Background Statement for SEMI Draft Document #5636
Revision to SEMI G92-1113, Specification for Tape Frame Cassette for
450mm Wafer
Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in
reaching an informed decision based on the rationale of the activity that preceded the creation of this Document.
Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant
patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this
context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the
latter case, only publicly available information on the contents of the patent application is to be provided.
Background Statement
According to AMHS manufacturers, they feel the current G92-0412 (450TFC) is insufficient with regards to AMHS
handling. Therefore we are requesting need some revisions on G92-0412.
Throughout this ballot, text to be deleted is shown struck through and text to be added is shown underlined.
Ballot will be discussed at 450mm Assembly & Test Die Preparation TF and adjudicated at the Japan Packaging
committee meetings in SEMI Japan Office, Tokyo, Japan, on 20 March, 2014.
If you have questions, please contact to 450 mm Assembly & Test Die Preparation Task Force;
Akihito Kawai / Sumio Masuchi (DISCO Corporation)
Tel. +81-3-4590-1115
Fax +81-3-4590-1076
Email: akihito@disco.co.jp , masuchi@disco.co.jp
Or contact SEMI Staff, Naoko Tejima at ntejima@semi.org
Semiconductor Equipment and Materials International
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SEMI Draft Document #5636
Revision to SEMI G92-1113, Specification for Tape Frame Cassette for
450mm Wafer
1 Purpose
1.1 The purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used
between the wafer mounting process and the die-bonding process.
2 Scope
2.1 This Standard is intended to set an appropriate level of specification that places minimal limits on innovation
while ensuring modularity and interchangeability at all mechanical interfaces.
2.2 Only the mechanical interfaces for the tape frame cassette are specified. Materials kinds or cleanliness are not
defined.
2.3 This Standard specifies both semi-automated (PGV) and automated (AGV or OHT) handling of the tape frame
cassette for 450 mm wafer. It does not intend to address manual handling.
2.4 A 450 mm wafer frame cassette has the following components and optional components. Optional components
are not required features for the 450 tape frame cassette (TFC). They can be added according to customers’ demands
or manufacturing problems.
2.4.1 Top
 Top cover (optional)
 Automation flange (optional)
2.4.2 Interior
 Frame supports for 13 or 25 tape frames
 Tape frame restraint
2.4.3 Sides
 Corresponds to the forklift handling
 Presence sense area
 Guide surface (both sides)
2.4.4 Rear
 Rear cover (optional)
 Label placement area (optional)
 RFID tag volume (required only when RFID tag is used)
2.4.5 Bottom
 Three features that mate with kinematic coupling pins
 Six Seven frame cassette sensing pads
 Tape frame release bar (optional)
 Seating plane (4x)
 Presence sense area
 Seating guide surface (bottom / side corners)
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2.4.6 Front
 Presence sense area
NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their
use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and
determine the applicability of regulatory or other limitations prior to use.
3 Referenced Standards and Documents
3.1 SEMI Standards and Safety Guidelines
SEMI G88 — Specification for Tape Frame for 450 mm Wafer
SEMI G95 — Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in Backend
Process
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 Abbreviations and Acronyms
4.1.1 AGV — automated guided vehicle
4.1.2 BP — bilateral plane
4.1.3 FP — facial plane
4.1.4 HP — horizontal plane
4.1.5 KC — kinematic coupling
4.1.6 KCP — kinematic coupling pin
4.1.7 LPA — label placement area
4.1.8 PGV — person guided vehicle
4.1.9 OHT — overhead hoist transport
4.1.10 RFID — radio frequency identification
4.1.11 TFC — tape frame cassette
4.1.12 TFRB — tape frame release bar
4.2 Definitions
4.2.1 450 TFC — used generally as a ‘term’ only to identify the TFC used in fabs for 450 mm wafers.
4.2.2 bilateral plane (BP) — a vertical plane, defining x=0 of a system with three orthogonal planes (HP, BP, FP),
coincident with the nominal location of the rear primary KCP, and midway between the nominal locations of the two
front primary KCP.
4.2.3 facial plane (FP) — a vertical plane, defining y=0 of a system with three orthogonal planes (HP, BP, FP).
4.2.4 front (of carrier) — the side that is facing to the equipment and allows the tape frame input and extraction.
4.2.5 horizontal plane (HP) — a horizontal plane, defining z=0 of a system with three orthogonal planes (HP, BP,
FP), coincident with the nominal location of the uppermost points (tips) of the three KCP.
