RAW MATERIALS FOR MANUFACTURE OF PCBs AT ZERO DUTY
VIDE MINI BUDGET NOTIFICATION NO. 9/2004 DATED 8.1.2004,
INCLUSIVE OF ALL EARLIER NOTIFICATIONS COVERING RAW
MATERIALS AS INDICATED.
( Required raw materials for PCB Manufacture are indicated in red)
Table
Ch
S.N
Description of imported
apt
Description of finished goods
o.
goods
er
(1) (2)
(3)
(4)
LIST A
15,
29,
Copper clad laminates
Alpha cellulose paper/cotton
32,
phenolic or paper phenolic or
paper; Electrical grade kraft
1. 34,
glass ep-oxy types; composite
paper; Tung oil; Volan/Silane
39,
type copper clad laminates;
treated glass fabric/cloth
48,
printed circuit boards.
70
25, Potassium
28, Carbonate/Potassium
40, Nitrate (prilled); Barium
Glass shell/parts of television
2. 56, carbonate; Pumice powder;
picture tube.
70, Cerium oxide; Anode buttons;
84, Necks and Neck tubings;
85 Wool felt; Spodumene
(In col.3 bold words has been substituted vide Cus Ntf No.26/2002
Dt.1/03/2002)
25,
28, Strontium carbonate; garnet
40, powder; stud pins; Titanium Class shells/parts for colour
3.
70, dioxide; sodium antimonate; picture tubes.
84, rubber sleeve
85
4.
Omitted
High purity gases : Argon;
Integrated circuits, Semi5. 28 halocarbon-14; halocarbonconductor devices.
116; halocar-bon-23; helium;
6.
28,
29
7.
28,
29,
38,
76
silicon tetra-chloride; sulphur
hexafluoride; chlorine; silane;
hydrochloric acid; phosphine
& silane mixture; boron
trichloride; dichlorosilane;
diborane; hydrogen bromide;
phosphine in nitrogen; nitrous
oxide; boron trifluoride;
arsine & arsine mixture;
phosphine in hydrogen;
hydrogen; nitrogen
High purity chemicals: Acetic
acid MOS/CMOS grade;
Sulphuric acid MOS/ CMOS
grade; Hydrochloric acid
MOS/CMOS grade; Buffered
oxide etchant MOS/ CMOS
grade; Ammonium fluoride
MOS/CMOS • grade;
Trichloro-ethylene MOS/
Integrated circuits, SemiCMOS grade; Isopropyi
conductor devices.
alcohol MOS/CMOS grade;
Acetone MOS/CMOS grade;
Hydrofluoric acid MOS/
CMOS grade; Nitric acid
MOS/CMOS grade; Phosphoric acid MOS/CMOS
grade; Hydrogen peroxide
MOS/ CMOS grade
Cadmium sulphide; cadmium
telluride; silicon dioxide;
cadmium chloride; zinc
telluride; indium; germane;
disilane; phosphine; hydrogen
fluoride; aluminium
sputtering target; zinc oxide Solar cells/modules.
sputtering target, adhesive
coated aluminium foil; high
purity hydrogen high purity
nitrogen; high purity argon;
copper doped graphite paste;
high purity methane; diborane
8.
28,
29,
32
38,
39,
68
74
.,
in high purity helium
Copper plating salts, their i,
brighteners, levellers, condi
tioners, replenishers, stabi
lizers; Black Oxide Coating
(Microtech) solution/ salts,
predip solution/salts,
palladium catalyst solution/
salts
9.
28,
29,
32
38,
71
Resistive, Conductive, Dielectric, Overglaze or solder
pastes, compositions or inks
in packing not exceeding 20
kg.
28,
29,
32,
39,
10.
48,
69,
74,
85
Printed Circuit Boards.
Hybrid Microcircuits;
Potentiometers; Resistors
(other than heating resistors);
Ceramic and Mica Capacitors;
Conductive Rubber
Switches/Key Boards.
Ceramic bodies (coated or
uncoated); bandoliering tape
with or without adhesives;
solder plated copper wire of
dia. upto 1 mm; solder plated
brass wire of dia. upto 1 mm; Thermistors.
high melting point solder
alloy; paper backed
polyurethane tape; epoxy
marking ink with or without
hardner/thinner
28,
Semi-conductor devices,
11. 29, Resist stripper
printed circuit boards.
34
Special materials: Surfactant,
tetra ethyl-ortho-silicate
28, (TEOS); trimethyl borate
29, (TMB); trimethyl phosphite Integrated circuits, Semi12.
34, (TMPI); trichloroethane
conductor devices.
85 (TCA); dichloroethylene;
sputtering targets; photo resist
primer; edge bead remover
28, Photo resist & associated
Semi-conductor devices,
13. 29, thinners or/and developers;
printed circuit boards.
37 photospin glass
28,
Etched or Formed Aluminium
14.
Electrolyte
29,
Foil, Electrolytic Capacitors.
38
28, Dopants or doping sources in
15. 29, all forms, and with or without Semi-conductor devices.
38 precious metal constituents
Capacitors; Semi-conductor
Devices; Light Emitting
Diodes; mounted piezo
electric crystal; Liquid
Crystal Displays; Electronic
Valves and Tubes; Switches;
Copper clad laminates of glass
epoxy/paper expoxy type;
composite type copper clad
laminates; Delay lines; Line
and Wave Traps;
Epoxy/Epoxide resins/ Epoxy
Potentiometers; Silicon
28, moulding powder,
Crystals or Silicon wafers;
29, compounds or encapsulants;
16.
Connectors; Resistors (other
38, Fillers, thinners, hardeners,
than heating resistors);
39 accelerators and fire
Deflection parts;
retardants
Loudspeakers; Magnetic
Heads; Paper Cones/
Spiders/Dust Caps for
Loudspeaker; Hybrid
Microcircuits; Printed parts.
