R3B Si Tracker Layout
Optimised for tracking of high-energy protons
to select events from QFS reactions
e.g. (p,2p), (p,pn)…
Calorimeter
Vacuum Chamber
High energy Ions
From this direction
3 Layers of Silicon
Liquid Hydrogen Target
Gold Foil surround (Not Shown)
Feed through
connectors.
68 way.
Diagram to show how a single Si module (ladder) is
connected to the Si support module and feed-throughs.
Shared Si
module
support
PCB.
No active
parts,
routing
only
Rigid PCBs with flex tail
1 per side of module with Al
cooling plate between
ASICs (12 or 16 per side of
each module)
Buffer board including LVDS
buffers, power regulation and
signal isolation.
Connector with all connections for
up to 16 ASICs on one side of Si
module. 150 pins per connector:
Power
connection
for ASICs and
Si bias
(common for
all modules)
(Probably 1
annular
shape PCB
handling all
30
modules)
• 4 diff pairs for serial data
• 1 diff pair for TS clock
• 3 single ended for I 2C
• 1 wired OR for FT OR
Silicon
• 1 diff pairs for Val/gate
The R3B Si tracker comprises 30 double sided
• 1 single ended for reset
• 4 pins ladder address (3 levels) modules like the one shown here:
•Outer layer 12 modules (16+16 ASICs each)
• 8 pins for 2x PT100
• 1 pin for Si bias voltage/return •Middle layer 12 modules (16+16 ASICs each)
• 64 Ground pins 4 per ASIC
•Inner layer 6 modules (12+12 ASICs each)
• 32 Power pins 2 per ASIC (A & D)
• 24 Extra grounds
24
Detectors in Vacuum
ASIC
Si Inner
FMC
i/f
FPGA
enet
ASIC
x6
ASIC
Si Inner
White Rabbit
timing
DAQ in Air
FMC
i/f
FPGA
Clk
&
trig
i/f
CALIFA
Timestamp &
coincidence
links
enet
ASIC
3x uTCA
crates
Si Middle
x12
FPGA
enet
FMC
i/f
FPGA
enet
ASIC
ASIC
Si Outer
FMC
i/f
ASIC
ASIC
Si Outer
enet
ASIC
ASIC
ASIC
120k strips
912 ASICs
Slow
Control
FPGA
FMC
i/f
FPGA
enet
10G Switch
Si Middle
x12
FMC
i/f
10G Switch
ASIC
DAQ
PC(s)
30 uTCA FEE cards + switches and clock card
R3B Si Tracker (NUSTAR)
To
R3B
DAQ
R3B Si Tracker Sensors
Outer detector assembly (300µm)
Plan to use the same mask set for the green detector of the outer and inner
modules to reduce cost. In total 4 different masks are needed.
Inner detector assembly (100µm)
Silicon sensors
Four different geometries (A, B, C, D), and thickness of 300 um (outer ring) and
100 um (inner ring). Number of strips ranges from 876 in D(100) detector to
2048 in C(300).
A
B
C
300 um
D
100 um
B
50.5 um strips in stereo
configuration of p and n side
Alignment and Bonding
Three ABC mechanical pieces (single sided sensors) assembled on a PCB frame. This is
being used to perfect the procedure to bond strips together. Adjusting bonding
parameters on our sample pieces has allowed us to achieve good wire bonds with
sufficiently good pull strengths.
R3B Si Tracker Status - 19 April 2013
Main Highlights:
• First ASIC prototypes delivered and testing system constructed
• Tests of ASIC so far show they are functioning
• Readout tests of 300um prototype Si finished, 100um ongoing
• Approval given to Micron for production of 300um Si sensors
• Prototype flex cable received and assembled
• Assembly procedure of ASICs to Flex trialled
• Prototype ASICs bonded to flex cable and awaiting bonding
• Production of prototype Si ladder underway
• Production of prototype readout underway
• Final R3B PDRA interviews held at Daresbury yesterday (18 April 2013)
• Conceptual design for a target mechanism done
• Mechanical design concentrating on supporting the Si tracker structure
and vacuum chamber, insertion and removal, etc.
• Status will be reported at R3B Collaboration Meeting in GSI in May.
ASIC chips mounted on
Flex board
Si
C fibre
structure
Cu cooling
blocks
Coolant ~-20° C
flowing in Cu pipe
Dave Seddon,
Liverpool
Day 3
Day 3 - Section
Prototype R3B Si Tracker Modules
 Work underway to determine how to align
the sensors to be wire bonded together
Hoping to be able to use cut edges of the
detectors if good enough quality and relationship
with Fiducials marked on Si well established.
 Work also underway on Si test assemblies
Bonding jigs built to test gluing and wire bonding with
‘mechanical’ Si pieces (300 um so far).
Liverpool and Daresbury technicians training in
LSDC.
Confident that sensors can be wire bonded
successfully.
 Next steps
Wire bonding of ‘real’ R3B Si sensors and readout
with VA1TA ASIC test boards (before R3B ASIC PCBs
available) planned for end of January 2013.
Plan to build ‘mock-up’ detector module trial assemblies
with 300um glass and glass blank ASIC chips.
R3B Si Tracker Prototype Sensors
£155k (+VAT)
For masks and 14 sensors
13 (+1) useable R3B Si prototype sensors from Micron since summer 2012.
All 4 designs (A, B, C, D) and 2 thicknesses (100um and 300 um).
All tested in Liverpool LSDC against specifications.
The R3B Si prototypes
Goal: to assembly one detector module to test the
detector performance as well as the production process.
ASICs
silicon sensors
PCB
mounting frame
Alignment and Bonding
Three mechanical pieces (single sided sensors) assembled on a PCB
frame. This is being used to perfect the procedure to bond strips
together.
At each corner, use the SmartScope’s feature finder to identify the edges,
and find where these lines intersect to define the corner.
Alignment and Bonding
Three ABC mechanical pieces (single sided sensors) assembled on a PCB frame. This is
being used to perfect the procedure to bond strips together. Adjusting bonding
parameters on our sample pieces has allowed us to achieve good wire bonds with
sufficiently good pull strengths.
Full Flex PCB completed
PT100
ASICs
Fit
here
All three items
viewed from
above.
The black raised
ASIC vacuum
pads can just be
seen on the
vacuum jig
underside.
200um spars in
laser cut stencil
to separate
ASICs.
ASIC-Flex Assembly Procedure: I
ASIC-Flex Assembly Procedure: II
ASIC-Flex Assembly Procedure: III
• Testing of chip assembly can start now
Flex during attachment to copper cooling plate
Attached with
double sided
thermal adhesive
coated copper tape
ASIC/Si test box – prototype detector
Copper cooling plate(s) fixed to FR4 PCB ready to accept Flex boards.
FR4 board waiting for silicon to be fitted and wire bonded.