K.M.B. Jansen
Address: Delft University of Technology
Faculty of Industrial Design Engineering
Section Product Engineering
Landbergstraat 15
2628 CE DELFT
The Netherlands
Room number: B-3.070
Telephone:
E-mail:
+31 (0)15-27 86905 k.m.b.jansen@tudelft.nl
…………………
NB: Links are included only for the older papers which are more difficult to obtain in electronic format
1. Jansen KMB, vanDam J, “An analytical solution for temperature profiles during injection molding, including dissipation effects”, Rheol Acta 31, pp. 592-602, 1992 ..\Word docs\Papers\old papers KMB\RA94jan temperature profiles.pdf
2. Jansen KMB , “Residual stresses in quenched and injection-molded products”, International
Polymer Processing 9, pp.82-89, 1994 ..\Word docs\Papers\old papers KMB\IPP94jan residual stress.pdf
3. Jansen KMB, Flaman AAM, “Construction of fast-response heating elements for injection molding applications”, Polym Eng Sci 34, pp.894-897, 1994 ..\Word docs\Papers\old papers
KMB\PES94jan heating elements.pdf
4. Jansen KMB, Flaman AAM, “The influence of surface heating on the birefringence distribution in injectionmolded parts”, Polym Eng Sci 34, pp.898-904, 1994 ..\Word docs\Papers\old papers KMB\PES94jan birefringence.pdf
5. Jansen KMB , “Analytical approximation of degradation profiles in polymer products” , Polym
Eng Sci 34, pp.1619-1627, 1994 ..\Word docs\Papers\old papers KMB\PES94jan degradation profiles.pdf
6. Jansen KMB , “Heat-transfer in injection molding systems with insulation layers and heating elements”, Intern J Heat Mass Transfer 38, pp.309-316, 1995
7. Jansen KMB, Titomanlio G , “Effect of pressure history on shrinkage and residual stresses -
Injection molding with constrained shrinkage ”, Polym Eng Sci 36, pp.2029-2040, 1996 ..\Word docs\Papers\old papers KMB\PES96jan pressure history.pdf

8. Titomanlio G, Jansen KMB , “In-mold shrinkage and stress prediction in injection molding”,
Polym Eng Sci 36, pp.2041-2049, 1996 ..\Word docs\Papers\old papers KMB\PES96tit inmold shrinkage.pdf
9. Jansen KMB , “Effect of pressure on electrical resistance strain gages”, Experim Mechanics
37, pp245-249, 1997 ..\Word docs\Papers\old papers KMB\EM96jan strain gages.pdf
10. Pantani R, Jansen KMB, Titomanlio G, “In-mould shrinkage measurements of PS samples with strain gages”, International Polym Processing 12, pp.396-402, 1997
11. Jansen KMB, Pantani R, Titomanlio G , “As-molded shrinkage measurements on polystyrene injection molded products ”, Polym Eng Sci 38, pp.254-264, 1998 ..\Word docs\Papers\old papers KMB\PES98jan as-molded shrinkage.pdf
12. Jansen KMB, Van Dijk DJ, Husselman MH, “Effect of processing conditions on shrinkage in injection molding”, Polym Eng Sci 38, pp.838-846, 1998 ..\Word docs\Papers\old papers
KMB\PES98jan shrinkage.pdf
13. Jansen KMB, van Dijk DJ, Bu rgers EV, “Experimental validation of shrinkage predictions for injection molded products ”, International Polym Processing 13, pp.99-104, 1998 ..\Word docs\Papers\old papers KMB\IPP98jan validation.pdf
14. Jansen KMB, Van Dijk DJ, Freriksen MJA, “Shrinkage anisotropy in fiber reinforced injection molded products ”, Polym Composites 19, 325-334, 1998 ..\Word docs\Papers\old papers
KMB\PC98jan shrinkage + fibres.pdf
15. Jansen KMB , “Measurement and prediction of anisotropy in injection moulded PP products”,
International Polym Processing 13, pp.309-317, 1998 ..\Word docs\Papers\old papers
KMB\IPP98jan PP shrinkage.pdf
16. Jansen KMB, van Dijk DJ, Keizer KP, “Warpage of injection moulded plates and corner products ”, International Polym Processing 13, pp.417-424, 1998 ..\Word docs\Papers\old papers KMB\IPP98jan warpage.pdf
17. Jansen KMB, Orij JJW, Meijer CZ, et al., “Comparison of residual stress predictions and measurements using excimer laser layer removal ”, Polym Eng Sci 39, pp.2030-2041,
