GBN(GROUND BOUNCE NOISE) TO MITIGATION
USING UNIPLANAR COMPACT EBG STRUCTURE
WITH MEANDERED BRIDGE FOR UWB
APPLICATIONS
*
B Dinesh raja, k Vasudevan
Department Electronics and Communication Engineering,Thiagarajar College of Engineering
Madurai – 625 015
1dineshrajameece@gmail.com
2kvasudevan@tce.edu
Abstract— The main goal of this paper is to suppressed Ground bounce
noise in ultra wide band(UWB). A modified uniplanar compact
EBG(Electro magnetic band-gap) structure which integrates meandered
bridged EBG structure with slits is proposed for UWB(Ultra wide
band).Bandwidth to cover from 450 MHz to 10 GHz at -40 db isolations
and also lower edge ot the bandgap is shifted towards the lower
freqency.Existing uniplanar compact EBG is modified to improve
isolation level, bridges are replaced with meander lines, are followed to
improve isolation over band gap is simulated . Simulation work done in
CST Microwave studio and analyze in frequency domain solver And Plot
the results of s21 parameter
Keywords— EBG( Electro magnetic bandgap),bandwidth,GBN
(Ground bounce noise),Ultra wide band(UWB)
I. INTRODUCTION
In recent years current packaging technologies, data, video,
voice sensing and other function modules such as digital,
analog, RF, memory devices, sensors, etc. are required to be
integrated into one package known as “system on package “or
“system in package,” which are used more widely in cell
phones and other communication systems . The forthcoming
generation of processors will have several parts of chipsets
integrated in the same package thus resulting in complex
integrated circuits.GROUND bounce noise[1] (GBN) on the
power/ground planes is becoming one of the major concerns
for the high-speed digital computer systems due to fast edge
rates, using high clock frequencies, and low voltage levels.
Because of the parallel-plate waveguide structure between
power and ground planes in the high-speed packages, the
resonance modes of the parallel-plate waveguide can be
excited by the GBN. The resonance noise propagating
between the power and ground planes not only causes signal
integrity (SI) problems for the circuits , but also results in
significant radiation or electromagnetic interference (EMI)
issues.[2]
Simultaneous switching noise (SSN)[3], also known as ground
bounce noise[1], or delta-I noise, on the power/ground buses
have become one of the major concerns during the design
because of high-speed digital communication systems with
even faster edge rates, lower voltage levels, and higher
integrations.In the current scenario, PCB design level it’s
major bottleneck for designers to mitigate noise in power
plane resonance while suppressing the propagation of waves
generated noise by the switching devices .Many Methods
introduced in past works, in order to eliminate ground bounce
noise, all try to reduce the resonance effects of the cavity-like
structure. The most widely used and effective of them include
the use of decoupling capacitors[4] , and capacitors , the use
of dissipative and lossy components along the PCB and at its
edges , dividing power planes in power islands , and via
stitching[5]
The use of decoupling capacitors is the most wide
spread method and it consists of placing large capacitors
around the sources of noise to disrupt high-frequency
fluctuations on the power planes by creating a low-impedance
path between the planes at these frequency. Other methods try
to overcome this frequency limitation, in one way or another.
Embedded capacitors and capacitances try to minimize the
length of the problematic leads. Power islanding is also widely
used, but its applicability is limited to applications in which
isolation is the goal such that the source of noise and the
susceptible components are kept on different power islands.
EBG is one of the most promising solution to
suppressed noise in mixed signal circuits. Earlier
days Mushroom structure[6] are first proposed.
this structure is specially designed via is
inserted between power and ground planes, which
make the fabrication cost is more effective. Later
many planar structure is designed because of cost
effective and fabrications cost is less. EBG
planar structures proposed over the past few years have
inherent features that make them important in EMI
applications in mixed signal circuits.It’s create High
Impedance surface(HIS).This is primarily due to the fact that
EBG structures suppress the propagation of surface waves
over a specific frequency band that directly depends on the
dimensions and type of the constitutive elements within the
EBG structures
This paper proposed a novel structure to widen the band gap
of EBG by introducing Meandered bridge instead of Lshaped bridges proposed in [7] and This paper compared the
results of existing uniplanar compact EBG structure and
modified structure The meandered bridge will reduce the
lower edge of the bandgap to attain wide isolation bandwidth
of the proposed structure.
