Applications Drive Analog Technology Development and Innovation Venu Menon Vice President, Analog Technology Development March 20, 2012 Inside the box What can you do with these? Nothing. Without analog! Growing need for analog More people entering the global economy and more electronics per person Analog units 10.3% CAGR (92B units in 2010) Semiconductor units Gross World Product World population Sources: WSTS, International Monetary Fund, U.S. Census Bureau 9.2% CAGR (660B units in 2010) 4.3% CAGR ($63T in 2010) 1.4% CAGR (6.9B in 2010) New applications and new markets New applications New solutions to old applications New markets Analog market WSTS Total Analog TAM 2011 $42.3B Standard Linear 17.1B Catalog Market Data Converter $2.7B Interface $2.5B Amp/Comp $3B Source: WSTS, December 2011 Application Specific 25.1B Vertical Market Consumer $2.5B Power Mgmt $9.1B OTH $1.9B Computer $3.1B Communications $11.7B Auto $5.7B Signal conditioning & data converter needs Process Needs Customers Want • Transistors Low-Noise − Speed − Linearity High-Accuracy − Noise High-Speed • Resistors • Capacitors − Temperature − Linearity Low Power coefficient − Matching − LinearityWidely Varying − MatchingVoltage Ranges • Technology Small − HSForm BiCMOS Factors − HV Bipolar − Price Prec. CMOS − High Density Competitiveness Analog CMOS High speed bipolar technologies deliver smaller amplifiers 3.05mm x 2.10mm (6.4mm2) 1.77mm x 1.38mm (2.4mm2) OPA827 MSOP-8 OPA627 SOIC-8 SOIC MSOP SOT23 SC70 High precision capacitors deliver better A/D converters Capacitor Voltage Coefficient Comparison Error vs. Code 1.0005 Error (LSB) Capacitor Ratio 1.001 HPA07 1 0.9995 Conventional Process 0.999 0.9985 -10 -8 -6 -4 -2 0 2 V (v) (V) Voltage 4 6 8 10 HPA07 Conventional Process Output Code The Most Important Component in Precision A/D Converters High precision resistors deliver better D/A converters Resistor Matching Comparison VDD=VREF=5V, TA=25C, 48 Channel C Output 48 2000 3232 1250 1000 HPA07 750 500 Error vs. Code Conventional Process 1616 INL (LSB) Conventional Process Error (LSB) Relative Error 1750 1500 DAC8534 & DAC8554 Channel C INL Error vs. DIGITAL INPUT CODE 00 -16 -16 HPA07 -32 -32 250 0 -48 -48 9 10 11 12 13 14 15 Bits 16 17 18 19 20 Output Code The Most Important Component in Precision D/A Converters DAC8534 - Channel C DAC8554 - Channel C Everything that uses electricity needs power management Power IC CareWant Abouts Customers • Power Fets Efficiency, Control, − LDMOS − Voltage Voltage Scaling, − Current −Form Ruggedness factor, − Power Metal − Package Sequencing/Multiphase • Analog mix In − ACMOS − DE-CMOS Audio − Bipolar − ESD Peripherals − Passives • Technology Batteries − LBCSOI − LBC4 Motors − LBC5 − Lighting LBC7 − Thick Cu Automobiles etc. High voltage, low Rdson devices deliver efficient power management For Any Voltage, Smaller is Better CompE Power Transistor Size 1.00 CompA CompB CompC CompD TI-Tech (LV) TI-Tech (MV) CompE 1d Si limit TI-Tech CompC CompD (med. voltage) CompA TI-Tech (low voltage) CompB 1d Si limit 0.10 TI-Gen(n-1) TI-Gen(n) 1d limit + 0.01 10 Voltage 100 High density analog CMOS microcontrollers that sip power MCU Customers IC Care Abouts Want • Ultra-low leakage MIPS process • Embedded non- volatile memory − Active pwr Low Power − − Standby pwr − − Near sub-Vt − Pwr source flexibility− operation − Passives − Low cost Fast wake-up Fast write Low power High endurance Low cost • Technology Security − ULL CMOS+NVM FRAM Voltage −Scaling Form factor Low price Ultra-low power MCU innovations FRAM – Lowest power NVM • 100X faster writes vs Flash • 300X lower