Japan Regional Standards Committee
(JRSC) Liaison Report to EURSC
R1.0
October, 9
JRSC Co-chairs:
M. Matsuda (Hitachi Kokusai Electric)
N. Kawai (The University of Tokyo)
Venue, Location, Date
Contents
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JRSC General Information
Meeting Schedule of TC Chapters in Japan
Highlights from TC/JRSC Activities
SEMICON Japan 2013
Staff Contact Information
Venue, Location, Date
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JRSC General Information
Venue, Location, Date
3
JRSC General Information
• Meetings
– Last Meeting: August 30, 2013 @ SEMI Japan
– Next meeting: December 2, 2013 @ SEMI Japan
• JRSC Leadership
– Chair-persons
• Naoyuki Kawai (The Univ. of Tokyo)
• Mitsuhiro Matsuda (Hitachi Kokusai Electric)
– Vice Chair-person
• Supika Mashiro (Tokyo Electron)
Venue, Location, Date
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JRSC General Information
• Membership Change (Aug. 30)
– Technical Committee Chairs:
• Micropatterning: Morihisa Hoga (DNP)
• Membership Change (April. 19)
– Technical Committee Chairs:
• Liquid Chemical: H. Araki (SCREEN) succeeded chair position from K.
Sugimoto (SCREEN)
• FPD Mask: K. Shiojiri (SK Electronics) succeeded chair position from A.
Okazaki (SK Electronics)
• PI&C: K. Yamagata (Daifuku) succeeded chair position from S. Komatsu
(Acteon)
• Micropatterning: Open (under coordination)
– Note: I. Higashikawa retired as of the end of March. The committee could not find his
successor before April 19.
• New Organization Chart
– See next slide
Venue, Location, Date
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JRSC Organization Chart
Red: April 19
Purple: Aug 30
JRSC
Standardization
Process
Integration (SPI)
Co-Chair: Naoyuki Kawai (Univ. of Tokyo)
Co-Chair: Mitsuhiro Matsuda (Hitachi Kokusai)
Vice Chair: Supika Mashiro (TEL)
I&C
Takayuki Nishimura
(SCREEN)
Mitsuhiro Matsuda
(Hitachi Kokusai)
PI&C
Tsuyoshi Nagashima
(Miraial)
Tsutomu Okabe (TDK)
Kenji Yamagata (Daifuku)
PV Automation
FPD Meteorology
Naoyuki Kawai (Tokyo Univ.)
Tetsuya Nakai (SUMCO)
Terry Asakawa (TEL)
Emi Ishikawa
（Atelier Ishikawa)
Makoto Ishikawa (Nisshinbo)
Ryoichi Watanabe
(Toshiba Mobile Display)
Akira Kawaguchi
(Otsuka Electronics)
Compound
Semiconductor
Materials
Gases &
Facilities
PV Materials
FPD Factory
Automation
Masayoshi Obara (SEH)
TBD
Toshio Murakami
( Murakami Corp.)
TBD
Kazunori Kato (AiT)
Yutaka Koma (Consultant)
Masahiro Tsuriya (iNEMI)
Venue, Location, Date
Supika Mashiro (TEL)
EHS
Packaging
Yoichi Iga (Renesas Elec.)
Hirokazu Tsunobuchi
(Keyence)
Yoshitada Nogami (SK Electronics)
Makoto Yamamoto (Muratec)
Hidetoshi Sakura (Intel)
Supika Mashiro (TEL)
Moray Crawford
(Hatsuta Seisakusho）
Silicon Wafer
Metrics
Traceability
FPD Coordination Group
Test
Hiroshi Kaga
(Renesas Electronics)
Takashi Umenaga
(Teradyne)
Hiromichi Enami
(Hitachi High-Technologies)
Isao Suzuki (MKS Japan)
Takashi Ishihara
(Mitsubishi Elec.)
