Manufacturing Facilities Photo Tour
Via
Lithography
Conductor Trace
Interconnection
Test & Inspection
Value Added
Reliability
Vias Capability
Hitachi Mechanical Drill
 Ultra high speed spindle (air bearing, high frequency motor) enable drill small φ
interlayer connecting hole down to <0.075mm with high speed spindles 200,000 rpm
 High precision servo motor
 Positioning accuracy ± 0.004mm
 Drilled hole accuracy ± 0.015mm
 Straightness of X-axis 0.005mm
 Straightness of Y axis 0.005mm
 Squareness of XY axis 0.010mm
 Spindle run-out (statically) 0.010mm at 12.7mm from spindle nose
 Accuracy measurement instrument “3 dimensional coordinate measuring”
Description
Aspect Ratio
Laser Via
Capabilities
D/S
10 : 1
MLB
8:1
D/S
100µm
MLB
150µm
Vias Capability
ESI UV Laser Drill
Mode: Spiraling & Direct via formation
Mode: Punching & Trepanned
From last via
Laser beam
trajectory
Programmable
no. of
revolution
Laser beam
turn on & off
To next via
Produce high quality micro vias in small geometry
circuit board with a pulse repetition frequency up to
70 KHz resulting in excellent via quality & sidewall
taper leaving the via in prime condition for plating
Laser blind via, through via & laser skiving
Typical size 1-6 mil
Placement accuracy ±20um
Repeatability ±25um
Description
Aspect Ratio
Punching & Trepanning mode
Spiraling & Direct via formation
Laser Via
Capabilities
Normal
5:1
Via Fill
1:1
D/S
50µm
MLB
75µm
skiving
Vias Capability
Hitachi CO2 Laser Drill
With 2 laser head for laser skiving and drilling
Positioning accuracy (XY) ±0.005mm
Straightness of x axis 0.005mm per max. drill area
Straightness of Y axis 0.005mm per max. drill area
Squareness of XY axes 0.010mm per 580mm travel
Large Window Process
Conformal Process
Resin Direct Process
Laser Skiving
Drilled hole accuracy ±0.0125mm
Cu Direct Process
Shape beam
Through or blind via, skiving on non rein-force material such as Polymide, resin
Gaussian beam
Form a bigger window than
laser beam width by etching
and then process resin
surface
Form a smaller window than
laser beam width by etching.
Unnecessary beam will be
eliminated by Cu
Form a via by exposured
laser beam directly to resin
Apply a special surface
treatment on Cu to have
better absorptivity of laser
beam, and then exposure
laser beam directly to Cu to
form a via
High Peak power – better for
copper drill
Lithography Capability
Orbotech Laser Direct Imaging (LDI)
Direct Imaging (DI) - a process using laser beam to imprint image directly on photo
sensitive resist without photo tool
LDI enabling technology process: Dynamic registration & scaling < 2 sec on each print
 Fine pitch pattern
 Improve yield through accurate scaling
 Excellent side to side registration
 High throughout up to 120 prints per hour
 Uniform exposure even on non uniform surface
 CCD based registration for maximum flexibility
Non uniform surface
Description
Capabilities
Line / Space
25 / 25µm
Registration Accuracy
±8µm
Layer to Layer Registration
±15µm
Depth Focus
75µm
Edge Roughness
±10µm
Transfer Image
Non Contact
Layer to Layer Register
Fine Pitch Image
Lithography Capability
Ono-Sokki Semi Auto Expose
A process using 5kw short-ark lamp to imprint image directly on photo
sensitive resist with photo tool set on the top acrylic plate
Semi auto expose technology process enabling in:
Dynamic registration & scaling < 4 sec on each print
Fine pitch pattern on the flat panel surface
Improve yield through :
auto alignment system with multi image processor with 4 CCD types
With HEPA filter cooling system
Description
Capabilities
Line / Space
35 / 35µm
Registration Accuracy
±50µm
Layer to Layer Registration
±50µm
Edge Roughness
>75µm
Transfer Image
Hard Contact
Phototool alignment on acrylic plate for
transferring image
Lithography Capability
Automa-Tech Automatic Double Sided Exposure
 5Kw collimated light
 Full automatic optical alignment 4 CCD cameras
 25um resolution
 With HEPA filter class 100
Description
Capabilities
Min Board Size
250*250mm
Max Board Size
610*500mm
Uniformity
≥83% for 610*500mm
Energy Density
25 mW/cm²
Registration Accuracy
±8um (artwork to board)
Top & Bot frame Repeatability
±3um
Collimated Angle
±1.5°
Declination Angle
1°
Resolution
1.5 mil (F9020DF)
Conductor Etch Capability
Schmid CuCI2 Etching
Special process for etching, dryfilm stripping and chemical cleaning of
single sided, double sided, multilayer and bareback panels after
imaging process
- To remove the unwanted copper and the remaining polymerized
resist protect the desired copper circuit traces during etching process
Description
Cu Thickness
(um)
Line / Space
(um)
Pad Plating
18
50 / 50
12
40 / 40
9
25 / 25
70
100 / 125
35
50 / 75
18
50 / 50
Panel Plating
Interconnection Capability
GCE Vertical Continuous Copper Plating Line
(Reverse Via Fill Plating)
Loaded
Degrease
Hot Rinse
After Cu
Plate, w.
