Center For Scalable and Integrated NAnoManufacturing
NSF Nanoscale Science and Engineering Center (NSEC), Award # CMMI-0751621
UC Berkeley • UCLA • Stanford • Northwestern • UNCC • HP Labs
3116 Etcheverry Hall, University of California, Berkeley, CA 94720-1740, http://www.sinam.org
Introduction
IRG I. Top-Down NAnoManufacturing
Vision: A New Nano Manufacturing Paradigm that Enables the Quantum
Leap from Lab Science to Industry Revolution
• Future Integrated Nano-Systems
•
• Critical Challenges
Prohibitive cost (EUV>$25M/tool), low speed (EBL)
Not suitable for 3D (nanoimprint, soft lithography)
Prone to defects (self-assembly)
• Goal
Technological Barriers



3D Terabit
Memory
Ultra
Sensitive
Bio-sensor
Self-assembly CANNOT:
 Heterogeneously assemble pattern for devices
 Avoid “defects” due to thermodynamic nature
Ultra Molding Impring Lithography
•
Deposition
Nano-manufacturing with 1-100 nm resolution
SiGe
Si
• Approaches:
Ultra Compact
light source &
integrated
photonics
Nano Fluidic
Circuits
• Critical Challenges
 Semiconductor Manufacturing at a crossroads
 50 nm resolution limit
 Lacking 3D capability
State of Art



•
IRG II. Hybrid Top-down and Bottom-up Manufacturing
Dimension below 20 nm → High density devices
3D complex nanostructures → Low power, high speed
Heterogeneous integration → Multiple functionality
• Plasmonic Imaging Lithography (PIL)
• Ultra Mold Imprinting Lithography (UMIL)
Plasmonic Imaging Lithography
8
4
Utilizing plasmonic lens
on air bearing slider
platform to achieve highthroughput maskless
lithography
Mission:
 Develop sub-20 nm 3D nano-manufacturing
 Enable the industrial quantum-leap
 Address work force crisis through innovative
education program
Etching
Ultra Molding Impring
Lithography use epitaxially
grown superlattices to make
1-10 nm molds in 2D
applications that require
molecular level resolution.
• Goal
•
Massive and parallel integration of heterogeneous nano-LEGOs into devices
• Approaches
• Hybrid Top-down and Bottom-up Manufacturing
40 nm
20
10
Imprinting
100 mm
100 nm
4nm imprinted features
SINAM logo with the line
width ~150 nm
Micro/nano Fluidics
Materials issues at very small dimensions:
Surface plasmon: The Electromagnetic wave
that propagates along the interface of metal
and dielectric layers, with reduced wavelength
to the order of several nanometers.
Mask
Demonstrate sub-100 nm features on a 170
nm period through aluminum hole array
mask using 365 nm wavelength light.
Education/Outreach
Dendrimer molecules as “molecular pixels”
Silicon and
carbon for
etch resistance
O
O
O
O
O
O
Si
O
O
Bio-Chip
Si
Si
Si
Si
O
O
Addressing &
Data acquisition
Si
O
O
O
O
Si
Si
O
Si
Integrated assembler system will
bridge the multifunctional nanoLEGOs onto bio-MEMS devices
and lead to scalable and cost
effective manufacturing at macroworld.
Assembly Motherboard
O
Cl
Chemical
linker
Discover Nanotechnology (Grades 7-12)
MS
HS
100 mm
Inquiry based modules
• See and feel the Nanoworld → Nanomanipulator
• Graduate teaching fellows, Teachers in training
• Piloted in Los Angeles and Oakland
[Ho, Caflisch, Chen, Maynard, Stoddart, UCLA; Majumdar, UC Berkeley; Heller, UCSD]
[Yablonovitch, Osher, UCLA; Zhang, Fréchet, Grigoropoulos, UC Berkeley]
Nano-Manufacturing Summer Academy/REU
UG
Connecting to research
• High school students, teachers, undergraduates
• Short courses, lab experience, competitions, internships
Interdisciplinary Curricula
GR
• Undergraduate → Intro to NanoMfg, design projects
• Graduate → New course modules based on SINAM
research
IRG III. System Engineering
• Critical Challenge
• Scale-up new nano-manufacturing processes for high throughput and
high yield
3D Nano-CAD
• Goal
Graduate Young Investigator–You’re the PI!
•
• Proposal competition (5 pages) among all graduate students
from five SINAM schools
• Graduate student brings 2+ faculty from different disciplines
• Funding for innovative research project
• Approaches
Develop Nano-manufacturing tool
Design
Nanomanufacturing Cluster Tools
Machine
Design
 Design for nano-manufacturing
 Tooling and metrology
3D Solid
Model
Decomposed
Layouts
UNCC 3D Sub-atomic
Measuring Machine
Collaborative Network
Multiscale Alignment and
Positioning System(MAPS)
Dynamic Positioning Control
Fabricated
Structures
Fabrication
Simulators
Predicted
Structures
Real time
Feedback
&
Calibration
Industrial Consortium
(IBM, HP, Eastman, Boeing, Rockwell, Nanomix, RAND, LG Electronics..)
Government laboratories/institutes
(Sandia, JPL, LBNL, NIH)
Business Partners
(RAND, Los Angeles Regional Technical Association)
International Institutions
(UK, German, Netherlands, Japan, Korea, China)
Device
Performance
Test
Nano-CAD
0.9
0.6
0.3
0
-0.3
1
X (nm)
Predicted
Device
Performance
Nano-CAD Development
Fabrication
The interactive design interface, 3D nanoCAD, will allow efficient interactions
between product design and process
development.
0.3nm step
0
Electromagnetic,
Thermodynamic
Simulators
2
Time (s)
3
4
5
Imprinting Module
• Nanomanufacturing Platform
[Tsao, Chen, Hahn, Lavine, UCLA; Dornfeld, Zhang, UC Berkeley; Prinz, Goodson, Stanford; Hocken, UNCC]
NSF Nanoscale Science and Engineering Center
Supported primarily by the Nanoscale Science and Engineering Initiative of the National Science Foundation under NSF Award Number CMMI-0751621 .
© Copyright 2008 Center for Scalable and Integrated NAnoManufacturing