Tetsuo Fukuda (AIST)
Kazuhiko Kashima
(Global wafers Japan)
FPD Materials &
Components
Liquid Chemicals
Hiroshi Tomita (Toshiba)
Hiroyuki Araki (SCREEN)
Micropatterning
Morihisa Hoga (DNP)
Yasunobu Otogawa (Daihen)
Harumichi Hirose
(Shibaura Mechatronics)
PV
Hiromu Takatsuka
(MITSUBISHI HEAVY
INDUSTORIES)
Kazuhiko Kashima
(Global wafers Japan)
Terry Asakawa (TEL)
Masaaki Yamamichi (AIST)
Hisashi Aruga (Seiko Epson)
Tadahiro Furukawa
(Yamagata Univ.)
Yoshihiko Shibahara (FUJIFILM)
FPD Mask
Kazuya Okazaki
(SK-Electronics)
Kaname Nitobe (HOYA)
TC Chapters Meeting during Fall
Meeting period
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JA Silicon TC Chapter / Sep. 3
JA PI&C TC Chapter / Sep. 4
JA I&C TC Chapter / Sep. 19
JA EHS TC Chapter / Sep. 26
JA Gases & Facilities TC Chapter / Sep. 27
JA Traceability TC Chapter / Oct. 4
JA Liquid Chemical TC Chapter / Oct. 11
JA PV Automation TC Chapter /Oct. 24
JA PV TC Chapter & JA PV Material TC Chapter / Oct. 24
JA FPD M&C TC Chapter & FPD Metrology TC Chapter / Oct. 27
JA Packaging TC Chapter / Nov. 11
Venue, Location, Date
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Highlights from TC/JRSC Activities
Venue, Location, Date
8
Restructuring of FPD Related
Committees
• JRSC will propose the following two actions to
ISC at the next ISC meeting in December.
– To disband the Global FPD mask Technical
Committee and to transfer documents of this TC to
Global FPD Materials and Components TC.
• This action was approved by the relevant GCS.
• Possibly joint proposal with NARSC
– To disband the Global FPD Factory Automation
Technical Committee and to put documents currently
under this TC under the “inactive” status.
• This action was approved by the relevant GCS.
• Possibly joint proposal with NARSC
Venue, Location, Date
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Program
STEP and Tutorial programs are in constant demand.
• Tutorial: SECS/GEM
– June 26 & 27 (2 days course) @ SEMI Japan
– Participants: 58
• Tutorial: GEM300
– September 20 @ SEMI Japan
– Participants: 58
• STEP/ S2
– November 15 @ SEMI Japan
Venue, Location, Date
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JRSC Annual Planning Meeting
• Aug. 30 Friday, 13:00-17:00
• SEMI Japan office, Ichigaya, Tokyo
• Number of attendees: 32
• Discussion about the continuity of SEMI Standards
– SEMI Standards and their activities are important for our
industry.
– Now and in the future
• Decreased Standards effectiveness because number of players (device
makers, equipment, material and other suppliers) decrease due to
oligopolization in our industry
• Lower interest to develop new Standards due to maturity of our
industry
– But maintenance of existing Standards is important
• Some (other) Standards activities/organizations were disbanded.
– JRSC has some concerns for the future.
• In the above situation, how can SEMI and stakeholders maintain the
importance and continuation of SEMI Standards and their activities?
Venue, Location, Date
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Highlight: TC Chapters
• Fiducial Mark Interoperability Task Force
– Leaders
• H. Tsunobuchi (KEYENCE)/Traceability, S. Mashiro (TEL)/PI&C,
S. Masuchi (DISCO)/Packaging, M. Matsuda (Hitachi Kokusai Electric)/I&C,
T. Nakai (SUMCO)/Si
– Charter
• Adoption of fiducial mark will affect not only Si wafer specification and related Standards
but also Standards owned by other Global Technical Committees that reference the
Notch. Furthermore, as readability of fiducial mark may change due to intentional and
unintentional interaction of wafer surface and various tools in their process apparatuses
and with wafer handling mechanisms, standardization of fiducial mark detection data and
their communication is deemed necessary to support traceability and to compensate
deteriorated readability of Fiducial Mark.
• In order to address above cross disciplinary challenge, this Task Force is established
under five Global Technical Committees, and develops the Standards to support the
fiducial mark.
– JA Silicon Wafer TC Chapter, JA Traceability TC Chapter, JA PI&C TC Chapter,
JA I&C TC Chapter, JA Packaging & Assembly TC Chapter
– Scope
• Investigate and verify to introduce the fiducial mark.
