Background Statement for SEMI Draft Document 5420A
NEW STANDARD: SPECIFICATION FOR 150 mm OPEN PLASTIC AND
METAL WAFER CASSETTES INTENDED FOR USE FOR
MANUFACTURING HB-LED DEVICES
Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in
reaching an informed decision based on the rationale of the activity that preceded the creation of this Document.
Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant
patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this
context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the
latter case, only publicly available information on the contents of the patent application is to be provided.
Background
Sapphire wafers are widely used in the manufacturing of HB-LED devices. These 150 mm sapphire wafers are
thicker than standard silicon wafers used in the semiconductor industry making it difficult to use the same cassettes
and standards for HB-LED manufacturing. A basic prerequisite for building highly efficient HB-LED Fabs is
automated material handling. Cassettes with larger pockets and more space between wafers are needed for reliable
automated handling of the sapphire wafers. Manufacturers and equipment suppliers are currently spend significant
time and effort on ensuring adequate material handling within their production lines. By relying on standardized
material handling, HB-LED manufacturers will be able to focus on their core competences.
This document is intended to define standards for cassettes used to handle 150 mm sapphire wafers in HB-LED
manufacturing. To minimize impact to the industry the Task Force is leveraging existing 150 mm silicon cassette
standards with minor revisions. This will allow interoperability with existing 150 mm equipment and any other 150
mm compatible products. Considerations were taken around the cassette’s pocket size and spacing so that the
sapphire wafers can be successfully transferred between cassettes with automated handling equipment.
A cassette standard will also enable standardization of load ports and transport systems. This will result in direct and
indirect cost savings throughout the whole supply chain, less risk during ramp up and less effort for integration of
the production line.
Review and Adjudication Information
Task Force Review
HB-LED Equipment Automation Task Force,
Hardware Working Group
Wednesday, April 3, 2013
Date:
Time & Timezone: 8:00 AM to 5:00 PM, Pacific Time
SEMI Headquarters
Location:
City, State/Country: 3081 Zanker Road
San Jose, California 95134
Jeff Felipe (Entegris)
Leader(s):
Daniel Babbs (Brooks Automation)
Group:
Committee Adjudication
North America HB-LED Committee
Thursday, April 4, 2012
3:00 PM to 5:00 PM, Pacific Time
SEMI Headquarters
3081 Zanker Road
San Jose, California 95134
David Reid (Silian)
Chris Moore (Semilab)
Iain Black (Philips-Lumileds)
Bill Quinn (WEQ Consulting)
Paul Trio (SEMI NA)
Paul Trio (SEMI NA)
Standards Staff:
408.943.7041 /ptrio@semi.org
408.943.7041 / ptrio@semi.org
This meeting’s details are subject to change, and additional review sessions may be scheduled if necessary. Contact
Standards staff for confirmation.
Telephone and web information will be distributed to interested parties as the meeting date approaches. If you will
not be able to attend these meetings in person but would like to participate by telephone/web, please contact
Standards staff.
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134-2127
Phone: 408.943.6900, Fax: 408.943.7943
DRAFT
SEMI DRAFT DOCUMENT 5420A
NEW STANDARD: SPECIFICATION FOR 150 mm OPEN PLASTIC AND
METAL WAFER CASSETTES INTENDED FOR USE FOR
MANUFACTURING HB-LED DEVICES
1 Purpose
1.1 This specification provides the dimensional requirements for plastic and metal wafer cassettes used for the
processing and handling of 150 mm diameter HB-LED sapphire wafers conforming to the SEMI standard.
2 Scope
2.1 This specification is for general usage and outlines the basic requirements for open cassettes for 150 mm
sapphire wafer sizes.
2.2 This document provides basic interface requirements for automated substrate handling.
2.3 To meet these specifications, cassettes must be manufactured within the dimensional limits and be
dimensionally stable within the specification when used in accordance with manufacturers’ recommendations.
NOTE 1: Recommended usage should be agreed to between user and supplier, since wafer cassettes are manufactured from a
number of different materials by several manufacturing methods.
NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their
use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and
determine the applicability of regulatory or other limitations prior to use.
3 Referenced Standards & Documents
3.1 SEMI Standards and Safety Guidelines
SEMI HB1 — Specifications for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light
Emitting Diode Devices
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 Definitions
4.1.1 bar — (see “crossbar.”)
4.1.2 bar end — the end surface of the cassette that has only one crossbar.
4.1.3 bar radius — the radius nearest the bar end of the cassette on the crossbar. (See Figure 1, D5b)
4.1.4 bar web — the mass of material for structural support which may or may not be present on the crossbar. (See
Figure 1, D5a, Type II.)
4.1.5 bar width — the distance or thickness of the bar when measured perpendicular to the top face. (See Figure 1,
D5b.)
