HT SUMMARY SLIDES TI High Temperature Products High Temperature Two HT Product Types • High Temperature (HT) 200°C parts • -55°C to +210°C - 1000 hours • Ceramic & KGD packaging • 175°C Plastic Parts • -55°C to +175°C operation • Plastic surface mount packaging Complete High-Temp (HT) signal-chain solutions for harsh environments Unique Die and Packaging optimized for HT Thermal shut-down removal HT products offerings: HT Plastic -55C to 175C HT Ceramic -55C to 210+C The are 3 areas TI has developed expertise to guarantee reliability on our released HT products • • HT Die -55C to 210+C • Initial qualification of process, package and silicon across temperature Silicon, Package Material set and Process modifications On-going production quality monitors TI Enhanced Industrial Packaging Complete signal chain solutions Smallest Footprint Widest Package Type Options Ruggedized Packages Hermetic Packages Up to 150°C Plastic Packaging Up to 175°C Plastic Packaging • Smallest size • Ruggedized Applications • Ruggedized Applications • Extreme Applications • Most Integration • Enhanced Qualification • Enhanced Qualification • HT Qualification • Multiple options • Extended Temperature • Extended Temperature • Extended Temperature • 25°C tested wafers to • Up to -55°C to 150°C • Up to -55°C to 175°C • Up to -55°C to 210°C • -55°C to 210°C Known Good • Multiple Package types • Multiple Package types • Multiple Package types • Special High Temperature • Most rugged hermetic Material Sets material option Bare Die/Wafers Solutions Die (KGD) • Broad portfolio Up to 210°C Ceramic Packaging High Temperature Offering Interface Down Hole Signals Signal Conditioning Temperature Pressure Position Speed Flow OPA2333-HT OPA211-HT INA129-HT INA333-HT INA271-HT THS4521-HT OPA820-HT A to D ADS1278-HT ADS1282-HT ADS1243-HT ADS8320-HT ADS8509-HT ADS6142-HT Resistivity Memory Rock Density SM28VLT32-HT SN65HVD233-HT SN65HVD11-HT SN65HVD1040-HT ISO7221-HT DSP/MCU Power TPS76901-HT TPS62000-HT TPS62110-HT TPS40200-HT TPS40210-HT TPS50301-HT TPS7H1201-HT TPS54363-HT REF5025-HT SM470R1B1M-HT SM320F2812-HT SM320F28335-HT MSP430F2619-HT OMAPL137-HT Legend 150/175C Plastic 210C Ceramic/KGD TI High Temperature Products HT Webpage: http://www.ti.com/ht TI HiRel Contact: Mont Taylor mont-taylor@ti.com (903) 868-6316 Comments/Feedback Please Visit : www.ti.com/ht Full TI High Temperature Products Presentation 7 HiRel Business Segments Enhanced Products Space High Temperature Bare Die Commercial-of-the-shelf (COTS) plastic solution for long life-cycle applications Complete signal chain solution for Space environments Complete High-Temp (HT) signal-chain solutions for harsh environments Ability to support complete signal chain solutions in die form Controlled baseline, traceability QMLV-certified wafer fabs Unique Die and Packaging optimized for HT Full Known-good die (KGD) for military, space and high temp applications Extended Product Change Notification (PCN) Extended Temperature (-55C to 125C) Additional test coverage and characterization RHA certification Radiation hardening IP TID/SEE testing on products Thermal shut-down removal HT products offerings: HT Plastic -55C to 175C HT Ceramic -55C to 210+C HT Die -55C to 210+C Tested die (TD) for commercial applications Wafer support and small quantity waffle pack support TI HiRel Advantage Commitment • 30+ years of experience working with HiRel customers • Largest dedicated organization in the industry • Worldwide sales and support infrastructure Leading-edge technology and manufacturing • HiRel approved fabs (certified by Defense & Aerospace standards) • Access to latest process technologies (HPA07, BiCom, etc.) • Broad packaging capabilities As short as 9 months As long as 30 years Product Consumer Life Cycle HiRel Products Life Cycle Intro Growt h Maturity Declin e Phase Out Extended product life