(In S. No.16, in column (4)
bold words has been
substituted vide CUS NTF
NO. 28/2003 DATE
01/03/2003)
Ferric Oxide of purity of 99%
and above; manganous
manganic oxide with
manganese content 71% or
above; Manganese di-oxide
28,
17.
of purity of 99% and above, Ferrites.
32
Manganous Oxide; Nickel
Oxide; Strontium Carbonate
(In S. No.17, in column (3)
bold words has been
28,
38,
39,
18.
70,
74,
76
28,
39,
19.
68,
73
28,
29,
20.
81,
85
substituted vide CUS NTF
NO. 28/2003 DATE
01/03/2003)
Aluminium paste; ethylene
vinyl acetate sheets (EVA);
primer for EVA; Crane glass;
tedlar coated aluminium
sheet; phosphorous
oxychloride; halo carbon
(CF4)/Freon gas; tinned
copper interconnect;
toughened glass with low iron
content and transmittivity of
min. 90% and above;
Solar cells/modules.
multilayered sheets with
tedlar base; fluro polymer
resin; ultra high purity (UHP)
silane in UHP nitrogen; UHP
silane; diborane in UHP
silane; MOCVD grade
phosphine in UHP silane;
silver sputtering target; high
purity tin tetrachloride;
nitrogen trifluoride of 99%
purity and above
Mounted piezoelectric
crystals; Printed Circuit
Boards; Semi-conductor
devices; Potentiometers;
Blue steel lapping
Resistors (other than heating
carriers/lapping carriers;
resistors); Connectors;
lapping vehicles; lapping
Switches; Relays; Tape deck
abrasive powder; lapping
mechanism; Magnetic heads;
compound
Deflection parts; DC
micromotor upto 13.5 V not
exceeding 20 Watt rating;
Silicon in all forms, LED
lamps and displays.
Tantalum powder; Tantalum
wire; CM Seals; Cans; Silver
Tantalum capacitors.
powder suspension;
Manganese Nitrate; Heat
28,
48,
69,
21. 75,
78,
81,
84
22.
28,
68
28,
70,
23. 73,
75,
85
24.
28,
81
25. 29
26. 32
27. 32
28
shrinkable polyester tubing
Lead based ceramic
composition; Magnesium
titanate based ceramic
composition; Neodium based
ceramic composition;
Alumina setters/slabs; Lint
free paper/paper towels/filter
paper; Zirconia milling
media/high alumina tumbling
media; Steel shots – copper
plated hollow; Nickel and
sulphonic acid based plating
chemicals; Razer
blades/doctor blades
Tantalum Neodyme oxide;
Neodyme oxide; Strontium
carbonate
Crystal Holders; Bases;
covers; Glass Bulbs; Glass
Bases; Nickel Eyelets;
Springs; Solder wire 25 SWG
or thinner; Chromium Pellets
Tungsten rhenium wire;
Suspension of aluminium
oxide in binder; Suspension
of tungsten powder and
aluminium oxide in binder;
Triple carbonate suspension
of calcium, barium, strontium
in binder
Tetra Bromo Bisphenol-A;
Tricresyl/Aryl Phosphate
Electron Phosphor
Desmearing agents
Silicone based resins, oils,
32,
varnishes, lacquers,
35,
elastomers, with or without
39
additives
Ceramic dielectric (multilayer)
capacitors.
Ceramic Capacitors.
Mounted Piezoelectric
crystals.
Electron guns and electron gun
parts.
Copper clad laminates for
Printed Circuit Boards.
Electronic Valves and Tubes
Printed Circuit Boards.
Semi-conductor Devices;
Liquid Crystal Displays;
Electronic Valves and Tubes;
Resistors (other than heating
resistors); Connectors;
Magnetic Tape; Relays;
Potentiometers; Switches;
Capacitor grade metallised
plastic film; Piezoelectric
crystal; Hybrid Micro circuits.
32, Solder Mask/Resist in ink or
29. 37, film form, with or without
Printed Circuit Boards.
39 associated catalysts
Semi-conductor devices,
printed circuit boards,
Screen printing inks, dyes,
potentiometers, capacitors,
32, emulsions, lacquers, films
30.
hybrid microcircuits, printed
38 (including sensitisers,
parts, coils and inductors,
hardners, catalysts)
resistors (other than heating
resistors).
internal dag, aqua dag,
graphite, hitasols, external
quoting graphite or external
dag
32,
31.
Electronic Valves and Tubes.
38
(In S. No.31, column (3) has
been substituted vide CUS
NTF NO. 28/2003 DATE
01/03/2003)
35, Polyamide coatings or
Semi-conductor devices; Heat
32.
39 adhesives
sinks; deflectioii parts.
Printed Circuit Boards; Liquid
33 37 Photo Polymer Film
Crystal Displays.
High resolution, high contrast
Printed Circuit Boards; semi37, photographic films and photo
34
conductor devices; hybrid
39 stencil films; DIAZO
microcircuits.
(C6H5N2) films
High Resolution Photo Masks;
Semi-conductor devices;
37, High Resolution Photo Plates;
35.
Liquid Crystal Displays;
70 Photomask Substrates
Silicon Single Crystals or
Wafers.
Semi-conductor devices;
37,
36.
High resolution photo mask Printed Circuit Boards; Liquid
70
Crystal Displays.
Silicon in the form of
37. 38
Semi-conductor devices.
undiffused wafers, discs or
chips
38, Polyvinyl flouride
38. 39, (TEDLAR); Tedlar
Solar cells/modules.
76 Aluminium Tedlar
38,
39.
Lithium niobate wafers
Hybrid microcircuits.
81
Silicon in the form of diffused
38,
Hybrid microcircuits or semi40.
wafers, discs or chips (with or
85
conductor devices.
without molybdenum disc)
38,
41.
Getters
Electronic valves and tubes.
85
Glass epoxy or/and
Multilayer Printed Circuit
42. 39
polyamide prepregs
Boards; copper clad laminates.
Keypad switches; parts of
43. 39 Silicone rubber
EHT transformers.