4.2.6 label placement area (LPA) — This is the placement area for the label to identify the 450 TFC. Labels
intended for use here include RFID, 2D-code, barcode, the label for visual confirmation, etc.
4.2.7 plane — a theoretical surface which has infinite width and length, zero thickness and zero curvature.
4.2.8 rear (of carrier) — the furthest side from the equipment.
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4.2.9 tape frame — the frame which uses the wafer tape and retains the wafer. It is used in dicing and die-bonding
processes, as well as shipping and handling during these processes.
4.2.10 tape frame cassette (TFC) — a carrier that holds one or more tape frames.
4.2.11 tape frame release bar (TFRB) — a bar to release tape frames. It unlocks automatically when the 450 TFC is
placed on the loading port of the equipment.
4.2.12 wafer tape — an adhesive plastic tape which retains the wafer or separated die.
5 Requirements
5.1 Dimensions — The 450 TFC dimensions are shown in Figures 1 through 16, and listed in Table 1.
5.2 Tape Frame Seating Position — The seating position is shown in Figure 6.
5.3 Top Cover (optional) — Top cover is an optional component. The dimension defined in ¶ 5.1.
5.4 Automation Flange (optional) — It may be installed on the top of 450 TFC. The dimension defined in ¶ 5.1.
5.4.1 The side surface of the automation flange shall have a detection area. The detection area shall be made of an
opaque material to enable the OHT system (or other systems which use the automation flange) to detect the presence
or absence of the carrier. The detection area is defined in Figure 2
5.5 Number of Slots — The number of slots for 450 TFC (the full storage number) is 13 or 25.
5.6 Tape Frame Release Bar — There must be tape frame release bar on 450 TFC to avoid frames sliding out from
the frame cassette during handling. This feature has to meet the dimension defined in ¶ 5.1.
5.7 Forklift Feature — 450 TFC shall have features on the sides for handling by forklift, shown in Figures 3 and 6.
The forklift feature includes a notched indentation for a pin to retain the 450 TFC on the forklift. The vertical
surface defined by x6 and horizontal surfaces defined by z15 and z13 must extend the full length of the 450 TFC
from front to rear.
5.8 Rear Cover (optional) — Rear cover is an optional component. The dimension defined in ¶ 5.1.
5.9 Kinematic Coupling Pin (KCP) and Kinematic Coupling (KC) Groove
5.9.1 KC Grooves — The 450 TFC shall have grooves to capture both primary and secondary KCP. The KCP and
KC grooves are specified by Figure 10. To allow for alignment of the 450 TFC into the right position when the 450
TFC is put on the loading port, the grooves must enable a positioning alignment error within 15 mm in the
horizontal direction.
5.9.2 KCP — The configuration of KCP is shown in Figure 14.
5.10 TFC Sensing Pads — The TFC must have six sensing pads on the bottom of the 450 TFC. Placement sensing
pads are intended to provide defined locations to confirm proper placement of the 450 TFC onto the KCP. The flat
areas shall be at height of z18. See Figures 11 and 12.
5.11 TFRB (optional) — The tape frame release bar is an optional component designed to keep the tape frame from
sliding out of the 450 TFC during transport or storage of the 450 TFC.
5.11.1 The TFRB is normally in the locked position, but unlocked when the 450 TFC is placed on a load port for
tape frame cassettes with a TFRB seating area. The 450 TFC is intended to slide up and down, sliding up to be
unlocked automatically when the bar is pushed up by setting 450 TFC on the load port. The weight of an empty or
full carrier must be enough to slide the bar. It shall be designed such that a force in excess of 6N is required to push
up the bar.
5.11.2 The TFRB mechanism works in reverse when the 450 TFC is lifted up from the load port, sliding down and
locking the tape frames in place inside the 450 TFC. The configuration shall be as shown in Figures 11 and 13.
5.11.3 The side surface of the TFRB shall have a detection area. The detection area shall be made of an opaque
material. It will move along with the vertical motion of the bar and enable judgment as to whether the bar is in the
locking or release position. The detection area is defined in Figure 17.
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5.11.4 The bottom surface of TFRB shall have a sensing pad for detecting the presence or absence of the cassette. It
will move along with the vertical motion of the bar and enable position judgment of the bar with load. The required
actuating force of the bar is 6N, and therefore the load for sensing shall be under 6N. The definition is referred to in
Figures 11 and 13.
