Building a world without wires!
October 6, 2000
Kichul Chang
Principal Engineer
LG Innotek Co., Ltd.
kcchang@lginnotek.com
http://carpc.co.kr
AGENDA
 Bluetooth Introduction
 Future of Bluetooth
 Market Overview
 Chipset & Module Trend
 Conclusion
Bluetooth
Introduction
Bluetooth Vision
 The best low-cost radio link technology
 Perfect for mobile devices – small, low power, and low cost, but good
performance
 Open, royalty free specification
Cable
Replacement
Landline
Data/Voice
Access Points
Personal Ad-hoc
Connectivity
-3-
Bluetooth SIG History
 Ericsson Invented the Concept - '94
 Invited Other Industry Leaders to Help Develop the Concept - '97
 Technology Announced - May '98
 Nine Lead Promoter Companies
- Ericsson, Nokia, Toshiba, Intel, IBM
- Microsoft, Motorola, 3Com, Lucent (Dec '99)
 Unprecendented Industry Acceptance of the Bluetooth Wireless Technology
- Over 2000 Adopter and Associate Companies Have Joined the SIG!
- Many Market Segments and Usage Models Have Been Defined
 v1.0 Specification Published - July '99
 v1.0b Update Published - Dec '99
 v1.1 Update will be Published - Nov '00
- New Member Web-Site Opened (http://www.opengroup.org/bluetooth)
 Products Are Starting to Enter the Market Now
- Mobile Phones, Headsets, Mobile PCs, Data Access Points
-4-
Korean SIG Members
 Total 62 Company/University/Institute (19/July/'00)
 About 200+ Companies participate in Bluetooth Developments.
 Main Application is Mobile Phone and Accessary
•Advanced Semiconductor Business Inc.
•Belco International Co., Ltd
•Bellwave, Inc.
•C&S Technology
•Commax.co.ltd
•Cyberbank
•D.O.Tel
•Dacom Corp
•Daewoo Telecom LTD
•DAIC Microsystems
•Doshin Electroniks Corp.
•DreamTel
•DSI Inc.
•EST(Embedded Solution Technology Inc.)
•ETRI
•Flinston
•Gmate, Inc. / ASIC design Lab.
•Hanchang Corp
•Hansei University
•HASSNet
•HC Telecom Co., Ltd.
•Hutel Inc.
•IWingz
•JATY ELECTRONICS CO., LTD
•Joohong Information and communication
•JTEL Co. Ltd
•Keti
•KiRyung Electronics Co., Ltd
•Korea Electronics Technology Institute
•Kortronics Enterprise Co., Ltd
•LG Electronics Inc./ Media-Communication Lab.
•LG Information & Communications,Ltd
•LG Innotek Co., Ltd.
•LG Telecom
•Maxon Electronics
•Miengine
•MMC Technology, Inc.
•N3 Technologies Inc
•Navtron
•Netnaru Ltd.
•Nexcell Telecom CO, Ltd
•Nong Shim Data System Co, Ltd.
•NuArk Co., Ltd.
•Open Solution
-5-
•Opentech Inc.
•Powerlink Corp.
•Radionix Inc.
•RFSS
•S&S Technology, Inc.
•Samsung
•SANION CO.,LTD.
•Sejin Electron Inc.
•SENA Technologies, Inc.
•SEWON TELECOM LTD
•Simplex Investment
•SK Telecom
•SysOnChip, Inc.
•TeleTek Inc.
•Telian Corporation
•Tescom co. ltd.
•UNO Systems Co., Ltd
•Wide Telecom, Inc.