Plastic Film Capacitors or
Mixed Dielectric Capacitors,
other than Power Capacitors.
Explanation.- for the removal
of doubts, “plain plastic film”
Plastic Film Capacitors;
44. 39 includes bi-axially oriented
Mixed Dielectric Capacitors.
polypropylene (BOPP) film
(In S. No.44 Explanation
has been inserted vide CUS
NTF NO. 28/2003 DATE
01/03/2003)
Nylon 6.30% glass filled,
flame retardant moulding
45. 39
powder/granules and with or
without other additives
Plain and glass filled
46. 39 nylon/polyamide with or
without other additives
Polypropylene moulding
47. 39
powder / granules
Potentiometers; connectors.
Relays; Potentiometers; tape
deck mechanism; connectors.
Deflection parts; Cassettes.
Connectors; deflection parts;
switches; relays.
Heat shrinkable PVC
Capacitors; relays; deflection
49. 39
sleeving, tubing, film or ring parts.
48. 39 Polybutylene terephthalate
50. 39 Polyurethane lapping pads
51. 39 Plain polystyrene film
Mounted piezoelectric
crystals; Printed Circuit
Boards/semi-conductors
devices; potentiometers;
resistors (other than heating
resistors); connectors;
switches; relays; tape deck
mechanisms; magnetic heads;
deflection parts; DC
Micromotors upto 13.5 volts
and not exceeding 20 watts
rating silicon (in all forms).
Plain film capacitors; mixed
dielectric capacitors.
Plain plastic film (other than
Polystyrene film) of thickness
12 microns or below
Electronic capacitor grade
metallised dielectric plastic
film.
52. 39 'Explanation.- For the
removal of doubt, "plan
plastic film" includes
Biaxially Oriented
Polypropylene (BOPP) film;
Release film for multilayer
53. 39
Printed Circuit Boards.
laminates
Polyvinyl Alcohol,
39, Polyisobutylene,
54.
Ferrites.
40 Chlorosulphona ted
Polyethylene (HYPALON)
Antistatic materials in the
form of tubes, strips, mats,
39,
55.
covers, bins, boxes,
43
containers Semi-conductor
devices. Hybrid microcircuits.
39, Insulating/taping material
Capacitors; deflection parts;
48, (including pocket carrier tape) resistors (other than heating
56.
59, in tape, roll or strip form with resistors); semi-conductor
85 or without adhesive
devices; inductors.
39,
Domes or Dust caps;
57. 48,
Loudspeakers.
Paper/Plastic cones
85
39,
58. 48, Parts of Potentiometers
Potentiometers.
85
Screen mesh of stainless
39,
steel/polyester/metallised
59. 59,
Ceramic capacitors.
polyester/metallised nylon (in
73
sizes of mesh 60 or above)
39,
69,
60.
Ceramic/alumina substrates Potentiometers; printed parts.
73,
85
39,
73,
61.
Parts of magnetic sound heads Magnetic sound heads.
79,
85
Copper clad laminates
laminated to nylon, teflon,
39,
62.
polyester; Aluminium clad
Printed Circuit Boards.
74
entry foil and back up
laminates
Polyethylene terephthalate
film with ferro magnetic
39,
63.
coating of thickness upto
Floppy diskettes.
85
0.005 inch with magnetic
coating 50 to 180 microinch
63A 39, Moulded shell with liner,
Floppy diskette (3.5" size).
.
73 Steel hub ring, spring, shutter
Liquid Crystal Displays;
Semi-conductor Devices; EHT
39, Parts/articles of silicone,
64.
Transformers; Potentiometers;
85 Elastomer or Silicone rubber
Electrolytic Capacitors; Solid
tantalum capacitors.
Formers, bases, bobbins;
39,
RF/IF coils or transformers or
65.
Holders, brackets; Shielding
85
deflection parts.
cases,cans
40, Bungs; Rubber pinch rollers Electrolytic capacitors; tape
66.
59 with or without plastic bush deck mechanisms.
Parts of Rotor Assembly;
40,
DC Micromotors upto 13.5
Commutator assembly or
67 84,
volts and not exceeding 20
parts thereof; Brush assembly
85
watts rating.
or parts thereof
68.
40,
85
69. 48
70.
48,
76
71
59
69,
72. 78,
85
73.
69,
85
74.
69,
85
Anode assembly consisting of
EHT cable, silicone rubber
cap and contact spring or
parts thereof (EHT cable in
cut pieces or running length)
Electrolytic
Capacitor/Condenser Tissue
paper
Kraft paper/tissue paper or
aluminium foil for voice coil
Felt sheet (fully compressed)
of 1.5 mm thickness and
below
Headers; Caps with or
without leads; Cans with or
without leads; Pins; Stud
seals; Lead beads; Ceramic
beads; Ceramic-glass
packages; Cap to Lead
Assembles; Ceramic Pipes;
Lead frames, single or in roll
form; Housings; Brass ring
Alumina rods and bars (with
Alumina content above 90%)
in coated or uncoated form;
Ceramic plates/flats/cases/
bases/formers; Steatite rods
and bars in coated or
uncoated form
Ceramic dielectric (coated or
uncoated)
75. 70 Glass filament yam
32, Glass frit or glass powder;
76. 70, Glass preforms or pellets;
85 Glass tubes
Deflection parts.
Electrolytic Capacitors; Plastic
Film Capacitors.
Loud-speakers (cone type).
Tape deck mechanism.
Semi-conductor devices; Light
Emitting Diodes; Resistors
(other than heating resistors);
Capacitors; Connectors;
Hybrid Microcircuits; Printed
parts.
Resistors (other than heating
resistors); Semi-conductor
Devices; Hybrid
Microcircuits; Electron Guns
and Electron Gun parts.
Ceramic capacitors.
Silane treated glass
cloth/fabric for use in the
copper clad laminates.
Liquid Crystal Displays; semiconductor devices; Electronic
valves and tubes (other than
television picture
tubes/cathode ray tubes);
Glass to metal seals; Lead
frames; Transistor headers;
77.
