Supporting Information 1. The scanning electron microscope (SEM) operations on carbon nanotubes (CNTs) The SEM examination of CNTs #1-7 was carried out using the SEM mode of Carl Zeiss Nvision 40 and its in-lens detector exclusively for secondary electrons (SEs). The accelerating voltage of the electron beam (e-beam) was 1 kV. The pressure in the SEM sample chamber was around 1×10-6 mbar. The working distance was adjusted to make sure that the leakage current, i", of any oxide area without any CNTs was around zero. For each SE measurement, the following process was used to assure that any influence of imaging history was avoided. Initially, an unscanned fresh segment of a measured CNT was located quickly with a fast scanning and a low magnification. Then, we increased quickly the magnification to get a desirable value of the size, L, of the scanned area, and the e-beam was blanked instantly. Only after the reading of the current meter returned to zero, we unblanked the e-beam and started to measure the leakage current, i', with a moderate scanning speed. After this, the same process was repeated on an unscanned fresh oxide surface area near the CNT and without any CNTs. i", L and i' are defined by Eq. (1) in the main text. 2. The SEM imaging mechanism of CNTs In SEM, the e-beam scans any sample surface point by point, and the signal from an SE detector is used to form an image. SEM is a powerful instrument to image individual CNTs.1-6 Figure S1 shows that the full width at half maximum of the intensity profile of the SEM image of CNT #1 before breaking was about 86 nm, much larger than its real diameter of 1.48±0.09 nm measured by atomic force microscope (AFM). In order to analyze this, Fig. S2 illustrates the interaction between 1 the e-beam and the samples, where the amorphous carbon (aC) covering the oxide surface is generated by the decomposition of residual hydrocarbon gases in vacuum induced by the illumination of the e-beam and its thickness is around 1 nm measured by AFM. The aC and the CNT are both very thin and light, and so the high-energy ebeam penetrates through them without much backscattering. However, a portion of the incident electrons will be backscattered by the oxide, as shown by the pink arrows in Figs. S2(d-f). Both the e-beam and the beam of the backscattered electrons (BSEs) can excite the bombarded samples to emit SEs.7,8 Generally, these two beams have larger diameters than CNTs, as illustrated in Fig. S2. Only a fraction of the electrons of the two beams reach the CNT. Thus, when the e-beam hits a point in Fig. S2(a) or S2(b) or S2(c) and dwells on it, the current balance gives:9 I b I SE I BSE i (1) I SE SiO2 I b aC ( I b I BSE ) CNT ( I b CNT I BSECNT ) (2) I BSE SiO2 I b (3) where Ib, ISE and IBSE denote the currents of the e-beam, the SEs and the BSE beam, respectively. i denotes the leakage current flowing through the sample to ground. δ and η denote the SE and the BSE yields, respectively. Ib-CNT and IBSE-CNT denote the currents of the fractions of the e-beam and the BSE beam hitting the CNT, respectively. 2 FIG. S1. Intensity profile and its fitting of SEM image (inset, cut from an intact image) of CNT #1 before it broke. The profile is the average of six profiles taken at six different positions in the SEM image. The transversal black line in the inset shows a profiling position. The SEM image in the inset was collected under the condition that the accelerating voltage of the e-beam was 1 kV and no charge existed in the oxide surface. FIG. S2. Schematic images for the interaction between the e-beam and the samples at three different moments, where the distance between the CNT axis and the centre of the e-beam spot changes from zero in (a) to d0 in (b) and then 2d0 in (c). d0 is the size of each scanned point on the oxide surface and the points are represented by the blue squares. The yellow arrows in (a) denote the scanning sequence of the e-beam, which runs from left to right and from top to bottom. The semitransparent green circles denote the amorphous carbon. The large black rectangle denotes the CNT. The red circle denotes the e-beam spot. The pink circle denotes the BSE beam spot. (a-c) Top views. (d-f) Cross sections corresponding to (a-c), respectively. The cross-cutting position is shown by the dashed white line in (a). The CNT is electrically connected with the Si part. The magnitudes of Ib-CNT and IBSE-CNT are determined by the distance between the CNT axis and the e-beam spot and the