Rinse
Auto
Unloader
Rinse
Rinse
Description
Capabilities
Min Board Size
305*500mm
Max Board Size
610*500mm
Uniformity
>90%
Speed Range
0.3-0.75/min, 48sec/pcs
Current Density
1.0 ῀ 4.0 ASD
Range of Plating
12 – 40 µm
Aspect Ratio (Pad / Panel plating)
2:1
Microetch
Rinse2
Carrier
Output
Plating
Output
Acid Dip
Cu Plating
Via Fill
(Reverse)
Carrier
Input
Plating
Input
Interconnection Capability
Copper Plating
Copper Plating is process whereas a layer of copper is
plated on panels surface and its hole permanently as
to connect the two sides of double sides CCL, in this
area the copper plating is categorized into:-
Copper Plating
1)
Pads Plating / Selective Plating
2)
Panels Plating
3)
Via Fill Plating
Description
Capabilities
Panel Plating
5:1
Pad Plating
8:1
Panel Plating
Plated Through Holes
1)
Black Hole Process (standard)
2)
Electroless Copper Plating (BV + RF)
Black hole :
Pads Plating
Via Fill Plating
Laser hole diameter up to 3 mils
Plating :
Plating with acid based.
Throwing power 95% up to 120 %
Via fill up to 85 % -100% filling
Interconnection Capability
达震 Anisotropic Conductive Paste

Printable anisotropically conductive paste that is most often used in low
cost flip chip assembly or as a replacement for ACF

composed structurally of fine conductive particles diffused in liquid
thermosetting resin

Mounting does not involve the use of lead or flux
Description
Capabilities
ACP Print Tolerance
± 10 mils, 36T stencil
ACP Print Thickness
15 – 30 µm
ACP Print Area
300 * 400mm
Camera Resolution
640 *480 pixels
Camera Field of View
7.0 *5.0mm
Camera Lighting
LED
ACP Printing
Interconnection Capability
Various Type of ACF Bond
Trimech Anisotropic Conductive Film
Source:
Sony ACF
Interconnection between pad through ACF
Bonding
Anisotropic Conductive Film, “ACF” are well known as
heat bondable adhesive interconnect material
consisting of conducting particles and adhesive
polymer resin in a film format and they have been
widely used as interconnect material in electronics
industry to make electrical and mechanical
connections functionally from drive electronics to
substrates by thermal bonding process; such as Flex
On Flex (FOF), Flex On Glass (FOG), Flex On Board
(FOB), Chip On Glass (COG), Camera Module on
Substrate / Flex (CMOS)
Pre-Laminate
Description
Capabilities
Description
Capabilities
Heating Method
Constant Heat
Heating Method
Pulse Heat
Work area
180mm x 180mm
Work area
420mm x 180mm
Hold Temperature
30°C - 300°C
Visual Aids
CCD
Hold Period
0.1-25 sec @0.05 sec accuracy
Magnification
50x
ACF Delay to Peel
0 – 5 sec
Work Table Type
Rotary Table
ACF Width
1.5 – 8mm
K Type
ACF Placement Accuracy
X, Y = ±0.1mm
Thermocouple
Type
Bonding Force
2.0 – 48kgf
Heater Block Size
5 x 1.5mm (min) – 80 x 8mm
(max)
Thermocouple Type
K Type
Test & Inspection Capability
Orbotech Automatic Optical Inspection (AOI)
Hole algorithm
Tight tolerance
Verifier System
120 degree
VeryFine
breakage
Dedicated VRS with video
on the AOI
No
breakage
Loose tolerance
 In process control for Etching Imaging / Etching process, and blind via
inspection
Description
Capabilities
 High frequency (160MHz) CCD, very high signal-to-noise ratio
Technology
25µm optic technology
 Unique customize lens include floating element to keep optimal
performance for all magnification range
Max. Inspect area
660 * 610mm
Board Thickness Range
25 – 700µm
Inspection Method
Full reference comparison
SIP-model based contour
comparison
Specific criteria per feature
Full multiple line width
measurement
 OMNI light source, high intensity (5 bulbs, 250W) diffusive & reflective
light. Uses custom-made mirror for wide 3-D coverage. Results in accurate
line measurement of both vertical and horizontal lines and excellent
detection of fine and shallow shorts.