78.
79.
80.
81.
82.
83.
84.
85.
86.
Reed relays or Reed switches;
delay lines; resistors (other
than heating resistors);
mounted piezoelectric crystals;
electron guns and electron gun
parts; gas discharge tubes.
Semi-conductor devices;
silicon in all forms.
Mounted Piezoelectric
crystals.
70,
Fused Quartzware
85
Synthetic quartz crystal
71
blocks and blanks
Contact tape with pure Nickel
base and Crown Gold alloy;
Contact tape with solder
71 Diamond Back in fine silver; Relays; Switches.
Contact tape in silver or silver
alloy with or without
palladium with Gold overlay
Gold in the form of wire,
Semi-conductor devices; Light
71 ribbon, preform of purity
Editing Diodes.
99.99 % and above
71,
72, Nickel plated steel strip; tin
Semi-conductor devices.
75, silver antimony alloy
80
Aluminium wire with silicon
71, or magnesium impurity of
76, upto 2%; gold wire with
Semi-conductor devices.
85 phosphorous or antimony
doping
CRNGO silicon steel strip
DC Micromotor;
72 /sheet/coil/hoop with or
Potentiometer; Resistors.
without tin plating
Coated/uncoated electrogalvanised CRCA/ mild steel/ DC Micromotor; tape deck
72
stainless steel in the form of mechanism.
sheet / s trip /wire/coils
72, Iron of 99.7% purity and
Cast Alloy Permanent
73 above
Magnets.
72,
Semi-conductor devices;
Nickel Iron Cobalt Alloy in
73,
electronic valves and tubes;
all forms
75,
transistor headers; glass to
81
metal seals/lead frames; cast
alloy permanent magnets;
hybrid microcircuits; gas
discharge tubes.
Copper clad tin coated steel
72
wire, dia 0.4 mm to 1.2 mm/ Lead tabs for electrolytic
87. or
solder plated Copper cover
capacitors.
73
steel wire (SPC).
Potentiometers; Hybrid
73, Metal clad substrates in any microcircuits; Printed parts;
88.
85 form with or without tags
semi-conductor devices; Light
Emitting Diodes.
Electrolytic Tough Pitch
89. 74
Lead wire for electronic parts.
(ETP) Copper wire rods
Potentiometers/parts of
potentiometers;
connectors/parts of
connectors; switches/parts of
switches; relays/parts of
Solder plated/unplated brassrelays.
strips upto 100 mm width;
90 74
silver plated brass strips upto
(Col.4 has been substituted
100 mm width
vide Cus Ntf No.57/2002 date
31/05/2002)
Phosphor Bronze Sheets/
bars/ section/ flats/
91. 74
strips/wire/rods/foils/ pipes,
with or without plating
[OLD Potentiometers;
connectors; switches; relays.]
Relays/parts of relays; Tape
Deck Mechanism;
connectors/parts of
connectors;
potentiometers/parts of
potentiometers; Heat Sinks;
cassettes; parts of cassettes;
T.V.Tuner; telescopic antenna;
gas discharge tubes/parts of
gas discharge tubes.
(Col.4 has been substituted
vide Cus Ntf No.57/2002 date
31/05/2002)
[OLD Relays; Tape Deck
Mechanism; Connectors;
Potentio-meters; Heat Sinks;
cassettes; parts of cassettes;
T.V. tuner; telescopic antenna;
Gas discharge tubes.]
Connectors/parts of
connectors; relays/parts of
relays; switches/parts of
switches; gas discharge
tubes/parts of gas discharge
tubes.
Beryllium Copper
rods/strips/sheets/wire/ foils,
92. 74 with or without plating ;
(Col.4 has been substituted
Rectangular Profile Brass
vide Cus Ntf No.57/2002 date
material(CuZn39Pb2)
31/05/2002)
[OLD Connectors; Relays;
Switches; gas discharge
tubes.]
(In col.3 bold words has been substituted vide Cus Ntf No.26/2002
Dt.1/03/2002)
Tin coated/solder plated
93. 74
Resistors.
copper wire
Continuous cast copper
Copper foil for copper clad
wire rod/copper scrap,
94. 74
electrolytic grade of purity
laminates.
99.9% or above
(In col.3 bold words has been substituted vide Cus Ntf No.26/2002
Dt.1/03/2002)
74, Copper-cadmium braided
95. 76, wire/Self-soldering/selfLoudspeakers; microphones.
85 bonding aluminium wire
Oxygen-free high
74,
96.
conductivity (OFHC) Copper Semi-conductor devices.
85
base with weldable steel ring
OFHC copper wires, bars,
Semi-conductor devices;
74, rods, angles, shapes and
electronic valves and tubes;
97.
85 sections, plates, sheets, strips, transistor headers; glass to
tubes and pipes
metal seals; capacitors.
98. 74, Rayon or Silk cover Litz wire RF/IF Coils or transformers.
85 of the following sizes -(a) 6,
8, 12 and 24 strands with each
strand diameter 0.03 mm; (b)
6 or 9 strands with each
strand diameter 0.04 mm
99.
74,
85
100. 76
101. 76
102. 76
103. 81
104. 81
105.
81,
85
106.
84,
85
107. 85
Semi-conductor devices,
electronic valves & tubes,
Parts made of OFHC copper
transistor headers, glass to
metal seals, capacitors.
Etched or formed Aluminium
Electrolytic Capacitors.
Foils
Plain Aluminium foil
Etched or formed Aluminium
containing more than 99%
foil; electrolytic capacitors or
Aluminium
plastic film capacitors.
Cans or Leads for Electrolytic
Aluminium of purity 99% or Capacitors; Semi-conductor
above in the form of wire,
Devices; Light Emitting
strips, sheets, rods, bars,
diodes; Capacitors; Capacitor
pipes, plates, sections, ribbons grade Metallised Plastic films;
or shapes
Potentiometers; Disc covers
for electrolytic capacitors.
Cast Alloy Permanent Magne
Cobalt
ts.
