Standard Resistor Values (± ± 5%) 1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 1.0K 1.1K 1.2K 1.3K 1.5K 1.6K 1.8K 2.0K 2.2K 2.4K 2.7K 3.0K 3.3K 3.6K 3.9K 4.3K 4.7K 5.1K 5.6K 6.2K 6.8K 7.5K 8.2K 9.1K 10K 11K 12K 13K 15K 16K 18K 20K 22K 24K 27K 30K 33K 36K 39K 43K 47K 51K 56K 62K 68K 75K 82K 91K 100K 110K 120K 130K 150K 160K 180K 200K 220K 240K 270K 300K 330K 360K 390K 430K 470K 510K 560K 620K 680K 750K 820K 910K 1.0M 1.1M 1.2M 1.3M 1.5M 1.6M 1.8M 2.0M 2.2M 2.4M 2.7M 3.0M 3.3M 3.6M 3.9M 4.3M 4.7M 5.1M 5.6M 6.2M 6.8M 7.5M 8.2M 9.1M Standard Capacitor Values (± ± 10%) 10pF 12pF 15pF 18pF 22pF 27pF 33pF 39pF 47pF 56pF 68pF 82pF 100pF 120pF 150pF 180pF 220pF 270pF 330pF 390pF 470pF 560pF 680pF 820pF 1000pF 1200pF 1500pF 1800pF 2200pF 2700pF 3300pF 3900pF 4700pF 5600pF 6800pF 8200pF .010µF .012µF .015µF .018µF .022µF .027µF .033µF .039µF .047µF .056µF .068µF .082µF .10µF .12µF .15µF .18µF .22µF .27µF .33µF .39µF .47µF .56µF .68µF .82µF 1.0µF 1.2µF 1.5µF 1.8µF 2.2µF 2.7µF 3.3µF 3.9µF 4.7µF 5.6µF 6.8µF 8.2µF 10µF 22µF 33µF 47uF LM139/LM239/LM339/LM2901/LM3302 Low Power Low Offset Voltage Quad Comparators General Description Features The LM139 series consists of four independent precision voltage comparators with an offset voltage specification as low as 2 mV max for all four comparators. These were designed specifically to operate from a single power supply over a wide range of voltages. Operation from split power supplies is also possible and the low power supply current drain is independent of the magnitude of the power supply voltage. These comparators also have a unique characteristic in that the input common-mode voltage range includes ground, even though operated from a single power supply voltage. n n n n n Application areas include limit comparators, simple analog to digital converters; pulse, squarewave and time delay generators; wide range VCO; MOS clock timers; multivibrators and high voltage digital logic gates. The LM139 series was designed to directly interface with TTL and CMOS. When operated from both plus and minus power supplies, they will directly interface with MOS logic — where the low power drain of the LM339 is a distinct advantage over standard comparators. n n n n n n n Wide supply voltage range LM139/139A Series 2 to 36 VDC or ± 1 to ± 18 VDC LM2901: 2 to 36 VDC or ± 1 to ± 18 VDC LM3302: 2 to 28 VDC or ± 1 to ± 14 VDC Very low supply current drain (0.8 mA) — independent of supply voltage Low input biasing current: 25 nA ± 5 nA Low input offset current: ± 3 mV Offset voltage: Input common-mode voltage range includes GND Differential input voltage range equal to the power supply voltage Low output saturation voltage: 250 mV at 4 mA Output voltage compatible with TTL, DTL, ECL, MOS and CMOS logic systems Advantages n n n n n n High precision comparators Reduced VOS drift over temperature Eliminates need for dual supplies Allows sensing near GND Compatible with all forms of logic Power drain suitable for battery operation One-Shot Multivibrator with Input Lock Out 00570612 © 2004 National Semiconductor Corporation DS005706 www.national.com LM139/LM239/LM339/LM2901/LM3302 Low Power Low Offset Voltage Quad Comparators March 2004 LM139/LM239/LM339/LM2901/LM3302 Distributors for availability and specifications. Absolute Maximum Ratings (Note 10) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ LM139/LM239/LM339 LM139A/LM239A/LM339A LM3302 LM2901 Supply Voltage, V+ 36 VDC or ± 18 VDC 28 VDC or ± 14 VDC 36 VDC 28 VDC −0.3 VDC to +36 VDC −0.3 VDC to +28 VDC 50 mA 50 mA Molded DIP 1050 mW 1050 mW Cavity DIP 1190 mW Small Outline Package 760 mW Differential Input Voltage (Note 8) Input Voltage Input Current (VIN < −0.3 VDC), (Note 3) Power Dissipation (Note 1) Output Short-Circuit to GND, (Note 2) Storage Temperature Range Continuous Continuous −65˚C to +150˚C −65˚C to +150˚C Lead Temperature (Soldering, 10 seconds) 260˚C 260˚C Operating Temperature Range −40˚C to +85˚C LM339/LM339A 0˚C to +70˚C LM239/LM239A −25˚C to +85˚C LM2901 −40˚C to +85˚C LM139/LM139A −55˚C to +125˚C Soldering Information Dual-In-Line Package Soldering (10 seconds) 260˚C 260˚C Vapor Phase (60 seconds) 215˚C 215˚C Infrared (15 seconds) 220˚C 220˚C Small Outline Package See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. ESD rating (1.5 kΩ in series with 100 pF) 600V 600V Electrical Characteristics (V+=5 VDC, TA = 25˚C, unless otherwise stated) Parameter Conditions LM139A Min Typ LM239A, LM339A Max Min Typ LM139 Max Min Typ Units Max Input Offset Voltage (Note 9) 1.0 2.0 1.0 2.0 2.0 5.0 mVDC Input Bias Current IIN(+) or IIN(−) with Output in 25 100 25 250 25 100 nADC 25 5.0 50 3.0 25 nADC Linear Range, (Note 5), VCM=0V Input Offset Current Input Common-Mode Voltage Range Supply Current IIN(+)−IIN(−), VCM=0V + V =30 VDC (LM3302, 3.0 + 0 V −1.5 + 0 V −1.5 + 0 V −1.5 VDC V+ = 28 VDC) (Note 6) RL = ∞ on all Comparators, 0.8 2.0 RL = ∞, V+ = 36V, 0.8 2.0 0.8 2.0 mADC 1.0 2.5 1.0 2.5 mADC (LM3302, V+ = 28 VDC) Voltage Gain RL≥15 kΩ, V+ = 15 VDC 50 200 50 200 50 200 V/mV 300 ns VO = 1 VDC to 11 VDC Large Signal Response Time www.national.com VIN = TTL Logic Swing, VREF = 300 1.4 VDC, VRL = 5 VDC, 2 300 (Continued) (V+=5 VDC, TA = 25˚C, unless otherwise stated) Parameter Conditions LM139A Min Typ LM239A, LM339A Max Min Typ Max LM139 Min Typ Units Max RL = 5.1 kΩ Response Time VRL = 5 VDC, RL = 5.1 kΩ, Output Sink Current VIN(−) = 1 VDC, VIN(+) = 0, 1.3 1.3 1.3 µs 16 mADC (Note 7) 6.0 16 6.0 16 6.0 VO ≤ 1.5 VDC Saturation Voltage VIN(−) = 1 VDC, VIN(+) = 0, 250 400 250 400 250 400 mVDC ISINK ≤ 4 mA Output Leakage Current VIN(+) = 1 VDC,VIN(−) = 0, 0.1 0.1 0.1 nADC VO = 5 VDC Electrical Characteristics (V+ = 5 VDC, TA = 25˚C, unless otherwise stated) Parameter Conditions LM239, LM339 Min Typ LM2901 Max Min Typ LM3302 Max Min Typ Units Max Input Offset Voltage (Note 9) 2.0 5.0 2.0 7.0 3 20 mVDC Input Bias Current IIN(+) or IIN(−) with Output in 25 250 25 250 25 500 nADC Input Offset Current IIN(+)−IIN(−), VCM = 0V Input Common-Mode V+ = 30 VDC (LM3302, Linear Range, (Note 5), VCM=0V Voltage Range Supply Current 5.0 50 V+−1.5 0 5 50 V+−1.5 0 3 0 100 nADC V+−1.5 VDC + V = 28 VDC) (Note 6) RL = ∞ on all Comparators, 0.8 2.0 0.8 2.0 0.8 2.0 mADC RL = ∞, V+ = 36V, 1.0 2.5 1.0 2.5 1.0 2.5 mADC (LM3302, V+ = 28 VDC) Voltage Gain RL ≥ 15 kΩ, V+ = 15 VDC 50 200 25 100 2 30 V/mV VO = 1 VDC to 11 VDC Large Signal Response Time VIN = TTL Logic Swing, VREF = 300 300 300 ns 1.3 1.3 1.3 µs 16 mADC 1.4 VDC, VRL = 5 VDC, RL = 5.1 kΩ, Response Time VRL = 5 VDC, RL = 5.1 kΩ, Output Sink Current VIN(−)= 1 VDC, VIN(+) = 0, (Note 7) 6.0 16 6.0 16 6.0 VO ≤ 1.5 VDC Saturation Voltage VIN(−) = 1 VDC, VIN(+) = 0, Output Leakage VIN(+) = 1 VDC,VIN(−) = 0, 250 400 250 400 250 500 mVDC ISINK ≤ 4 mA Current 0.1 0.1 0.1 nADC LM139 Units VO = 5 VDC Electrical Characteristics (V+ = 5.0 VDC, (Note 4)) Parameter Conditions LM139A Min Typ Max LM239A, LM339A Min Typ Max Min Typ Max Input Offset Voltage (Note 9) 4.0 4.0 9.0 Input Offset Current IIN(+)−IIN(−), VCM = 0V 100 150 100 mVDC nADC Input Bias Current IIN(+) or IIN(−) with Output in 300 400 300 nADC Input Common-Mode V+=30 VDC (LM3302, V+−2.0 VDC Voltage Range V+ = 28 VDC) (Note 6) Linear Range, VCM = 0V (Note 5) 0 3 V+−2.0 0 V+−2.0 0 www.national.com LM139/LM239/LM339/LM2901/LM3302 Electrical Characteristics LM139/LM239/LM339/LM2901/LM3302 Electrical Characteristics (Continued) (V+ = 5.0 VDC, (Note 4)) Parameter Conditions LM139A Min Typ Saturation Voltage VIN(−)=1 VDC, VIN(+) = 0, LM239A, LM339A Max Min Typ Max LM139 Min Typ Units Max 700 700 700 mVDC 1.0 1.0 1.0 µADC 36 36 36 VDC ISINK ≤ 4 mA Output Leakage Current VIN(+) = 1 VDC, VIN(−) = 0, VO = 30 VDC, (LM3302, VO = 28 VDC) Keep all VIN’s ≥ 0 VDC (or V−, Differential Input Voltage if used), (Note 8) Electrical Characteristics (V+ = 5.0 VDC, (Note 4)) Parameter Conditions