density profiles of the e-beam and the BSE 3 beam, which can be described by the Gaussian distribution.10,11 So, the densities, Jb and JBSE, of the two beams are given by: x2 y2 J b J b 0 exp( ) wb2 J BSE J BSE0 exp( (4) x2 y 2 ) 2 wBSE (5) where Jb0 and JBSE0 are both constants, x and y are the coordinates along the x and the y directions in Fig. S2(a), and wb and wBSE are the Gaussian radii of the e-beam and the BSE beam, respectively. The e-beam and the BSE beam spots have the same centre,7 as shown in Fig. S2. The centre is used as the origin of the x, y coordinates. wBSE is generally much larger than wb.7,11 Moreover, there are equations between the currents and the densities as Ib J b dxdy wb2 J b 0 I BSE (6) 2 J BSEdxdy wBSE J BSE0 (7). Because the axis of the CNT is along the y direction, Ib-CNT and IBSE-CNT are given as I b CNT x r x r I BSECNT x r (8) J b dxdy x r (9) J BSE dxdy where r is the radius of the CNT and x is the distance between the CNT axis and the centre of the e-beam spot. When wb is much larger than r, Eqs. (8, 9) evolve to I b CNT I b dCNT x2 exp( 2 ) wb wb I BSE CNT (10) I BSE dCNT x2 exp( 2 ) wBSE wBSE (11) 4 where dCNT is the CNT diameter and equal to 2r. Thus, Eq. (2) can be rewritten as I SE SiO2 I b aC ( I b I BSE ) CNT ( I b CNT I BSE CNT ) I 0 CNT ( I b CNT I BSECNT ) I BSE d CNT x2 x2 I 0 CNT [ exp( 2 ) exp( 2 )] wb wBSE wb wBSE I b d CNT I 0 CNT [ I0 Ib I b d CNT wb exp( SiO2 I b d CNT x2 x2 ) exp( )] 2 wb2 wBSE wBSE CNT d CNT d x2 x2 exp( 2 ) I b CNT SiO2 CNT exp( 2 ) wb wBSE wb wBSE (12) where I0 denotes the contribution from SiO2 and aC. The second and the third terms are contributed by the SEs from the CNT excited by the e-beam and the BSE beam, respectively. In SEM instrument, only a portion of the SEs can reach the SE detector. So, the current ISE-d of the SEs reaching the detector is I SE d C 0 I 0 C1 I b CNT d CNT d x2 x2 exp( 2 ) C 2 I b CNT SiO2 CNT exp( 2 ) wb wBSE wb wBSE (13) where C0-2 denote the ratios of the SEs reaching the detector. Because the detector converts this portion of SEs to an imaging signal with the intensity proportional to the amount of the SEs in this portion, the total signal intensity S of the point hit by the ebeam and with the distance x from the CNT axis is S C 3 I SE d CNT d CNT CNT SiO2 d CNT x2 x2 C 3 C 0 I 0 C 3C1 I b exp( 2 ) C 3 C 2 I b exp( 2 ) wb wBSE wb wBSE (14) where C3 denotes the conversion ratio. For simplicity, Eq. (14) can be rewritten as B1 B2 x2 x2 S S0 exp( 2 ) exp( 2 ) wb wBSE wb wBSE (15). 5 The first, the second and the third terms are the contributions from the SEs of SiO2 and aC, the ones of the CNT excited by the e-beam and the ones of the CNT excited by the BSE beam, respectively. Because the e-beam scans any sample surface point by point, we get x nd 0 (16) where n is the amount of the scanned points along the x distance and d0 is the size of each point. Equations (15, 16) fit well with the intensity profile in Fig. S1, giving wb=4.2±1.5 nm and wBSE=53.9±0.7 nm. In order to confirm the validity of the above analysis, the value of wb was measured independently under the same SEM conditions by a sharp edge method.12 Figures S3(a-c) show a membrane windown grid. This grid is actually a Si chip with a window at its centre. A Si3N4 membrane with low stress, the root mean squared roughness of 0.2 nm and the thickness of 50 nm is suspended across the window. Although there were pores produced by the manufacturer in the membrane, we used the focused ion beam (FIB) of Carl Zeiss Nvision 40 to drill new square holes in the membrane. Because the angle between the e-beam and the FIB was known, we tilted the grid with the membrane to acquire that the edges of the square holes were exactly parallel with the incident direction of the e-beam. After this, firstly we measured the leakage current from an area of the membrane without any holes to ground and found it to be 0±49 fA, exactly at the zero point. This indicated that the membrane was completely opaque to electrons and no charge existed on it. Then we increased the magnification quickly and collected the SEM image of the edge of a square hole, as shown in the inset of Fig. S3(d). From the intensity profile of a line across the edge image, we measured the value of w, the distance between the two points corresponding to 75% and 25% of the highest intensity, as shown in Fig. 6 S3(d). Because wb = 1.045w,12 the value of wb was obtained as 6.7±0.7 nm, close to the value of 4.2±1.5 nm from the