Bluetooth SIG Structure
- Promoter
- Associate
- Early Adopter
- Independent
Program Management
Board
(PM Board)
Regulatory
(GOV)
RF
Regulations
Aviation
Regulations
Legal
Committee
(LEGAL)
China
Regulations
Management
Services
(ADMIN)
Architecture
Review
Board
(BARB)
Test and
Interop
(TEST)
Subgroups
BTAB
BQA
Technical
Working
Groups
Expert
Groups
Security
Regulations
Japan
Regulations
Qualification
Review
Board
(BQRB)
Marketing
(MKTG)
BQB
Errata Owner and Review pool
BQRB = Bluetooth Qualification Review Board
BTAB = Bluetooth Technical Advisor Board
BQA = Bluetooth Qualification Administrator
BQB = Bluetooth Qualification Body
-6-
Spec Overview
Applications
TCP/IP HID
RFCOMM
Application Framework
and Support
Data
L2CAP
Audio
Host Controller
Interface
Link Manager and L2CAP
Link Manager
Baseband
Radio & Baseband
RF
Test Specification
-7-
Spec Overview (Radio)
 Frequency band & Channel Arrangement : ISM Band
- USA
2.4000 - 2.4835 GHz
f = 2402 + k MHz, k=0, …78
- Europe 2.4000 - 2.4835 GHz
f = 2402 + k MHz, k=0, …78
- Spain
2.4450 - 2.4750 GHz
f = 2449 + k MHz, k=0, …22
- France 2.4465 - 2.4835 GHz
f = 2454 + k MHz, k=0, …22
 Transmitter Power
- 0 dBm (Class 3)
- 4 dBm (Class 2)
- 20 dBm (Class 1)
 Power Consumption
- 0.3 mA (Standby mode), 30mA (Operating Mode)
 Modulation
- GFSK (BT = 0.5; 0.28 < h < 0.35)
- 1 MSymbols/s
 Receiver Sensitivity
- -70dBm @ 0.1% BER
-8-
Spec Overview (Baseband)
 Channel
- Data channel + 3 Voice Channel
- Data Rate
: 723.2 kbps / 57.6 kbps (Asymmetric),
432.6 kbps / 432.6 kbps (Symmetric)
- Voice
: 64 kbps for each channel
 FEC (Forward Error Correction)
- 1/3 Rate FEC, 2/3 Rate FEC
- ARQ scheme for the data
 Security
- Robust Authentication and Encryption : Key Length up to 128 bits
- Fast Frequency Hopping : 79 channels
- Low transmission Power : Range typically 10 meters
 Audio
- CVSD (Continuous Variable Slope Delta Modulation)
- 64k samples /s linear PCM data
 Support up to 8 devices / piconet, Max 10 piconet (71 devices)
-9-
Spec Overview (Link)
SCO (Synchronous Connection Oriented) - 1대1의 대향 Link를 형성. 1 Packet / 1 Slot
ACL (Asynchronous Connection-Less) - Packet 교환형, 1,3,5등 3종류의 Slot 점유
Packet
ACL
SCO
Payload User
Header Payload
DM1
1
17
DH1
1
27
DM3
2
121
DH3
2
183
DM5
2
224
DH5
2
339
AUX
1
29
HV1
na
10
HV2
na
20
HV3
na
30
DV-A
na
10
DV-D
1
9
Type
FEC
CRC
2/3
no
2/3
no
2/3
no
no
1/3
2/3
no
no
2/3
yes
yes
yes
yes
yes
yes
no
no
no
no
no
yes
Max.
Slot
1
1
3
3
5
5
1
1
2
3
1
1
- 10 -
Max Max Sym Symmetri Asymmetric
Asym Slot/sec c Forward Reverse
800
800 108.8 108.8 108.8
800
800 172.8 172.8 172.8
400
267 258.1 387.2
54.4
400
267 390.4 585.6
86.4
267
160 286.7 477.9
36.3
267
160 433.9 723.2
57.6
800
800 185.6 185.6 185.6
800
64.0
400
64.0
267
64.0
800
64.0
800
57.6
Piconets & Scatternets
 A master and up to 7
slaves from a Piconet
 Up to 10 Piconets in a
Scatternet before
performance starts to
degrade
 Master controls the Piconet
 Slaves only communicate
with the master
Slave 5
Slave 4
Slave 3
Slave 1
 Total 71 devices can be
connected together
(= 7*9 + 8)
Master
Piconet 2
Slave 7
Slave 6
Master
Piconet 1
Master
Piconet 3
Slave 2
Slave 8
- 11 -
Bluetooth Profile
 Profiles provide a vertical slice through the protocol stack
- Each profile defines mandatory and optional features of each protocol
 One profile defined per usage model
 Profiles are the basis for interoperability and logo requirements
 Each Bluetooth device supports one or more profile
Protocols
Applications
Profiles
- 12 -
Bluetooth Profile
Bluetooth Profile
Intercom Image
Profiles
Equipments
Cordless Telephone Handset, CT Phone
Intercom
VOICE
Handset, CT Phone
Mobile
Phone
Dial-up Networking Modem
FAX
FAX
Headset
Headset
LAN Access
Router, Gateway
File Transfer
PC, Notebook
Object Push
Handset, PC
Synchronization
PDA, Notebook
Mobile
Phone
Dialup Networking Image
DATA
Mobile
Phone
Generic OBEX Profile
Serial Port Profile
SDP (Service Discovery Profile)
GAP (Generic Access Profile)
Modem
- 13 -
DATA
Bluetooth Qualification
Goal : To ensure interoperability between different Bluetooth devices even from
different vendors
Product
tested
Declaration and
documentation
review
USA
Qualified
products lists
BQA
RF
FCC Part 15
EMC
FCC Part 15
SAR
FCC Part 2
BQB
Manufacturer
Documents pulled
from web side
: 6 Week
Cost
: USD 10k
EUROPE
BQTF
Test report
checked by BQB
Delivery
Qualification
Program Documents
Qualification Program
(Bluetooth Identity)
RF
ETS 300328
EMC
ETS 300826
SAR
ES 59005
Deliverry
: 5 Week
Cost :
: USD 15k
Regulatory Type Approval
(License to sell)
- 14 -
UnPlugFest-4
 DATE: 5 - 9th November 2000 (Sunday - Thursday).