• Develop Standards to support the fiducial mark, such as
–
–
–
–
T7 revision (Traceability Committee),
Wafer Handling issue (Physical Interfaces & Carriers Committee),
Backend Alignment issue (Assembly & Packaging Committee),
Fiducial Mark Information Handling issue (Information & Control Committee) and so on.
• Development of physical specification of fiducial mark is outside the scope of this TF.
Venue, Location, Date
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Highlight: TC Chapters
• Gases & Facilities
– Discussion on the feasibility of standardization has been started
recently under the “Standardization of the live gas flow ware”
Study Group.
• I&C
– JA I&CC Maintenance Task Force
• To maintain all the documents that cannot be addressed by existing
task forces.
• Silicon Wafer / Traceability
– Held a joint meeting in June for sharing information about
450mm notch-less wafers, about 30 people participated
• PV Automation
– 5223A:New Subordinate Standard: “Media Interface
Specifications for a Horizontal Communication between
Equipment for Larger Sized Substrate Oriented Photovoltaic
Fabrication System” to Be Used to Implement SEMI PV35
• 5223 was failed and 5223A will be adjudicated by the TC Chapter on
Oct. 24
Venue, Location, Date
13
Highlight: TC Chapters
• Packaging
– 3D-IC Study Group supports the 3D-IC area in the
Advanced Manufacturing Technology Pavilion in
conjunction with SEMICON 2013
• Compound Semiconductor Materials
– Interest in 150mm SiC wafer specification
• The following companies have shown their interests and to
join the European task force directly.
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–
–
–
–
–
–
–
–
–
Venue, Location, Date
Mitsubishi Electric Corporation,
Sumitomo Electric Industries, Ltd.,
DENSO CORPORATION,
Panasonic Corporation,
SHOWA DENKO K.K.,
Toyota Motor Corporation,
Toshiba Corporation,
Kwansei Gakuin University,
NIPPON STEEL & SUMIKIN MATERIALS CO.,LTD.,
Dream Incubator Inc.
14
SEMICON Japan 2013
Venue, Location, Date
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SEMICON Japan2013
Website:
http://www.semiconjapan.org/en/
Event Schedule:
http://www.semiconjapan.org/en/sessions/master-schedule
Venue, Location, Date
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SEMICON Japan 2013
Technical Committee Meetings
Date/Time
Committee
Dec. 2 (Mon) 15:30-18:00 JRSC (Invitation Only)
15:00-17:00 Liquid Chemicals TC Chapter
Dec. 4 (Wed) 07:00-09:00 Reg. SC (Invitation Only)
14:00- Gases & Facilities TC Chapter
17:00
Dec. 5 (Thu)
Dec. 6 (Fri)
Venue, Location, Date
As of Oct. 04
Venue
SEMI Japan, Ichigaya
SEMI Japan, Ichigaya
ICH 204
ICH 203
07:00-08:00 Regu.SC (Invitation Only)
ICH 202
10:30-18:00 Silicon Wafer TC Chapter
*12:00-14:30 Break
ICH 202
14:00-17:00 3D-IC Study G
ICH 203
13:00-16:30 ISC (invitation only)
ICH 205
09:00-12:00 PI&C TC Chapter
ICH 202
12:00-13:00 I&C GCS (Invitation Only)
ICH 202
13:00-17:00 I&C TC Chapter
ICH 202
13:00-17:00 EHS TC Chapter
ICH 202
15:00-17:00 Traceability TC Chapter
ICH 204
SEMICON Japan 2013
Standards Related Seminars & Event
As of Oct. 04
• EHS Standards Workshop
Dec. 4 (Wed), 13:00-17:00 @ ICH Room 304
• Standards Friendship Party & Award Ceremony
Dec. 5 (Thu), 18:00-19:30 @ ICH Room 303
• Proposals to the Assembly Technologies to Drive 3D-IC
Dec. 6 (Fri), 12:30-14:20 @ TechSTAGE WEST, Hall 1
• STEP/ 450mm Standards Overview
Dec. 6 (Fri) 13:30-16:30 @Room 303
http://prod.semiconjapan.org/en/sessions/standards
for the latest information
Venue, Location, Date
SEMI Standards Friendship Reception and
Member Recognition Awards Ceremony
• Dec. 5 (Thursday), 18:00-19:30
• Room 105, ICH, Makuhari Messe
• SEMI International Standards members are
cordially invited to attend complementary
reception.
