MEMS-BASED INTEGRATED-CIRCUIT MASS

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MEMS-BASED

INTEGRATED-CIRCUIT

MASS-STORAGE SYSTEMS

L. R. Carley, G. R. Ganger, D. F. Nagle

Carnegie-Mellon University

Paper highlights

• Discusses a new secondary storage technology that could revolutionize computer architecture

– Faster than hard drives

– Lower entry cost

– Lower weight and volume

– Lower power consumption

• Paper emphasis is on physical description of device

DISK DRIVE LIMITATIONS

Disk drive capacities double every year

– Better than the 60% per year growth rate of semiconductor memories

• Two major limitations of disk drives are

Access times decreases have been minimal

Minimum entry cost remains too high for many applications

Stating the problem

• We need a type of new mass storage that can break both barriers of

– Access times

– Minimum entry cost

 New mass storage should also be significantly cheaper than non-volatile RAM

$100 now buys 1 GB of flash memory

MEMS

Microelectromechanical systems (MEMS) use

– Same parallel wafer-fabrication process as semiconductor memories

Keeps the prices low

– Same mechanical positioning of R/W heads as disk drives

Data can be stored using higher density thin-film technology

Main advantages of MEMS (I)

• Potential for dramatic decreases in

Entry cost

Access time

Volume

Mass

Power dissipation

Failure rate

Shock sensitivity

Main advantages of MEMS (II)

• Integrate storage with computation

– Complete systems-on-a-chip integrating

• Processing unit

• RAM

• Non-volatile storage

– Many many new portable applications

THE CMU MEMS PROTOTYPE

• Like a disk drive, it has

– recording heads

– a moving magnetic recording medium

• Major departures from disk drive architecture are

– MEMS recording heads—probe tips—are fabricated in a parallel wafer-level manufacturing process

– Media surface does not rotate

How the media surface moves

• Media surfaces that rotate require ball bearings

• Very small ball bearings have “striction” problems that prevent accurate positioning

– Elements would move by sticking and slipping

• Best solution is to have media sled moving in

X-Y directions

– Sled moves in Y-direction for data access

– Sled is suspended by springs

Conceptual view

Sled suspension is omitted from drawing

Sled with magnetic coating on bottom

Fixed part with tip array

The media sled

• Size is 8mm x 8mm x 500 m m

• Held over the probe tip array by a network of springs

• Motion applied through electrostatic actuators

– Motion limited to 10% or less of suspension/actuator length

– Each probe tip can only sweep 1% of the media sled

The probe tip array

• Includes a large number of probe tips for

– Being able to access whole media sled

(in combination with X-Y motions of sled)

– Improving data throughput

– Increasing system reliability

Probe tip positioning (I)

• Most MEMS include some form of tip height control because

– Media surface is not perfectly flat

– Probe tip heights can vary

• CMU prototype places each probe tip on a separate cantilever

• Cantilever is electrostatically actuated to a fixed distance from the media surface

Probe tip positioning (II)

• IBM Millipede

– Uses a 32 x 32 array of probe tips

– Each tip is placed at the end of a flexible cantilever

– Cantilever bends when tip touches surface

• HP design places media surface and probe tips sufficiently apart

– No need to control probe tips

Probe tip positioning (III)

• CMU solution is most complex of three

– Must control individual heights of 6,400 probe tips

• Required by recording technology

Probe tip fabrication

• Major challenge is fabricating read/write probe tips in a way that is compatible with the underlying CMOS circuitry

• This includes

– thermal compatibility

– geometrical compatibility

– chemical compatibility

– ...

Media positioning

• System’s current target is to have each probe tip in the middle of a 100 m m square

– Media actuator must be able to move at least

±50 m m in each direction

– Can be achieved with an actuation voltage of

120V

Well above CMOS rated voltage

Storing, reading and writing bits

• CMU prototype uses same magnetic recording technology as current disk drives

– Minimum mark size is around 80 m m x 80 m m

• Other solutions include

– Melting pits in a polymer (IBM Millipede):

• Raises tip wear issues

– Phase change media (HP prototype)

• Same technology as CD-ROM

PROTOTYPE PERFORMANCE (I)

All data were obtained through simulation

Average service time around 0.52 ms

– Disk drive service time is 10.1 ms

– Key factor for service time is X-seek time

I/O bandwidth depends on

– number of simultaneously active tips

– per-tip data rate

PROTOTYPE PERFORMANCE (II)

Sustainable data rate is not a linear function of access data rate

– Track switching time now depends on access velocity:

Faster sled means higher turn around time

• Maximum sustainable data rate of

single tip varies from 1.4 to 1.8 Mb/s

– Reached for peak data rate of 2 to 3 MB/s

Application performance

PostMark benchmark:

– Models file activity in Internet servers

– Prototype is 3.4 times faster than current drives

• Much faster metadata updates

TPC-D benchmark:

– Models transaction processing

– Prototype is 3.9 times faster despite extensive caching in competing disk drive

POTENTIAL APPLICATIONS

• Lighter and less shock sensitive than disk drives

– Great for notebook PC’s, PDA’s and video camcorders

• Lower cost than disk drives in 1 to 10 GB range

– Will open many new applications

• High areal densities

– Great for storing huge amounts of data

• Can combine computing and storage on a single chip

MY OVERALL OPINION

• Technology has a bright future if and when production kinks get solved

• We should remain somewhat skeptical

– Not the first “gap-filling” technology to be tried

– Bubble memories were “hot” in the 70’s

– Lower RAM prices killed them in the early 80’s

• Watch prices of non-volatile RAM

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