5.12 LPA (optional) — LPA is an optional area to place and set the label or RFID tag. The part of rear cover is used.
It shall be as shown in Figures 15 and 16.
5.13 The Cutout of the Cassette Top Plate or Bottom Plate — Make a cutout on the cassette for 450 mm to avoid
the push-pull arm (mechanical clamp) bumping into the cassette when the tape frames are input and extracted from
the cassette. These cutout dimensions of the cassette top plate are defined as x22 and y16 in Figure 7, and those of
the cassette bottom plate are defined as x24 and y27 in Figure 10.
5.14 Tape Frame Position — When placed into the 450 TFC the front edge of the frame must be positioned y24
from the FP and the sides of the tape frame positioned less than x20 from the BP. After the 450 TFC has been placed
on a loadport (and the optional TFRB released), the front and sides of the frame must also be positioned per y24 and
x20 to allow for removal of the frame from the 450 TFC. See Figures 3 and 6.
5.15 Center of Gravity Volume — The position of the x and y direction of the center of gravity of 450 TFC shall be
defined as y18 and r18, when the carrier is empty. It is defined in Figure 7.
5.15.1 The position of the center of the gravity measurement method is clarified in APPENDIX 1.
5.16 Presence Sense Area — The 450 TFC shall have a presence detection area on the front, sides and bottom
surfaces. The detection area shall be made of an opaque material. The OHT system, load port, and any system which
uses the KCP may use these areas to detect the presence of the 450 TFC even if it is not in the ideal position. The
front area is defined in Figures 3 and 5. The side areas are defined in Figure 17 and shall be present on both sides of
the TFC. The bottom area is defined in Figures 11 and 12.
5.17 Guide Surface — The 450 TFC shall have a vertical Guide Surface on both sides at the forklift feature. The
Guide system supports the surface of the 450 TFC and prevents vibration while handling. It is defined in Figures 2
and 3.
5.18 Seating Guide Surface — Both bottom – side corners of the 450 TFC shall have a Seating Guide Surface.
These vertical and horizontal surfaces are used as a guide plane for placing the 450 TFC on the stocker, and as a roll
prevention feature at times it is stored in the stocker. It is defined in Figures 3, 10, 12, and 17.
5.19 Seating Plane — There shall be 4 Seating Planes on the bottom surface of the 450 TFC. They are used as
placement and seating surfaces when it is stored in the stocker. They are defined in Figures 3, 10 and 12.
5.20 Weight of the 450 TFC — When a carrier is empty, it is preferable to limit the mass of the 450 TFC to within
25 kg for a 25 slot TFC case and to within 20 kg for a 13 slot TFC case.
5.21 RFID Tag Placement Volume (optional) — When an RFID tag is used, the entire tag shall be placed in the
volume defined in Figures 15 and 16.
5.22 The entire bottom surface of the TFC shall be covered or enclosed with no openings or through-holes.
6 Related Documents
6.1 SEMI Standards and Safety Guidelines
SEMI E158 — Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450
FOUP) and Kinematic Coupling
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Figure 1
450 TFC Overall View
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Figure 2
450 TFC Side View (both sides of the TFC)
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Figure 3
450 TFC Front View
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Figure 4
Tape Frame Slot Detail View
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Figure 5
450 TFC Cross-Section View (Fig.3 View A-A)
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Figure 6
Loading and Unloading Position of Tape Frame (Fig.2 View B-B)
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Figure 7
450 TFC Top View
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Figure 8
Automation Flange Detail View (Top View)
Figure 9
Automation Flange Cross-Section View
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Figure 10
450 TFC Bottom View KC Position
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Figure 11