LM239, LM339 Min Typ Max LM2901 Min Typ LM3302 Max Min Typ Units Max Input Offset Voltage (Note 9) 9.0 9 15 40 Input Offset Current IIN(+)−IIN(−), VCM = 0V 150 50 200 300 mVDC nADC Input Bias Current IIN(+) or IIN(−) with Output in 400 200 500 1000 nADC V+−2.0 VDC 700 700 mVDC 1.0 1.0 1.0 µADC 36 36 28 VDC Linear Range, VCM = 0V (Note 5) Input Common-Mode V+ = 30 VDC (LM3302, V+ = 28 VDC) Voltage Range (Note 6) Saturation Voltage VIN(−) = 1 VDC, VIN(+) = 0, V+−2.0 700 V+−2.0 0 400 0 ISINK ≤ 4 mA Output Leakage Current VIN(+) = 1 VDC, VIN(−) = 0, VO = 30 VDC, (LM3302, V O = 28 VDC) Differential Input Voltage Keep all VIN’s ≥ 0 VDC (or V−, if used), (Note 8) Note 1: For operating at high temperatures, the LM339/LM339A, LM2901, LM3302 must be derated based on a 125˚C maximum junction temperature and a thermal resistance of 95˚C/W which applies for the device soldered in a printed circuit board, operating in a still air ambient. The LM239 and LM139 must be derated based on a 150˚C maximum junction temperature. The low bias dissipation and the “ON-OFF” characteristic of the outputs keeps the chip dissipation very small (PD≤100 mW), provided the output transistors are allowed to saturate. Note 2: Short circuits from the output to V+ can cause excessive heating and eventual destruction. When considering short circuits to ground, the maximum output current is approximately 20 mA independent of the magnitude of V+. Note 3: This input current will only exist when the voltage at any of the input leads is driven negative. It is due to the collector-base junction of the input PNP transistors becoming forward biased and thereby acting as input diode clamps. In addition to this diode action, there is also lateral NPN parasitic transistor action on the IC chip. This transistor action can cause the output voltages of the comparators to go to the V+ voltage level (or to ground for a large overdrive) for the time duration that an input is driven negative. This is not destructive and normal output states will re-establish when the input voltage, which was negative, again returns to a value greater than −0.3 VDC (at 25˚)C. Note 4: These specifications are limited to −55˚C ≤ TA ≤ +125˚C, for the LM139/LM139A. With the LM239/LM239A, all temperature specifications are limited to −25˚C ≤ TA ≤ +85˚C, the LM339/LM339A temperature specifications are limited to 0˚C ≤ TA ≤ +70˚C, and the LM2901, LM3302 temperature range is −40˚C ≤ TA ≤ +85˚C. Note 5: The direction of the input current is out of the IC due to the PNP input stage. This current is essentially constant, independent of the state of the output so no loading change exists on the reference or input lines. Note 6: The input common-mode voltage or either input signal voltage should not be allowed to go negative by more than 0.3V. The upper end of the common-mode voltage range is V+ −1.5V at 25˚C, but either or both inputs can go to +30 VDC without damage (25V for LM3302), independent of the magnitude of V+. Note 7: The response time specified is a 100 mV input step with 5 mV overdrive. For larger overdrive signals 300 ns can be obtained, see typical performance characteristics section. Note 8: Positive excursions of input voltage may exceed the power supply level. As long as the other voltage remains within the common-mode range, the comparator will provide a proper output state. The low input voltage state must not be less than −0.3 VDC (or 0.3 VDCbelow the magnitude of the negative power supply, if used) (at 25˚C). Note 9: At output switch point, VO.1.4 VDC, RS = 0Ω with V+ from 5 VDC to 30 VDC; and over the full input common-mode range (0 VDC to V+ −1.5 VDC), at 25˚C. For LM3302, V+ from 5 VDC to 28 VDC. Note 10: Refer to RETS139AX for LM139A military specifications and to RETS139X for LM139 military specifications. www.national.com 4 MM54HC05/MM74HC05 Hex Inverter (Open Drain) General Description Features The MM54HC05/MM74HC05 are logic functions fabricated by using advanced silicon-gate CMOS technology, which provides the inherent benefits of CMOSÐlow quiescent power and wide power supply range. These devices are also functionally and pin-out compatible with standard DM54LS/DM74LS logic families. The MM54HC05/ MM74HC05 open drain Hex Inverter requires the addition of an external resistor to perform a wire-NOR function. All inputs are protected from static discharge damage by internal diodes to VCC and ground. Y Y Y Y Open drain for wire-NOR function Fanout of 10 LS-TTL loads Typical propagation delays: tPZL (with 1 kX resistor) 8 ns tPLZ (with 1 kX resistor) 13 ns Low input current: 1 mA maximum Connection Diagram Dual-In-Line Package TL/F/9388 – 1 Top View Order Number MM54HC05 or MM74HC05 Logic Diagram Typical Application TL/F/9388 – 2 TL/F/9388 – 3 Note: Can be extended to more than 2 inputs. C1995 National Semiconductor Corporation TL/F/9388 RRD-B30M105/Printed in U. S. A. MM54HC05/MM74HC05 Hex Inverter (Open Drain) January 1988 Absolute Maximum Ratings (Notes 1 & 2) Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage (VCC) DC Input or Output Voltage (VIN, VOUT) Operating Temp. Range (TA) MM74HC MM54HC Input Rise or Fall Times (tr, tf) VCC e 2.0V VCC e 4.5V VCC e 6.0V b 0.5V to a 7.0V Supply Voltage (VCC) b 1.5V to VCC a 1.5V DC Input Voltage (VIN) b 0.5V to VCC a 0.5V DC Output Voltage (VOUT) g 20 mA Clamp Diode Current (IIK, IOK) g 25 mA DC Output Current, per pin (IOUT) g 50 mA DC VCC or GND Current, per pin (ICC) b 65§ C to a 150§ C Storage Temperature Range (TSTG) Power Dissipation (PD) (Note 3) 600 mW S.O. Package only 500 mW Lead Temperature (TL) (Soldering 10 seconds) 260§ C DC Electrical Characteristics Symbol Parameter Conditions Min 2 0 Max 6 VCC Units V V b 40 b 55 a 85 a 125 §C §C 1000 500 400 ns ns ns (Note 4) VCC TA e 25§ C 74HC 54HC TA eb40§ C to a 85§ C TA eb55§ C to a 125§ C Units Typ Guaranteed Limits VIH Minimum High Level Input Voltage 2.0V 4.5V 6.0V 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 V V V VIL Maximum Low Level Input Voltage** 2.0V 4.5V 6.0V 0.5 1.35 1.8 0.5 1.35 1.8 0.5 1.35 1.8 V V V VOL Maximum Low Level Output Voltage VIN e VIH lIOUTl s20 mA RL e % VIN e VIH lIOUTl s4.0 mA lIOUTl s5.2 mA 2.0V 4.5V 6.0V 0 0 0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V V V 4.5V 6.0V 0.2 0.2 0.26 0.26 0.33 0.33 0.4 0.4 V V 0.5 5 10 mA g 0.1 g 1.0 g 1.0 mA 2.0 20 40 mA ILKG Maximum High Level VIN e VIH or VIL Output Leakage Current VOUT e VCC 6.0V IIN Maximum Input Current VIN e VCC or GND 6.0V ICC Maximum Quiescent Supply Current VIN e VCC or GND 6.0V IOUT e 0 mA Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Note 2: Unless otherwise specified all voltages are referenced to ground. Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package: b 12 mW/§ C from 65§ C to 85§ C; ceramic ‘‘J’’ package: b 12 mW/§ C from 100§ C to 125§ C. Note 4: For a power supply of 5V g 10% the worst case output voltages (VOH and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC e 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. **VIL limits are currently tested at 20% of VCC. The above VIL specification (30% of VCC) will be implemented no later than Q1, CY’89. 