4.1.6 cassette — open wafer carrier which stores multiple substrates in a vertical stack for transport between
process equipment.
4.1.7 crossbar — the mass of material connecting the two sides of the cassette at the bar end of the cassette.
4.1.8 end wall — the wall of the cassette opposite the bar end of the cassette.
4.1.9 hole — the area for the pin on another cassette to enter for transferring wafers. (See Figure 1, C8.)
4.1.10 parallelism tolerance — the minimum and maximum dimension allowance for the opposite pockets to vary
in relation to their distance from the crossbar end of the cassette. (See Figure 1, D1.)
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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Document Number: 5420A
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4.1.11 pin — the mass of material which enters the hole or slot of another cassette for transferring wafer. (See
Figure 1, C7.)
4.1.12 pin and hole center distance from pocket centerline — the distance from centerline of either the pin or hole
to the closest pocket centerline. (See Figure 1, C9.)
4.1.13 pocket — the area in which the wafer is located in the cassette.
4.1.14 pocket centerline — the imaginary line which bisects each pocket.
4.1.15 pocket depth — the distance from the pocket flat to its own pocket nose, not to the opposite pocket. (See
Figure 1, C2.)
4.1.16 pocket flat — the width of the pocket along the vertical walls at its narrowest distance. (See Figure 1, C3.)
4.1.17 pocket nose — the top of the mass of material between adjacent pockets.
4.1.18 pocket size — the distance between opposite pocket flats. (See Figure 1, C4.)
4.1.19 pocket spacing — the distance between pocket centerlines. (See Figure 1, B2.)
4.1.20 pocket width — the width of the pocket at its widest distance. (See Figure 1, C1.)
4.1.21 slot — (see “hole”)
4.1.22 top face — the plane or surface of the cassette from which side wafers enter into or exit out of the cassette.
4.1.23 track clearance — the unobstructed area between the two cassette sides on the bar end. (See Figure 1, D6a)
4.1.24 wafer carrier — any cassette, box, pod, or boat that contains wafers.
4.1.25 wafer tilt — the possible unparallel position of the wafer, when the cassette is resting on the bar end, in
relation to a nominal horizontal wafer plane that is parallel to the plane at the bar end of the cassette. (Figure 1.)
4.1.26 wafer transfer — the act of relocating wafers from one cassette into another. This can be accomplished by
several methods.
5 Requirements
5.1 Wafer Compatibility — Due to the tolerances present in the cassette dimensions, as well in a standardized
sapphire wafer, not every possible SEMI Standards wafer cassette may be compatible with every possible SEMI
Standard wafer. Please verify the compatibility of your specific wafer and cassette with the respective vendors.
5.2 Cassette Identification – Barcode and RFID locations are defined in this document to show the locations that
cassette ID’s will be placed. The use of RFID and/or barcode on the cassettes are optional.
5.3 Cassette Dimensions
5.3.1 Table 1 contains a list of the cassette dimensions used in the following tables and figures.
5.3.2 Table 2 contains values for the specific wafer cassettes according to wafer dimension and cassette type.
5.3.3 Dimension Notations
5.3.3.1 Overall dimensions are indicated as “Ax.”
5.3.3.2 Capacity dimensions are indicated as “Bx.”
5.3.3.3 Detail dimensions are indicated as “Cx.”
5.3.3.4 Machine fit specifications are indicated as “Dx.”
5.3.3.5 ID location specifications are indicated as “Ex.”
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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DRAFT
6 Dimensions
Table 1 Reference Symbols and Descriptions
Reference
Description
A1
Length
A2
Width (with/without flange)
A3
Reference
Description
D5b
Bar width measured perpendicular to the top
surface.
Height (excluding pin)
D5c
From the outside of the bar end to the bar web
B1
Pockets per cassette
D6a
Track clearance
B2
Pocket spacing
B3
Center distance from the 1st to last pocket
D6b
On the bar end surface, the distance between
the two struts perpendicular to the crossbar.
C1
Pocket width
C2
Pocket depth
D6c
On the bar end surface, the thickness of each
of the two struts perpendicular to the crossbar.
C3
Pocket flat
C4
Pocket size
D6d
On the bar end surface, the length of each of
the two struts perpendicular to the crossbar.
C5
Pin and hole location (width)
C6
Pin and hole location (length)
D8e
Pickup flange – Refer to the appropriate Figure
for details.
C7
Pin diameter and height
E1a*
Track barcode tag area height
C8
Hole or slot
E1b*
End wall barcode tag area height
C9
Pin and hole center distance from pocket
center line.
E1c*
Barcode tag area width
D1
From the outside of the bar end of the cassette
to the center line of the 1st pocket.
E2a*
From the bottom of the cassette to the bottom
of the barcode tag area.
