EE187: VLSI and ULSI Technology (3-0-6)
Prof. Y.C. Tai
Office: Moore 11
Email: yctai@mems.caltech.edu
Overview of the Course:
This is more of a senior/graduate course on silicon VLSI/ULSI technology. The time has gone from
VLSI to ULSI (as many include this as nanotechnology), where there are more than 10 million
transistors per chip. This course is designed to cover the fundamental theory and state-of-the-art
micro/nano technologies for the make of ULSI including BJT, CMOS and BiCMOS. Technological
topics in this course include lithography, oxidation, diffusion, ion implantation, thin-film deposition,
wet and dry etching, metalization, micromachining. Scientific topics include the use of physics,
chemistry, thermal dynamics, mechanics and engineering.
Main Course Materials:
Class Notes and Reference books
Homework:
There will be (totally 5-6) weekly problem sets for the term. Homework solutions will be available
after your homeworks are graded. Late homeworks will have no credit except for medical extension.
No collaboration on homeworks is allowed, but sufficient TA time will be available.
Final Term-Paper and Presentation:
There will be no written midterm and final exams for this course. Instead, a final paper will be
required. You can pick your own topic but it has to be approved by the instructor in advance
(preferably around the mid-term time). If you need help, there will be a list of suggested topics for
your reference. The term paper is limited to 3-5 pages of single-spaced text, but no limit on figures
or exhibits. The grading on the term paper depends on its originality, creativity, depth and level of
work, etc. Equally important, a 10 minute presentation (during the final-exam period) based on your
final-paper is required. Grading on your presentation will depend on your effort, not English.
Grading:
Note that graduate and undergraduate students will be graded separately so no competition between
the two groups, and the final grades depend on:
Homework
60%
Final Paper
20%
Presentation
20%
(Optional) Textbook:
Silicon Processing for the VLSI Era, Volume 1 – Process Technology, 2nd Edition or newer
version, S. Wolf and R.N. Tauber, Lattice Press, ISBN 0-9616721-6-1
Reference Books
1. S.A. Campbell, “The Science and Engineering of Microelectronic Fabrication,” 1996, Oxford.
2. C.Y. Chang and S.M. Sze, “ULSI Technology,” 1996, McGraw-Hill Book Co.
3. C. Wang, “Introduction to Semiconductor Technology,” 1990, John Wiley & Sons
4. S.M. Sze, "VLSI Technology," 1983, McGraw-Hill Book Co.
5. S. Wolf and R.N. Tauber, " Silicon Processing," Vol. 2 and 3, Lattice Press.
6. S.K. Ghandhi, "VLSI Fabrication Principles," John Wiley & Sons.
7. L. Maissel & R. Glang, “Handbook of Thin Film Technology,” 1970, McGraw-Hill Book Co.
8. S.K. Ghandhi, "The Theory and Practice of Microelectronics," John Wiley & Sons.
9. R.A. Colclaser, "Microelectronics -- Processing and Device Design,"
10. A.S. Grove, "Physics and Technology of Semiconductor Devices," John Wiley & Sons
11. G.W. Neudeck and R.F. Pierret, "Introduction to Microelectronic Fabrication,"
12. R.S. Muller and T.I. Kamins, "Device Electronics for Integrated Circuits,"
13. S.M. Sze, "Physics of Semiconductor Devices," Newest version.
14. H.F. Wolf, "Semiconductors,"John Wiley & Sons Inc.
15. J. Vossen and W. Kern, “Thin Film Processes I&II” Academic Press, Inc.
16. Runyan & Bean, “Semiconductor Integrated Circuit Processing Technology,” Adison-Wesley, Inc.
17. Beadle, Tsai, and Plummer, "Quick Reference Manual for Si IC Technology," Bell Lab.