2 AC Electrical Characteristics VCC e 5V, TA e 25§ C, CL e 15 pF, tr e tf e 6 ns Symbol Parameter Conditions Typ tPZL, tPLZ Maximum Propagation Delay RL e 1 kX 8 AC Electrical Characteristics Symbol Parameter Conditions Guaranteed Limit Units ns VCC e 2.0V to 6.0V, CL e 50 pF, tr e tf e 6 ns unless otherwise specified VCC TA e 25§ C Typ 74HC TA eb40§ C to a 85§ C 54HC TA eb55§ C to a 125§ C Units Guaranteed Limits tPZL Maximum Propagation Delay RL e 1 kX 2.0V 4.5V 6.0V 30 8 7 75 15 13 95 19 16 110 22 19 ns ns ns tPLZ Maximum Propagation Delay RL e 1 kX 2.0V 4.5V 6.0V 30 13 12 90 18 15 115 23 20 135 27 23 ns ns ns tTHL Maximum Output Fall Time 2.0V 4.5V 6.0V 30 8 7 75 15 13 95 19 16 110 22 19 ns ns ns CPD Power Dissipation Capacitance (Note 5) CIN Maximum Input Capacitance (per gate) 8 5 pF 10 10 10 pF Note 5: CPD determines the no load dynamic power consumption, PD e CPD VCC2 f a ICC VCC, and the no load dynamic current consumption, IS e CPD VCC f a ICC. The power dissipated by RL is not included. Physical Dimensions inches (millimeters) Order Number MM54HC05J or MM74HC05J NS Package Number J14A 3 SLRS007B − NOVEMBER 1986 − REVISED NOVEMBER 1995 • • • • • • • • • • • • • • NE PACKAGE (TOP VIEW) 1-A Output-Current Capability Per Driver Applications Include Half-H and Full-H Solenoid Drivers and Motor Drivers Designed for Positive-Supply Applications Wide Supply-Voltage Range of 4.5 V to 36 V TTL- and CMOS-Compatible High-Impedance Diode-Clamped Inputs Separate Input-Logic Supply Thermal Shutdown Internal ESD Protection Input Hysteresis Improves Noise Immunity 3-State Outputs Minimized Power Dissipation Sink/Source Interlock Circuitry Prevents Simultaneous Conduction No Output Glitch During Power Up or Power Down Improved Functional Replacement for the SGS L293 1,2EN 1A 1Y HEAT SINK AND GROUND 1 16 2 15 3 14 4 13 5 12 2Y 2A 6 11 7 10 VCC2 8 9 VCC1 4A 4Y HEAT SINK AND GROUND 3Y 3A 3,4EN FUNCTION TABLE (each driver) INPUTS† OUTPUT A EN Y H H H L H L X L Z H = high-level, L = low-level X = irrelevant Z = high-impedance (off) † In the thermal shutdown mode, the output is in a highimpedance state regardless of the input levels. description The SN754410 is a quadruple high-current half-H driver designed to provide bidirectional drive currents up to 1 A at voltages from 4.5 V to 36 V. The device is designed to drive inductive loads such as relays, solenoids, dc and bipolar stepping motors, as well as other high-current/high-voltage loads in positive-supply applications. All inputs are compatible with TTL-and low-level CMOS logic. Each output (Y) is a complete totem-pole driver with a Darlington transistor sink and a pseudo-Darlington source. Drivers are enabled in pairs with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4 enabled by 3,4EN. When an enable input is high, the associated drivers are enabled and their outputs become active and in phase with their inputs. When the enable input is low, those drivers are disabled and their outputs are off and in a high-impedance state. With the proper data inputs, each pair of drivers form a full-H (or bridge) reversible drive suitable for solenoid or motor applications. A separate supply voltage (VCC1) is provided for the logic input circuits to minimize device power dissipation. Supply voltage VCC2 is used for the output circuits. The SN754410 is designed for operation from − 40°C to 85°C. Copyright 1995, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ • DALLAS, TEXAS 75265 • HOUSTON, TEXAS 77251−1443 POST OFFICE BOX 655303 POST OFFICE BOX 1443 1 SLRS007B − NOVEMBER 1986 − REVISED NOVEMBER 1995 logic symbol† 1A 1,2EN 2A 3A 3, 4EN 4A logic diagram 2 3 1 EN 1, 2EN EN 7 6 10 11 9 EN 2A 2Y 3A 3Y 3, 4EN EN 15 1A 1Y 14 4A 4Y 2 3 7 6 10 11 9 15 14 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. schematics of inputs and outputs EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS VCC2 VCC1 Current Source Output Input GND 2 GND • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 1Y 1 2Y 3Y 4Y SLRS007B − NOVEMBER 1986 − REVISED NOVEMBER 1995 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Output supply voltage range, VCC1 (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 36 V Output supply voltage range, VCC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 36 V Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V Output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −3 V to VCC2 + 3 V Peak output current (nonrepetitive, tw ≤ 5 ms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 2 A Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 1.1 A Continuous total power dissipation at (or below) 25°C free-air temperature (see Note 2) . . . . . . . . 2075 mW Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to network GND. 2. For operation above 25°C free-air temperature, derate linearly at the rate of 16.6 mW/°C. To avoid exceeding the design maximum virtual junction temperature, these ratings should not be exceeded. Due to variations in individual device electrical characteristics and thermal resistance, the built-in thermal overload protection can be activated at power levels slightly above or below the rated dissipation. recommended operating conditions MIN MAX Output supply voltage, VCC1 4.5 5.5 V Output supply voltage, VCC2 4.5 36 V High-level input voltage, VIH 2 −0.3‡ 5.5 V 0.8 V −40 125 °C Low-level input voltage, VIL Operating virtual junction temperature, TJ UNIT Operating free-air temperature, TA −40 85 °C ‡ The algebraic convention, in which the least positive (most negative) limit is designated as minimum, is used in this data sheet for logic voltage levels. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 3 SLRS007B − NOVEMBER 1986 − REVISED NOVEMBER 1995 electrical characteristics over recommended ranges of supply voltage and free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VIK Input clamp voltage II = − 12 mA IOH = − 0.5 A VOH High-level output voltage IOH = − 1 A IOH = − 1 A, MIN TJ = 25°C TYP† MAX UNIT −0.9 −1.5 V VCC2 −1.5 VCC2 −2 VCC2 −1.1 VCC2 −1.8 VCC2 −1.4 1 V Low-level output voltage IOL = 0.5 A IOL = 1 A IOL = 1 A, VOKH High-level output clamp voltage IOK = − 0.5 A IOK = 1 A VCC2 + 1.4 VCC2 + 1.9 −2 Low-level output clamp voltage −1.3 −2.5 IOZ(off) Off-state high-impedance-state output current IOK = 0.5 A IOK = − 1 A VO = VCC2 −1.1 VOKL VOL IIH IIL High-level input current VO = 0 VI = 5.5 V Low-level input current VI = 0 ICC1 Output supply current IO = 0 ICC2 Output supply current IO = 0 1.4 2 TJ = 25°C 1.2 V 1.8 VCC2 + 2 VCC2 + 2.5 500 −500 V µA A 10 µA −10 µA All outputs at high level 38 All outputs at low level 70 All outputs at high impedance 25 All outputs at high level 33 All outputs at low level 20 All outputs at high impedance † All typical values are at VCC1 = 5 V, VCC2 = 24 V, TA = 25°C. V mA mA 5 switching characteristics, VCC1 = 5 V, VCC2 = 24 V, CL = 30 pF, TA = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT td1 td2 Delay time, high-to-low-level output from A input 400 ns Delay time, low-to-high-level output from A input 800 ns tTLH tTHL Transition time, low-to-high-level output 300 ns 300 ns tr tf Rise time, pulse input tw ten1 Pulse duration Enable time to the high level 700 ns ten2 tdis1 Enable time to the low level 400 ns 900 ns tdis2 Disable time from the low level 600 ns 4 Transition time, high-to-low-level output See Figure 1 Fall time, pulse input See Figure 2 Disable time from the high level • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • TCRT5000, TCRT5000L Vishay Semiconductors Reflective Optical Sensor with Transistor Output FEATURES • Package type: leaded • Detector type: phototransistor • Dimensions (L x W x H in mm): 10.2 x 5.8 x 7 • Peak operating distance: 2.5 mm • Operating range within > 20 % relative collector current: 0.2 mm to 15 mm 19156_2 • Typical output current under test: IC = 1 mA C • Daylight blocking filter A • Emitter wavelength: 950 nm E Top view • Lead (Pb)-free soldering released C • Compliant to RoHS directive 2002/95/EC accordance to WEEE 2002/96/EC 19156_1 DESCRIPTION APPLICATIONS The TCRT5000 and TCRT5000L are reflective sensors which include an infrared emitter and phototransistor in a leaded package which blocks visible light. The package includes two mounting clips. TCRT5000L is the long lead version. • Position sensor for shaft encoder and in • Detection of reflective material such as paper, IBM cards, magnetic tapes etc. • Limit switch for mechanical motions in VCR • General purpose - wherever the space is limited PRODUCT SUMMARY PART NUMBER DISTANCE