fitting within the error bars. This consistency was repeated on the two sections of CNT #1 after breaking and a second CNT (CNT #2), as shown in Table I. These indicate that the above theoretical analysis is consistent with observations. We conclude that the increase in diameter observed in SEM images of CNTs compared to their true diameters is caused by the Gaussian density profiles of e-beams and BSE beams. It is noted that the above theoretical analysis and conclusion are also applicable to CNTs unconnected with electron reservoir, because the difference between the cases of the unconnected and the connected CNTs is only that the values of the leakage currents are different due to the different flowing paths of the leakage currents. This applicability is proved by the data of the unconnected sections of CNTs #1 and 2 in Table I. FIG. S3. Measurement of wb of the e-beam by the sharp edge method. (a) Top-view SEM image of a membrane window grid purchased from the company of SPI Supplies, where there is a Si3N4 membrane suspended acorss the window in the centre. (b) Top-view close-up of the Si3N4 membrane, where the round pores were produced by the company and the square hole was made by the focused ion beam (FIB) of Carl Zeiss Nvision 40. (c) Cross-sectional 7 schematic (not to scale) of the grid, where the square hole is not shown. (d) Intensity profile of the blue line across the edge of the square hole in the SEM image in the inset. w is the distance between the two points on the blue line, which are corresponding to 75% and 25% of the highest intensity, respectively. Table I. Data of the analyses on the SEM imaging mechanism of the CNTs. CNT# dCNT (nm) 1 1 1 2 2 1.48±0.09 1.48±0.09 1.48±0.09 2.5±0.3 2.5±0.3 wb (nm) from the fitting 4.2±1.5 2.6±0.7 2.5±1.2 12.3±2.4 5.8±3.7 wb (nm) from the edge measurement 6.7±0.7 4.7±0.6 4.6±0.7 11.0±1.5 9.0±0.6 Connected with Si Yes Yes No Yes No Notes Before breaking After breaking After breaking After breaking After breaking 3. Theoretical analysis on the SE yields of CNTs When the e-beam hits a point and dwells on it, Eqs. (1-3) give: I b SiO2 I b SiO2 I b aC ( I b I BSE ) CNT ( I b CNT I BSECNT ) i I 0 CNT ( I bCNT I BSECNT ) i (17) I 0 SiO2 I b SiO2 I b aC ( I b I BSE ) (18). So, during the dwelling of the e-beam on this point, the charge flowing through the sample to ground is q it d (19) where td is the dwell time of the e-beam on the point and equal to 100×2p-1 ns. p is the ranking number of the nominal scanning speed in SEM and can be selected among the integers of 1~15. Thus, the total charge flowing through the sample to ground during scanning a whole intact SEM image is Q (it d ) td i x, y (20). x, y An intact SEM image consists of M (x-directional) × N (y-directional) scanned points. Because the axis of a CNT is along the y direction, as shown in Figs. S2(a-c), a 8 whole intact SEM image can be divided into N identical lines parallel to the x direction and perpendicular to the y direction. Thus, Eq. (20) can be rewritten as Q Nt d i (21). x If td is too long in experiments, obvious drift of sample, overcharge and deposition of too much aC will happen in taking SEM images. A short td is used, which does not leave enough time to measure i, however, the average leakage current i' from scanning a whole intact SEM image can be measured. We can get Q i T i M Nt d (22) where T is the period of scanning a whole intact SEM image. If no CNT exists in an intact SEM image, Eq. (17) becomes I b I 0 i (23). where i" is the leakage current flowing through the sample to ground when no CNT exists in the SEM image. Based on Eqs. (3, 10, 11, 16, 17, 21, 22, 23), we get CNT M (i i ) ( I bCNT I BSECNT ) x M (i i ) I b d CNT I BSE d CNT x2 x2 x [ w exp( w 2 ) w exp( w 2 )] b BSE b BSE i i Ib i i Ib M 1 x2 x2 d CNT [ exp( 2 ) SiO2 exp( 2 )] wb wBSE wb wBSE x M M 2 d CNT 1 [w n M 2 b exp( (24). n d n d ) SiO2 exp( 2 )] 2 wBSE wb wBSE 2 2 0 2 9 2 0 This equation can be simplified further. When wb >> d0, Md 0 Md 0 … are 2wb 2wb quasi-continuous. Thus, we can get M 2 M n 2 d 02 n 2 d 02 1 1 2 [ [ exp( )] exp( )]dn M w 2 2 M2 wb w w b b b n 2 Md 0 2 wb Md 0 2 wb d0 [ d n 1 exp( V 2 )]dV , V 0 d0 wb erf ( Md 0 ) 2 wb (25). where erf is the Gauss error function. When M/2 >> wb/d0, we further get d0 erf ( Md 0 ) erf () 2wb d0 d0 (26). This mathematical process can be also used for M 2 M n 2 [ 1 w BSE exp( n 2 d 02 2 w BSE )] . Thus, we can simplify Eq. 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