• Please register thought the website
http://prod.semiconjapan.org/en/sessions/networkin
g/#standards%20reception
Venue, Location, Date
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Staff Contact Information
Venue, Location, Date
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Contact Information
Committee Assignment
Staff
EHS, Packaging, Micropatterning, Gases & Facilities,
FPD FA, FPD M&C, FPD Metrology, FPD Mask
Naoko Tejima
Manager, Standards
ntejima@semi.org
Silicon Wafer, PI&C, Traceability, Test,
PV, PV Automation, PV Materials, SPI Task Force
Hirofumi Kanno
Manager, Standards
hkanno@semi.org
I&C, Metrics, Liquid Chemicals
Chie Yanagisawa
Sr. Coordinator, Standards
cyanagisawa@semi.org
JRSC, Compound
Junko Collins
Director, Standards & EHS
jcollins@semi.org
81.3.3222.5819
** EHS, SIG
Others
Staff
Standards Products General Information
C.Yanagisawa
Web Contents
H. Kanno
Standards Membership
N.Tejima
Other Standards Operation
J. Collins
Venue, Location, Date
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Thank you for your attention!
Venue, Location, Date
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Back-up
Venue, Location, Date
Restructuring of FPD Related Committees
Venue, Location, Date
24
Disbanding FPD Mask Technical
Committee was approved
• Disbandment of Global FPD Mask Technical
Committee together with JA FPD Mask TC Chapter
was approved.
– Standards which were developed by Global FPD Mask TC
will be maintained by Global FPD Materials and
Components TC.
• Voting Result: Yes/7 No/0
• Voting Result: Yes/7 No/0
Venue, Location, Date
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Disbanding of FPD Factory
Automation Committee was approved
• Disbandment of Global FPD FA Technical
Committee together with JA FPD FA TC Chapter
was approved.
– Standards which were developed by Global FA TC will
become INACTIVE Standards.
• Voting Result: Yes/6 No/0
– Note: H. Hirose is out of contact.
Venue, Location, Date
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GCS Members for each FPD
related Global TC
Voting
Registr
ation
Japan
FPD
Meteoro
logy
R. Watanabe
A. Kawaguachi
FPD
Factory
Automat
ion
Y. Otokawa
H. Hirose
FPD
Materials
&
Compon
ents
H. Aruga
T. Furukawa
Y. Sibahara
FPD
Mask
K. Shiojiri
K. Nitobe
Venue, Location, Date
Yes
N/A
Korea
Taiwan
NA
*confirmed by
Natalie
*confirmed by Catherine
*confirmed by Paul
Jong Seo Lee
Il Ho Kim
Tzeng-Yow Lin
Jia-Ming Liu
Bill Colbran
Jong Seo Lee
Il Ho Kim
Yes
Yes
Jong Seo Lee
Il Ho Kim
Yes
Yes
Jong Seo Lee
Il Ho Kim
Tzeng-Yow Lin
Jia-Ming Liu
Yes
Yes
Tzeng-Yow Lin
Jia-Ming Liu
Yes
Yes
Tzeng-Yow Lin
Jia-Ming Liu
Bill Colbran
Yes
Bill Colbran
Yes
Yes
Bill Colbran
Yes
27
Japan Spring/Summer Standards Meeting
Overall TC Updates
Venue, Location, Date
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FPD Materials & Components 2013/07/05 (Next meeting 2013/TBD)
Passed the following documents;
#5552: Reapproval of SEMI D13-0708,Terminology for FPD Color Filter Assemblies
#5553:Reapproval of SEMI D29-1101, Test Method for Heat Resistance in Flat Panel Display
(FPD) Color Filters
#5554:Reapproval of SEMI D30-0707, Test Method for Light Resistance in Flat Panel Display
(FPD) Color Filters
FPD Metrology, 2013/04/12 (Next meeting October, 2013- TBD)
No special report from this meeting
Mircopatterning, 2013/08/28 (Next Meeting: 2013/12/11)
New Chair-person: M. Hoga (DNP), he is also leader of 5-year Review TF
Facilities & Gases, 2013/09/27 (Next Meeting: 2013/12/04)
New study group “Standardization of the live gas flow rate” starts feasibility study.