FOR MAXIMUM CTRrel (1) (mm) DISTANCE RANGE FOR RELATIVE Iout > 20 % (mm) TYPICAL OUTPUT CURRENT UNDER TEST (2) (mA) DAYLIGHT BLOCKING FILTER INTEGRATED TCRT5000 2.5 0.2 to 15 1 Yes TCRT5000L 2.5 0.2 to 15 1 Yes Notes (1) CTR: current transfere ratio, I /I out in (2) Conditions like in table basic charactristics/sensors ORDERING INFORMATION PACKAGING VOLUME (1) REMARKS TCRT5000 Tube MOQ: 4500 pcs, 50 pcs/tube 3.5 mm lead length TCRT5000L Tube MOQ: 2400 pcs, 48 pcs/tube 15 mm lead length ORDERING CODE Note MOQ: minimum order quantity (1) ABSOLUTE MAXIMUM RATINGS PARAMETER (1) TEST CONDITION SYMBOL VALUE UNIT INPUT (EMITTER) Reverse voltage VR 5 V Forward current IF 60 mA Forward surge current Power dissipation Junction temperature Document Number: 83760 Rev. 1.7, 17-Aug-09 tp ≤ 10 µs IFSM 3 A Tamb ≤ 25 °C PV 100 mW Tj 100 °C For technical questions, contact: sensorstechsupport@vishay.com www.vishay.com 1 TCRT5000, TCRT5000L Reflective Optical Sensor with Transistor Output Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS PARAMETER (1) TEST CONDITION SYMBOL VALUE UNIT Collector emitter voltage VCEO 70 V Emitter collector voltage VECO 5 V OUTPUT (DETECTOR) Collector current Tamb ≤ 55 °C Power dissipation IC 100 mA PV 100 mW Tj 100 °C Junction temperature SENSOR Tamb ≤ 25 °C Total power dissipation Ptot 200 mW Ambient temperature range Tamb - 25 to + 85 °C Storage temperature range Tstg - 25 to + 100 °C Tsd 260 °C 2 mm from case, t ≤ 10 s Soldering temperature Note (1) T amb = 25 °C, unless otherwise specified ABSOLUTE MAXIMUM RATINGS P - Power Dissipation (mW) 300 Coupled device 200 Phototransistor 100 IR - diode 0 25 0 95 11071 75 50 100 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature BASIC CHARACTERISTICS (1) PARAMETER TEST CONDITION SYMBOL IF = 60 mA VR = 0 V, f = 1 MHz MIN. TYP. MAX. VF 1.25 1.5 Cj 17 UNIT INPUT (EMITTER) Forward voltage Junction capacitance V pF Radiant intensity IF = 60 mA, tp = 20 ms Ie Peak wavelength IF = 100 mA λP Method: 63 % encircled energy d Collector emitter voltage IC = 1 mA VCEO 70 V Emitter collector voltage Ie = 100 µA VECO 7 V VCE = 20 V, IF = 0 A, E = 0 lx ICEO VCE = 5 V, IF = 10 mA, D = 12 mm IC (2) (3) IF = 10 mA, IC = 0.1 mA, D = 12 mm VCEsat (2) (3) Virtual source diameter 21 940 mW/sr nm 2.1 mm OUTPUT (DETECTOR) Collector dark current 10 200 nA 1 2.1 mA 0.4 V SENSOR Collector current Collector emitter saturation voltage 0.5 Note Tamb = 25 °C, unless otherwise specified (2) See figure 3 (3) Test surface: mirror (Mfr. Spindler a. Hoyer, Part No. 340005) (1) www.vishay.com 2 For technical questions, contact: sensorstechsupport@vishay.com Document Number: 83760 Rev. 1.7, 17-Aug-09 TCRT5000, TCRT5000L Reflective Optical Sensor with Transistor Output Vishay Semiconductors 94 9226 IF Flat mirror ∅ = 22.5 mm rem. 2 IC VCC d = working distance D = distance 12 ± 0.2 mm TCRT5000 7.0 ± 0.2 mm A 96 12314 Fig. 2 - Test Circuit Fig. 3 - Test Circuit BASIC CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 1000 10 IC - Collector Current (mA) IF - Forward Current (mA) VCE = 5 V 100 10 1 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VF - Forward Voltage (V) 96 11862 1 0.1 0.01 0.001 0.1 96 11763 1.2 1.1 0.9 0.8 0.7 0.6 - 30 - 20 -10 0 10 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) Fig. 5 - Relative Current Transfer Ratio vs. Ambient Temperature Document Number: 83760 Rev. 1.7, 17-Aug-09 100 10 VCE = 5 V I F = 20 mA 1.0 96 11762 10 Fig. 6 - Collector Current vs. Forward Current IC - Collector Current (mA) CTR rel - Relative Current Transfer Ratio Fig. 4 - Forward Current vs. Forward Voltage 1 I F - Forward Current (mA) I F = 50 mA 20 mA 1 10 mA 5 mA 2 mA 0.1 1 mA 0.01 0.1 96 11764 1 10 100 VCE - Collector Emitter Voltage (V) Fig. 7 - Collector Emitter Saturation Voltage vs. Collector Current For technical questions, contact: sensorstechsupport@vishay.com www.vishay.com 3 TCRT5000, TCRT5000L Vishay Semiconductors Reflective Optical Sensor with Transistor Output 1.2 VCE = 5 V I Crel - Relative Collector Current CTR - Current Transfer Ratio (%) 100 10 1 0.1 0.1 96 11765 VCE = 10 V I F = 20 mA 1.0 0.8 0.6 0.4 0.2 0.0 1 10 I F - Forward Current (mA) 100 Fig. 8 - Current Transfer Ratio vs. Forward Current 0 96 11766 4 8 10 12 14 16 2 6 d - Distance to Reflecting Card (mm) Fig. 9 - Relative Collector Current vs. Distance PACKAGE DIMENSIONS in millimeters, TCRT5000 96 12073 www.vishay.com 4 For technical questions, contact: sensorstechsupport@vishay.com Document Number: 83760 Rev. 1.7, 17-Aug-09 PIC32MX3XX/4XX TABLE 29-9: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS DC CHARACTERISTICS Param. Symbol No. VOL DO10 Characteristics OSC2/CLKO VOH DO20 Typical Max. Units Conditions — — 0.4 V IOL = 7 mA, VDD = 3.6V — — 0.4 V IOL = 6 mA, VDD = 2.3V — — 0.4 V IOL = 3.5 mA, VDD = 3.6V — — 0.4 V IOL = 2.5 mA, VDD = 2.3V 2.4 — — V IOH = -12 mA, VDD = 3.6V 1.4 — — V IOH = -12 mA, VDD = 2.3V 2.4 — — V IOH = -12 mA, VDD = 3.6V 1.4 — — V IOH = -12 mA, VDD = 2.3V Output High Voltage I/O Ports DO26 Min. Output Low Voltage I/O Ports DO16 Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤TA ≤+85°C for Industrial -40°C ≤TA ≤+105°C for V-Temp OSC2/CLKO TABLE 29-10: ELECTRICAL CHARACTERISTICS: BROWN-OUT RESET (BOR) DC CHARACTERISTICS Param. Symbol No. BO10 VBOR DS61143H-page 158 Characteristics BOR Event on VDD transition high-to-low Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤TA ≤+85°C for Industrial -40°C ≤TA ≤+105°C for V-Temp Min. Typical Max. Units Conditions 2.0 — 2.3 V — © 2011 Microchip Technology Inc. PIC32MX3XX/4XX TABLE 29-11: DC CHARACTERISTICS: PROGRAM MEMORY(3) Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤TA ≤+85°C for Industrial -40°C ≤TA ≤+105°C for V-Temp DC CHARACTERISTICS Param. No. Symbol Characteristics Min. Typical(1) Max. Units Conditions Program Flash Memory D130 EP Cell Endurance 1000 — — E/W — D131 VPR VDD for Read VMIN — 3.6 V — D132 VPEW VDD for Erase or Write 3.0 — 3.6 V — D134 TRETD Characteristic Retention 20 — — Year — D135 IDDP Supply Current during Programming — 10 — mA — TWW Word Write Cycle Time 20 — 40 μs — 3 4.5 — ms — (2) D136 TRW Row Write Cycle Time (128 words per row) D137 TPE Page Erase Cycle Time 20 — — ms — TCE Chip Erase Cycle Time 80 — — ms — — — 6 μs — D138 LVDstartup Flash LVD Delay Note 1: 2: 3: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. The minimum SYSCLK for row programming is 4 MHz. Care should be taken to minimize bus activities during row programming, such as suspending any memory-to-memory DMA operations. If heavy bus loads are expected, selecting Bus Matrix Arbitration mode 2 (rotating priority) may be necessary. The default Arbitration mode is mode 1 (CPU has lowest priority). Refer to the “PIC32MX Flash Programming Specification” (DS61145) for operating conditions during programming and erase cycles. TABLE 29-12: PROGRAM FLASH MEMORY WAIT STATE CHARACTERISTICS DC CHARACTERISTICS Required Flash wait states Note 1: Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤TA ≤+85°C for Industrial -40°C ≤TA ≤+105°C for V-Temp SYSCLK 0 Wait State 0 to 30 1 Wait State 31 to 60 2 Wait States 61 to 80 Units Comments MHz — 40 MHz maximum for PIC32MX320F032H and PIC32MX420F032H devices. © 2011 Microchip Technology Inc. DS61143H-page 159 PIC32MX3XX/4XX TABLE 29-13: COMPARATOR SPECIFICATIONS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤TA ≤+85°C for Industrial -40°C ≤TA ≤+105°C for V-Temp DC CHARACTERISTICS Param. Symbol No. D300 D301 D302 D303 D304 D305 Note Characteristics Min. Typical Max. Units — ±7.5 ±25 mV Comments AVDD = VDD, AVSS = VSS VICM Input Common Mode Voltage 0 — VDD V AVDD = VDD, AVSS = VSS (Note 2) CMRR Common Mode Rejection Ratio 55 — — dB Max VICM = (VDD - 1)V (Note 2) Response Time — 150 400 ns AVDD = VDD, TRESP AVSS = VSS (Notes 1,2) ON2OV Comparator Enabled to Output — — 10 μs Comparator