 LOCATION: Bellevue, Washington, U.S.A
(located near Seattle on the North West coast of the USA. Hosted by
Microsoft).
 WHO IS INVITED?
Engineers who meet ALL of the following criteria:
- Are developing Bluetooth components, firmware or software
- Have a unique implementation
- Are able to fix problems with the portion of the product that they are testing
- Are members of the Bluetooth SIG
 THOSE **NOT** INVITED:
- System integrators who are bringing third party products for evaluation
- Marketing Staff
- Observers, Press, Sales Representatives, Students
 HOW WILL TESTING BE CONDUCTED
- Category-1 (RF, BB, LM),
- Category-2 (L2CAP, SDP, RFCOMM, TCS)
- Category-3 (Application profiles).
- 15 -
Bluetooth Software
vCard/vCal
WAE
OBEX
WAP
TCP
IP
PPP
SD Client
Virtual OS Layer
Application
Software
UDP
AT
Commands
SD Server
SCM
TCS BIN
DBM
RFCOMM
L2CAP
Audio
HCI - Host Driver
HCI Transport/Drivers
USB
Serial
PCMCIA
USB
Serial
PCMCIA
HCI
Baseband
Firmware
HCI Transport/Drivers
Host Controller
SSI
Flash Loader
Link Manager
RTOS
LC Driver
Timer Driver
Baseband w/ Link Controller ASIC
Bluetooth RF Module
- 16 -
IRQ Driver
Flash Driver
Future of
Bluetooth
Comparsion with Other Spec.
Major Company
Status
Technology
Power
Symbol Rate
Range
Standard
Topology
Security
Freq HOP
MAC Protocol
Voice
Modulation
Application
Time to Market
Bluetooth
HomeRF
Ericsson, Intel, IBM
Nokia, Toshiba
Microsoft, Intel, IBM
HP, Compact
SIG 1.0b
SWAP 1.11 (‘99.6)
RF 2.4GHz, FHSS
0 ~ 20 dBm
(1mW ~ 100mW)
RF 2.4GHz, FHSS
< 20 dBm
(100mW)
1MS/s
10 m
100m(Optional)
0.8/1.6 MS/s
8 (Piconet),Ponit-to-Multi
Authentication
Encryption
79ch, 1600 hop/sec
Link Management
L2CAP
3Ch, 64kb/ch
CVSD, Log PCM
Mobile Phone
Mobil Computer
11MS/s
Optional
Optional, WEP
79ch, 50 hop/sec
79ch, 2.5hop/sec
Ethernet
Ethernet
?
