Applications Drive Analog Technology
Development and Innovation
Venu Menon
Vice President,
Analog Technology Development
March 20, 2012
Inside the box
What can you do with these?
Nothing. Without analog!
Growing need for analog
More people entering the global economy and more
electronics per person
Analog
units
10.3% CAGR
(92B units in 2010)
Semiconductor
units
Gross World
Product
World
population
Sources: WSTS, International Monetary Fund, U.S. Census Bureau
9.2% CAGR
(660B units in 2010)
4.3% CAGR
($63T in 2010)
1.4% CAGR
(6.9B in 2010)
New applications and new markets
New applications
New solutions to
old applications
New markets
Analog market
WSTS Total Analog TAM 2011 $42.3B
Standard
Linear
17.1B
Catalog Market
Data Converter
$2.7B
Interface
$2.5B
Amp/Comp
$3B
Source: WSTS, December 2011
Application
Specific
25.1B
Vertical Market
Consumer
$2.5B
Power Mgmt
$9.1B
OTH
$1.9B
Computer
$3.1B
Communications
$11.7B
Auto
$5.7B
Signal conditioning & data converter needs
Process Needs
Customers
Want
• Transistors
Low-Noise
− Speed
− Linearity
High-Accuracy
− Noise
High-Speed
• Resistors
• Capacitors
− Temperature
− Linearity
Low Power
coefficient
− Matching
− LinearityWidely Varying
− MatchingVoltage Ranges
• Technology
Small
− HSForm
BiCMOS
Factors
− HV Bipolar
− Price
Prec. CMOS
− High Density
Competitiveness
Analog CMOS
High speed bipolar technologies deliver
smaller amplifiers
3.05mm x 2.10mm (6.4mm2)
1.77mm x 1.38mm (2.4mm2)
OPA827  MSOP-8
OPA627  SOIC-8
SOIC
MSOP
SOT23
SC70
High precision capacitors
deliver better A/D converters
Capacitor Voltage
Coefficient Comparison
Error vs. Code
1.0005
Error (LSB)
Capacitor Ratio
1.001
HPA07
1
0.9995
Conventional
Process
0.999
0.9985
-10
-8
-6
-4
-2
0
2
V (v) (V)
Voltage
4
6
8
10
HPA07
Conventional Process
Output Code
The Most Important Component in Precision A/D Converters
High precision resistors
deliver better D/A converters
Resistor
Matching Comparison
VDD=VREF=5V, TA=25C,
48 Channel C Output
48
2000
3232
1250
1000
HPA07
750
500
Error vs. Code
Conventional
Process
1616
INL (LSB)
Conventional
Process
Error (LSB)
Relative Error
1750
1500
DAC8534 & DAC8554 Channel C INL Error vs.
DIGITAL INPUT CODE
00
-16
-16
HPA07
-32
-32
250
0
-48
-48
9
10
11
12
13
14
15
Bits
16
17
18
19
20
Output Code
The Most Important Component in Precision D/A Converters
DAC8534 - Channel C
DAC8554 - Channel C
Everything that uses electricity
needs power management
Power
IC CareWant
Abouts
Customers
• Power Fets
Efficiency,
Control,
− LDMOS
− Voltage
Voltage
Scaling,
− Current
−Form
Ruggedness
factor,
− Power Metal
− Package
Sequencing/Multiphase
• Analog mix
In
− ACMOS
− DE-CMOS
Audio
− Bipolar
− ESD
Peripherals
− Passives
• Technology
Batteries
− LBCSOI
− LBC4
Motors
− LBC5
− Lighting
LBC7
− Thick Cu
Automobiles etc.
