Teaching Plan
PUSAT PENGAJIAN KEJURUTERAAN MIKROELEKTRONIK
UNIVERSITI MALAYSIA PERLIS (UniMAP)
MEMS DESIGN AND FABRICATION
EMT 432
SEMESTER 1
SESSION 2008/2009
COURSE OUTCOMES
At the end of the course, student will be:
1. In depth understanding of MEMS fabrication techniques and technology
2. Able to identify and solve problems/challenges associated with MEMS technology
3. Demonstrate knowledge and theories of semiconductor device and process technology
4. Able to produce MEMS Design and products
SYNOPSIS
This course focuses on the basics of MEMS and process technology involved in the fabrication of
Integrated Circuits (ICs).
Topics covered are divided into 4 parts as follow;
Part I: a) MEMS Overview
i)
MEMS Technologies
ii)
Major markets
b) MEMS Fabrication Technology
i)
MEMS Fabrication
ii)
Advantages of MEMS Manufacturing
iii)
MEMS current challenges
iv)
Packaging
v)
Fabrication – Deposition, Lithography and Etching processes
Part II: a) MEMS Design, Simulation and Layout
b) Electronic Interfaces, Packaging and Testing
i)
Design challenges
ii)
Scaling effect of miniaturization
c) MEMS Devices and Applications
i)
MEMS Application
ii)
Bio-Technology
iii)
Communication
iv)
Accelorometer
v)
Optical/RF components
Part III: Semiconductor Fundamentals and Basic Materials
a) Basics of Semiconductors
b) Semiconductor Materials
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c) Silicon Process Technology
Part IV: Wafer Processing
a) Wafer Cleaning
b) Ion Implantation
c) Thermal Processes
d) Lithography
e) Etching
f) Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD)
g) Chemical Mechanical Polishing (CMP)
h) Metalization
REFERENCES
i)
ii)
Chang Liu, Foundation of MEMS, Pearson International.
Hong Xiao, Introduction to Semiconductor Manufacturing Technology, Prentice Hall,
2001
ASSESSMENT
(i) Peperiksaan akhir semester/ Final examination: 50%
(ii) Kerja kursus/course work:
50%
(iii) Perincian sumbangan kerja kursus/details of course work contribution: (Sila perincikan satu
persatu dengan peratusan setiap satu sumbangan)
Lab:
Mini Project:
Theory Tests:
Quiz/Assignment:
20%
10%
15%
5%
StudyWeek
Course Content
Delivery
Mode
Level of
Complexity
Psbl.
Asmt.
1
MEMS Overview
Lecture;
Knowledge
a, e, f
Lecture;
Knowledge
Synthesis
a, e, f
Lecture;
Lab;
Tutorial;
Knowledge
Repetition
Synthesis
Application
a, b,
c, e, f
Lecture;
Lab;
Tutorial;
Knowledge
Repetition
Synthesis
a, b,
c, e, f
MEMS technology and product overview, major market. Basic
MEMS
applications
and
operations.
Introduction
to
micromachining process technology: bulk, surface and LIGA
processes. Microsystems vs microelectronics. Miniaturization
considerations.
2
MEMS Micromachining Technology
Bulk micromanufacturing, surface micromachining and LIGA
process technology.
3
Essential Electrical and Mechanical Concepts in MEMS
Analysis of Stress, Strain and Stress-Strain Relationship,
Measurement of Strain, Boundary conditions
4
MEMS Design: Electrical & Thermal Analysis
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Application
Electrostatic actuation, Thermal heat transfer; Conduction,
Convection and Radiation.
5
Piezoresistive sensor & Optoelectronics MEMS
Lecture;
Lab;
Knowledge
Repetition
Synthesis
a, e, f
Lecture;
Lab;
Knowledge
Repetition
Synthesis
a, e, f
Lecture
Knowledge
Repetition
Evaluation
a, e, f
Lecture
Knowledge
Repetition
Evaluation
a, e, f
Lecture;
Lab;
Knowledge
Repetition
Synthesis
a, e, f
Lecture;
Lab;
Knowledge
Repetition
Synthesis
a, e, f
Lecture;
Lab;
Knowledge
Repetition
Synthesis
a, e, f
Piezoresistive sensor, Wheastone bridge, Analysis of stress and
strain on Piezoresistive sensor, Optoelectronics MEMS devices
6
Introduction to Semiconductor Process Technology
Overview of silicon process. Wafer preparation, single crystal
silicon growth, front-end and backend process technology.
MEMS product testing and packaging technology.
Typical CMOS process flow.
Cleanroom protocols, Defect and Yield
Test 1: 14th August 2008
7
Basics of Semiconductor Physics
Semiconductor materials, crystal properties of solids. Energy
bands and carriers concentration in thermal equilibrium,
quantum mechanics and mechanics statistics. The formation of
energy bands and electron conduction in solids.
Electron and hole concentrations, resistivity and conductivity,
mobility and Hall Effect. Carrier transport mechanism in solids.
8
CUTI PERTENGAHAN SEMESTER/MID SEMESTER BREAK
9
Basics of Semiconductor Physics contd.
Electron and hole concentrations, resistivity and conductivity,
mobility and Hall Effect. Carrier transport mechanism in solids.
10
Thermal Processes
Oxidation mechanics, Deal-Groove Model. Application of
oxidation process, LOCOS isolation, diffusion barrier etc.
Factors for oxidation rate, dry vs wet, oxidation process steps,
RTP and other oxidation techniques. Oxide measurement.
11
Thermal Processes contd.
Diffusion process and thermal budget. Diffusion process
applications and characterization (four point probe).
Annealing, reflow and alloying processes, appilications.
Wafer clean technology
Thermal processes hardware overview.
12
Lithography Process
Photolithography systems and process requirements. Photoresist
requirement and technology. Basic steps in photolithography,
Photoresist coating, alignment and exposure, photoresist
development. Process characterization, spin speed vs spin rate
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and viscosity, projection system and process control. Future
trend.
13
Etch Process
Lecture;
Lab;
Knowledge
Repetition
Synthesis
a, e, f
Lecture;
Lab;
Knowledge
Repetition
Synthesis
a, e, f
Etch process terminology, wet etch technology, dry etch
technology, plasma vs RIE etch, etch applications.
Process control and characterization. Hardware overview.
Test 2: 16th October 2008
14
Thin Film Deposition
CVD process; dielectric thin film applications, physics of CVD
process, PECVD, APCVD and LPCVD, CVD systems
overview. CVD pre-cursor (Silane vs TEOS based films), CVD
process characterization and control.
PVD process; thin film conductor applications, evaporation vs
CVD vs PVD, overview on the PVD systems.
15
16-17
MINGGU ULANGKAJI / REVISION WEEK
PEPERIKSAAN AKHIR SEMESTER / FINAL
EXAMINATION
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