module is Valid configured before setting the comparator ON bit. (Note 2) Internal Voltage Reference 0.57 0.6 0.63 V — IVREF 1: Response time measured with one comparator input at (VDD – 1.5)/2, while the other input transitions from VSS to VDD. 2: These parameters are characterized but not tested. VIOFF Input Offset Voltage TABLE 29-14: VOLTAGE REFERENCE SPECIFICATIONS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤TA ≤+85°C for Industrial -40°C ≤TA ≤+105°C for V-Temp DC CHARACTERISTICS Param. No. Symbol Characteristics D310 VRES Resolution D311 VRAA Absolute Accuracy D312 Note 1: TSET Settling Min. Typical Max. VDD/24 — — — — — Time(1) Units Comments VDD/32 LSb — 1/2 LSb — 10 μs — Settling time measured while CVRR = 1 and CVR3:CVR0 transitions from ‘0000’ to ‘1111’. This parameter is characterized, but not tested in manufacturing. TABLE 29-15: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤TA ≤+85°C for Industrial -40°C ≤TA ≤+105°C for V-Temp DC CHARACTERISTICS Param. No. Symbol Characteristics Min. Typical Max. Units Comments D320 VCORE Regulator Output Voltage 1.62 1.80 1.98 V — D321 CEFC External Filter Capacitor Value 8 10 — μF Capacitor must be low series resistance (< 1 Ohm) D322 TPWRT Power-up Timer Period — 64 — ms ENVREG = 0 DS61143H-page 160 © 2011 Microchip Technology Inc. PIC32MX3XX/4XX 29.2 AC Characteristics and Timing Parameters The information contained in this section defines PIC32MX3XX/4XX AC characteristics and timing parameters. FIGURE 29-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2 VDD/2 CL Pin RL VSS CL Pin RL = 464Ω CL = 50 pF for all pins 50 pF for OSC2 pin (EC mode) VSS TABLE 29-16: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS AC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤TA ≤+85°C for Industrial -40°C ≤TA ≤+105°C for V-Temp Param. Symbol No. Min. Typical(1) Characteristics Max. Units Conditions DO56 CIO All I/O pins and OSC2 — — 50 pF EC mode DO58 CB SCLx, SDAx — — 400 pF In I2C™ mode Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. FIGURE 29-2: EXTERNAL CLOCK TIMING OS20 OS30 OS31 OSC1 OS30 © 2011 Microchip Technology Inc. OS31 DS61143H-page 161 GP2Y0A02YK0F GP2Y0A02YK0F Distance Measuring Sensor Unit Measuring distance: 20 to 150 cm Analog output type ■Description ■Agency approvals/Compliance GP2Y0A02YK0F is a distance measuring sensor unit, composed of an integrated combination of PSD (position sensitive detector) , IRED (infrared emitting diode) and signal processing circuit. The variety of the reflectivity of the object, the environmental temperature and the operating duration are not influenced easily to the distance detection because of adopting the triangulation method. This device outputs the voltage corresponding to the detection distance. So this sensor can also be used as a proximity sensor. ■Features 1. Compliant with RoHS directive (2002/95/EC) ■Applications 1. Touch-less switch (Sanitary equipment, Control of illumination, etc. ) 2. Sensor for energy saving (ATM, Copier, Vending machine, Laptop computer, LCD monitor) 3. Amusement equipment (Robot, Arcade game machine) 1. Distance measuring range : 20 to 150 cm 2. Analog output type 3. Package size : 29.5×13×21.6 mm 4. Consumption current : Typ. 33 mA 5. Supply voltage : 4.5 to 5.5 V Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: E4-A00101EN Date Dec.01.2006 1 ©SHARP Corporation GP2Y0A02YK0F ■Block diagram ③VCC ②GND Signal processing circuit Voltage regulator PSD Oscillation circuit LED drive circuit ①VO Output circuit LED Distance measuring IC ■Outline Dimensions (Unit : mm) Stamp Stamp (Example) Model name Production month : Jan. to Sep. ; 1 to 9 Oct. ; X, Nov. ; Y, Dec. ; Z Production year : Last digit of prod. year Lens case * Light emitter side * Light detector side Connector PWB Terminal ① Output terminal voltage ② Ground ③ Supply voltage Note 1. Unspecified tolerances shall be ± 0.3 mm. Note 2. The connector is made by J.S.T.TRADING COMPANY,LTD. and its part number is S3B-PH. Note 3. The dimensions in parenthesis are shown for reference. Note 4. The dimension marked by “*” show a distance from/to the center of an internal optical slit. Symbol VO GND VCC Product mass : approx. 4.8g Sheet No.: E4-A00101EN 2 GP2Y0A02YK0F ■Absolute Maximum Ratings Parameter Supply voltage Output terminal voltage Operating temperature Storage temperature (Ta=25℃,VCC=5V) Symbol VCC VO Topr Tstg Rating -0.3 to +7 -0.3 to VCC+0.3 -10 to +60 -40 to +70 Unit V V ℃ ℃ ■Electro-optical Characteristics Parameter Average supply current Measuring distance range Output voltage Symbol ICC ΔL VO Output voltage differential ΔVO (Ta=25℃,VCC=5V) Conditions L=150cm (Note 1) (Note 1) L=150cm (Note 1) Output voltage difference between L=20cm and L=150cm (Note 1) MIN. ― 20 0.25 TYP. 33 ― 0.4 MAX. 50 150 0.55 Unit mA cm V 1.8 2.05 2.3 V * L : Distance to reflective object Note 1 : Using reflective object : White paper (Made by Kodak Co., Ltd. gray cards R-27・white face, reflectance; 90%) ■Recommended operating conditions Parameter Supply voltage Symbol VCC Conditions Rating 4.5 to 5.5 Unit V Sheet No.: E4-A00101EN 3 GP2Y0A02YK0F Fig. 1 Timing chart Vcc(Power supply) 38.3ms±9.6ms Distance measuring operating Vo(Output) First measurement Unstable output Second measurement First output nth measurement Second output nth output MAX 5.0ms Sheet No.: E4-A00101EN 4 GP2Y0A02YK0F Fig. 2 Example of distance measuring characteristics (output) 3 White paper (Reflectance ratio : 90 %) Output voltage [V] 2.5 Gray paper (reflectance ratio : 18 %) 2 1.5 1 0.5 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Distance to reflective object L [cm] 3 15cm 20cm 2.5 Output voltage [V] 10cm 30cm 2 40cm 1.5 50cm 60cm 1 100cm White paper (Reflectance ratio : 90 %) 0.5 Gray paper (reflectance ratio : 18 %) 150cm 0 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1 Inverse number of distance [1/cm] Sheet No.: E4-A00101EN 5 GP2Y0A02YK0F ■Notes ●Advice for the optics • The lens of this device needs to be kept clean. There are cases that dust, water or oil and so on deteriorate the characteristics of this device. Please consider in actual application. • Please don’t do washing. Washing may deteriorate the characteristics of optical system and so on. Please confirm resistance to chemicals under the actual usage since this product has not been designed against washing. ●Advice for the characteristics • In case that an optical filter is set in front of the emitter and detector portion, the optical filter which has the most efficient transmittance at the emitting wavelength range of LED for this product (λ = 850 ± 70nm), shall be recommended to use. Both faces of the filter should be mirror polishing. Also, as there are cases that the characteristics may not be satisfied according to the distance between the protection cover and this product or the thickness of the protection cover, please use this product after confirming the operation sufficiently in actual application. • In case that there is an object near to emitter side of the sensor between sensor and a detecting object, please use this device after confirming sufficiently that the characteristics of this sensor do not change by the object. • When the detector is exposed to the direct light from the sun, tungsten lamp and so on, there are cases that it can not measure the distance exactly. Please consider the design that the detector is not exposed to the direct light from such light source. • Distance to a mirror reflector can not be sometimes measured exactly. In case of changing the mounting angle of this product, it may measure the distance exactly. • In case that reflective object has boundary line which material or color etc. are excessively different, in order to decrease deviation of measuring distance, it shall be recommended to set the sensor that the direction of boundary line and the