Semi-conductor devices,
Mounted piezo electric
High purity chromium
crystals, electronic valves and
powder (99.99% and above)
tubes, vacuum interrupter
tubes.
Molybdenum and
Electronic Valves and Tubes;
molybdenum alloys, wrought, X-ray tubes; Semi-conductor
in all forms and articles and Devices; Mounted
parts thereof
Piezoelectric Crystals.
Parts of Vacuum Interrupter
Vacuum Interrupter Tubes.
Tubes
Deflection parts;
Loudspeakers; Relays;
Self bonding/Self soldering Magnetic Heads; RF/IF Coils;
insulated or enamelled copper Transformers (other than
wire
Power transformers); DC
Micromotors upto 13.5 volts
and not exceeding 20 watts
rating; electronic tuner.
(In col.3 bold words has been substituted vide Cus Ntf No.26/2002
Dt.1/03/2002)
108. 85 Parts of gas discharge tubes Gas discharge tubes.
Light Emitting Diodes in the
Light Emitting. Diodes;
109. 85 form of Chips, wafers or
Lamps and Displays.
undiced discs
Parts of Cathode Ray Tubes
110. 85
Cathode Ray Tubes.
(other, than Glass parts)
111. 85 Lead Tabs/Paddle Tabs
Electrolytic Capacitors.
Parts of Relays, Switches,
112. 85
Relays; Switches; Connectors.
Connectors
Electron Guns, Television
113. 85 Parts of electron Guns
picture tubes or Cathode Ray
Tubes.
114. 85 Casings of aluminium
Electrolytic capacitors.
115. 85 Parts of CD-Deck Mechanism CD Deck Mechanism.
116. 85 Parts of Fly-back Transformer Flyback Transformers.
117. 85 Parts of Tuners
TV Tuners.
118. 85 Parts of Data Cartridge
Data Cartridge.
119. 85 Parts of transmitting tubes
Transmitting tubes.
Parts of deflection yoke (DY),
120. 85 excluding colour deflection Deflection parts.
yoke core
OMITTED
121
(S.No.121 has been omitted vide CUS NTF NO. 28/2003 DATE
.
01/03/2003)
Semi-conductor Devices;
Liquid Crystal Displays;
Electronic valves and tubes;
Pick-up cartridges; Stylii; XRay Tubes; Cast Alloy
[O
75,8 Nickel and nickel alloys,
Permanent magnets; Transistor
LD
5, wrought in all forms and
Headers; Glass to metal seals;
121
90 articles thereof
Lead frames; Resistors (other
.
than heating resistors);
Magnetic Heads;
Potentiometers; Electron guns
and electron gun parts;
Electro-magnetic shields;
Encoders and synchros.]
39,7 Composite copper clad
122 4,75 materials consisting of Paper Printed Circuit Boards
,76 + Epoxy + Glass cloth
Glass Epoxy Copper clad
123 74 laminates or Paper Phenolic Printed Circuit Boards
Copper clad laminates
Copper clad laminates
(phenolic or glass epoxy
Copper foils(plain or adhesive
124 74
types);composite type copper
coated)
clad laminates; multi-layer
Printed Circuit Boards
Cupric Chloride Etchant;
Ammonical Etchants; Solid
Carbide Drills; Routers; Hot
28,2
Air Levelling Flux;
9,38
Electroless Copper Plating
125 ,72,
Printed Circuit Boards
Solution; Sensitisers;
74,8
Activators; Post Activators;
4
Copper foil of refined copper;
Colloidal / Semi colloidal
Graphite (Shadow)
Plastic Film for Wafer
Dicing; Graphite Jigs /Block/
Rods /Plates; Dicing blades/
wheels; Tungsten filament
and or parts thereof;
Tungsten Wire / Rod; Colour
Paste and Diffusants; Silver LED/LED Displays;
28,2
conductive paste /
Semiconductor Devices;
9,39
Suspension; Palladium Wire; Hybrid Microcircuits;
126 ,68,
n- Butyl Acetate; Bonding
Mounted Piezo Electric
71,8
Tools
Crystals; Resistors;
1,82
Potentiometers
(In Col.3 bold words has
been substituted vide Cus
Ntf No.57/2002 date
31/05/2002)
[OLD
70,8 Parts of data graphic display Data graphic display
127
5
tubes(colour), with a
tubes(colour), with a phosphor
phosphor dot screen pitch
smaller than 0.4mm
Glass Tubes/ Insulators/
Spacers;
128
70,7
(S.No.128 column (3) has
5
been substituted vide CUS
NTF NO. 28/2003 DATE
01/03/2003)
Diallylphthalate(DAP)
Moulding Powder or
Compound (Plain or
Glass/Fibre filled with or
without additives)
dot screen pitch smaller than
0.4mm
Mounted piezo electric
crystals
Connectors; Switches with
contact rating less than 5
(Col.3 has been substituted amperes at voltage not
129 39 vide Cus Ntf No.57/2002
exceeding 250 Volts AC or
DC; Potentiometers; Relays of
date 31/05/2002)
contact rating upto 7 amperes;
[OLD Diallylphthalate (DAP) Resistors
Moulding Powder or
Compound; Plain or Glass/
Fibre filled with or without
additives]
Polyvinyl Chloride
130 39
Floppy Disks/Diskettes
Film/Sheet
Gold plating make up and
Semiconductor devices;
28,3
131
replenisher solutions and
LED/LED Displays;
8,39
salts; Resins for gold recovery Connectors; PCBs
Solder Plated Annealed
132 74 Copper Wire (SCA) of
Plastic film capacitors
diameter 0.4mm to 1mm
Zinc of purity 99% or above
in Rod, Wire or Strip form; Electronic Capacitor Grade
133 79 Zinc Wire / Zinc- Aluminum Metallised Plastic Film /
wire with dia up to 5mm ; Tin Capacitors
- zinc wire with dia upto 3mm
Plastic Film Capacitors;
134 80 Tin Foil/ Tin Alloy Foil
Resistors (other than heating
resistors)
135 76 Aluminium wire (of purity
Lead Wires/Lead Tabs for
99.9% or above ) of dia upto electrolytic capacitors;
3mm
Electronic Capacitor grade
Metallized Plastic film; Plastic
film capacitors; semiconductor
devices
136 28 Barium Carbonate
Ceramic Capacitors
Hydroxy Propyl Methyl
Ceramic Capacitors, Ceramic
38,3 Cellulose Barium Titanate