 Hole algorithm enables inspection of panels with holes without masking
the area around the holes and accurate holes measurement.
Test & Inspection Capability
Synpower Automatic Optical Inspection
 Inspection cosmetic defect on board with coverlay lamination
 Detection defects such as excess coverlay, dent, oxidation, coverlay
shifted, expose copper
 Golden board learning without Gerber transfer required
Expose Copper
Stiffener Shifted
Description
Capabilities
Resolution
10um / pixel
Camera
10000 pixel / 2 set
Max Board Size
200 * 330mm
Board Thickness
0.2 ~ 3.0
Camera Lighting
Fluorescent lamp + LED
Inspection Mode
Manual single type
Oxidation
Dent
Excess Coverlay
Test & Inspection Capability
ViTrox SMT Automated X-ray and Automated Optical Inspection (AOI)
 In process control SMT
 Lighting system: Multiple color, multiple angle, multiple segment LED lighting head with auto
calibration
Description
Capabilities
Camera Type
4 Mega pixel digital camera
Camera Resolution
19um per pixel resolution
Adjustable Camera Pixel
Scalable from 22um to 12um
X.Y. Driver Encoder Resolution
1um
Max Component Height Inspection
41mm
Min. Edge Clearance
3.5mm
Min. Component
01005
Functionality
Post-reflow Inspection
Coverage: Missing offset, skewed, polarity,
billboard, tombstone, lifted/bent leads,
excess/insufficient solder, bridging, wrong
part and traceability
Pre-reflow Inspection
Coverage: Missing offset, skewed, polarity,
billboard, wrong part inspection, extra part
inspection and traceability
Inspection Speed
Post-reflow:
6.5in˄2/sec (42.0cm ˄2/sec)
Pre-reflow:
8.5in˄2/sec (55.0cm ˄2/sec)
Test & Inspection Capability
ATG Luther & Maelzer Flying Probe Tester
 Fixtureless, with 8 active electrical probes
 Non undesirable dents marks on the pad
 Continuously threshold adjustable from 1 ohm applicable to all trace
 Automatic alignment using 4 camera and electromagnetically
controlled
 4 camera (640 *480 pixel), optical scanning of top & bottom side
resolution from 12µm / pixel
 Repeatable accuracy ± 10µm
Spring mounted on test head instead of on test probe. Spring force adjustable
from 5g to 15 g and is set to 6g and equipped with soft landing feature on so
that it will not cause any undesirable dent marks on the pad.
Description
Capabilities
Smallest Pad Size
2 mil
Smallest Pitch Size
4 mil
Continuity Test
1 Ω ~10k Ω
Isolation Test
5M ~10M Ω
Max. board Size
650mm * 520mm
Max. Test Area
610mm * 460mm
Board Thickness
0.1mm~10mm
No of Test Head
8
No of CCD
4
Test & Inspection Capability
Surpass Flying Probe Tester
Fixture design with multi row of board test
Description
Capabilities
Smallest Pad Size
2 mil
Smallest Pitch Size
4 mil
Continuity Test
2 Ω ~8k Ω
Isolation Test
10k ~25M Ω
Max. Board Size
650mm * 520mm
Max. Test Area
610mm * 500mm
Board Thickness
0.3mm~6mm
No of Test Head
4
No of CCD
4
Test & Inspection Capability
EMS CheckSum
To test most single or double-sided SMT / through hole circuit assemblies. It can perform
effective power-down testing for most analog or digital assemblies
 Dual level probing and optional power-up functional test capability is ideally suited for
lower frequency analog assemblies with some digital content
 Able test the entire assembly and individual component without power apply
 Using sophisticated measurement techniques such as DC or complex-impedance
measurement in conjunction with multi point guarding
 To find majority of faults such as short, opens and wrong or incorrectly installed
component
Component Type
Functional Test Description
Input
Output
Resistor
Measure Resistance
Current
Resistance value
Capacitor
Measure Capacitance
Voltage
Capacitance value
Inductor
Measure Resistance
Current
Resistance value
Transistor
Switching test
Voltage
Resistance value
LED
Use sensor to sense LED light
Light
Voltage value
Current
Receiver
Power on Vibrator and measure current.
