2014 LESTER EASTMAN CONFERENCE ON
HIGH PERFORMANCE DEVICES
Technically Co-sponsored by the IEEE Electron Devices Society (EDS)
August 5th–7th, 2014 (Tuesday-Thursday)
Duffield Hall, Cornell University, Ithaca, New York, USA
Final Call for Abstracts
Submission Deadline Extended to June 7th, 2014
Brief History of LEC. The Lester Eastman Conference on High Performance Devices is a
biennial conference. It was officially renamed in 2002 from the IEEE-Cornell Conference on
High Performance Devices to honor Professor Lester Eastman, a pioneer in the field of high
performance devices based on compound semiconductors. In 1967, Professor Eastman
originated the biennial IEEE-Cornell Conference in Microwave Semiconductors shortly after he
started GaAs research at Cornell in 1965. The conference was later renamed the IEEE-Cornell
Conference on High Performance Devices. Professor Eastman graduated 125 Ph.D. students,
more than 40 M.S. students, and hosted more than 80 postdocs and visiting scientists between
1958 and 2010. Some of the legendary contributions from the Eastman group include high
quality GaAs epitaxy, delta-doping, the first lattice-matched InGaAs channel HEMT, T-gate,
ballistic devices and polarization effects in GaN. In memory of Professor Eastman’s passing in
2013, the 2014 conference will feature a special technical session with invited speakers to honor
his technical contributions to the industry in the high performance compound semiconductor
device area.
The 2014 Lester Eastman Conference returns to the location of its origin – the beautiful campus
of Cornell University in Ithaca, New York. Cornell University, in the scenic Finger Lakes region
of New York State, is conveniently located 5 miles from Ithaca/Tompkins Airport, a 1-hour drive
from Syracuse Hancock International Airport, or a 3.5-hour drive from New York City. The
conference center Duffield Hall, opened in 2004, houses two national nano-technology centers.
Submission. The submission of Abstracts are extended to June 7th, 2014.
Submit 2-page abstracts online at http://www.leconf.com/. Abstracts should clearly state the
purpose of the work, specific results and how the high performance device technology is
advanced. Please indicate if it is a student paper thus eligible for student paper award
competition. Please note that all necessary company and/or government approvals must be
obtained before abstract submission. Instructions on how to submit an abstract to the conference
are available at the Conference Website: http://www.leconf.com/. Accepted abstracts will be used
for the 2014 Lester Eastman Conference Program (CD/memory stick) that will be provided to all
attendees during the conference. Authors of accepted abstracts are strongly encouraged to
submit a full length (4-page) paper; upon review and acceptance (typically within a month),
these papers will be published in the Conference Proceeding, which will be submitted for posting
in IEEE Xplore.
Papers that emphasize innovative device concepts and physical phenomena leading to new
devices are particularly encouraged. Specifically, papers are solicited covering, but not limited
to, the following technical areas:
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High-Speed Devices, Low-Power Switches and IRMMW-THz (high frequency electronics
and optoelectronics; low power and energy efficient switches; quantum cascade lasers;
photodetectors; Schottky and BWO devices; photomixers; waveguides; metamaterials)
Power Conversion, Switching and Transmission (high efficiency/flexible photovoltaics;
high power electronics/switching; normally-off devices)
On-Chip Thermal Management (thermal management for high performance microwave &
millimeter-wave electronics and optoelectronics; measurement techniques/packaging)
“Green” Photonic Technology (photonic devices and systems designed to have reduced
energy consumption or to improve energy efficiency; visible/UV LEDs for lighting/displays;
ultraviolet LEDs for water/air/surface purification and bioscience/monitoring/instrumentation;
photonic techniques for energy generation and transmission; high quantum efficiency
photodetectors/avalanche photodiodes)
Next-Generation Devices (new materials; 2-D crystals; oxides; topological insulators;
nanoelectronics; nanophotonics; plasmonics; spintronics; MEMS; Si photonics)
Confirmed invited speakers
Travis Anderson (Naval Research Lab)
Karim Boutros (Hughes Research Lab)
Paul Chow (Rensselaer Polytechnic Institute)
James Hwang (Lehigh University)
Isik Kizilyalli (Avogy)
Kelin Kuhn (Intel)
Martin Margala (UMass Lowell)
Hideo Ohno (Tohoku University)
Shriram Ramanathan (Harvard)
Jose Silas (Jet Propulsion Lab)
Mike Spencer (Cornell University)
Daniel Twitchen (Element 6)
Gary Wicks (University of Rochester)
John Blevins (Air Force Research Lab)
April Brown (Duke University)
Alex Hains (Microlink Devices)
Jacob Khurgin (John Hopkins)
Erhard Kohn (Ulm University)
Paul Maki (Office of Naval Research)
Umesh Mishra (UC Santa Barbara)
Rajeev Ram (MIT)
Michael Shur (RPI)
Jim Speck (UC Santa Barbara)
Tetsuya Takeuchi (Meijo University)
Dave Welch (Infinera)
Peide Ye (Purdue)
2014 Organizing Committee:
General Chair: …………………Dr. P.C. Chao (BAE Systems)
Program Chair: ……………….. Professor Grace Huili Xing (University of Notre Dame)
Technical Chair: ……………… Dr. Paul Maki (Office of Naval Research)
Local Chair: …………………... Professor Ehsan Afshari (Cornell University)
Professor Mike Spencer (Cornell University)
Treasurer: ……………………...Mr. Timothy D. Richter (Cornell University)
Publicity Chair: ………………..Dr. Joe Smart (HexaTech)
Publication Chair………………Professor Shayla Sawyer (Rensselaer Polytechnic Institute)
Past Conference Chair: ………..Professor Paul Chow (Rensselaer Polytechnic Institute)
2014 Technical Committee:
On Chip Thermal Management:
Avi Bar-Cohen (DARPA) – Chair
Jonathan Felbinger (AAAS/DoD) – Co-Chair
C.L. Chen (University of Missouri, Columbia)
Matt Tyhach (Raytheon)
Power Electronics:
Patrick Fay (University of Notre Dame) – Chair
Eldad Bahat-Treidel (Ferdinand-Braun Institue)
Vivek Mehotra (Teledyne Scientific Imaging)
Lucy (Junxia) Shi (University of Illinois, Chicago)
Joe Smart (Hexatech)
Chris Youtsey (Microlink)
Next Generation:
Mike Gerhold (Army Research Office) - Chair
James Hwang (Lehigh University)
Debdeep Jena (Notre Dame)
Shriram Shivaraman (Intel)
Green Photonics:
Kei May Lau (Hong Kong University of Science and Technology) – Chair
Siddharth Rajan (Ohio State University)
Mike Wraback (Army Research Laboratory)
Yuji Zhao (UC Santa Barbara)
Electronics/IRMMW-THz:
Eric Lind (Lund University) – Chair
Tomas Bryllert (Chalmers)
Joe Qiu (Army Research Office)
Berardi Sensale-Rodriguez (University of Utah)
Uttam Singisetti (SUNY-Buffalo)
Special Session
Leda Lunardi (North Carolina State University) – Chair
Michael Shur (Rensselaer Polytechnic Institute)