cycles Longevity Assured • Obsolescence mitigation • Supply beyond commercial availability • Product resurrection Market expertise • Baseline control and qualification per unique market requirements: TID, SEU, high-temp, ceramic, QML –Q/V, EP, die solutions, etc. High temperature and harsh environments markets Down hole Avionics • Drilling • Logging • Well monitoring Medical • Autoclave • Sterilization • Jet Engines • Brakes Heavy Industrial Geothermal • Chemical Processing • Sensors • Actuation/ Control • Drilling • Well monitoring Market requirements • Ruggedized packages • Small size • Low power • Qualified operation >150°C 10 TI HiRel High Temperature Products Two HT Product Types • High Temperature (HT) 200°C parts • -55°C to +210°C - 1000 hours • Ceramic & KGD packaging • 175°C Plastic Parts • -55°C to +175°C operation • Plastic surface mount packaging 11 HT Reliability • There are 3 areas TI has developed expertise to guarantee reliability on our released HT products 1. Initial qualification of process, package and silicon across temperature 2. Silicon, Material set and Process modifications 3. On-going production quality monitors Parametric Characterization done for each HT Release • Functionality • • • • AC and DC Parametrics Speed / Performance Leakages & Power Analysis IO Peripheral timing / performance Operational Mode Idd in mA vs. T emp 340 330 320 310 300 Vmin in Volts Core DSP 150Mhz vs. T emp in DegC 290 1.9 280 270 1.8 260 1.7 250 240 1.6 Mean StdDev Min Max Q3 Q1 1.5 25 249.3034 4.0199 243.8160 255.9840 252.8040 246.4630 125 254.0111 3.4564 248.9640 258.9500 257.2870 251.6250 160 259.4265 4.2324 253.4000 266.4850 262.3755 256.1458 185 265.0004 3.7693 260.4060 270.3570 267.6970 261.5813 220 279.1381 4.9385 273.5630 287.7660 281.8740 274.8520 250 296.3656 23.7235 259.7050 339.9770 306.9300 280.7270 1.4 1.3 1.2 Mean StdDev Min Max Q3 Q1 25 1.5000 0.0000 1.5000 1.5000 1.5000 1.5000 125 1.5333 0.0500 1.5000 1.6000 1.6000 1.5000 160 1.5778 0.0667 1.5000 1.7000 1.6000 1.5000 185 1.6111 0.0333 1.6000 1.7000 1.6000 1.6000 220 1.6111 0.0333 1.6000 1.7000 1.6000 1.6000 250 1.6750 0.0707 1.6000 1.8000 1.7000 1.6000 13 High Temperature 210°C Quality and Reliability These qualification tests are typically preformed for each new 210°C HT Ceramic product release • Package Qualification – – – – Bond Strength Die Attach Strength Mechanical Shock (1.5K g) Constant acceleration (30K g) – – – – Variable Frequency Vibration (20 g peak 20Hz to 2KHz) Temperature Cycle (-65°C/+150°C 1000 cycles) Hermetic test (Fine and Gross Leak) Thermal Shock (-65°C/+150°C 100 cycles) • Technology Verification – Electromigration Design Rule Verification – – – Voltage Box Characterization Negative Bias Temperature Instability Rules Verification Operational Characterization (from three lots) • Life Test (1000Hours/200°C) – – – – By technology node (function, wafer fabrication process, and feature size) 2,000 hours at 200°C, 1000 hours to release Static (e.g., Analog) or Dynamic (e.g. DSP/MCU) Sample size is 15 units minimum (3 lots) with no failures 14 New Leadform Packages 8-pin Ceramic FP 84-pin Ceramic QFP Leadformed Releases ADS8320SHKQ Released OPA2333SHKQ Released SN65HVD1040SHKQ Released OPA211SHKQ Released REF5025SHKQ Released INA271SHKQ Released INA129SHKQ Released TPS76901SHKQ Released SN65HVD233SHKQ Released INA333SHKQ Released THS4521SHKQ Released SN65HVD11SHKQ Released ADS1278SHKP Released SM470R1B1MHKPS Released 175°C Plastic Packages • There are several ways TI provides a ruggedized plastic package for our 175C offerings • We have a different material set than the commercial/industrial devices to improve reliability at temperature • Special leadframe, mold compounds, and die attach to withstand the stresses from CTE mismatch • Special bonding wires and processes to minimize Kirkendall voiding causing degraded bond strength 