137
Substrates /Rods/ Discs /
9,69 based or Lead Titanatebased
Dielectric
Ceramic composition/ Powder
Magnesium Oxide (Purity not
less than 98%); Zinc Oxide
(Purity not less than 98%);
Aluminium Oxide (Purity not
less than 99.9%); Vanadium
Pentoxide (Purity not less
than 99.9%); Lithium
Carbonate (Purity not less
than 99%); Manganese
Carbonate (Purity not less
than 98%); Bismuth Oxide
(Purity not less than 99%);
Cobalt Oxide (Purity not less
than 99%); Copper Carbonate
(Purity not less than 98%);
Chromium Oxide (Purity not
138 28
Resistors; Ceramic Capacitors
less than 98%); Indium Oxide
(Purity not less than 99%);
Dysprosium oxide (Purity not
less than 99%); Gadolinium
Oxide (Purity not less than
99%);Yttrium Oxide (Purity
not less than 99.9%); Calcium
Carbonate (Purity not less
than 98%) ; Tin Oxide (Purity
not less than 98%);
Magnesium Carbonate Purity
not less than 99%); Iron
Oxide (Purity not less than
99%); Barium Carbonate
(Purity not less than 99%)
(S.No.138 column (3) has
been substituted vide CUS
NTF NO. 28/2003 DATE
01/03/2003)
Resin -VAGH CoPolymerised Vinyl Chloride
39,4 Vinyl Acetate, Pressure
139
Magnetic Tapes/Cassettes
8,59 Sensitive felt, with or without
adhesive,Silicon Coated/
Carbonized silicon paper
IC Sockets (Connectors);
140 39 Polyimide Film (Kapton)
Resistors; Potentiometers;
Semiconductor devices
Modified Polyphenylene
Deflection Components ;
141 39
Oxide
potentiometers
Resistors; Potentiometers;
Phenolic Moulding Powder/
142 39
Capacitors; Hybrid MicroResin
circuits
Resistors ; Potentiometers;
Plastic Film Capacitors; Lead
Tabs of Electrolytic
Lead wires of Iron or non
Capacitors
72,7
143
alloy steel plated or coated
4
with other base metals
(In Col.4 bold words has
been substituted vide Cus
Ntf No.57/2002 date
31/05/2002)
29,7 Copper alloy resistance wire
2,74 and strips; Steel or
144
Resistors; Potentiometers
,76, Aluminium in substrate or
85 sheet form; Butyl DiGol
Resistors; Resistor Grade
145 81 Metal alloy targets
Metallized Ceramic Cores
Chip Transistors; Varicap
Tuners; Modulators; Hybrid
146 85
Diodes
Micro Circuits
Switches with contact rating
Cladded Copper/ Copper
less than 5 amperes at voltage
147 74
Alloy Strip / Foil
not exceeding 250 Volts AC
or DC; Connectors
Zinc Oxide (Purity minimum Pre-Calcined Ferrite Powder
148 28
99.5%);Strontium Oxide/
(Spray Dried); Resistors
Strontium Carbonate; Zinc
Stearate (Purity minimum
99%); Polyvinyl alcohol
(PVA); Polyvinyl Butyral
(Ash Content max 1%)
Zirconium Oxide (Purity not
less than 99%); Tin Oxide
(Purity not less than 99%);
Lanthanam Oxide (Purity not
less than 99%); Zinc Oxide
(Purity not less than 98%);
Microwave Dielectrics;
Polystyrene (Purity not less
149 28
Ceramic Capacitors; Resistors
than 98%); Magnesium Oxide
; Varistors; Thermistors
(Purity not less than 98%);
Calcium Carbonate (Purity
not less than 98%); Tantalum
Oxide (Purity not less than
99%); Barium Carb onate
(Purity not less than 99%)
Hybrid Micro circuits;
Potentiometers; Ceramic
Capacitors; Thermistors;
Phenolic Moulding Powder Varistors; Switches with
150 39
/Resin
contact rating less than 5
amperes at voltage not
exceeding 250 Volts AC or
DC; Connectors
39,6 Guide Ceramic; Guide LCP
151
Print heads
9
(Liquid Crystal Polymer)
152 85 Parts of Loudspeaker
Loudspeakers
High Voltage Rectifier
Diodes; Focus Potmeter;
74,8
153
Electrolytic Tough Pitch
Deflection Components
5
Wire/Rods/Formed Pins/parts
made thereof
Resistors; Potentiometers;
Switches with contact rating
Polycarbonate (Plain or glass
154 39
less than 5 amperes at voltage
filled moulding powder)
not exceeding 250 Volts AC
or DC
Resistors; Potentiometers;
155 39 Poly Vinyl Acetate
Hybrid Micro Circuits
156 72
157 39
158 25
159 32
160 74
161
72,7
4
162
28,2
9
163 38
164
28,3
4
165 29
28,2
166 9,38
,48
167 76
Nickel Iron (low carbon / gas
free grade) in Sheet or strip
form / EB Welded Triple
Resistors; Potentiometers ;
Metal Strips./ Controlled
Expansion Alloy Strips
SRBP (Synthetic resin
bonded paper) sheets and
Potentiometers; Switches with
substrate
contact rating les than 5
amperes at voltage not
(S. No.157 column (3) has
exceeding 250 Volts AC or
been substituted vide CUS
DC
NTF NO. 28/2003 DATE
01/03/2003)
Ceramic Cores /Substrates for
Ball Clay
resistors
Parts of Electron Gun
Borosilicate Glass Powder
/Multiform Bead Glass Rods
Unplated Brass Strips in Coil
form 70 mm width; Phosphor Connectors
Bronze Strips in Coil Form
Bimetal sheets in coil forms/
piece parts; Copper clad steel Relays of contact rating upto 7
sheets in coil forms / piece
amperes
parts
Ammonium Dihydrogen
Phosphate ; Ammonium
Electrolytic Capacitors
pantaborate
Carbon / Flurographite
Potentiometers
Powder
Boron Nitride Suspension ; Electronic Capacitor Grade
Metallisation Inhabitation
metallised Plastic Film/ Plastic
Fluid (Oil)
Film Capacitors
Dowanol PX-16S (Non- CFC Flyback Transformers / Focus
solvent)
Resistors
Monoalkylethers of ethylene
glycol.; Flux 1544
;Ammonium Hydroxide
Semiconductor devices
(CMOS Grade); Ammonia
(NH3) (CMOS Grade); Lid
perform; Chemcassette
Etched Aluminium Foil
Formed Aluminium Foil for
electrolytic capacitors.
