STEP-in-Spacecraft-Development-Ver4.ppt
32
R
STEP AP 210 (ISO 10303-210)
Domain: Electronics Design
~800 standardized concepts (many applicable to other domains)
Development investment: O(100 man-years) over ~10 years
Interconnect
Assembly
Printed Circuit Assemblies
(PCAs/PWAs)
Product Enclosure
Die/Chip
Packaged Part
Printed Circuit
Substrate (PCBs/PWBs)
Die/Chip
Adapted from 2002-04 - Tom Thurman, Rockwell-Collins
Package
External Interfaces
33
Rich Features in AP210: PWB traces
AP210 STEP-Book Viewer - www.lksoft.com
34
Rich Features in AP210: Via/Plated Through Hole
Z-dimension details
…
35
Rich Features in AP210: Electrical Component
The 3D shape is generated from these “smart features” which
have electrical functional knowledge. Thus, the AP210-based
model is much richer than a typical 3D MCAD package model.
210 can also support the detailed design of a package itself
(its insides, including electrical functions and physical
behaviors).
36
Rich Features in AP210: 3D PCB Assembly
37
PWA/PWB Assembly Simulation using AP210
User Alerted on
Exceptions to
Producibility
Guidelines
Rules (From
Definition
Facility)
Generic
Manufacturing
Equipment
Definitions
2002-03 - Tom Thurman, Rockwell-Collins
Specific
Manufacturing
Equipment
Used
38
Analogy
Physical Integration Modules  Model Integration Frameworks
Design System Architecture
Stacked Fine-Pitch BGA
www.shinko.co.jp
System-On-a-Package (SOP)
Wafer Level Packaging
RF, Digital, Analog, Optical, MEMS
www.prc.gatech.edu
Challenge:
Integrating
Diverse
Technologies
2001 ITRS
39
Recommended Solution Approach



Philosophy: Consider engineering design environments
as analogous to electronic packaging systems
Leverage international collaboration with other industries
Follow systems engineering approach
– Decompose problem into subsystems
» Architectures, components (standards, tools, …), and techniques
– Identify & define gaps
– Identify existing solutions where feasible
– Define solution paths
» Identify who will “supply”/develop these “components”
– Develop & prototype solutions
– Advocate solution standardization and vendor support
– Test in pilots
– Deploy in production usage
40