- 18 -
IEEE 802.11 Rev D10
RF 2.4GHz
FHSS, DSSS, irDA
< 20 dBm
(100mW)
30 m
128
CSMA
Home WLAN
Q3, 2000
Harris,3COM,Lucent
Symbol, Aironet,
50/100 m
128
CSMA
DECT
6Ch, 32Kbps ADPCM
2GFSK
4GFSK
2GFSK
IEEE 802.11
X
FHSS(2GFSK,4GFSK)
DSSS(DBPSK,DQPSK)
WLAN
On Market
IEEE 802.15 WPAN
 Task Group 1 (TG1)
- Bluetooth - IEEE Standards making efforts
- To publish an approved standard early next year
 Task Group 2 (TG2)
- Coexistence between 802.11 and 802.15 Wireless Network
- Target Completion Date : Mar 2001
 Task Group 3 (TG3)
- High Rate Study Group (>20Mbps)
- Target Completion Date : Nov 2001
 MC (Marketing Committee)
 R2SG (Radio 2 Study Group)
 LRSG (WPAN Low Rate Study Group)
- 19 -
Bluetooth Spec 2.0 (Radio 2)
 Improved Mode : 2Mbps
 Higher Rate Mode : 10Mbps
 Fully backward interoperable with Bluetooth Specification 1.0
 To meet cost/power requirements, SIG did not want larger bandwidth application
 Conflict with IEEE 802.15.3 (TG3)
Radio 1
Radio 2
Bluetooth
2.4G, 1Mbps
2.4G, 2~10Mbps
802.15
2.4G, 1Mbps
2.4G, 20Mbps
- 20 -
Radio 3
5G(?), 20Mbps
A/V Profile W/G
 Developed by Philips, Sony, Toshiba, Ericsson and Nokia
 Classes:
 Sound distribution: high quality audio to headphones and speaker sets
 Surround distribution: wireless surround sound systems
 Video distribution: observation camera, video projector
 Video conferencing: 3rd generation mobile phones
 Audio/video control: control signals
 Key aspects: Quality of service and choice of right codecs
 Audio Compression : MP3
 Video Compression : MPEG4
 MPEG1(1.5Mbps) & MPEG2(>5Mbps) will realize in ver2.0 or higher
- 21 -
Automotive W/G
 Accessing the Car
 Portable Device Functionality
 Authorize for Car Access
 Personalized Setting
 Authorize car embedded equipment
 Authorize for Service
 Portable Smart Card
 Portable Phonebook
 Portable Voice Recognition
Automotive
&
Bluetooth
 Vehicle Area LAN Extension
 Public Access Profile
 Authorized Workshop, Gas Station,
etc.
 Anonymous Access
- 22 -
Car Hands Free
 운전중 휴대폰 사용 금지 법제화 추진 ('01년 입법화 예정)
 Headset, Ear Piece의 사용 여부 미결정
 Navigation System, A/V System 등에 장착 예정
Bluetooth
Microphone
Bluetooth
Control Unit
Bluetooth
Interface
Bluetooth
Mobile Phone
Source : Kenwood
- 23 -
Bluetooth
Market Overview
Bluetooth Business Model
 Open, Global Market
 Over 2,000 Company Participate in Bluetooth Business
Nitch
Market
Ericsson
ALPS
Lucent
MACO
Silicon
Vendor
Module
Vendor
Set
Maker
?
Modile Phone
PC Maker
Consumer
etc...
Philips
Infineon
CSR
ATMEL
S/W
Vendor
Bluetooth
S/W Stack
Ver 1.0
SSL
S3
IVT
Extended System
Bluetooth
Qualification
- 25 -
Salutation Con.
Cetecom
7Layer
TUV
Potential Bluetooth Markets
Video
Projectors
Office
Networks
Photo
Printers
Notebooks,
HHPCs
Digital
Cameras
Set Top
Boxes
FAX
Desktop
PCs
Palm
Computers
Cellular/PCS
Home
Networking
Cordless
Phones
Printers
PBX
Headsets
Automotive
Cellular
Source : Cahners In-Stat Group, July 2000
- 26 -
Bluetooth Product Trend
2000
2001
Dongle
Type
Phone
• 핸즈프리
• 명함 교환
BT Module
을 내장
• 데이터 교환
• 3 in 1 Phone
• 인터넷연결
• 화일교환
• WLAN
• 주소록교환
2003
Baseband 기능을 Host Chip
에 내장하고 RF부분만
Module화
• 리모콘
• 전자상거래
본체내 Module 내장
USB Dongle
PCMCIA Card
Notebook
PDA
• 주변기기연결
(Printer,카메라등)
본체내 Module 내장
PC Card
USB Adapter
DesktopPC
• WLAN
• 주소록 교환
휴대폰
전용 H/F
Accessary
&
Etc.
2002
• 주변기기연결
(Printer등,카메라)
차량용/PC용
H/F
가정용
H/F
PSTN Gateway
LAN Access Point
BT적용
RF적용
CNS,A/V
REKES
- 27 -
• 주변기기연결
(마우스,키보드등)
마우스
키보드
가전,게임기
장남감
Bluetooth Worldwide Market Growth
 Europe and Japanese Markets take off faster than in North America.
 Total 1,375Million Unit in 2005
Million Unit
1,375
1400
1200
1000
811.0
800
600
442.4
400
166.7
200
0
0.06 2.49
Industrial & Medical
Automotive
Other/Misc
Output Equipment
Digital Still Camera
Computing
Communications
30.6
1999 2000 2001 2002 2003 2004 2005
Source : Cahners In-Stat Group, July 2000
- 28 -
Top 6 Bluetooth Application
 Digital Mobile Phone's Bluetooth Market grows from 45.6% to 73.2%
 As more products integrate Bluetooth, the percentage of PC Cards/Adapters will
shrink.