line between emitter center and detector center are in parallel. (Incorrect) (Correct) • In order to decrease deviation of measuring distance by moving direction of the reflective object, it shall be recommended to set the sensor that the moving direction of the object and the line between emitter center and detector center are vertical. (Incorrect) (Correct) (Moving direction) (Moving direction) ●Advice for the power supply • In order to stabilize power supply line, we recommend to insert a by-pass capacitor of 10μF or more between Vcc and GND near this product. ●Notes on handling • There are some possibilities that the internal components in the sensor may be exposed to the excessive mechanical stress. Please be careful not to cause any excessive pressure on the sensor package and also on the PCB while assembling this product. Sheet No.: E4-A00101EN 6 TIP120/TIP121/TIP122 NPN Epitaxial Darlington Transistor • Medium Power Linear Switching Applications • Complementary to TIP125/126/127 Equivalent Circuit C B TO-220 1 1.Base 2.Collector R1 3.Emitter R1 @ 8kW R2 @ 0.12k W Absolute Maximum Ratings* Symbol VCBO VCEO R2 E T a = 25°C unless otherwise noted Collector-Base Voltage Parameter : TIP120 : TIP121 : TIP122 Collector-Emitter Voltage : TIP120 : TIP121 : TIP122 Ratings 60 80 100 Units V V V 60 80 100 V V V VEBO Emitter-Base Voltage 5 V IC Collector Current (DC) 5 A ICP Collector Current (Pulse) IB Base Current (DC) PC 8 A 120 mA W Collector Dissipation (Ta=25°C) 2 Collector Dissipation (TC=25°C) 65 W TJ Junction Temperature 150 °C TSTG Storage Temperature - 65 ~ 150 °C * These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. © 2007 Fairchild Semiconductor Corporation TIP120/TIP121/TIP122 Rev. 1.0.0 www.fairchildsemi.com 1 TIP120/TIP121/TIP122 — NPN Epitaxial Darlington Transistor October 2008 Symbol VCEO(sus) Parameter Collector-Emitter Sustaining Voltage : TIP120 : TIP121 : TIP122 ICEO Collector Cut-off Current ICBO Collector Cut-off Current Test Condition IC = 100mA, IB = 0 Min. Typ. Max. 60 80 100 Units V V V : TIP120 : TIP121 : TIP122 VCE = 30V, IB = 0 VCE = 40V, IB = 0 VCE = 50V, IB = 0 0.5 0.5 0.5 mA mA mA : TIP120 : TIP121 : TIP122 VCB = 60V, IE = 0 VCB = 80V, IE = 0 VCB = 100V, IE = 0 0.2 0.2 0.2 mA mA mA 2 mA 2.0 4.0 V V IEBO Emitter Cut-off Current VBE = 5V, IC = 0 hFE * DC Current Gain VCE = 3V,IC = 0.5A VCE = 3V, IC = 3A VCE(sat) * Collector-Emitter Saturation Voltage IC = 3A, IB = 12mA IC = 5A, IB = 20mA VBE(on) * Base-Emitter On Voltage VCE = 3V, IC = 3A 2.5 V Cob Output Capacitance VCB = 10V, IE = 0, f = 0.1MHz 200 pF 1000 1000 * Pulse Test: Pulse Width£300ms, Duty Cycle£2% © 2007 Fairchild Semiconductor Corporation TIP120/TIP121/TIP122 Rev. 1.0.0 www.fairchildsemi.com 2 TIP120/TIP121/TIP122 — NPN Epitaxial Darlington Transistor Electrical Characteristics* Ta=25°C unless otherwise noted VBE(sat), VCE(sat)[V], SATURATION VOLTAGE 10000 hFE, DC CURRENT GAIN VCE = 4V 1000 100 0.1 1 3.5 IC = 250IB 3.0 2.5 2.0 1.5 1.0 VBE(sat) VCE (sat) 0.5 0.1 10 IC[A], COLLECTOR CURRENT 1 10 IC[A], COLLECTOR CURRENT Figure 1. DC current Gain Figure 2. Base-Emitter Saturation Voltage Collector-Emitter Saturation Voltage 1000 10 IC[A], COLLECTOR CURRENT Cib 10 0.1 1 10 100 1 0.1 0.01 VCB[V], COLLECTOR-BASE VOLTAGE VEB[V], EMITTER-BASE VOLTAGE s 5m Cob s 1m 100 DC Cob[pF] Cib[pF], CAPACITANCE s 0m 10 ms 0 50 f=0.1MHz TIP120 TIP121 TIP122 1 10 100 VCE[V], COLLECTOR-EMITTER VOLTAGE Figure 3. Output and Input Capacitance vs. Reverse Voltage Figure 4. Safe Operating Area 80 PC[W], POWER DISSIPATION 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 175 o TC[ C], CASE TEMPERATURE Figure 5. Power Derating © 2007 Fairchild Semiconductor Corporation TIP120/TIP121/TIP122 Rev. 1.0.0 www.fairchildsemi.com 3 TIP120/TIP121/TIP122 — NPN Epitaxial Darlington Transistor Typical characteristics ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 HIGH-VOLTAGE, HIGH-CURRENT DARLINGTON TRANSISTOR ARRAYS Check for Samples: ULN2002A, ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, ULQ2004A FEATURES 1 • • • • • 500-mA-Rated Collector Current (Single Output) High-Voltage Outputs: 50 V Output Clamp Diodes Inputs Compatible With Various Types of Logic Relay-Driver Applications ULN2002A . . . N PACKAGE ULN2003A . . . D, N, NS, OR PW PACKAGE ULN2004A . . . D, N, OR NS PACKAGE ULQ2003A, ULQ2004A . . . D OR N PACKAGE (TOP VIEW) 1B 2B 3B 4B 5B 6B 7B E 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 1C 2C 3C 4C 5C 6C 7C COM DESCRIPTION The ULN2002A, ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, and ULQ2004A are high-voltage high-current Darlington transistor arrays. Each consists of seven npn Darlington pairs that feature high-voltage outputs with common-cathode clamp diodes for switching inductive loads. The collector-current rating of a single Darlington pair is 500 mA. The Darlington pairs can be paralleled for higher current capability. Applications include relay drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line drivers, and logic buffers. For 100-V (otherwise interchangeable) versions of the ULN2003A and ULN2004A, see the SN75468 and SN75469, respectively. The ULN2002A is designed specifically for use with 14-V to 25-V PMOS devices. Each input of this device has a Zener diode and resistor in series to control the input current to a safe limit. The ULN2003A and ULQ2003A have a 2.7-kΩ series base resistor for each Darlington pair for operation directly with TTL or 5-V CMOS devices. The ULN2004A and ULQ2004A have a 10.5-kΩ series base resistor to allow operation directly from CMOS devices that use supply voltages of 6 V to 15 V. The required input current of the ULN/ULQ2004A is below that of the ULN/ULQ2003A, and the required voltage is less than that required by the ULN2002A. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1976–2013, Texas Instruments Incorporated ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA PDIP – N –20°C to 70°C SOIC – D SOP – NS TSSOP – PW PDIP – N ULN2002AN ULN2003AN ULN2003AN ULN2004AN ULN2004AN Tube of 40 ULN2003AD Reel of 2500 ULN2003ADR Reel of 2500 ULN2003ADRG3 Tube of 40 ULN2004AD Reel of 2500 ULN2004ADRG3 Reel of 2000 ULN2003A ULN2003ANSR ULN2003A ULN2004ANSR ULN2004A Tube of 90 ULN2003APW Reel of 2000 ULN2003APWR Tube of 25 ULN2004A UN2003A ULQ2003AN ULQ2003A ULQ2004AN ULQ2004AN Reel of 2500 ULQ2003ADR Tube of 40 ULQ2004AD Reel of 2500 ULQ2004ADR SOP – NS Reel of 2000 ULN2003AINSR ULN2003AI PDIP – N Tube of 425 ULN2003AIN ULN2003AIN Tube of 40 ULN2003AID Reel of 2500 ULN2003AIDR Reel of 2500 ULN2003AIPWR SOIC – D TSSOP – PW (2) ULN2002AN ULQ2003AD SOIC – D (1) Tube of 25 TOP-SIDE MARKING Tube of 40 –40°C to 85°C –40°C to 105°C ORDERABLE PART NUMBER ULQ2003A ULQ2004A ULN2003AI UN2003AI For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. LOGIC DIAGRAM 9 COM 1 16 1C 1B 2 15 2C 2B 3 14 3C 3B 4 13 4C 4B 5 12 5C 5B 6 11 6C 6B 7 7B 2 Submit Documentation Feedback 10 7C Copyright © 1976–2013, Texas Instruments Incorporated Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 SCHEMATICS (EACH DARLINGTON PAIR) 10.5 kW 7.2 kW 3 kW ULN2002A RB ULN/ULQ2003A: RB = 2.7 kW ULN2003AI: RB = 2.7 kW 7.2 kW 3 kW ULN/ULQ2004A: RB = 10.5 kW ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, ULQ2004A All resistor values shown are nominal. The collector-emitter diode is a parasitic structure and should not be used to conduct current. If the collector(s) go below ground an external Schottky diode should be added to clamp negative undershoots. Copyright © 1976–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A 3 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) at 25°C free-air temperature (unless otherwise noted) MIN VCC VI TA 50 V Clamp diode reverse voltage (2) 50 V Input voltage (2) 30 V 500 mA Output clamp current 500 mA Total emitter-terminal current –2.5 A See Figure 14 and Figure 