profilo società

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PROFILO SOCIETÀ
1. INFORMAZIONI GENERALI
NOME / RAGIONE SOCIALE
INDIRIZZO SITO WEB
CITTÀ / PROVINCIA
ANNO DI FONDAZIONE
NUMBERO ADDETTI
FATTURATO 2012
2. PUNTO DI CONTATTO
NOME & COGNOME
INDIRIZZO E-MAIL
FATTURATO 2013
TELEFONO
3. CAMPI DI ATTIVITÀ (indicare quelli relativi al proprio core business)
4. DESCRIZIONE DEI PRODOTTI/SERVIZI
QUALI SONO LE PIÙ COMUNI APPLICAZIONI DEI VOSTRI PRODOTTI/SERVIZI?
CHI SONO I CLIENTI FINALI DEI VOSTRI PRODOTTI/SERVIZI?
5. INDICARE I PRINCIPALI FATTORI DI COMPETITIVITÀ DELLA VOSTRA SOCIETÀ (Porre una “X” nel riquadro)
PROGETTAZIONE
ATTIVITÀ DI R&D
ALTRO (SPECIFICARE):
RAPPORTO QUALITÀ/PREZZO
TECNOLOGIE
QUALITÀ
INNOVAZIONE
6. VISTO IL PROFILO DI THALES ALENIA SPACE, IN QUALI DEI SEGUENTI CAMPI TECNOLOGICI LA VOSTRA
SOCIETÀ OFFRE PRODOTTI e/o SERVIZI? (Porre una “X” nel riquadro)
ENGINEERING ANALYSIS & DESIGN (e.g.: Electronic, Electrical, Mechanical, Thermal, Optical, CAD Modelling, Propulsion,
Power, Radio Frequency, Data Transfer, Quality, Safety & RAMS, …)
ELECTROMECHANICAL, OPTICAL/PHOTONIC AND ELECTRONIC COMPONENTS (e.g.: PCBs, EEE, Switches, CMOS imaging,
Harness/Connectors, ASICs, FPGAs, Memories, GaN technology, Substrates, Active Optics, Optical Links, Optic Fibers, …)
TESTING SERVICES (Mechanical, Thermal, EMC, Electronic) and Non Destructive Inspections (RX, Ultrasounds, …)
ELECTRICAL MANUFACTURING ACTIVITIES (e.g.: Electromechanical Assemblies, Harness, …)
ELECTRONIC MANUFACTURING ACTIVITIES (e.g.: PCBs, WIRED & EQUIPPED ELECTRONIC HOUSINGS, …)
MECHANICAL MANUFACTURING ACTIVITIES (e.g.: Mechanical and Hydraulic Assemblies, Machining, Tools and Jigs,
Surface and Thermal Treatments, Built To Print /Specification, Racks & Cabinets, Composite Parts, Additive Manufact.… )
OPTICAL, THERMAL AND RF MANUFACTURING ACTIVITIES (e.g.: Thermal Insulation Blankets, Microelectronics and RF,
Microwave Printed Circuit Assembly and Microwave Box Assemblies, …)
GROUND SUPPORT EQUIPMENT (Design and Manufacturing of Mechanical, Electrical, Optical and Fluidic Ground Support
Equipment) and FLIGHT CONTAINERS
GROUND EQUIPMENT (e.g.: Amplifiers, Antenna Components, Payload Data Handling & Transmission, RF Converters,
Power Generation, …)
SYSTEM SOFTWARE (Methods, Tools, Functions, S/W Development Life Cycle, Geo Information Systems, …)
PROPULSION TECHNOLOGY (Chemical, “Green”, Hybrid, Electric) and COMPONENTS (Tanks, Valves, Piping, Electronics)
MECHANISMS, MECHATRONIC and ROBOTIC (e.g.: Nano/Micro Electromechanical Devices, Non-Pyro Force & Torque
Release Systems, Flexible Solar Arrays, …)
ATTITUDE/NAV. CONTROL SYSTEMS (e.g.: Motion Sensors, Vision Equipment, Trackers, Low Noise Reaction Wheels, GPS)
ADVANCED MATERIALS (Ceramic, Composite, Special Alloys…) and STRUCTURES (Ultra-Light, Flexible, Deployable.,..)
SPACE LIFE AND CREW SUPPORT TECHNOLOGIES (Regenerative, Greenhouse and Biomedical Technologies)
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