Use
sensor to sense vibrator.
Impedance measurement test.
Microphone
receive Receiver SPL frequencies
Microphone
Microphone receive Receiver SPL frequencies
Sound pressure(Fx)
Frequency(Fx) value
Measure MIC sensitivity test (db)
Dome Switch
Switching Resistance test
Mechanical press
Resistance value
Dome sensitivity test / dome tactility
test (Dome switch)
Magnet Sensor
Use magnet to activate switching
Magnetic induction
Voltage value
Light Sensor
Use LED light to activate switching
Light source
Voltage value
Diode
Forward Bias test
Current
Voltage value
Zener Diode
Zener test
Current
Voltage value
Lighting, LED,
Power IC Driver
As per component data sheet
Current / Voltage
As per application
Connector
Open and short test
Current
Resistance value
Vibrator
AC Voltage
Vibration
Sound pressure(Fx)
Current
Advance Test Option
LED analyser – wavelength, intensity
and chromaticity test
Resistance
Impedance value
value
Frequency(Fx)
Test & Inspection Capability
Jova CMOS Image Sensor / Camera Module Tester
The Jova automated tester performs electrical and image quality tests on the
camera module component contains on the device flex strip assembly
Consists of 3 primary component:
 Pre-configuration testing workstation – automated testing software including
tester and light source control
 Automated tester – test electronics and automated fixture with controllable dark
and light field, and operator push button and RGB LED
 Remote light source / light box with testing target
Description
Capabilities
Description
Sensor Power
Analog, Digital & AF voltage
and current
-
Relative Uniformity
Illumination
Relative illumination
Relative uniformity
Both Relative Illumination and
Uniformity are calculated from the
same image captured from device with
the uniform light source.
Blemish
Blemish (defective pixel
cluster, dust & particles
The Blemish test is calculated from the
same image captured at device with
the uniform light
Macro Focus (MTF)
Macro MTF (Image
Sharpness)
The MACRO MTF test is calculated from
the image taken from device position in
position with the sensor viewing a test
target at 10cm from the device module
INF Focus (MTF)
INF MTF (Image sharpness)
The INF MTF test is calculated from the
image taken from device at position
with the sensor viewing a test target at
120cm from the device module lens.
Value Added Capability
SEHO Vision Press Robot
SEHO Auto Stiffener Bonder
 Auto pick & place ‘with X.Y Axis’ on various
material, PI, EMI, SUS & FR4,
thickness range 1-10mils
 7 Ton servo press with mold size 35mm * 35mm -150mm
* 130mm, with one press head
 2 camera as Image processing for pattern
matching with reflective illumination
 Pressing speed 2.0 sec / stroke
 Panel thickness at 0.05mm – 1.0mm
 Press accuracy ±20um
 Position Accuracy ± 50um
 With 2 camera
 Bonded material size at 5mm * 5mm 50mm *50mm
 Panel size 250mm * 250mm – 520mm * 520mm
 Panel thickness at 0.05mm – 1.0mm
Description
Tolerance
a
± 0.03mm
± 0.05mm
ACF/ZIF finger distance to board edge
b
± 0.05mm
Outline
c
± 0.05mm
Coverlay edge to board edge
d
± 0.05mm
Stiffener position
e
± 0.10mm
ACF/ZIF finger distance tolerance (length =<25mm)
ACF/ZIF finger distance tolerance (length = >25mm)
Adhesive material (±0.10% of length)
Non Adhesive material (±0.20% of length)
Value Added Capability
WORR Automatic Dual Station
Stiffener Bonding
 Roll material are pressed through servo press
 Bonding is made against on the product integrated control servo