450 TFC Bottom View Sensing Pads, TFRB Position
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Seating Plane,Presence Sense Area and Placement Sense Pad Cross-Section View
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Figure 13
TFRB Cross-Section View
Figure 14
KCP
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450 TFC Rear View Label Placement Area and RFID Tag Placement Volume
Figure 16
RFID Tag Placement Volume Detail View (View C-C)
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450 TFC Side View (both sides of the TFC)
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Table 1 450 TFC Dimension
Symbol Used
Figure
Value Specified
Datum Measured From
Feature Measured To
(1)
10
(34.0 degrees)
BP
Axis of symmetry of front pin-mating
grooves
2
9
45 (0.5 degrees)
Vertical (BP and FP)
Edge of automation flange centering
feature
3
8
45 (0.5 degrees)
Perpendicular to side surface of
automation flange
Side surfaces of automation flange
notches
4
6
45 (0.5 degrees)
FP
Side of forklift retainer feature
(d1)
9
(ø17)
Automation flange centering
feature at x19, y2
Diameter at bottom of depression
d2
9
ø51.0 (0.5)
Automation flange centering
feature at x19, y22
Diameter at top of depression
d3
8
(ø71)
Automation flange centering
feature at x19, y22
Outer edge of sensing area
r1
14
R 10.0 ±0.025
Centerline of KCP
Cylindrical (side) surface of KCP
r2
14
R 14 ±0
Centerline of KCP
Circle to define center of curvature of
KCP contact surface
r3
14
R 30.0 ±0.05
Circle defined by r2 and z4
Contact surface of KCP
r4
14
R 15.0 ±0.05
Centerline of KCP and z3
Top surface of KCP (sphere)
r5
14
R 2.0 ±0.1
Blend radius
Boundary between KCP contact surface
and adjacent surfaces
r6
10
≤R 136
Origin
Innermost end of KC groove for front
KCPs
r7
10
≥R 218
Origin
Outermost end of KC groove for rear
KCP
(r8)
10
(R 145)
Origin
Location of rear secondary KCP
r9
11
≥R 10.0
Center of info, placement and
lock-out pads
Extent of pad area
(r10)
10
(R 206.5)
Origin
Location of front primary KCPs
r11
10
≥R 231
Origin
Outermost end of KC groove for front
KCPs
(r12)
10
(R 160)
Origin
Location of front secondary KCPs
(r13)
10
(R 194)
Origin
Location of rear primary KCP
r14
10
≤R 121
Origin
Innermost end of KC groove for rear
KCPs
r15
11
≤R 15
Center of TFRB
Boundary of bar area
r16
3,4,12
≥R 2
Surface of Seating guide and
Seating plane
Outer limit of the corner edge
r17
11
≥R 8
Center of placement sense pad
Boundary of pad area
r18
7
≤R 20
BP,y18
Outer surface of cylinder containing the
center of gravity of the carrier
r19
1,7
≤R 350
Origin
Outer limit of 450 TFC
(x1)
1, 7
(≤644)
n/a
Overall width of 450 TFC
x2
2,3,6
322+0,-2
BP
Guide surface
Surface of Forklift
x3
8
300 ±0.5
BP
Width of automation flange
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
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Document Number: 5636
Date: 2/6/2016
Semiconductor Equipment and Materials International
3081 Zanker Road
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Phone: 408.943.6900, Fax: 408.943.7943
Figure
Value Specified
Datum Measured From
Feature Measured To
x4
3, 7
150 ±1
BP
Right edge of automation flange on 450
TFC
x5
11
193 ±1
BP
Center of placement sense area
x6
3
304.5
BP
Inner side of forklift feature
x7
10
171.20 ±0.05
BP
Location of front primary KCP
x8
10
132.65 ±0.05
BP
Location of front secondary KCP
x9
11
141 ±1
BP
Center of invalid placement sense area
x10
11
55 ±1
BP
Center of lock-out pad (1 left/2 right)
x11
8
50 ±0.5
Right side of automation flange
Automation flange notch
x12
8
210 ±0.5
Right side of automation flange
Automation flange notch
x13
8
12 ±1
Edge of flange
Automation flange chamfer
x14
8
250 ±0.5
Right side of automation flange
Automation flange notch
x15
6
14 ±0.5
Outer edge of tape cassette
Depth of the notch for forklift
x16
8
14 ±0.5
Edge of automation flange
Depth of notches
x17
11
154 ±1
BP
Inner center of placement sense pad
x18
11
102 ±1
BP
Inner center of placement sense pad
x19
8
150 ±0.5
Right side of automation flange
Front automation flange notch and
center of d3
x20
3
279.5 ±0.3
BP
Inner wall of 450 TFC
x21
3
271 +0, −10
BP