15 Operating free-air temperature range Package thermal impedance (3) θJA UNIT Collector-emitter voltage Peak collector current IOK MAX (4) –20 70 ULN200xAI –40 105 ULQ200xA –40 85 ULQ200xAT –40 105 D package 73 N package 67 NS package 64 PW package 108 D package 36 N package 54 °C °C/W θJC Package thermal impedance (5) TJ Operating virtual junction temperature 150 °C Lead temperature for 1.6 mm (1/16 inch) from case for 10 seconds 260 °C 150 °C Tstg (1) (2) (3) (4) (5) (6) (6) ULN200xA Storage temperature range –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Maximum power dissipation is a function of TJ(max), θJC, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with MIL-STD-883. ELECTRICAL CHARACTERISTICS TA = 25°C PARAMETER VI(on) On-state input voltage TEST FIGURE Figure 6 TEST CONDITIONS ULN2002A MIN TYP MAX VCE = 2 V, IC = 300 mA II = 250 μA, IC = 100 mA 0.9 1.1 13 II = 350 μA, IC = 200 mA 1 1.3 II = 500 μA, IC = 350 mA 1.2 1.6 VCE(sat) Collector-emitter saturation voltage Figure 4 VF Clamp forward voltage Figure 7 IF = 350 mA Figure 1 VCE = 50 V, II = 0 50 Figure 2 VCE = 50 V, TA = 70°C II = 0 100 VI = 6 V 500 IC = 500 μA ICEX Collector cutoff current II(off) Off-state input current Figure 2 VCE = 50 V, II Input current Figure 3 VI = 17 V IR Clamp reverse current Ci Input capacitance 4 Submit Documentation Feedback Figure 6 VR = 50 V VI = 0, 1.7 50 1.25 100 50 f = 1 MHz V V V μA μA 65 0.82 TA = 70°C 2 UNIT 25 mA μA pF Copyright © 1976–2013, Texas Instruments Incorporated Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 ELECTRICAL CHARACTERISTICS TA = 25°C PARAMETER TEST FIGURE TEST CONDITIONS ULN2003A MIN TYP ULN2004A MAX MIN TYP IC = 125 mA VI(on) On-state input voltage Figure 6 VCE = 2 V 2.4 IC = 250 mA 2.7 6 IC = 275 mA 7 ICEX Collector cutoff current 8 II = 250 μA, IC = 100 mA 0.9 1.1 0.9 1.1 II = 350 μA, IC = 200 mA 1 1.3 1 1.3 II = 500 μA, IC = 350 mA 1.2 1.6 1.2 1.6 Figure 1 VCE = 50 V, II = 0 50 50 Figure 2 VCE = 50 V, TA = 70°C II = 0 100 100 Figure 5 VF Clamp forward voltage Figure 8 IF = 350 mA II(off) Off-state input current Figure 3 VCE = 50 V, TA = 70°C, VI = 6 V 50 VI = 3.85 V II Input current Figure 4 2 65 1.7 50 0.93 Clamp reverse current Ci Input capacitance Figure 7 VI = 5 V VR = 50 V VI = 0, μA TA = 70°C f = 1 MHz 2 V μA 65 1.35 VI = 12 V IR V 500 1.7 IC = 500 μA V 3 IC = 350 mA Collector-emitter saturation voltage UNIT 5 IC = 200 mA IC = 300 mA VCE(sat) MAX 15 0.35 0.5 1 1.45 50 50 100 100 25 15 25 mA μA pF ELECTRICAL CHARACTERISTICS TA = 25°C PARAMETER VI(on) On-state input voltage TEST FIGURE Figure 6 ULN2003AI TEST CONDITIONS VCE = 2 V MIN TYP IC = 200 mA 2.4 IC = 250 mA 2.7 IC = 300 mA VCE(sat) Collector-emitter saturation voltage Figure 5 II = 250 μA, IC = 100 mA II = 350 μA, II = 500 μA, II = 0 ICEX Collector cutoff current Figure 1 VCE = 50 V, VF Clamp forward voltage Figure 8 IF = 350 mA II(off) Off-state input current Figure 3 VCE = 50 V, II Input current Figure 4 VI = 3.85 V IR Clamp reverse current Figure 7 VR = 50 V Ci Input capacitance Copyright © 1976–2013, Texas Instruments Incorporated VI = 0, MAX V 3 0.9 1.1 IC = 200 mA 1 1.3 IC = 350 mA 1.2 1.6 50 1.7 IC = 500 μA UNIT 50 15 V 1.35 mA 50 μA 25 pF Submit Documentation Feedback Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A μA μA 65 0.93 f = 1 MHz 2 V 5 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 www.ti.com ELECTRICAL CHARACTERISTICS TA = –40°C to 105°C PARAMETER VI(on) VCE(sat) TEST FIGURE On-state input voltage Figure 6 Collector-emitter saturation voltage VCE = 2 V Figure 5 ULN2003AI TEST CONDITIONS MIN TYP MAX IC = 200 mA 2.7 IC = 250 mA 2.9 IC = 300 mA 3 II = 250 μA, IC = 100 mA 0.9 1.2 II = 350 μA, IC = 200 mA 1 1.4 II = 500 μA, IC = 350 mA 1.2 1.7 II = 0 ICEX Collector cutoff current Figure 1 VCE = 50 V, VF Clamp forward voltage Figure 8 IF = 350 mA II(off) Off-state input current Figure 3 VCE = 50 V, II Input current Figure 4 VI = 3.85 V IR Clamp reverse current Figure 7 VR = 50 V Ci Input capacitance 100 1.7 IC = 500 μA 30 f = 1 MHz 15 V V μA V μA 65 0.93 VI = 0, 2.2 UNIT 1.35 mA 100 μA 25 pF ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST FIGURE TEST CONDITIONS ULQ2003A MIN TYP ULQ2004A MAX MIN TYP IC = 125 mA VI(on) On-state input voltage Figure 6 VCE = 2 V IC = 200 mA 2.7 IC = 250 mA 2.9 6 IC = 275 mA 7 ICEX Collector cutoff current VF Clamp forward voltage Figure 5 IC = 100 mA 0.9 1.2 0.9 1.1 II = 350 μA, IC = 200 mA 1 1.4 1 1.3 1.2 1.7 1.2 1.6 II = 500 μA, IC = 350 mA VCE = 50 V, II = 0 Figure 2 VCE = 50 V, TA = 70°C II = 0 Figure 8 IF = 350 mA VCE = 50 V, TA = 70°C, II(off) Off-state input current Figure 3 II Input current Figure 4 8 II = 250 μA, Figure 1 100 2.3 65 0.93 1.7 50 Clamp reverse current Ci Input capacitance 6 Figure 7 Submit Documentation Feedback VR = 50 V VI = 0, TA = 25°C f = 1 MHz 15 2 V μA 65 1.35 VI = 5 V VI = 12 V IR μA 500 1.7 VI = 3.85 V V 50 100 VI = 6 V IC = 500 μA V 3 IC = 350 mA Collector-emitter saturation voltage UNIT 5 IC = 300 mA VCE(sat) MAX 0.35 0.5 1 1.45 100 50 100 100 25 15 25 mA μA pF Copyright © 1976–2013, Texas Instruments Incorporated Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 SWITCHING CHARACTERISTICS TA = 25°C PARAMETER ULN2002A, ULN2003A, ULN2004A TEST CONDITIONS MIN TYP MAX UNIT tPLH Propagation delay time, low- to high-level output See Figure 9 0.25 1 μs tPHL Propagation delay time, high- to low-level output See Figure 9 0.25 1 μs VOH High-level output voltage after switching VS = 50 V, IO = 300 mA, See Figure 10 VS – 20 mV SWITCHING CHARACTERISTICS TA = 25°C PARAMETER ULN2003AI TEST CONDITIONS MIN tPLH Propagation delay time, low- to high-level output See Figure 9 tPHL Propagation delay time, high- to low-level output See Figure 9 VOH High-level output voltage after switching VS = 50 V, IO ≈ 300 mA, See Figure 10 TYP MAX 0.25 1 0.25 1 VS – 20 UNIT μs μs mV SWITCHING CHARACTERISTICS TA = –40°C to 105°C PARAMETER ULN2003AI TEST CONDITIONS MIN TYP MAX tPLH Propagation delay time, low- to high-level output See Figure 9 1 10 tPHL Propagation delay time, high- to low-level output See Figure 9 1 10 VOH High-level output voltage after switching VS = 50 V, IO ≈ 300 mA, See Figure 10 VS – 50 UNIT μs μs mV SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER ULQ2003A, ULQ2004A TEST CONDITIONS MIN TYP MAX UNIT tPLH Propagation delay time, low- to high-level output See Figure 9 1 10 μs tPHL Propagation delay time, high- to low-level output See Figure 9 1 10 μs VOH High-level output voltage after switching VS = 50 V, IO = 300 mA, See Figure 10 Copyright © 1976–2013, Texas Instruments Incorporated VS – 20 Submit Documentation Feedback Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A mV 7 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 www.ti.com TYPICAL CHARACTERISTICS VCE(sat) VCE(sat) - Collector-Emitter Saturation Voltage - V 2.5 TA = 25°C 2 II = 250 µA II = 350 µA II = 500 µA 1.5 1 0.5 0 0 100 200 300 400 500 600 700 800 VCE(sat) VCE(sat) - Collector-Emitter Saturation Voltage - V COLLECTOR-EMITTER SATURATION VOLTAGE vs COLLECTOR CURRENT (ONE DARLINGTON) COLLECTOR-EMITTER SATURATION VOLTAGE vs TOTAL COLLECTOR CURRENT (TWO DARLINGTONS IN PARALLEL) 2.5 TA = 25°C II = 350 µA 1.5 II = 500 µA 1 0.5 0 0 100 300 400 500 600 700 Figure 11. Figure 12. COLLECTOR CURRENT vs INPUT CURRENT D PACKAGE MAXIMUM COLLECTOR CURRENT vs DUTY CYCLE 800 600 500 IIC C - Maximum Collector Current - mA RL = 10 Ω TA = 25°C 450 IC IC - Collector Current - mA 200 IC(tot) - Total Collector Current - mA IC - Collector Current - mA 400 VS = 10 V 350 VS = 8 V 300 250 200 150 100 50 0 500 N=1 400 N=4 N=3 300 N=2 N=6 200 N = 7 N=5 100 TA = 70°C N = Number of Outputs Conducting Simultaneously 0 0 25 50 75 100 125 II - Input Current - µA Figure 13. 