Venue, Location, Date
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EHS, 2013/09/26 (Next meeting 2013/12/06)
No special updates from the last meeting except holing the STEP/S2 on November 15.
I&C, 2013/09/19 (Next meeting 2013/12/06)
AMHS TF was disbanded.
I&CC Maintenance TF was established by GCS approval.
5486: New Standard: Specification for Predictive Carrier Logistics Information from Equipment to be used for
Predictive Carrier Logistics Management (PCL) – Failed
E153-0310 (AMHS document) will be maintained by the I&CC Maintenance TF
Venue, Location, Date
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I&C, 2013/09/19 (Next meeting 2013/12/06)
AMHS TF was disbanded.
I&CC Maintenance TF was established by GCS approval.
5486: New Standard: Specification for Predictive Carrier Logistics Information from Equipment to be used for
Predictive Carrier Logistics Management (PCL) – Failed
E153-0310 (AMHS document) will be maintained by the I&CC Maintenance TF
Venue, Location, Date
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Liquid Chemicals, 2013/07/22 (Next meeting 2013/10/11)
5471:New Standard: Test Method for Particle Removal Performance of Liquid Filter Rated Below 30
nm with ICP-MS – Cycle 6-13
Packaging, 2013/07/19 (Next meeting 2013/11/11)
JA 450mm Assembly and Test Die Preparation Task Force
New leader: K. Watanabe (Lintec)
Related Information of G92-0412, Specification for Tape Frame Cassette for 450 mm Wafer
passed.
New SNARF:
5636:Revision of SEMI G92-0412, Specification for Tape Frame Cassette for 450mm Wafer
5637:Revision of SEMI G95-0613, Mechanical Interface Specification for 450mm Load Port for
Tape Frame Cassettes in the Backend Process – for Cycle 6, 2013
Revised TFOF: JA 450mm Assembly and Test Die Preparation Task Force
Add “About a method to align in Packaging Process of 450mm Notch-Free Wafer”
Venue, Location, Date
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PV Automation, 2013/07/24 (Next meeting: 2013/10/24)
EIS TF actively works with EU EIS TF (Global EIS TF)
The following ballots for cycle 6-2013
#5223: New Subordinate Standard: “Media Interface Specifications for a Horizontal
Communication between Equipment” to be Used to Implement SEMI PV35
#5631: Line Item Revisions to SEMI PV35-1012, Specification For Horizontal Communication
Between Equipment For Photovoltaic Fabrication System
PV Materials, 2013/07/23 (Next meeting: 2013/10/24)
No special report from this meeting.
PV, 2013/07/23 (Next meeting: 2013/10/24)
No special report from this meeting.
Traceability, 2013/08/06 (Next meeting 2013/10/04)
5592: New Standards: Guide for Smart Label for PV Traceability –Cycle 7-2013 by JA PV
Traceability TF
Venue, Location, Date
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Silicon Wafer, 2013/09/05 (Next meeting 2013/12/05)
International 450mm Wafer Task Force is active.
Involved in STEP 450 for SEMICON Japan
4848B: New Standard: Guide for the Measurement of Trace Metal Contamination on Silicon Wafer
Surface by Inductively Coupled Plasma Mass Spectrometry –Cycle 7, 2013
5389A: Revision to MF1982-1110,Test Method for Analyzing Organic Contaminants on Silicon
Wafer Surfaces by Thermal Desorption Gas Chromatography –Cycle 7, 2013
New SNARF
Line Item Revision of SEMI M80-0812, Mechanical Specification for Front-Opening Shipping Box
Used to Transport and Ship 450 mm Wafer
PI&C, 2013/09/04 (Next meeting 2013/12/06)
STEP:
The STEP 450 will be conducted during SEMICON Japan 2013
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