Inner edge of tape frame support
x22
7
≥200
BP
Inner surface of top cover
x23
11
277 ±0.5
BP
Location of TFRB
x24
10
≥200
BP
Inner surface of bottom plate
x25
15
45
BP
Inner edge of LPA
x27
3
≤132
BP
Side of automation flange neck
x28
3
≤322
BP
Outer surface of 450 TFC
x29
13
≤x2
BP
Outer surface of 450 TFC
x30
3,10,17
304.5+0,-2
BP
Outer surface of seating guide
Outer edge of seating plane
x31
3,10
≤x30
BP
Outer surface of 450 TFC
x32
10
≤285
BP
Inner edge of seating plane
x33
11
≥30
BP
Outer edge of presence sense area
x34
11
≤160
BP
Inner edge of presence sense area
x35
11
≥220
BP
Outer edge of presence sense area
x36
3
≥190
BP
Outer edge of presence sense area
x37
10,17
x30+0,-5
BP
Outer surface of presence sense area
x38
15
145±1
BP
Inner side of RFID placement volume
x39
15
195±1
BP
Outer side of RFID placement volume
x40
7
≤312
BP
Chamfer of 450 TFC
(y1)
1, 2
(≤569)
n/a
Overall depth of 450 TFC
y2
2, 5, 7
≤288
FP
Rear of 450 TFC
y3
8
300 ±0.5
y4
2, 5, 7
281 ±0.5
FP
Front surface of 450 TFC
y5
5, 7
162 ±1
FP
Front edge of automation flange
y6
10
194 ±0.05
FP
Location of rear primary KCP
Depth of automation flange
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
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Document Number: 5636
Date: 2/6/2016
Semiconductor Equipment and Materials International
3081 Zanker Road
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Phone: 408.943.6900, Fax: 408.943.7943
Figure
Value Specified
Datum Measured From
Feature Measured To
y7
10
115.5 ±0.05
FP
Location of front primary KCP
y8
10
89.47 ±0.05
FP
Location of front secondary KCP
y9
10
145 ±0.05
FP
Location of rear secondary KCP
y10
5
≥281
FP
Inner wall of 450 TFC
y11
11
151 ±1
FP
Outer center of placement sense pad
y12
11
74 ±1
FP
Outer center of placement sense pad
y13
11
194 ±1
FP
Center of rear placement sense areas
y14
8
12 ±1
Edge of automation flange
Automation flange chamfer
y15
8
90 ±0.5
FP
Automation flange notch
y16
5, 7
≤264
FP
Inner surface of top cover
y17
8
14 ±0.5
Edge of automation flange
Depth of notches
y18
7
12 ±1
FP
Center of cylinder containing the center
of gravity
y19
9
≤144
FP
Front and rear of automation flange neck
y20
11
125 ±1
FP
Inner center of placement sense pad
y21
11
48 ±1
FP
Inner center of placement sense pad
y22
8
150 ±0.5
Front of automation flange
Notch
y23
9
≤120
FP
Rear side of automation flange neck
y24
6
278 ±1.5
FP
Tape frame placement position
y25
11
≤110
FP
Front side of TFRB
y26
11
≤10
FP
Rear side of TFRB
y27
5,10
264+0,-5
FP
Inner surface of bottom plate
y28
16
≥278
FP
Front of RFID placement volume
y29
16
≤283
FP
Rear of RFID placement volume
y33
4.2.4
194 ±0
FP
Nominal location of rear primary KCP
y34
2
≥270
FP
Front limit of guide surface
y35
2
≥120
FP
Rear limit of guide surface
y36
6
≥270
FP
Front limit of fork-lift feature
y37
6
≥120
FP
Rear limit of fork-lift feature
y38
17
≥270
FP
Front limit of seating guide surface and
presence sense area
y39
17
≤220
FP
Front side of seating guide surface
y40
17
≥120
FP
Rear limit of seating guide surface and
presence sense area
y41
17
≤70
FP
Rear side of seating guide surface
y42
10
≥270
FP
Front limit of seating plane
y43
10
≤220
FP
Front side of seating plane
y44
10
≥120
FP
Rear limit of seating plane
y45
10
≤70
FP
Rear side of seating plane
y46
17
≥106
FP
Front side of presence sense area
(TFRB)
y47
17
≤90
FP
Rear side of presence sense area (TFRB)
y48
11
98±1
FP
Center of placement sense pad (TFRB)
y49
11
≥30
FP
Inner edge of presence sense area
y50
11
95±1
FP
Center of rear placement sense pad
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
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Document Number: 5636
Date: 2/6/2016
Semiconductor Equipment and Materials International
3081 Zanker Road
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Phone: 408.943.6900, Fax: 408.943.7943
Figure
Value Specified
Datum Measured From
Feature Measured To
y51
5
264+0,-10
FP
Surface of presence sense area
y52
7
≤271
FP
Chamfer of 450 TFC
z1
9
≥17
Top of automation flange
Bottom of centering depression
z2
14
15 ±0
HP
Point on KCP centerline to define KCP
