THE STERLING GROUP MISSION VIETNAM 2013 Time: 14h00 – 15h00, September 10, 2013 Meeting room: C1-222, Hanoi University of Science and Technology, No. 1, Dai Co Viet Road, Hanoi Lecturers’ biographies Lecture abstracts Prof. Steve J Bull (MA PhD FIMMM FInstP CEng) Chairman of the Sterling Group Cookson Group Chair of Engineering Materials School of Chemical Engineering and Advanced Materials Newcastle University Merz Court, Newcastle upon Tyne, NE1 7RU, UK Tel: +44 191 222 7913 Email: steve.bull@ncl.ac.uk Title: Designing products using nanostructured materials and coatings Professor Steve Bull is Cookson Group Chair of Engineering Materials in the School of Chemical Engineering and Advanced Materials at Newcastle. He has over twenty five years experience in research on structure-property relationships in thin films and coatings having spent eight years at AEA Technology, Harwell running coating activities before moving to Newcastle University in 1996. His current research is focussed on the relationship between functional properties (e.g. electrical or optical) and the mechanical response of sub-micron multilayered and porous coating systems. The properties of thin (submicron) layers are often critical in dictating device performance in electronic and optical applications such as in the microchips and displays in mobile phones. For instance plastic deformation of thin metal lines used in semiconductor metallisation can influence the reliability of microelectronic devices by controlling failure modes such as stressmigration. Also, thin metal layers may be used in the joining of ceramic components (e.g. copper in the diffusion bonding of alumina insulators). One key issue is that the properties of these metals may change during processing (e.g. by rapid thermal annealing or during bonding) and a direct measurement of their properties is required. Designing products based on these coating requires engineering design methods that work at the nanometre scale and high quality property data for the materials to be used. Audience: Students and academics with background in Chemical Engineering, Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, Materials Engineering, Engineering Design, Physics His work combines property measurement at high spatial resolution with theoretical analysis to understand and interpret the data generated. A particular emphasis of recent work is the understanding of fracture processes in multilayer coatings and the development of predictive modelling approaches to provide data for design. He is currently working on the fracture properties of solar control coatings on glass, Whereas relatively simple bulk characterisation tests can be adapted stress generation and stress relaxation in semiconductor metallisation to test thin films for many electrical or optical properties it is much 1 and lithium ion battery electrodes and strain control in strained more difficult to make mechanical measurements of such small silicon/silicon germanium substrates for high speed microelectronic volumes of material. Nanoindentation is one of the few methods devices. available that can measure the elastic and plastic properties of semiconductor metallisation at a scale of an individual device but He has published over 180 papers in refereed journals and is regularly may be affected by the constraint from surrounding materials; invited to present his work at International conferences. measurements in a blanket thin film often give different results to those obtained from an individual metallisation line. This presentation will discuss how to accurately measure the properties of very thin coatings and isolated submicron patterned metal lines. It will also discuss the effects of testing thin bonding layers edge-on, where constraint from the materials to be joined is significant. The use of finite element modelling to assess the validity of test data and for subsequent component design will be highlighted. The talk will be illustrated with examples for a range of current applications including copper metallisation in microchips, multilayer coatings for solar control and self cleaning glass and flexible lighting based on organic light emitting diodes (OLEDs). 2