1999 H:\Word docs\Papers\old papers KMB\PES99Jan residual stress.pdf
Fast response heater
18. Jansen KMB, Agterof WGM, Mellema J, “Droplet breakup in concentrated emulsions”, J
Rheol 45, pp.227-236, 2001
19. Jansen KMB, Agterof WGM, Mellema J, “Viscosity of surfactant stabilized emulsions”, J
Rheol 45, pp.1359-1371, 2001

20. LJ Ernst, KMB Jansen, G.Q Zhang, R Bressers, “Time and Temperature Dependent Thermo-
Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging
Process Stresses”, ASME Journal of Electronic Packaging, Transactions of ASME 125, 2003, pp. 539-548
21. DG Yang , KMB. Jansen, LG Wang, L. Ernst, GQ Zhang, HJL Bressers, "Micromechanical
Modeling of Stress Evolution Induced During Cure in a Particle-filled Electronic Packaging
Polymer", IEEE Transactions on Components and Packaging Technologies 27, p.676-683,
2004
22. K.M.B. Jansen , V. Gonda, L.J. Ernst, H.J.L. Bressers, G.Q. Zhang , “The State-of-the-Art of
Thermo-Mechanical Characterization of thin Polymer Films ", J Electronic Packaging 127, pp.530-536, 2005
23. K.M.B. Jansen, H.J.L. Bressers, L.J. Ernst, Effect of resin formulation on thermoset viscoelasticity, “Journal of Engineering Materials and Technology” 128, 478-483, 2006
24. M.H.H. Meuwissen, H.A. de Boer, H.L.A.H. Steijvers, K.M.B. Jansen, P.J.G. Schreurs, M.G.D.
Geers, “Prediction of mechanical stresses induced by microelectronic packaging materials during cure”, J. of Adhesion and Adhesives 26, 212-225, 2006
25. L.J. Ernst, K.M.B. Jansen, D.G. Yang, C. van ’t Hof, H.J.L. Bressers, G.Q. Zhang, Polymer
Materials Characterization, Modeling and Application, in "Micro- and Opto-Electronic
Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging", edited by E.
Suhir, C.P. Wong, Y.C. Lee, 2007
26. van Soestbergen M, Ernst LJ, Jansen KMB, et al., Measuring the through-plane elastic modulus of thin polymer films in situ , Microelectronics Reliability 47 (12): 1983-1988, 2007
27. Yang DG, Jansen KMB, Ernst LJ, et al., Effect of filler concentration of rubbery shear and bulk modulus of molding compounds , Microelectronics Reliability 47 (2-3): 233-239, 2007
28. van't Hof C, Jansen KMB, Wisse G, et al., Novel shear tools for viscoelastic characterization of packaging polymers, Microelectronics Reliability 47 (2-3): 240-247 FEB-MAR 2007
29. Gonda V, Jansen KMB, Ernst LJ, den Toonder J, Zhang GQ, Micro-mechanical testing of
SiLK by nanoindentation and substrate curvature techniques, Microelectronics Reliability 47
(2-3): 248-251, 2007
30. Bressers HJL, van Driel WD, Jansen KMB, Ernst LJ, Zhang GQ, Correlation between chemistry of polymer building blocks and Microelectronics Reliability, Microelectronics
Reliability 47 (2-3): 290-294, 2007
31. Yang DG, Jansen KMB, Ernst LJ, et al., Numerical modeling of warpage induced in QFN array molding process, Microelectronics Reliability 47 (2-3): 310-318, 2007
32. X. Ma, K.M.B. Jansen, L.J. Ernst, W.D. van Driel, O. van der Sluis, G.Q.Zhang,
Characterization of moisture properties of polymers for IC packaging, Microelectronics
Reliability 47, p.1685-1689, 2007
33. Falat T, Wymyslowski A, Kolbe J, Jansen KMB and Ernst LJ, Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach , Microelectronics Reliability
47 (12): 1989-1996, 2007

34. Wang, L; Xiao, A; Jansen, KMB, et al., Mechanical reliability of a segmented silicon layer on ultra-thin polyimide substrates, Progress in Fracture and Strength of Materials and Structures
1-4, Vol353-358, pp.2529-2532, 2007
35. JS Nakka, K.M.B Jansen, L.J. Ernst, W.F.Jager, Effect of the epoxy resin chemistry on the viscoelasticity of its cured product, J. Appl. Polymer Sci. 108, 1414-1420, 2008
36. Gui, DY; Ernst, LJ; Jansen, KMB, Yang DG, Goumans L, Bressers HJL, Janssen JHJ, Effects of molding pressure on the warpage and the viscoelasticities of HVQFN packages, J. Appl.