(Sl.No.122 to 167 has been inserted vide Cus Ntf No.26/2002
Dt.1/03/2002)
(1) (2) (3)
(4)
DBE Solvent; DMH Solvent;
29,3 Printing Inks; Protective
2, U.V.Lacquer; Dyes; Optical
168 38,3 grade polycarbonate; Methyl CD-R (unrecorded CD)
9, Lactate; OFP; Cake Box;
71 BOPP Film; Jewel box; Silver
Sputtering Target
(Sl.No.168 has been substituted vide Cus Ntf No.08/2003 Date
13/01/2003)
[O
28, Dyes; Optical grade
CD-R (unrecorded CD)]
LD
39 polycarbonate; Jewel box
168
(Sl.No.168 has been inserted vide Cus Ntf No.108/2002 Date
10/10/2002)
169 76 Aluminium clad entry foil
Printed circuit board
Phosphoric acid
(MOS/CMOS, electronic
170
Semi-conductor devices,
28 grade);Hydrogen peroxide
.
LED/LED displays
(MOS/CMOS, electronic
grade)
Aluminium wire with silicon
74, or magnesium with impurity Semi-conductor devices,
171
76, upto 2%;
LED/LED displays, Hybrid
.
80 Bonding wire (aluminum,
micro-circuits
gold and copper based )
172
Tin silver antimony alloy in Semi-conductor devices,
80
.
any form
LED/LED displays
173
Titanium dioxide of minimum Potentiometers, ceramic
28
.
purity 99%
capacitors
Barium bromide; Sodium
aluminate ; Barium
28,
aluminate; Methoklone;
29,
174
Methyl chloride; Dichloro
35,
Gas discharge tubes
.
methane; Titanium metal
72,
powder (99% purity); Cesium
81
glass powder; Barium glass
powder; Argon –Neon mixed
gas (99% purity); Argonhydrogen mixed gas (99%
purity); Copper Plied Steel
wire (tin plated ) with dia
upto 1.5 mm;Adhesive paste
175
39
.
Tedlar film
176
39
.
Polyester film
Printed circuit boards,
semiconductor devices, multi
layer laminates, glass epoxy
copper clad laminates
Magnetic tape, plastic film
capacitors
MEK (Methyl Ethyl Ketone);
177 29,
Polyurethane /Urethane
Magnetic tape
.
39
elastomer;Cyclohexanone
178
Polyolefin heat shrinkable
39
Deflection components
.
tubes/ sleeves
27, Kilopoise Grease; Polyester
179 39, mesh; Nickel alloys resistance
Resistors and Potentiometers
.
75, wires and strips in bare or
85 enameled form;
180
Semi-conductor devices,
85 Buffered Oxide Echants
.
LED/LED displays
181
Conductive silver epoxy and Mounted Piezoelectric
39
.
hardener
crystals,Hybrid microcircuits
182
LED/LED Displays, switches,
39 Noryl; Nylon
.
power entry connectors
183
39 Polyacetal
LED/LED displays, switches
.
184
HDPE; LDPE; Poly
39
LED/LED displays
.
propylene
Electron gun, electronic valves
185 75,
Stem pin
and tubes, parts of electron
.
85
gun
Capacitors, resistors,
186
electronic capacitor grade
39 Silicon oil
.
metallised plastic film/ plastic
film capacitors
187
27 Microcrystalline wax
Plastic film capacitors
.
188
Coated/ uncoated CRCA/
72
Switches, lead frames
.
Mild stainless steel in the
189 69,
.
73
69,
190 70,
.
74,
85
28,
191
29,
.
38
192
68
.
25,
28,
193 40,
.
69,
73,
85
form of sheets/ strips/ coils
Conveying trays/super
refractories/ pusher tiles/
Soft ferrite parts/ pre-calcined
ceramic saggers; Grinding
ferrite powder (spray dried),
steel balls (hardness 58-60%,
capacitors, resistors
carbon minimum 0.15%,
chromium 1-1.2%);Steel balls
Silver copper alloy
wires;Glass tubes of sizes
between 4mm and 6mm
Glass cartridges fuses/ ceramic
outside diameter, in cut
tube fuses/ PPTC resettable
lengths upto 40mm; Brass
fuses
fuse caps; PPTC chips;
Ceramic tubes
Silicon carbide roller for
Soft ferrites parts/ prefurnace; polyethylene glycol;
calcinated ferrite powder
Zucoplast; Polyamonium
(spray dried)
citrate; Octanol; Copper oxide
Grinding wheels (metal bond,
resin bond, diamond wheel, Soft ferrites parts/ pre-calcined
Conc 50-100%, grit D15ferrite powder (spray dried),
D30-400 mesh)/slicing
semiconductor devices
wheels
High speed spindles of more
than 10,000 RPM; silicon
carbide hollow heating rods,
with or without perforations;
Heating coils (made of
kanthal wire suitable for
13750 C dia 1 mm ); Cobalt
oxide (99% pure); Conveying
trays (335 X 340 X 30 mm
Alumina / cumulite); Setting Ferrites
batts (320X320X15 mm
alumina / cumulite);Alumina
sandwiched silicon carbide
plate (340X170X15 mm
alumina / cumulite);
Magnesium oxide; Cupric
oxide; Miraflow-A
(polycarbon acid);
Chloropolyethylene (CPE);
Temperature measuring rings
Piezo ceramic formulated
material / powder; Piezo
ceramic discs/ mounted piezo
194 69,
electric plates; diaphragm of Buzzers/ sirens /ringers
.