10 II = 250 µA 2 Submit Documentation Feedback 150 175 200 0 10 20 30 40 50 60 70 80 90 100 Duty Cycle - % Figure 14. Copyright © 1976–2013, Texas Instruments Incorporated Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 TYPICAL CHARACTERISTICS (continued) N PACKAGE MAXIMUM COLLECTOR CURRENT vs DUTY CYCLE MAXIMUM AND TYPICAL INPUT CURRENT vs INPUT VOLTAGE 600 2000 TJ = -40°C to 105°C 500 1600 N=1 N=3 N=2 400 N=4 300 N=5 N=6 N=7 Input Current – µA IIC C - Maximum Collector Current - mA 1800 200 1400 1200 1000 Maximum 800 600 400 100 0 Typical TA = 85°C N = Number of Outputs Conducting Simultaneously 0 10 20 30 40 50 60 70 200 0 80 2 90 100 2.5 Duty Cycle - % Figure 15. 3 3.5 4 Input Voltage – V 4.5 5 Figure 16. MAXIMUM AND TYPICAL SATURATED VCE vs OUTPUT CURRENT MINIMUM OUTPUT CURRENT vs INPUT CURRENT 500 2.1 V CE = 2 V TJ = -40°C to 105°C TJ = -40°C to 105°C 450 400 Output Current – mA Maximum VCE(sat) Voltage – V 1.9 1.7 1.5 Maximum 1.3 350 300 250 Minimum 200 1.1 150 Typical 0.9 100 200 300 400 500 100 250 350 450 Output Current – mA Input Current – µA Figure 17. Figure 18. Copyright © 1976–2013, Texas Instruments Incorporated 550 650 Submit Documentation Feedback Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A 11 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 www.ti.com APPLICATION INFORMATION ULN2002A VSS V 1 P-MOS Output ULQ2003A VCC 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 V 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 Lam Test TTL Output Figure 19. P-MOS to Load ULN2004A ULQ2004A VDD Figure 20. TTL to Load VCC V V ULQ2003A 1 16 1 16 2 15 2 15 3 14 3 14 4 13 4 13 5 12 5 12 6 11 6 11 7 10 7 10 8 9 8 9 RP CMOS Output TTL Output Figure 21. Buffer for Higher Current Loads 12 Submit Documentation Feedback Figure 22. Use of Pullup Resistors to Increase Drive Current Copyright © 1976–2013, Texas Instruments Incorporated Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A DS3658 www.ti.com SNLS365B – MARCH 1995 – REVISED APRIL 2013 DS3658 Quad High Current Peripheral Driver Check for Samples: DS3658 FEATURES DESCRIPTION • • • • The DS3658 quad peripheral driver is designed for those applications where low operating power, high breakdown voltage, high output current and low output ON voltage are required. A unique input circuit combines TTL compatibility with high impedance. In fact, its extreme low input current allows it to be driven directly by a CMOS device. 1 2 • • • • • • • • • • • • • Single Saturated Transistor Outputs Low Standby Power, 10 mW Typical High Impedance TTL Compatible Inputs Outputs May Be Tied Together for Increased Current Capacity High Output Current – 600 mA Per Output – 2.4A Per Package No Output Latch-up at 35V Low Output ON Voltage (350 mV typ @ 600 mA) High Breakdown Voltage (70V) Open Collector Outputs Output Clamp Diodes for Inductive Fly Back Protection NPN Inputs for Minimal Input Currents (1 µA Typical) Low Operating Power Standard 5V Power Supply Power Up/Down Protection Fail Safe Operation 2W Power Package Pin-for-Pin Compatible with SN75437 The outputs are capable of sinking 600 mA each and offer a 70V breakdown. However, for inductive loads the output should be clamped to 35V or less to avoid latch-up during turn off (inductive fly back protection—refer to AN-213 'SNOA610'). An on-chip clamp diode capable of handling 800 mA is provided at each output for this purpose. In addition, the DS3658 incorporates circuitry that specifies glitchfree power up or down operation and a fail-safe feature which puts the output in a high impedance state when the input is open. The PDIP package is specifically constructed to allow increased power dissipation over conventional packages. The four ground pins are directly connected to the device chip with a special cooper lead frame. When the quad driver is soldered into a PC board, the power rating of the device improves significantly. APPLICATIONS • • • • • • • • • • Relay Drivers Lamp Drivers Solenoid Drivers Hammer Drivers Stepping Motor Drivers Triac Drivers LED Drivers High Current, High Voltage Drivers Level Translators Fiber Optic LED Drivers 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995–2013, Texas Instruments Incorporated DS3658 SNLS365B – MARCH 1995 – REVISED APRIL 2013 www.ti.com Connection Diagram Figure 1. PDIP- Top View See Package Number NFG0016E These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 7V Input Voltage 15V Output Voltage 70V Output Current Continuous Power Dissipation @ 25°C Free-Air 1.5A (3) 2075 mW −65°C to +150°C Storage Temperature Range Lead Temperature (Soldering, 4 sec.) (1) (2) (3) 260°C “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be specified. They are not meant to imply that the device should be operated at these limits. Electrical Characteristics provides conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. For operation over 25° free-air temperature, derate linearly to 1328 mW @ 70°C @ the rate of 16.6 mW/°C. Operating Conditions Supply Voltage Ambient Temperature 2 Min Max 4.75 5.25 V 0 70 °C Submit Documentation Feedback Units Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: DS3658 DS3658 www.ti.com SNLS365B – MARCH 1995 – REVISED APRIL 2013 Electrical Characteristics (1) (2) Symbol Parameter Conditions VIH Input High Voltage VIL Input Low Voltage IIH Input High Current VIN = 5.25V, VCC = 5.25V IIL Input Low Current VIN = 0.4V VIK Input Clamp Voltage VOL Output Low Voltage Min Typ Max Units 2.0 V 0.8 V 1.0 1.0 µA ±10 µA II = −12 mA −0.8 −1.5 V IL = 300 mA 0.2 0.4 V IL = 600 mA (3) 0.35 0.7 V 100 µA 1.6 V ICEX Output Leakage Current VCE = 70V, VIN = 0.8V VF Diode Forward Voltage IF = 800 mA IR Diode Leakage Current VR = 70V 100 µA ICC Supply Current All Inputs High 60 85 mA All Inputs Low 2 4 mA (1) 1.0 Unless otherwise specified, min/max limits apply across the 0°C to +70°C temperature range and the 4.75V to 5.25V power supply range. All typical values are for TA = 25°C and VCC = 5.0V. All currents into device pins are shown as positive, all currents out of device pins are shown as negative, all voltages are referenced to ground, unless otherwise specified. All values shown as max or min are so classified on absolute value basis. All sections of this quad circuit may conduct rated current simultaneously, however, power dissipation averaged over a short interval of time must fall within specified continuous dissipation ratings. (2) (3) Switching Characteristics (1) Typ Max Units tPHL Symbol Turn On Delay RL = 60Ω, VL = 30V 226 500 ns tPLH Turn Off Delay RL = 60Ω, VL = 30V 2430 8000 ns (1) Parameter Conditions Min Unless otherwise specified, min/max limits apply across the 0°C to +70°C temperature range and the 4.75V to 5.25V power supply range. All typical values are for TA = 25°C and VCC = 5.0V. Truth Table (1) (1) IN EN OUT H H L L H Z H L Z L L Z H = High state L = Low state Z = High impedance state Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: DS3658 3 DS3658 SNLS365B – MARCH 1995 – REVISED APRIL 2013 www.ti.com AC Test Circuit Figure 2. Switching Waveforms Figure 3. Typical Applications Figure 4. Stepping Motor Driver 4 Submit Documentation Feedback Figure 5. Lamp Driver Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: DS3658 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 – DECEMBER 1983 – REVISED MARCH 1988 Copyright 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 – DECEMBER 1983 – REVISED MARCH 1988 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 – DECEMBER 1983 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 – DECEMBER 1983 – REVISED MARCH 1988 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SDLS033 – DECEMBER 1983 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 !! ! " #$%&''(&&')*+',$ -$(*' .$-/&&)$.#.0,1''+2'%$ 3$ (%'(*4'&('1%2++(%'&4&+(*5(4$ 6$**('('178**+(42+1*$ ($" 3.# 9#3#:6 (4" # 3 ; ;<;; 2''( #.. & *&(4 3. &*(4 / (4&(1(4 6. =>/ (4&(1(4 // =#.. 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