D2
From the center line of the 1st pocket to the
closest point on the crossbar or web.
E2b*
Center point of the barcode tag area relative to
the center of the cassette.
D3a
The step from the bar end of the carrier to the
crossbar (the tolerance indicates allowable
bow).
E3a*
From the bottom of the cassette to the bottom
of the barcode tag area.
E3b*
From the outside of the bar end of the cassette
to the start of the barcode tag area
D3b
Sensor Pad Location - The step from the bar
end of the carrier to the crossbar (the tolerance
indicates the allowable deviation measured at a
maximum distance of 1/2" from the
crossbar/sidewall junction).
E4a*
RFID tag area height
E4b*
RFID tag area width
D4a
From the bottom of the cassette to the center of
the crossbar, measured at the bar end of the
cassette. Applicable only to full-depth wafer
cassettes; i.e., the wafer sits below the top of
the cassette.
E4c*
From the bottom of the cassette to the bottom
of the RFID tag area.
D4b
Center point of a nominal size wafer relative to
a cassette reference.
E4d*
From the center of the cassette to the start of
the RFID tag area (RFID tag to be located on
left side of cassettes as shown in Figure 2)
D5a
Bar web width which is the mass of material
which may be present on the crossbar and is
measured perpendicular to the top surface.
Bar web width on type II crossbar.
* These references define optional features
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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Document Number: 5420A
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Figure 1
General Usage Cassette Outline for 150 mm Wafers
Figure 2
RFID and Barcode Tag Areas
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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DRAFT
Table 2 Dimensions for 150 mm 18 Capacity General Usage Wafer Cassettes (Reference Figure 1 except
where noted otherwise)
Figure 1 Reference
Overall Dimensions
A1
143.4 mm + 0.64 mm/−0.5 mm (5.645 in. + 0.025 in./−0.020 in.)
A2
177.80 mm (7.000 in.) maximum
A3
171.40 mm (6.750 in.) maximum
B1
18
B2
6.73 mm ± 0.25mm (0.265 in. ± 0.010 in.)
B3
114.43 mm ± 0.25 mm (4.505 in. ± 0.010 in.)
C1
1 degrees minimum
8 degrees maximum
C2
9.53 mm (0.375 in.) minimum/12.70 mm (0.500 in.) maximum
C3
3.51 mm ± 0.13mm (0.138 inch ± 0.005 inch)
C4
153.5 mm ± 1.0 mm (6.043 in. ± 0.040 in.)
C5
156.0 mm ± 0.5 mm (6.142 in. ± 0.020 in.)
C6
134.52 mm ± 0.25 mm (5.296 in. ± 0.010 in.)
C7
3.56 mm + 0.13 mm/−0.38 mm (0.140 in. + 0.005 in./−0.015 in.) diameter by
4.32 mm ± 0.50 mm (0.170 in. ± 0.020 in.) high
C8
3.96 mm + 0.50 mm/−0.00 mm (0.156 in. + 0.020 in./−0.000 in.) diameter by
5.0 mm (0.197 in.) minimum depth
C9
11.40 mm ± 0.25 mm (0.449 in. ± 0.010 in.)
D1
15.82 mm ± 0.25 mm (0.623 in. ± 0.010 in.)
D2
5.87 mm (0.231 in.) minimum
D3
1.57 mm ± 0.5 mm (0.062 in. ± 0.020 in.)
D4a
79.76 mm ± 0.50 mm (3.140 in. ± 0.020 in.)
D4b
On center within ± 1.27 mm (± 0.050 in.)
This specification describes the center point of the wafer in relationship to the centerline of the
crossbar (for a 150 mm nominal wafer)
D5a
25.40 mm + 0.0 mm/−0.5 mm (1.000 in. + 0.000 in./−0.020 in.)
D5b
6.35 mm + 0.00 mm/−0.38 mm (0.250 in. + 0.000 in./−0.020 in.)
D5c
5.33 mm ± 0.76 mm (0.210 in. ± 0.030 in.)
D6a
76.2 mm (3.000 in.) minimum
D6b
131.06 mm ± 1.02 mm (5.160 in. ± 0.040 in.)