Notebook PCs
3.4%
Desktop PCs
6.4%
Cordless
Phones
2.6%
Printer &
Fax
7.0%
Other
2.1%
Notebook PCs PC Cards &
Adapters
3.8%
3.6%
Printer & Fax
4.1%
Other
4.9%
Headsets
4.6%
Desktop PCs
5.9%
Mobile
Phones
45.6%
PC Cards &
Adapters
32.9%
2001 = 31M Units
Mobile
Phones
73.2%
2005 = 1,375M Units
Source : Cahners In-Stat Group, July 2000
- 29 -
Semiconductor Revenue vs. ASP
 Total 6 year CAGR of 256% in revenue
 29% decline in average sales price, from 1999 to 2005
Million US$
US$
6,000
30
5,000
25
4,000
20
3,000
15
Revenue
ASP
2,000
10
1,000
5
0
0
1999 2000 2001 2002 2003 2004 2005
Source : Cahners In-Stat Group, July 2000
- 30 -
Bluetooth Equipment Maker














3Com - Bluetooth Modem Card for Notebook PCs
Acer NeWeb - licensed WIDCOMM's dongle, PCMCIA, CF
Alcatel - OneTouch 500, 700 GSM Phone
Axis Communications - Access Point
Compaq - Psion's PC Cards, USB Dongle
Dell - Psion's PC Cards, USB Dongle
Motorola/Digianswer A/S - PCMCIA, USB Adapter, Car-Kit
Ericsson - T36 GSM Phone, Headset
Handspring - Acer Nweb's Product
IBM - Motorola and TDK's PC Card
Socket Communication - CompactFlash Card
TDK - PC Cards, USB Adapter, CF, LAN Access Point
Toshiba - Note Book PCs
Xircom - PC Cards, USB Dongle, CF
Motorola
Axis
IBM
- 31 -
TDK
Widcomm
Bluetooth
Chipset & Module
Trend
Bluetooth Module & Components
Power
Mgmt
PLL
Clocks
RF
Interface
PLL and
control logic
Transmit
Buffer
1/3, 2/3
FEC
Data
Whitening
2
VCO
CVSD/
PCM
PD
N/A
Prescaler
BB Chip
RF Chip
1/3, 2/3
FEC
Clock
Recovery
Sliding
Correlator
Offset
Canceller
Demod
A/D
(RSSI)
S&H
LNA
Data
in/out
Receive
Buffer
UART
Low IF
Receiver
Link
Controller
PCM
RF Module
Power
Management
ROM
Voice
in/out
Antenna
Band Pass Filter
Substrate (FR-4)
RF Shield
RF Chip
Balun
Crystal
BB Chip
RF Switch
Substrate (LTCC)
Flash Memory
Radio Module
Regulator
Bluetooth Module
- 33 -
Radio IC
 BiCMOS Technology - Low Power Consumption
 Low IF or Direct Conversion
 Qualcomm MSM Interface
 BlueRF Interface
 Vendor
Philips (UAA3558, BiCMOS)
Conexant/Philsar (PH2401, SiGe-BiCMOS)
Siliconwave (SiW015, SOI BiCMOS)
Broadcomm/Innovent (NVT1003, CMOS)
Infineon (PMB6615, BiCMOS)
Lucent (W7020, BiCMOS)
National Semiconductor (LMX3162, BiCMOS)
OKI (ML7050LA, CMOS)
Atmel/TEMIC (T2901, SiGe-BiCMOS)
 Package
TSSOP-38, BGA-48, TQFP-48
- 34 -
Baseband Structure
CPU Core
16~32bit RISC
PORT
LINK
CONTROLLER
EEPROM
or
FLASH
DEBUG I/F
XTAL
SYSTEM
CONTROLLER
UART I/F
TIMER
WATCHDOG
USB I/F
INTERRUPT
CONTROLLER
PCM I/F
HOST
I/F
CVSD
ROM
Amp & SPK
ADC & DAC
-Phone
RAM
RF
MODULE
POWER
MANAGEMENT
RF I/F
- 35 -
VOLTAGE
REGULATOR
Baseband IC
 Processing Power - 3 to 4 MIPS
 ARM7 Core - Ericsson & Philips, Nokia, Xircom, 3Com, Lucent, Atmel
Mitel Semiconductor, Conexant/Philsar, Alcatel Microelectronics
 Other Baseband Core
CSR : 16bit RISC
Broadcom(Innovent) : 8051
Hitachi : H8
National : CR16
Digianswer : DSP
 External Flash Memory for Firmware (2Mbits to 4Mbits)- To reduce risk
Specification is not fixed!
