Experimental Wallboard: R-Value
Validation
Paul Gollnick
Dave Garrett
Will Watson
8/13/07
Overview

Objective

Test 1- Conduction apparatus

Test 2- Tube Test

Test 3- Hot Plate

Recommendations

Conclusion
Objective
1. Wallboard Testing:
The purpose of this series of experiments
was to determine the heat transfer
coefficient and associated R-value for
standard ½” composite wallboard
2. Group:
Our objective was to evaluate the
problems associated with testing and suggest
a more appropriate test method
Test 1: Conduction Apparatus
Set Up #1
Set Up #2
Set Up #1 Data
Power
2.25 W
3.15 W
6.35 W
10.7 W
ED#2
D#2
E.D#1
D#1
E.D#3
D#3
E.D#4
D#4
T1
47.51
45.7
54.1
55.6
84.4
83.96
118.8
120.47
T2
47.09
45.2
53.3
55.2
83.3
82.81
117.2
118.48
T3
46.36
44.5
52.3
54.2
82.4
81.87
115.9
118.48
T7
24.8
24.2
23.6
24.7
25.7
27.29
27.7
29.66
T8
24.8
24.2
23.5
24.6
25.6
27.18
27.4
29.54
T9
24.8
24.2
23.4
24.6
25.6
27.18
27.3
29.54
Temperature with Respect to Power: Experimental Wallboard vs. Standard Wallboard
120
100
Temperature (c)
80
2.5 W E.D
2.5 W D
3.15 W E.D
3.15 W D
6.35 W E.D
60
6.35 W D
10.7 W E.D
10.7 W D
40
20
0
T1
T2
T3
T7
Temperature Probe
T8
T9
Test #1 Analysis
g    (Ts  T )  D 3
Ra D 
 
1/ 6

0.387 Ra D

Nu D  0.6 
9 / 16

1  0.559 / Pr 


h
Nu D  k
D
qconv  h  As (T7  T3 )
qrad  A     (Ts  Tsur )
4
q3  q1  qconv  qrad
k
q3  L
(T3  T7 )
A
4


8 / 27 



2
Test #2 Data
Power
6.2 W
6.2 W
10 W
15.1 W
6.15 W
9.85 W
13.45 W
E.D#1
E.D#2
E.D#3
E.D#4
D#1
D#2
D#3
T1
66.8
68.7
95.5
115.5
76.2
104.5
123.8
T2
66.8
68.3
93.1
115.3
75.1
103.7
124.4
T3
65.5
67.9
92.5
114.1
71.8
99.2
119.2
T7
32.1
34.7
41.9
48.5
30.4
33.4
34.7
T8
31.8
34.4
41.4
47.8
30.2
33
34.2
T9
31.7
34.3
41.2
47.4
30.1
32.8
34.1
Temperature along Heat Path
140
120
100
Temperature (C)
6.2
80
6.2
10
15.1
6.15
60
9.85
13.45
40
20
0
1
2
3
4
Thermocouple location
5
6
Test # 2 Analysis
q3  q1
k
q3  L
(T3  T7 )
A
Test 2: Tube Test
Thermal Conductivity Comparison: ACTR Wallboard vs. Standard
350
300
Temperature (C)
250
200
Standard Hot
Standard Cold
ACTR Hot
ACTR Cold
150
100
50
0
0:00:00
0:15:00
0:30:00
0:45:00
1:00:00
1:15:00
Tim e (m in)
1:30:00
1:45:00
2:00:00
2:15:00
Test 3: Hot Plate
Figure 3: Hot Plate Test Results for Standard Drywall and ACTR Wallboard
80
70
Temperature (C)
60
50
40
30
20
10
0
0:00
0:30
1:00
1:30
2:00
Time (hr:min)
Standard Drywall #1
Standard Drywall #2
Standard Drywall #3
ACTR Wallboard #1
ACTR Wallboard #2
ACTR Wallboard #3
2:30
Hot Plate Analysis
q"  k al (Ti  Tsi )
Tsi  Tso
q" 
L p1 Lx L p 2


k p kx
kp
Recommendations





Perform test #1 run #1 with aluminum foil and or saran
wrap enclosed in duct tape to trap dead air space as an
insulator
When running test #1 use lube to eliminate contact
resistance
Consider the time it takes to reach steady state, not just
what happens at steady state
Make boxes of the material and fill them with ice to test
which one lasts longest
Try different thicknesses of the material and run it
without the paper
Conclusion

Objective

Test 1- Conduction apparatus

Test 2- Tube Test

Test 3- Hot Plate

Recommendations

Conclusion