top surface, r1
z3
14
24.543 ±0
HP
Center of radius, r3
z4
1,3
584.5 ±1 [25 slots]
364.5 ±1 [13 slots]
HP
Top of TFC (in case of an automation
flange installed)
z5
9
≥21
Bottom surface of automation
flange
Clearance for use of automation flange
z6
1,3,12
≤21
HP
450 TFC bottom surface areas not
otherwise specified
z7
9
7.5 ±0.5
Top surface of automation flange Bottom surface of automation flange
z8
4
36 ±0
HP
Bottom nominal tape frame seating
plane
z9
4
≥20
Height of first wafer slot top
Clearance below top of first tape frame
slot
z10
4
≥8
Top surface of each nominal tape Bottom surface of next higher tape
frame seating plane
frame support
z11
4
20 ±0
Each nominal wafer seating
plane
Adjacent nominal tape frame seating
planes (slot pitch)
z12
3
≥12
Top surface of top wafer slot
Any point above top nominal tape frame
seating plane
z13
3
163 ±1
HP
Top of forklift feature
z14
3
≥10
Top of forklift feature
Bottom of forklift retainer feature
z15
3
≤74
HP
Bottom of forklift feature
z16
1,3
556 ±1 [25 slots]
336 ±1 [13 slots]
HP
Top of TFC(When the automation flange
is installed, this dimension is invalid)
z17
4
0 ±0.5
Each nominal tape frame seating Each actual tape frame seating plane
plane
z18
12
21 +0, −2
HP
Surface of sensing pads
z19
13
21 +2, −0
HP
TFRB release position (up and unlocked
position)
z20
4, 13
36+0,-2
HP
TFRB locking position (down position)
(z21)
1
(≤592) [25 slots]
(≤372) [13 slots]
Bottom face of TFRB
Top of TFC (in case of no automation
flange)
(z22)
1
(≤620.5) [25 slots]
(≤400.5) [13 slots]
Bottom face of TFRB
Top of TFC (in case of an automation
flange installed)
z23
15
25
HP
Lower edge of LPA
z24
15
100
HP
Upper edge of LPA
z25
1,3,4,12
21+0,-2
HP
Surface of seating plane
z26
3,17
≥5
HP
Upper edge of seating guide surface and
presence sense area
z27
17
≥8
HP
Lower edge of seating guide surface and
presence sense area
z28
17
≥34
HP
Lower edge of presence sense area
(TFRB)
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
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Document Number: 5636
Date: 2/6/2016
Semiconductor Equipment and Materials International
3081 Zanker Road
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Phone: 408.943.6900, Fax: 408.943.7943
Figure
Value Specified
Datum Measured From
Feature Measured To
z29
17
≤24
HP
Upper edge of presence sense area
(TFRB)
z30
3,5
≥5
HP
Upper edge of presence sense area
z31
3,5
≥10
HP
Lower edge of presence sense area
z32
12
20+1,-5
HP
Bottom surface of next tape frame
support (above)
z33
3,12,17
≤z25
HP
450 TFC bottom surface areas
z34
16
≥5
HP
Bottom of RFID placement volume
z35
16
≤10
HP
Top of RFID placement volume
NOTICE: Semiconductor Equipment and Materials International (SEMI) makes no warranties or representations as
to the suitability of the Standards and Safety Guidelines set forth herein for any particular application. The
determination of the suitability of the Standard or Safety Guideline is solely the responsibility of the user. Users are
cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant literature,
respecting any materials or equipment mentioned herein. Standards and Safety Guidelines are subject to change
without notice.
By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any items mentioned in this Standard or Safety Guideline. Users of
this Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights,
and the risk of infringement of such rights are entirely their own responsibility.
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
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development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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APPENDIX 1
METHOD FOR MEASURING CARRIER CENTER OF GRAVITY
A1-1 Suggested Method Using Load Cells
A1-1.1 The carrier’s COG (center of gravity) can be measured by using three load cells.
A1-1.2 Each of the load cells should provide a support point similar to the Kinematic Coupling Pins defined in this
standard.
A1-1.3 The location of the pins should conform to the Relevant SEMI Standard for 450 mm load ports in order to
provide a reference for the FP and BP.