Polymer Sci. 109, pp.2016-2022, 2008
37. K.M.B. Jansen, C. Qian, L.J. Ernst, C. Bohm, A. Kessler, H. Preu, M. Stecher, Modeling and characterization of molding compound properties during cure, Microelectronis Reliability 49, pp.872-876, Aug 2009
38. Regard C, Gautier C, Fremont H, Poirier P, Ma X, Jansen KMB, Fast reliability qualification of
SiP products, Microelectronis Reliability 49, pp.958-962, Sep-Nov 2009
39. G. Perfetti , K.M.B. Jansen , H. Wildeboer,G. Meesters, P van Hee, Characterization of physical and viscoelastic properties of polymer films for coating applications under different temperature of drying and storage, Intern J Pharmaceutics 384, pp.109-119, 2010
40. X.S. Ma, K.M.B. Jansen, G.Q. Zhang, A fast moisture sensitivity level qualification method,
Microelectronics Reliability 50, pp.1654-1660 (2010)
41. M. van Soestbergen, A. Mavinkrurve, R.T.H. Rongen, K.M.B. Jansen, L.J. Ernst and G.Q.
Zhang, Theory of aluminum metallization corrosion in microelectronics, Electrochimica Acta
55 (2010) 5459-5469
42. J. de Vreugd, K.M.B. Jansen, L.J. Ernst, C. Bohm, Prediction of cure induced warpage of micro-electronic products, Microelectronics Reliability, Volume 50, Issue 7, July 2010, Pages
910-916
43. van Soestbergen M, Mavinkurve A, Rongen RTH, Jansen KMB, Ernst LJ and Zhang GQ,
Theory of aluminum metallization corrosion in microelectronics, Electrochimica Acta 55, pp.5459-5469 (2010)
44. M. Akram, K.M.B.Jansen, L.J.Ernst and S. Bhowmik, Atmospheric Pressure Plasma Surface
Modification of Titanium for High Temperature Adhesive Bonding, Int J Adhesion and
Adhesives 31, pp.598-604, 2011
45. J.S. Nakka, K.M.B. Jansen, L.J. Ernst, Effect of Chain Flexibility in the Network Structure on the Viscoelasticity of Epoxy Thermosets, J Polym Res 18, pp.1879-1888 (2011)
46. I.B. Vendik, O.G. Vendik, V.P. Afanasjev, I.M. Sokolova, D.A. Chigirev, R.A. Castro, K.M.B.
Jansen, L.G. Ernst, and P. H.M. Timmermans, The unified relaxation model of dynamical electrical and mechanical properties of a polymer composite, submitted to IEEE Trans.
Advanced Packaging
47. K.M.B. Jansen, J. de Vreugd and L.J. Ernst, Analytical estimate for cure induced stress and warpage in coating layers, J Appl Polym Sci 126, p.1623-1630 (2012)
48. M. Sadeghinia, K.M.B. Jansen, L.J. Ernst, Characterization and modeling the thermomechanical cure dependent properties of epoxy molding compound, International Journal of
Adhesion and Adhesives 32, pp. 82-88 (2012)
49. M. Sadeghinia, K.M.B. Jansen, L.J. Ernst, Characterization of the viscoelastic properties of an epoxy molding compound during cure, Microelectronic Reliability 52, pp.1711-1718 (2012)
50. C.K.Y. Wong, S.Y.Y. Leung, R.H. Poelma, K.M.B. Jansen, C.C.A. Yuan, W.D. van Driel and
G.Q. Zhang, Establishment of the Coarse Grained parameters for epoxy-copper Interfacial
Separation, J. Applied Physics 111, p.094906 (2012)
51. J.S. Nakka, K.M.B. Jansen, L.J. Ernst, Tailoring the viscoelasticity of epoxy thermosets, J
Appl Polymer Science, accepted
52. K.M.B. Jansen, B. Öztürk and L.J. Ernst, Warpage estimation of a multilayer package including cure shrinkage effects, submitted to IEEE Trans Advan Packaging

53. M. Akram, K.M.B. Jansen, S. Bhowmik, L.J. Ernst, Durability of polyimid to titanium bonds, in preparation
54. M. Sadeghinia, K.M.B. Jansen, L.J. Ernst, Mechanical characterization of epoxy molding compound in pressurized steam, International Journal of Adhesion and Adhesives 40, pp.
103-107 (2013)