85
permalloy; weight of
permalloy; terminal pins;
yoke
195
73 Needle and springs
Print head
.
196 72,
T-yoke
Loudspeakers
.
85
Acetylene black carbon/ other
197 28,
carbon and carbon powders; Resistors and potentiometers
.
39
PTFE powder solutions
Former, bases, bobbins,
39, brackets; CP wires; P.B.T.;
198
74, Phenol resin moulding
Transformers
.
85 powder;Lamination/ El
silicon steel strips
199
39 Polybutylene terephthalate
Connectors
.
200
Ammonium adipate;Acelaic
29
Electrolytic capacitors
.
acid;P.Nitro benzoic acid
201
Pelladium copper contact
71
Relays
.
tapes
202 34, Polywax; Tin coated CRCA
Tuners
.
72 sheets
203
85 Parts of remote control
Remote control
.
204
85 Diffusion elements
Semiconductor devices
.
205
Silver copper alloy wire in dia Metal to ceramic brazing rings
71
.
upto 0.25 mm
for GD tubes
Ceramic disc single layer;
38,
pin; washer; axial lead finish;
39,
solder/ solder paste/ solder
206 40,
with paste/ solder flux; solder EMI/RFI filters
.
68,
with flux; wire leads; eyelet
74,
finish; eyelet fixing collect;
85
marking ink; epoxy resin/
stycast; carrier tape/ cover
tape/ taping material/ sealing
tape/ plastic reels
207
34
.
Termination paste
Capacitors, EMI/RFI filters
208
39
.
Phenolic resins; epoxy
phenolic resins; silicon
adhesive agent
Capacitors, resistors
Rivets
Potentiometers
Parts of cathodes
Cathodes for electron guns
Soft magnetic iron strips
Relays
Zinc manganate
Soft ferrites
Polypropylene granules
Capacitors
Catalysts
Resistors
Bronze powder
Resistors
Bentone
Resistors
Quartz powder
Resistors
Pigments
Capacitors, resistors
209
73
.
69,
210
75,
.
85
211
72
.
212
79
.
213
39
.
214
38
.
215
74
.
216
38
.
217
25
.
218
32
.
219
28
.
Magnesium aluminum silicate Resistors
Fabric coated with
Loudspeakers, paper cones/
rubber;Wax emulsion;
spiders/ dust caps for
basoplast
loudspeakers
Polyacetals, AcrylonitrileButadiene-Styrene(ABS)
39,
221
copolymers; polystyrene;
CD /DVD mechanism,
40,
.
Rubber belts /ring upto 150 loudspeakers
84
mm; Acetal plastic powder/
resin /granule; Capstan shafts,
220
59
.
sintered bush, rubber belts
28,
Polyester latex; glass cloth
222 39,
tape; acry emulsion; cobalt
Cathode ray tubes
.
40,
blue
70
Stainless steel wire of dia
69,
below 0.8 mm; Stainless steel
223 72,
strips of thickness below
Parts of electron guns
.
75,
0.6mm; ceramic bases;
85
eyelets; sleeves; caps; nails
LIST B
Glass shells/parts for colour
1. 28 Litharge
picture tubes.
Magnetic Inks or Magnetic
2. 28 Gamma Ferric Oxide
Tape.
Precalcined / Pre-sintered
3. 38
Ferrites
ferrite powder
Molybdenum Silidde/
58,6
Molybdenum disilicide
4. 9,84
Ferrites
heating elements; conveying
, 85
trays; saggers
OM
5. ITT
ED
OM
6. ITT
ED
OM
7. ITT
ED
(Sl.Nos.5,6 & 7 has been omitted vide Cus Ntf No.26/2002
Dt.1/03/2002)
[O 39,7 Composite copper clad
LD 4,75 materials consisting of paper Printed Circuit Boards
5. , 76 + Epoxy + Glass cloth
Glass Epoxy Copper clad
OL
D 74 laminates or Paper Phenolic Printed Circuit Boards
6.
Copper clad laminates
Copper clad laminates
OL
Copper foils (plain or
(phenolic or glass epoxy
D 74
adhesive coated)
7.
types); composite type copper
clad laminates; multi-layer
Printed Circuit Boards.]
(LIST C OMITTED)
[OLD LIST C
1.
Omitted
2.
Omitted
3.
Omitted
4.
Omitted
TV Glass bulbs/shells; CRT
5. 70 Glass Bulbs/shells;
Magnetron Glass bulbs/shells
Glass parts for colour picture
6. 70 tubes (excluding neck or
reneck tubes)
Parts of TV/CRT Glass
bulbs/shells including panels,
7. 70 funnels. Glass tubes
(excluding neck or reneck
tubes)
8
9.
10.
70
Neck or reneck tubes
Television picture tubes.
Cathode Ray tubes or
magnetrons.
Colour picture tubes.
TV Glass bulbs/shells for TV
picture tube or CRT Glass
bulbs/shells for CRT.
CRT Glass bulbs/shells for
CRT.
Omitted
Omitted]
(This notification has been last amended vide CUS NTF NO. 09/2004 DATE
08/01/2004)
(Amended vide Cus Ntf No. 20/2001 Date 1/3/2001)
(Please refer CUS CIR NO. 71/2003 DATE 07/08/2003)
(Please refer CUS CIR NO. 70/2003 DATE 06/08/2003)