write energy • 100uA/MHz Active Power Advanced power management • Power gating Analog IP • ADC12 at 75uA with 200 ksps • 32kHz oscillator at 50nA 1.4 1.2 1 0.8 0.6 0.4 0.2 0 250x less energy per bit 130nm ULL Process 0.9v,1.8v, 3.3v, 5v Digital standard cell library • 360nA Standby w/ RTC • 7 low-power modes • Fine-grained standard cells 4000 3000 2000 Lowest standby power Lowest power ADC ULP SRAM Half the power of competing MCUs • 21X reduction in active leakage • Advance power management − 50X lower leakage in deep sleep − 50nA LPM4 Retention Mode 250 200 150 100 1000 50 0 0 Lowest active power Analog process technology platforms High-Speed BiCMOS • SOI & Bulk • SiGe NPN and PNP • Precision thin film resistors and capacitors • Low parasitic capacitance BiCom3 High Speed High-Precision Analog CMOS High-Voltage BiCMOS • Low power, low parasitic CMOS • Low 1/f noise • Precision thin film resistors and capacitors Precision • High Non-volatile memories • Power LDMOS devices • Broad and multivoltage capability • Thick metal technology • SRAM and non-volatile memories HPA07 LBC7 High Power High-Density Analog CMOS • • • • Dense, low power CMOS Analog friendly CMOS Multi-Vt CMOS FRAM, SRAM & other low power memories A035 High Density • Finely tuned analog process technology portfolio • Significant differentiation through process and components • Long process and product life-times. Continuous improvement is key • Years of accumulated process/component IP • Multiple factories useful for parallel development • Use mostly depreciated equipment Analog vs digital 800,000 700,000 600,000 180nm CMOS Volume 500,000 250nm A-CMOS 400,000 250nm CMOS 300,000 180nm A-CMOS 200,000 100,000 0 0 1 2 3 4 5 6 7 8 Years 9 10 11 12 13 14 15 Analog vs digital 800,000 250nm LBC 700,000 600,000 180nm CMOS Volume 500,000 250nm A-CMOS 400,000 250nm CMOS 300,000 180nm A-CMOS 200,000 100,000 180nm LBC 0 0 1 2 3 4 5 6 7 8 Years 9 10 11 12 13 14 15 Product diversity drives package diversity Small Outline Transistor Package (SOT23) Transistor Outline (TO236) Mini Small Outline Package (MSOP) Small Outline Transistor (SOT223) Power Modules Transistor Outline (TO220) PowerPad Small Outline Package (HSOP) MicroStar JR ™ Chip Scale Pkg (u*JR BGA) Wafer Scale Package (WSP) MicroStar Ultra Thin™ Land Grid Array Chip Scale Package (u*UT LGA) Small Outline No Leads (SON) Small Outline Integrated Circuit (SOIC) Shrink Small Outline Package (SSOP) Thin Shrink Small Outline Package (TSSOP) Quad Flatpack No Leads (QFN) Plastic Dual-In-Line Package (PDIP) Heat Sink Thin Quad Flatpack (HTQFP) Heat Slug Small Outline Integrated Circuit Power Small Outline Package (PSOP3) MicroStar BGA ™ Chip Scale Tape BGA (u*BGA) Laminate Chip Scale BGA (nFBGA) Thermally Enhanced BGAs Analog Mirror Packages Flip-Chip Power Packages Thin Quad Flatpack (TQFP) Surface Mount Header (DDPak) Thin is in SOIC 1.75 mm QFN 1 mm TSSOP 1.2 mm MicroStar 1 mm WCSP (NanoStar) 0.6/0.5 mm Thin QFN 0.8 mm TWCSP 0.4/0.3 mm PicoStar 0.15/0.1 mm U*CSP 0.45mm X-QFN 0.4 mm Invisible to naked eye PicoStar-2G 0.075mm ~0.04 mm More chips in package Inductor 150um 250um Challenges & opportunities • Not limited by an industry roadmap. Significant opportunities to differentiate. Creative ideas welcome! • Managing large diversity of process technologies in many factories • Years of accumulated process/component/design IP. Maintaining & updating processes, SPICE models, PDKs and documentation is a challenge. • Leveraging older equipment and factories drives challenges with process matching. Must “copy smart” • Speed boats, not aircraft carriers Thank You!