A1-1.4 Variables
A1-1.4.1 F1, F2 & F3 – the downward force on each pin due to the weight of the carrier.
A1-1.4.2 Lx – the distance parallel to the FP between the front KCPs.
A1-1.4.3 Lx/2 –the distance from each front KCP to the BP
A1-1.4.4 Ly – the distance parallel to the BP between the front KCPs and the rear KCP
A1-1.4.5 Lx0 – the distance from the BP to the COG.
A1-1.4.6 Ly0 – the distance from the rear KCP to the COG.
A1-1.5 Derivation of Lx0 Calculation:
F1 × Lx0 + F3 × (Lx / 2 + Lx0) = F2 × (Lx / 2 - Lx0)
F1 × Lx0 + F3 × Lx / 2 + F3 × Lx0 = F2 × Lx / 2 – F2 × Lx0
(F1 + F2 + F3) × Lx0 = (F2 - f3) × Lx / 2
Lx0 = Lx / 2 × (F2 - F3) / (F1 + F2 + F3)
A1-1.6 Derivation of Ly0 Calculation:
F1 × Ly0 = F2 × (Ly - Ly0) + F3 × (Ly - Ly0)
F1 × Ly0 = F2 × Ly – F2 × Ly0 + F3 × Ly – F3 × Ly0
(F1 + F2 + F3) × Ly0 = (F2 + F3) × Ly
Ly0 = Ly × (F2 + F3) / (F1 + F2 + F3)
NOTE 1: For the Primary KCPs Lx = 342.4 mm (x7 × 2) and Ly = 309.5 mm (y6 + y7). For the secondary KCPs
Lx = 265.3 mm (x8 × 2) and Ly = 234.5 mm (y8 + y9).
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
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Figure A1-1
Center of Gravity Measurement
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
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Phone: 408.943.6900, Fax: 408.943.7943
RELATED INFORMATION 1
FACTORY FUNCTIONALITY
NOTICE: This Related Information is not an official part of SEMI G92 and was derived from the work of the
Assembly & Packaging Global Technical Committee. This Related Information was approved for publication by full
letter ballot procedures on August 22, 2013.
The information below is referenced from SEMI E158 and describes the correct functionality for interaction
between the automation flange and the AMHS in the factory. It also describes the TFC loadport kinematic coupling
pins to TFC factory interactions, especially during automated delivery of a cassette to a loadport. The functionally
applies to FOUPs defined in SEMI E158 as well as TFCs. Equipment and carrier suppliers should consider this
information when designing and building TFCs and load ports.
R1-1 Referenced Standards and Documents
R1-1.1 SEMI Standards and Safety Guidelines
SEMI E158 — Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450
FOUP) and Kinematic Coupling
R1-1.2 ISO Standards1
ISO 4287 — Geometrical Product Specifications (GPS) – Surface Texture: Profile Method – Terms, Definitions and
Surface Texture Parameters
R1-2 Features for Automation Flange
R1-2.1 Automation Flange — On top of the 450 TFC is an automation flange for manipulating the carrier. See
Figures 3, 5, 7, 8, and 9.
R1-2.1.1 The automation flange shall be centered in front of the FP. Its orientation and location are constrained by
x4 and y5. See Figure 7.
R1-2.1.2 The center of the flange is located x19 and y22 relative to its side and front respectively. The flange shall
have a centering feature at its center. The centering feature shall have a depth of z1, diameter of d2 at the top surface,
and (d1) at the bottom. The side of the centering feature shall have an angle of θ2.
R1-2.1.3 The flange shall extend back from its front side by y3, and shall extend from its right side (as viewed from
the front of the carrier) to the opposite side by x3. The neck dimension below the flange shall be more than 18 mm
thinner than the dimension of x4, and shall extend y19 in front of the FP and y23 behind the FP.
R1-2.1.4 The flange has a pattern of notches on all sides. Notches on the front and back have a depth of y17 and
those on the sides shall have a depth of x16. The notches shall have an angle of θ3. The four corners shall have
chamfers with size of x13 and y14. Notches are located at x11, x12, x19 on the front and x14 on the back, and at y15
on the right side and at y22 on both the right and left sides. The flange shall have a thickness of z7, and the carrier
shall have no obstructions around the flange for a height of z5.
R1-2.1.5 The presence sensing feature on the top surface of the automation flange consists of an area bounded by
d2 and d3. The feature is designed to provide a flat surface for presence sensing and is located z4 above the HP.