motor by x-robot & servo motor & CCD camera
WORR Auto Coverlay Bonding
Configuration:- Once supplied coverlay with conveyor belt by manually,
transferred by the conveyor belt, through vacuum head & positioning or rotating
by servo motor, alignment via vision, before pre-bonding
Description
Capabilities
Description
Capabilities
Max Work Size
500*400mm
Max Work Size
500*500mm
Tact Time
1-1.2sec
Coverlay Size Max
250*200mm (sheet type)
Bonding Accuracy
±100µm
Tact Time
6 sec
Top & Bottom CCD FOV
1024*768 pixel
CCD FOV
1024*768 pixel
Table Temperature Tolerance
±10°C
Bonding Accuracy
±100µm
Table
Vacuum system & heater
Value Added Capability
SOLUF Semi Auto Stiffener Bonding
SEIYU Auto Puncher with Load & Unloading System
Description
Capabilities
For flexible printed circuit metal / FR4 or rigid stiffener pre lamination
Working Area
330*250mm
Heating Temperature 170°C
Thickness
0.05-1.0mm
Working area 290*280mm
Alignment Mode
Pinning
Press Power Force
Servo Power
Press Force
25 Ton
Mold Size
200*255mm
Press Speed
3-5sec
5x air cylinder for pressure platen
Built-in fixture or offline fixture changeable
Encapsulation Capability
Nordson Asymtek Dispensing (Underfill)
 Underfill comprised of a fill liquid polymer, silica filled epoxy, dispensed along edges of a flip
chip
 Surface tension forces draw the material under the die
 Auto dispensing system eliminate process variation
 Software managed temperature, fluid and air pressure provide closed-loop control that
eliminates the needs for operator adjustment
 Tight temperature control using software manage jet / needle heaters
 Non contact jetting
Description
Capabilities
X-Y Placement Accuracy
±0.05mm
X.Y Z Repeatability
±0.05mm
X.Y Velocity
1 m/s peak
Camera Resolution
640*480 pixels
Camera Field of View
7.0*5.0mm
Camera Lighting
LED
Legend Printing Capability
Xeilli Automated Inkjet Legend Printing
To print legend for identification and labelling according to customer demands
Description
Capabilities
Max. Board Size
610*762mm
Board Thickness
0.1῀5.5mm
Max. Thickness
10mm
No of Nozzles
1024
Min. Line Width
75µm
Min. Character
500µm*400µm
Accuracy
±35µm
Depth of Focus
1.5mm
Registration
CCD camera, 3 points registration
Printing Mode
True A-A or A-B side
Throughput/hour
32 sides (1440x720mm)
Reliability Test Capability
Test Item
1) Dynamic Sliding/Slider
2) Dynamic Hinge/Flip
3) Static/Folding
4) Thermal Shock (AIR)
5) Thermal Shock (LIQUID)
6) Humidity Chamber
7) Shear Force
8) Peel Strength
9) Solder Float
10) Solderability Test
11) Hi-pot Tester
Test Conditions
•Speed : 25, 30, 60 (Customer define)
•Stroke : 25, 30, 35mm
•Radius : 0.9, 1.0, 1.5, 2.0mm
•Temp : 25deg C to -10deg C
•Cycles : Test to failure (Customer define)
•Radius : 3mm
•Speed : 120, 250, 350 rpm
•Temp : 25deg C
•Diameter : 1.5 to 15mm
•Speed : 60X / min
•Angle : 0 ~ 180 deg
•Temp : 25deg C
•Max temp : +125C for 30mins (High)
•Min temp : -40C for 30mins (Low)
•Duration : 10 ~ 1000 cycles
•Max temp : +125C for 5mins (High)
•Min temp : -55C for 5mins (Low)
•Duration : 100 ~ 300 cycles
•Temp : 85deg C
•Humidity 95%RH
•Duration : 240 hrs
2
1
9
3
4
•Min spec : 0.8kgf
•Temp : 25deg C
•Speed : 0.8mm/sec
•Temp : 25deg C
•IPC TM 650 2.4.9
•IPC TM 650 2.6.8
•Method A (260 deg C)
•Method B (288 deg C)
•Duration : 10 sec
*Pre-condition : 1hr /155 deg C
•Inert gas chamber <100ppm O2
•Solderability of SMD from 02001
•Temp : 30 – 400 deg C
•Power source : 220 VAC
•Frequency : 50 Hz
•Current range 0῀20mA
5
7
6
8
11
10