AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC
COMPATIBILITY OF INTEGRATED CIRCUITS
Etienne SICARD
INSA/DGEI
University of Toulouse
31077 Toulouse - France
Etienne.sicard@insa-toulouse.fr
Alexandre BOYER
INSA/DGEI
University of Toulouse
31077 Toulouse - France
Alexandre.boyer@insa-toulouse.fr
1
SUMMARY
1. CONTEXT
2. EDUCATIONAL NEEDS
3. STANDARDS
4. WHAT IS IC-EMC
5. EXAMPLE
6. EVALUATION
7. CONCLUSION
2
CONTEXT
EMC – ONE ACRONYM, TWO CONCEPTS
Susceptibility to EM waves
Carbon airplane
Emission of EM waves
Equipements
Personnal
interferences
Boards
Safety systems
Radar
Components
Hardware fault
Software failure
Function Loss
3
CONTEXT
TRENDS – INCREASED PARASITIC EMISSION
Increased complexity, IOs number, operating frequencies, transient current
Technology
180nm
130nm
90nm
45nm
50M
100M
250M
500M
2002
2004
2006
2008
Core
Core+
DSP
Core DSPs
eMem
3A
10 A
32nm
Complexity
1G
Packaging
Embedded blocks
transient current
1A
2010
Multicore,
DSPs, FPGA,
RF multiband
Memories
Sensor
Multicore, Multi
DSP Reconf FPGA,
Multi RF
Memories
Sensors
30 A
100 A
4
CONTEXT
TRENDS - INCREASED SUSCEPTIBILITY
Less voltage margin
150 mV
margin
Supply (V)
5.0
3.3
I/O supply
2.5
Core supply
1.8
1.2
0.7
0.5µ
0.35µ
0.18µ
90nm
Technology
65nm
45nm
32nm
5
CONTEXT
PACKAGES AS ANTENNAS
Package dimensions are close to lambda/4
at GHz range
EMC
Issues
6
CONTEXT
EMC VALIDATED BEFORE FABRICATION
What IC designers and EMC experts are
dreaming of…
DESIGN
Tools
This work Training
Design Guidelines
Architectural
Design
Design Entry
Design Architect
EMC Simulations
Compliance ?
FABRICATION
NO GO
GO
EMC compliant
7
EDUCATIONNAL NEEDS
EMC TRAINING AT IC LEVEL – HOW TO START?
A nightmare?
8
EDUCATIONNAL NEEDS
EMC TRAINING AT IC LEVEL – HOW TO START?
A nightmare?
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 j Zw
r
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
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i(x,t)
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9
EDUCATIONNAL NEEDS
THINGS WE NEED TO DO
• Illustrate technology scale down
– Complexity
– Current switching
– Impact on EMC
• Illustrate package role and
complexity
• Simulate simple models with simple
simulator (SPICE-like)
3D real-time view in Microwind
• Post-process in Freq. domain for
Spectrum comparison
• “see” E, H fields from currents and
voltage
• Investigate “what if” with students
IBIS 3D viewer in Microwind
10
EDUCATIONNAL NEEDS
OUR PROPOSAL – KEY FACTS
• Give key facts about technology impact on EMC
• Introduce standard measurement methods
• Simulate first order effects using standard model
approaches
• Give the basics of
– emission prediction
– immunity simulation
• Give simple design rules for improved design
• Address both
– Undergraduate, graduate students
– Engineers in companies
• Leave plenty of space for exercises and real-case
problem solving
• Fit the course in a one or two days format (cost, duration)
11
EDUCATIONNAL NEEDS
OUR PROPOSAL – COURSE OUTLINES
• Overview (EMC-IC for
managers)
• Basic concepts
• Measurement methods
• Guidelines for improved
EMC
• Case study
• EMC models
• Chip-chip coupling
12
STANDARDS
EMISSION MEASUREMENT METHODS
International Standards IEC 61967
IEC 61967-2
IEC 61967-3/6
IEC 61967-4
(TEM : 1GHz)
(Near field scan, 5GHz)
(1/150 ohm, 1 GHz)
Most usual
conducted method
Most usual
radiated method
IEC 61967-5
IEC 61967-7
IEC 61967-2
(WBFC, 1 GHz)
(Mode Stirred Chamber:
18 GHz)
(GTEM 18 GHz)
www.iec.ch
13
STANDARDS
IMMUNITY MEASUREMENT METHODS
International Standards IEC 62 132
IEC 62132-3
IEC 62132-4
IEC 62132-2
(Bulk Current Injection :
1 GHz)
(Direct Power Inj 1GHz)
(TEM/GTEM)
Most usual
radiated method
Most usual
conducted method
www.iec.ch
IEC 62132-5
New proposal:
Still research:
(WBFC 1 GHz)
(LIHA : 10 GHz)
(NFS 10 GHz)
14
STANDARDS
MODEL APPROACHES
International Standard IEC 62 433
1. ICEM-CE - Conducted RF emission
2. ICEM-RE - Radiated RF emission
www.iec.ch
4. ICIM-CI - Conducted RF immunity
4. ICIM-RI - Radiated RF immunity
15
WHAT IS IC-EMC
IC-EMC - A TOOL FOR EMC PREDICTION