R1-3 Features for KCPs
R1-3.1 KCP Shape — The physical alignment interface on the bottom of the TFC consists of features (defined in
R1-4) that mate with six pins underneath. As shown in Figure 14 and defined in Table 1, each pin is radially
symmetric about its vertical center axis line and can be seen as the intersection of a cylinder of radius r1 and a
sphere of radius r4 (which establishes the tip of the pin and might contact a flat plate). The radius r4 is centered on
the axis of symmetry at a height z2 below the HP. An additional radius r3 establishes the contact with the angled
mating groove surface on the TFC. The center of the radius r3 is defined by the intersection of a vertical plane
through the axis of symmetry of the pin with the horizontal circle of radius r2 at the height z3 below the HP. A blend
1
International Organization for Standardization, ISO Central Secretariat, 1 rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland;
Telephone: 41.22.749.01.11, Fax: 41.22.733.34.30, http://www.iso.ch
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document
development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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Document Number: 5636
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radius of r5 is applied at the intersection of r1 and r3, and at the intersection of r3 and r4. The minimum height of the
pin is given by z3. The surface finish roughness of the surfaces defined by dimensions r1, r3, r4, and r5 should be
less than 0.30 µm. The surface finish roughness is defined by ISO 4287. Dimensions r2, z2, and z3 have zero
tolerance because they only define offsets and not physical features.
R1-3.2 KCP Locations — The KCPs are arranged in three sets with two pins in each set, as shown in Figure 10 and
Figure R1-1. The outer pins of each set are designated the primary pins for use on a load port or vehicle nest, and the
inner pins are designated the secondary pins for use on a robotic arm used to pick up a carrier from the primary pins.
The rear pins (farthest from the door) are located on the BP, at a distance from the FP of y9 for the secondary pin
and y6 for the primary pin. The front primary pins are located at a distance of y7 from the FP, symmetric across the
BP with distance x7 from the BP. The front secondary pins are located at a distance of y8 from the FP, symmetric
across the BP with distance x8 from the BP. For reference only, the front KCPs are located symmetrically with
respect to the BP at an angle of (θ1), and circumferentially equidistant on a circle about the origin with radius (r10)
for the primary KCPs and radius (r12) for the secondary KCPs. For reference only, the rear primary kinematic pin is
located on the BP and on a circle with radius (r13), and the secondary rear pin is located on the BP and on a circle
with radius (r8). See Figure 10 and Figure R1-1.
Figure R1-1
Bottom view of 450TFC
Kinematic Coupling Pin Locations
R1-4 Features for KC Groove
R1-4.1 In order to achieve the lead-in value of less than 15 mm and to control contact pressures, certain
characteristics of the kinematic groove surface on the bottom of the 450 TFC are described in this section and are
shown in Figures R1-2 and R1-3.
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
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R1-4.2 KC Groove Locations — Grooves should be provided to capture both primary and secondary pin locations.
The CLs of the grooves are located along radii passing through the kinematic pin locations from the origin. The rear
groove has its CL along the BP, and the two front grooves have their CLs at the angle (θ1) with respect to the FP.
R1-4.3 KC Groove Shape and Finish — When viewed along the axis of symmetry of the groove (parallel to the HP),
the angle of each wall should be 45 degrees ±6 to the vertical. The height of the groove at the opening should be z6
beneath the HP. The shape and surface finish of the groove should ensure that the carrier will seat fully onto the
KCPs when there is an offset (lead-in error) of r16, allowing an empty, partially filled or full carrier to seat
completely on the KCPs so long as it is placed on the load port r16 from nominal. See Figure 10 and R1-2.
R1-4.4 KC Groove Length — In order to ensure capture of either the primary or secondary KCP during a physical
handoff with an offset (lead-in error) of r16, along the length of the groove, a minimum groove length is specified.
The innermost end of the front KC grooves should be no farther than r6 from the origin, and the outermost end of
the grooves should be no closer than r11 from the origin. The innermost end of the rear KC groove should be no
farther than r14 from the origin, and the outermost end of the groove should be no less than r7 from the origin. The
KC grooves should not interfere with the edge of the conveyor rail or other exclusion features. See Figures 10 and
R1-3.
Figure R1-2
Kinematic Coupling Groove
Figure R1-3
Kinematic Coupling Offset
This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline.
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Doc. 5636  SEMI
LETTER (YELLOW) BALLOT
DRAFT
Document Number: 5636
Date: 2/6/2016