High voltage, low Rdson devices deliver
efficient power management
For Any Voltage, Smaller is Better
CompE
Power Transistor Size
1.00
CompA
CompB
CompC
CompD
TI-Tech (LV)
TI-Tech (MV)
CompE
1d Si limit
TI-Tech
CompC
CompD
(med. voltage)
CompA
TI-Tech
(low voltage)
CompB
1d Si limit
0.10
TI-Gen(n-1)
TI-Gen(n)
1d limit
+
0.01
10
Voltage
100
High density analog CMOS
microcontrollers that sip power
MCU
Customers
IC Care Abouts
Want
• Ultra-low leakage
MIPS
process
• Embedded non-
volatile memory
− Active pwr Low Power
−
− Standby pwr
−
− Near sub-Vt
−
Pwr source flexibility−
operation
− Passives
− Low cost Fast wake-up
Fast write
Low power
High endurance
Low cost
• Technology
Security
− ULL CMOS+NVM
FRAM
Voltage −Scaling
Form factor
Low price
Ultra-low power MCU innovations
FRAM – Lowest power NVM
• 100X faster writes vs Flash
• 300X lower write energy
• 100uA/MHz Active Power
Advanced power management
• Power gating
Analog IP
• ADC12 at 75uA with 200 ksps
• 32kHz oscillator at 50nA
1.4
1.2
1
0.8
0.6
0.4
0.2
0
250x less energy per bit
130nm ULL Process
0.9v,1.8v, 3.3v, 5v
Digital standard cell library
• 360nA Standby w/ RTC
• 7 low-power modes
• Fine-grained standard cells
4000
3000
2000
Lowest standby power
Lowest power ADC
ULP SRAM
Half the power
of competing MCUs
• 21X reduction in active leakage
• Advance power management
− 50X lower leakage in deep sleep
− 50nA LPM4 Retention Mode
250
200
150
100
1000
50
0
0
Lowest active power
Analog process technology platforms
High-Speed BiCMOS
• SOI & Bulk
• SiGe NPN and PNP
• Precision thin film
resistors and capacitors
• Low parasitic
capacitance
BiCom3
High Speed
High-Precision
Analog CMOS
High-Voltage BiCMOS
• Low power, low
parasitic CMOS
• Low 1/f noise
• Precision thin film
resistors and
capacitors
Precision
• High
Non-volatile
memories
• Power LDMOS devices
• Broad and multivoltage capability
• Thick metal technology
• SRAM and non-volatile
memories
HPA07
LBC7
High Power
High-Density
Analog CMOS
•
•
•
•
Dense, low power CMOS
Analog friendly CMOS
Multi-Vt CMOS
FRAM, SRAM & other
low power memories
A035
High Density
• Finely tuned analog process technology portfolio
• Significant differentiation through process and components
• Long process and product life-times. Continuous improvement is key
• Years of accumulated process/component IP
• Multiple factories useful for parallel development
• Use mostly depreciated equipment
Analog vs digital
800,000
700,000
600,000
180nm
CMOS
Volume
500,000
250nm
A-CMOS
400,000
250nm
CMOS
300,000
180nm
A-CMOS
200,000
100,000
0
0
1
2
3
4
5
6
7
8
Years
9
10
11
12
13
14
15
Analog vs digital
800,000
250nm
LBC
700,000
600,000
180nm
CMOS
Volume
500,000
250nm
A-CMOS
400,000
250nm
CMOS
300,000
180nm
A-CMOS
200,000
100,000
180nm
LBC
0
0
1
2
3
4
5
6
7
8
Years
9
10
11
12
13
14
15
Product diversity drives package diversity
Small Outline
Transistor
Package
(SOT23)
Transistor
Outline
(TO236)
Mini Small
Outline
Package
(MSOP)
Small Outline
Transistor
(SOT223)
Power Modules
Transistor
Outline
(TO220)
PowerPad
Small Outline
Package
(HSOP)
MicroStar JR ™
Chip Scale Pkg
(u*JR BGA)
Wafer Scale
Package
(WSP)
MicroStar Ultra Thin™
Land Grid Array
Chip Scale Package
(u*UT LGA)
Small
Outline
No Leads
(SON)
Small
Outline
Integrated
Circuit
(SOIC)
Shrink
Small Outline
Package
(SSOP)
Thin Shrink
Small Outline
Package
(TSSOP)
Quad Flatpack
No Leads
(QFN)
Plastic Dual-In-Line
Package
(PDIP)
Heat Sink Thin
Quad Flatpack
(HTQFP)
Heat Slug
Small Outline
Integrated
Circuit
Power
Small Outline
Package
(PSOP3)
MicroStar BGA ™
Chip Scale Tape BGA
(u*BGA)
Laminate Chip Scale BGA
(nFBGA)
Thermally
Enhanced BGAs
Analog Mirror
Packages
Flip-Chip
Power Packages
Thin Quad
Flatpack
(TQFP)
Surface Mount
Header
(DDPak)
Thin is in
SOIC
1.75 mm
QFN
1 mm
TSSOP
1.2 mm
MicroStar
1 mm
WCSP (NanoStar)
0.6/0.5 mm
Thin QFN
0.8 mm
TWCSP
0.4/0.3 mm
PicoStar
0.15/0.1 mm
U*CSP
0.45mm
X-QFN
0.4 mm
Invisible to
naked eye
PicoStar-2G
0.075mm
~0.04 mm
More chips in package
Inductor
150um
250um
Challenges & opportunities
• Not limited by an industry roadmap. Significant opportunities
to differentiate. Creative ideas welcome!
• Managing large diversity of process technologies in many
factories
• Years of accumulated process/component/design IP.
Maintaining & updating processes, SPICE models, PDKs
and documentation is a challenge.
• Leveraging older equipment and factories drives challenges
with process matching. Must “copy smart”
• Speed boats, not aircraft carriers
Thank You!