A schematic editor to enter macro-models

An interface to WinSpice analog simulator

A post-processor to compare simulated with measured
spectrum

An Electromagnetic solver to simulate radiated field

Freeware, online, 250 pp documentation, 15 case studies
16
WHAT IS IC-EMC
SCHEMATIC EDITOR
SPICE compatible
Key tools
Main analysis Immunity
Smith
Spectrum
Chart
analysis
simulation
IC, package and PCB model Near-field
IBIS
Impedance
interface
simulation Basic
simulation
symbols
17
EXAMPLE
CONDUCTED EMISSION
Emission prediction approach
Simulation
Measurements
IEC 62 433
Core
Model
Package
Model
Probe
Model
Test board
Model
Analog Time Domain Simulation
Frequency
measurements
IEC 61 967
Fourier Transform
Time-domain
measure
Fourier Transform
Compare dBµV vs. Frequency
18
EXAMPLE
CONDUCTED EMISSION
Emission spectrum analysis
Probe
Model
Test board
Model
Conversion to
Win-SPICE
Analog Time-Domain
Simulation
Package
Model
Fourier
Transform
Core
Model
dB vs Freq (log)
conversion
19
EXAMPLE
CONDUCTED EMISSION
Emission spectrum analysis
Frequency
measurements
Compare dBµV
vs. Frequency
What if?
• Effect of decoupling
• Effect of package
supply pairs
• Effect of current
reduction
• …
20
EVALUATION
AUDIENCE
Since 2002, more than 20 sessions involving 300 students and
engineers have been organized
– ISEN France
– ENSME France
– On-Semiconductors
– NOKIA
– APEMC Beijing
One-day or two-days format.
The majority of students said
– They understood the mechanisms of parasitic emission and
susceptibility
– They felt confident in their ability to handle EMC at IC level
21
EVALUATION
QUESTIONS
#
Question
1
I appreciated the contents of the training.
2
The level of the training is in accordance with my expectations.
3
The balance between theory and practice was acceptable
4
The contents was adapted to life-long learning.
5
I appreciated the documents given in the training.
6
I appreciated the way the training was taught
7
The contents is clearly related to my work/studies.
8
I may use the contents directly in my activities
9
The lecturer followed the initial planning
10
Overall I was satisfied with the quality of this course.
22
EVALUATION
7. The contents is clearly related to
my work/studies.
RESULTS
8. I may use the contents directly in
my activities
Answers to questionnaire
70%
% response
60%
50%
40%
30%
20%
10%
0%
1
2
3
4
5
6
7
8
9
10
Evaluation item #
Strongly agree
Agree
Neutral
Disagree
Strongly disagree
23
CONCLUSION

An environment for EMC prediction at IC level and trainings has been
developed

The tool is free and is based on measurement and model standards

Trainings help students and engineers to understand the mechanisms of
parasitic emission and susceptibility

As little theory as possible

As much practice and examples as possible

Positive feedback from trainees concerning the tool usage for the illustration of
EMC concepts (80 – 90 % satisfaction rate)
24
REFERENCES
•
•
•
•
E. Sicard, A. Boyer, “IC-EMC v.2 User's Manual”
ISBN 978-2-87649-056-7, July 2009, 320 pages,
INSA Editor
C. Dupoux, S. Akue Boulingui, E. Sicard, S.
Baffreau, N. Bouvier, "Measurement and
Simulation of Electromagnetic Interference in 3G
Mobile Components“, EMC Compo 2009,
November 2009, Toulouse, France.
S. Akue Boulingui, C. Dupoux, S. Baffreau, E.
Sicard, N. Bouvier, B. Vrignon, "An Innovative
Methodology for Evaluating Multi-Chip EMC in
Advanced 3G Mobile Platforms", IEEE
Symposium on EMC, 2009, Austin, USA.
S. Bendhia, M. Ramdani, E. Sicard,
Electromagnetic Compatibility of Integrated
Circuits, book published by Springer, USA, 2006,
0-387-26600-3
The tool, manual and course
slides are online at
www.ic-emc.org
25
THANK YOU FOR YOUR ATTENTION
26