patch.The substrate dielectric is FR4 with a relative
permittivity of 4.4 and a loss tangent of 0.02. The thickness of
the substrate is 0.4mm and Metal conductor is PEC(Perfect
electric conductor)
with thickness is 0.017mm and
corresponding parameters is Length and width(a) =29.6 mm
Width of the meandered bridges(w1) =0.2mm,Length of the
slit is(L) =7.25mm ,Width of the slit(W)=1.0mm,Gap between
the two meandered lines(g)=0.75mm,Slit length(S)=4mm
II. DESIGN OF MEANDERED EBG STRUCTURE WITH SLITS(MBS)
A . Electromagnetic band gap (EBG)
The EBG structure is behaves as distinctive properties in
Microwave application
and arranged in periodic
structures(some cases as non-periodic), that materials may
have not found in nature and Engineered made it artificially
and altered the surface properties of the structure, EBG
structure otherwise called as FSS(frequency selective
surface),AMC(Artificial magnetic conductor) or HIS(high
impedance surface ),PBG(photonic band gap structure).The
properties of This structure is to restricts the propagation of
electromagnetic waves in a forbidden band. Fig 1(a) shows in
side view of EBG structure
Fig 1(b) Unit cell of meandered bridge EBG with slits and dimensions
Fig 1(a) Side view of EBG Structure
B. Design concept
The proposed EBG structure is a two-dimensional (2-D)
structure, and consisting of a metal patch with four connecting
meandered bridges, it can be realized with metal patches
connected by meandered bridges to form a distributed LC
network (where L is inductance and C is capacitance).The unit
cell of this EBG structure is shown in Fig 1(b)
The meandered bridges connecting the neighbouring unit cells
will influence the inductance, while the patch and the gap
between two neighbouring unit cells will induce the
capacitance. Therefore, a higher inductance from effective
increased meandered bridges will lead to more efficient lower
edge. Meandered bridge EBG structure with slits(MBS) is
proposed .It’s not only improve the inductance value but also
supressed the noise at lower frequency. Dimensions of the
slits and meandered bridges as properly designed to supressed
the ground bounce noise in UWB Applications
III. ULTRA WIDEBAND SUPPRESSIONS
We considered a two layer PCB with dimensions of
64×64mm in 2×2 cells as shown in fig 1(b).The unit cell of
the EBG as shown in fig 1(a). A power plane consists of one
square patch with four narrow slits inserted at the boundary of
the patch, and four meandered bridges on each side of the
Fig 1(b) Modified Uniplanar compact EBG structure with meandered
bridges and slits(MBS), Showing the location of the ports for s21 measurement
Cases
Parameter
Reference board
L-Bridgedwith
slits
Proposed(MB-EBG)
-40 db suppressions
Frequency
Bandwidth
none
750Mhz
to 10Ghz
450Mhz
to 10Ghz
none
9.250Ghz
9.550Ghz
Centre
frequency at
5Ghz
Isolation
level
-30db
-60db
thickness is 0.017mm and corresponding parameters is
Length and width(a) =29.6 mm Width of the L bridges(w1)
=0.2mm,Length of the slit is(L) =7.25mm ,Width of the
slit(W)=1.0mm,Gap
between
the
two
bridges
lines(g)=0.75mm,Slit length(S)=4mm
TABLE I
-110db
SUPPRESSED BEHAVIOR BETWEEN PORT 1 AND PORT 2 COMPARISON
Fig 2(a) simulation s21 of the proposed meandered bridge EBG Structure
with slits(MBS)
Fig 2(a) and Table I Shows comparison results of suppressed
behaviour between port 1 and port 2. The reference board
provides isolation of -30 dB over 1GHZ to 10GHZ and
produces Unwanted anti-resonance, which is induced by
GBN(Ground bounce noise) in PCB board circuits. The
proposed MB-EBG( Meandered bridge) structure provides a
bandgap of 450MHZ to 10 GHZ beyond for satisfied UWB
applications and also suppressed the anti resonance which is
provided by the reference board. By introducing of meandered
bridge, the lower edge of the band gap is shifted towards the
lower frequency.the proposed MBS-EBG structure provide a
wide band gap compared to conventional L-EBG structure
An ultra wideband supressions is observed at starts from
750mhz to 10 GHz. A proposed MBS-EBG power plane can
suppress the GBN from lower frequency (450 MHz)to higher
frequency (10 GHz), which can cover the whole UWB
IV. CONCLUSIONS
Fig 2(b) Comparison between L –bridged with slits(LBS) and proposed
structure MBS-EBG structure
In this paper, an efficient method for noise suppression of
Ground bounce noise in UWB Applications using a Modified
uniplanar compact EBG structure is designed in the chosen
commercial software tools CST Microwave Studio
to
suppressed Ground bounce noise in ultra wide band(UWB)
applications at frequency starts from 750MHZ to
10GHZ,isolation level below -40db is noted. By using
meandered bridges in uniplanar compact EBG structure to
improve good isolation level is observed at below -40db is
observed and bandwidth covered from 450 MHZ to 10GHZ
beyond.
.
REFERENCES
Fig. 2(a) shows the simulated for the designed MBS-EBG
power/ground planes. An ultra-wideband suppression is
observed starting at approximately 450 MHz and extending to
10 GHz. The definition of bandwidth adopted here is the
continuous frequency range over which S21 is lower than -40
dB.Compare with conventional UC(uniplanar compact)-EBG
which has the same subtrates and 2 × 2 cells The substrate
dielectric is FR4 with a relative permittivity of 4.4 and a loss
tangent of 0.02. The thickness of the substrate is 0.4mm and
Metal conductor is PEC(Perfect electric conductor) with
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