 CMOS Technology - One Chip
 Package - BGA-96, TQFP-100/144, FPBGA-96
 Include Voice Codec
 Full 3 SCO Support
- 36 -
Types of Bluetooth Module
 RADIO ONLY
 Portable phones! Phones contain powerful processors and memory
capable of providing baseband and control functions
 A cost-effective solution is often to provide a module containing only the
radio function
 RADIO + BASEBAND
 ….if phone processor does not have excess capacity to support Bluetooth
TX data formatting and RX synchronization.
 RADIO + BASEBAND + MICROCONTROLLER + MEMORY
 For retrofit upgrade and unhosted applications - headsets, PC cards
 Appropriate to include crystal and voltage regulation also
- 37 -
Bluetooth Module Trend
Low IF, Direct Conversion 기술 적용
SiGe-BiCMOS 기술-저전력화
다양한 형태의 Antenna
Solution등장
CODEC, MP3 기능 내장
다양한 Embedded
Solution
RF
BPF
Ballun
Rx
Ballun
Tx
SW
Baseband
Interface의 표준화
(BlueRF)
PCB내층에 Pattern으로
설계
VCO
X-tal
BPF 2개 사용으로
SW 삭제
Regulator
PA
- 38 -
Flash
Memory
Firmware 안정화에 의한
Baseband내 내장
Host 부분과의 최대한 공
용화로 원가 절감
Bluetooth Module Maker
Maker
Module& PCB Type
RF Chip
BB Chip
Status
Ericsson Components
Full Module/RF Module
(PCB Substrate & LTCC)
Lucent
Philips
출하중
'00/10 ~ 100만개/월
Lucent
RF Module
(LTCC)
Lucent
-
출하중
Ericsson 대응
MACO
(마쯔시다전자부품)
Full Module/RF Module
(ALIVH Substrate)
Philsar
Mitel
'00/6 Sample
'01/Q1 양산
ALPS전기
Full Module
(PCB)
CSR
CSR
'00/5 Sample
'00/12 양산
Taiyo Yuden
Full Module
(?)
Silicon
Wave
Hitachi
'00/Q3 Sample
Murata 제작소
RF Module
(LTCC)
Lucent등
-
출하중
Atmel
Full Module
(PCB)
Temic
Atmel
2000년내 양산
Alcatel
Full Module
(LTCC)
자사 (One Chip)
'01/Q1 양산
JTDC
Full Module
(PCB)
Philsar
Mitel
?
미쯔미전기
Full Module/RF Module
CSR
CSR
'01/Q1 양산
- 39 -
Radio Module
 Substrate : LTCC (Low Temperature CoFired Ceramic)
 Flip-Chip, Wire Bonded
 BGA Packaging
 Target Application : Mobile Phone, Full
Module
Ericsson
Philips
Murata
12 mm
10 mm
(6mm x 8mm)
- 40 -
BlueRFTM
 Standard Interface for RF and Baseband
 Benefits
- SoC designers need not to have expertise in RF design
- SoC vendors will have confidence there will be multiple RF parts
- RF designers will have one design for multiple SoC applications
 Receive Path - RxMode1,2,3
 Transmit Path - One Configuration
 Control Register Interface - JTAG, DBus
 Contact to bluerf@arm.com to get the specification
- 41 -
Useful Web-Site for Bluetooth
 http://www.opengroup.org/bluetooth
 http://www.palowireless.com/bluetooth
 http://developer.axis.com
 http://ne.nikkeibp.co.jp/IEEE1394/bluetoothtop_.html
 http://grouper.ieee.org/groups/802/15/index.html
 http://new.topsitelists.com/bestsites/bluetooth/topsites.html
 http://www.egroups.com/group/bluetooth
 http://www.egroups.com/group/bluetooth-korea
 http://www.bluetooth.or.kr
- 42 -
Conclusion / Q&A
 Who will be win in Bluetooth Business?
 Mobile Phone Air Time Loss
- 3-in-1 Phone, WAP Kiosk etc.
 Real Royalty Free Technology?
Thanks for Listening!
All presentation material will be hosted in
my personal Homepage
http://carpc.co.kr
- 43 -