D6c
4.0 mm (0.157 in) minimum
D6d
112.0 mm (4.409 in) minimum
D8e
74.0 mm (2.913 in.) minimum
E1a
25.4 mm (1.000 in.) maximum (reference Figure 2)
E1b
38.1 mm (1.500 in.) maximum (reference Figure 2)
E1c
63.5 mm (2.500 in.) maximum (reference Figure 2)
E2a
34.29 mm (1.350 in.) (reference Figure 2)
E2b
On center within ± 1.27 mm (± 0.050 in.) (reference Figure 2)
E3a
3.39 mm (0.133 in.) (reference Figure 2)
E3b
15.88 mm (0.625 in.) (reference Figure 2)
E4a
47.63 mm (1.785 in.) (reference Figure 2)
E4b
7.62 mm (0.300 in.) (reference Figure 2)
E4c
63.5 mm (2.500 in.) (reference Figure 2)
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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DRAFT
Figure 1 Reference
E4d
Wafer Tilt
Overall Dimensions
69.85 mm (2.750 in.) (reference Figure 2)
+/- 0.64 mm (0.025 in.) maximum
Table 3 Dimensions for 150 mm 12 Capacity General Usage Wafer Cassettes (Reference Figure 1 except
where noted otherwise)
Figure 1 Reference
Overall Dimensions
A1
143.4 mm + 0.64 mm/−0.5 mm (5.645 in. + 0.025 in./−0.020 in.)
A2
177.80 mm (7.000 in.) maximum
A3
171.40 mm (6.750 in.) maximum
B1
12
B2
9.52 mm ± 0.25mm (0.375 in. ± 0.010 in.)
B3
104.78 mm ± 0.25 mm (4.125 in. ± 0.010 in.)
C1
1 degrees minimum
8 degrees maximum
C2
9.53 mm (0.375 in.) minimum/12.70 mm (0.500 in.) maximum
C3
3.51 mm ± 0.13mm (0.138 inch ± 0.005 inch)
C4
153.5 mm ± 1.0 mm (6.043 in. ± 0.040 in.)
C5
156.0 mm ± 0.5 mm (6.142 in. ± 0.020 in.)
C6
134.52 mm ± 0.25 mm (5.296 in. ± 0.010 in.)
C7
3.56 mm + 0.13 mm/−0.38 mm (0.140 in. + 0.005 in./−0.015 in.) diameter by
4.32 mm ± 0.50 mm (0.170 in. ± 0.020 in.) high
C8
3.96 mm + 0.50 mm/−0.00 mm (0.156 in. + 0.020 in./−0.000 in.) diameter by
5.0 mm (0.197 in.) minimum depth
C9
10.11 mm ± 0.25 mm (0.398 in. ± 0.010 in.)
D1
14.54 mm ± 0.25 mm (0.572 in. ± 0.010 in.)
D2
4.57 mm (0.18 in.) minimum
D3
1.57 mm ± 0.5 mm (0.062 in. ± 0.020 in.)
D4a
79.76 mm ± 0.50 mm (3.140 in. ± 0.020 in.)
D4b
On center within ± 1.27 mm (± 0.050 in.)
This specification describes the center point of the wafer in relationship to the centerline of the
crossbar (for a 150 mm nominal wafer)
D5a
25.40 mm + 0.0 mm/−0.5 mm (1.000 in. + 0.000 in./−0.020 in.)
D5b
6.35 mm + 0.00 mm/−0.38 mm (0.250 in. + 0.000 in./−0.020 in.)
D5c
5.33 mm ± 0.76 mm (0.210 in. ± 0.030 in.)
D6a
76.2 mm (3.000 in.) minimum
D6b
131.06 mm ± 1.02 mm (5.160 in. ± 0.040 in.)
D6c
4.0 mm (0.157 in) minimum
D6d
112.0 mm (4.409 in) minimum
D8e
74.0 mm (2.913 in.) minimum
E1a
25.4 mm (1.000 in.) maximum (reference Figure 2)
E1b
38.1 mm (1.500 in.) maximum (reference Figure 2)
E1c
63.5 mm (2.500 in.) maximum (reference Figure 2)
E2a
34.29 mm (1.350 in.) (reference Figure 2)
E2b
On center within ± 1.27 mm (± 0.050 in.) (reference Figure 2)
E3a
3.39 mm (0.133 in.) (reference Figure 2)
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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Figure 1 Reference
Overall Dimensions
E3b
15.88 mm (0.625 in.) (reference Figure 2)
E4a
47.63 mm (1.785 in.) (reference Figure 2)
E4b
7.62 mm (0.300 in.) (reference Figure 2)
E4c
63.5 mm (2.500 in.) (reference Figure 2)
E4d
69.85 mm (2.750 in.) (reference Figure 2)
Wafer Tilt
+/- 0.64 mm (0.025 in.) maximum
NOTICE: Semiconductor Equipment and Materials International (SEMI) makes no warranties or representations as
to the suitability of the Standards and Safety Guidelines set forth herein for any particular application. The
determination of the suitability of the Standard or Safety Guideline is solely the responsibility of the user. Users are
cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant literature,
respecting any materials or equipment mentioned herein. Standards and Safety Guidelines are subject to change
without notice.
By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any items mentioned in this Standard or Safety Guideline. Users of
this Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights,
and the risk of infringement of such rights are entirely their own responsibility.
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
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