17 Differences in Flows Commercial IC Flow - Cost Driven EP Flow - Quality Driven HT Plastic Flow - Quality and Temp Driven Wafer Fab Wafer Fab Wafer Fab One Wafer Fab One Wafer Fab/HT Die AT Site AT Site AT Site AT Site AT Site Material Set Material Set Material Set Material Set HT Material Set Commercial products can be built in multiple FABs, AT sites and may use various material sets for each product build EP products are built in one FAB, one AT site and use one material set for product build HT products are built in one FAB, one AT site and use one material set optimized for HT 175°C Plastic Package Qualification The following high temperature plastic package qualification test sequence is required for each pin/package and die technology combination in addition to the EP standard qualification requirements. Data can be combined from different device types from the same pin/package and die technology. • Preconditioning (surface mount packages) • HTSL (Bake): 2000 hours at TA = TJ, where TJ is the maximum recommended operating temperature for the device type • Temperature Cycle: 500 cycles at -65°C to +150°C • Electrical Test: per datasheet at +125°C minimum with additional pin-to-pin leakage testing. • CSAM: 5 units/lot • TSAM (PowerPad packages only): 5 units/lot • Bond Pull: 5 units/lot - 15 wires/device • Bond Shear: 5 units/lot - 15 bonds/device • Cross section: 1 unit/lot - 1 bond/unit or 1 bump/pad 19 HT Plastic Qualification Commercial plastic failing HT Qual • Delamination • Bond degradation CSAM Before After Bond Cross Section Initial X-Ray Bond Pull 175°C Plastic Package Summary • TI HT Plastic parts use special leadframes, mold compounds, die attach, and bonding • We have a material set different from the commercial/industrial devices to improve reliability at temperature • Special leadframe, mold compounds, and die attach to withstand the stresses from CTE mismatch • Special bonding wires and pad processes to mimimize Kirkendall voiding causing degraded bond strength 21 High Temperature Wafer Lot Qualification • New qualification test performed on each HT wafer lot • 45 units from every wafer lot used for HT products will be subjected to: – 210C burn in for 240 hours then, – End point electrical testing at operating temperature of -55C t o 210C – Requirement for all to pass standard HT tests – Allows any parametric drifts to be observed • Requirement for all new HT products beginning in 2Q’12. • Allows HiRel to keep a tight monitor on all HT products to control process variations that might affect performance across temperature. 22 High Temperature Products DC/DC Controller Power FET Point Of Load Power HT Advantage & Qual Voltage Reference Precision Op-Amp Analog to Digital Converter Processor Communication Interface H.E.A.T. EVM Flash Memory Power Driver Digital To Analog Converter Precision Op-Amp Power FETs or BJTs TI HT Roadmap High Temperature Qualified Data Converters ADS1282-HT Resolution (Bits) ADS1243-HT High Resolution ΔΣ, 250SPS to 4KSPS ADC Octal Low Power 24-bit ΔΣ ADC 24 210 210 ADS1278-HT Octal Simult. Sampling 24-bit, 128KSPS ΔΣ 175 DIE DIE 210 175 DIE PFLC ADS8509-HT 16-bit 250kHz CMOS ADC 16 175 ADS8320-HT 16-bit 2.7V to 5V µ-Power Sampling ADC 175 210 DIE 14 ADS6142-HT PFLC 14-bit, 65 MSPS ADC w/ selectable outputs 210 DIE 175 DAC Released 210 175 DIE PFLC 210 °C Ceramic 175 °C Plastic Die Pre-formed lead ceramic <1 Development Planned 4K 100K 128K 250K Sample Rate (SPS) 65M High Temperature Qualified Instrumentation Amplifiers INA271-HT Voltage Output Wide Common-Mode Shunt Monitor 10K 210 DIE Input Offset (µV) PFLC INA128-HT Low Power Wide-Supply Instrumentation Amp 50 210 25 210 175 DIE PFLC 175 210 °C Ceramic 175 °C Plastic Die Pre-formed lead ceramic 130 INA333-HT Released Low Power Single Supply Instrumentation Amp Development 210 DIE Planned PFLC 200 500 Bandwidth (kHz) for G=100 1,000 High Temperature Temperature Qualified Qualified Amplifiers Amplifiers High LM95172 13 to 16-bit Digital Temperature Sensor Temperature Sensors 210 THS4521-HT Single-Channel Rail-to-Rail Output Differential Amp Differential Amplifiers Standard Op-Amps 210 175 DIE PFLC OPA2333-HT OPA211-HT Very Low Power Zero-Drift Series 1.1nV/√Hz 45MHz +/-10V 210 175 210 150 DIE PFLC DIE PFLC OPA820-HT Unity-Gain Low-Noise Voltage Feedback Op-Amp 210 DIE PFLC Released 210 175 DIE PFLC 210 °C Ceramic 175 °C Plastic Die Pre-formed lead ceramic Development Planned High Temperature Qualified High Temperature Qualified PowerAmplifiers Management DC/DC Controllers TPS40200-HT Wide Input, Low-pin Buck Controller 210 175 DIE PFLC TPS40210-HT 4.5 to 52V Input Current-Mode Boost Controller 210 DIE LM5116WG-HT Wide Range 100V Synchronous Buck Controller 210 DIE DRV8332-HT Motor Driver Voltage References Motor Driver DIE 210 175 REF5025-HT 2.5V Precision Voltage Reference 210 DIE PFLC DC-DC POL Converter TPS62110-HT Adjustable, Step-Down Converter TPS50301-HT 3Amp, 3V to 7V Step-Down SWIFT DC/DC Converter 210 175 TPS54362-HT 1Amp, 48V Step-Down SWIFT DC/DC Converter 175 Released LDO TPS76901-HT TPS7H1201-HT Single-Output 100mA Adjustable LDO Single-Output 500mA Adjustable LDO 210 175 DIE PFLC 210 210 175 DIE DIE PFLC 210 °C Ceramic 175 °C Plastic Die Pre-formed lead ceramic Development Planned High Temperature Qualified Amplifiers High Temperature Qualified Processors and Memory Embedded Controllers MSP430-HT 16-bit Ultra Low Power MCU SM470R1B1M-HT SM320F2812-HT Digital Signal Controller ARM 7 Microcontroller Digital Signal Controller 210 150 DIE DIE Embedded Processors SM320F28335-HT 150 210 150 220 DIE PFLC DIE OMAPL137-HT C674x DSP + ARM9 Processor 175 DIE SM28VLT32-HT Memory 4MByte FLASH Storage Device Memory 210 DIE Released PFLC Development Planned Temperature Qualified Amplifiers HighHigh Temperature Qualified Interface Products SN65HVD233-HT CAN CAN Transceiver with Diagnostic Functions SN65HVD1040-HT Low-Power CAN Transceiver with BUS Wake-Up 210 175 210 DIE PFLC DIE PFLC ISO7221C-HT Isolators Dual High-Speed Digital Isolator 175 SN65HVD11-HT RS485 3,.3V RS485 Single HalfDuplex Transceiver 210 175 DIE PFLC Released Development Planned Introducing the H.E.A.T. EVM Harsh Environment Acquisition Terminal (H.E.A.T.) EVM Features and benefits • Full high-temperature data acquisition system utilizing TI’s comprehensive signal-chain product portfolio • Eight Analog Input Channels – – Six channels optimized for temperature, pressure sensors and accelerometers Two general-purpose channels (fully differential and single-ended) • Comprehensive set of TI components qualified for – – Operating temperatures from -55ºC to 210ºC Minimum 1,000 hours operating life • Board is made with polyimide material, and incorporating high-temperature rated passive components and solder materials • EVM is test oven ready and can withstand temperatures up to 200°C for 200 operating hours. H.E.A.T. EVM high-temperature components • SM470R1B1M-HT – ARM7 microcontroller • OPA2333-HT – low power zerodrift series operational amplifier • REF5025-HT – 2.5V precision voltage reference • ADS1278-HT – octal simultaneous sampling 24- bit 128KSPS ADC • INA333-HT – zero drift, low power, single supply instrumentation amplifier • SN65HVD233-HT – CAN transceiver • OPA211-HT – low-noise operational amplifier • THS4521-HT – low-power fully differential amplifier • SN65HVD11-HT – RS485 transceiver New HT Design Support for 2013 • H.E.A.T. Power Reference Design – Demonstrating TI HT power solutions – Sequencing • TPS50301-HT POL Evaluation Board – Standard temperature board and evaluation – Spot for TPS7H1201-HT LDO when available • HT FLASH EVM • Generic HT Op Amp Board PowerHEAT EVM w/ Voltage Sequencing Sequencing Timing Diagram • • • • • • Output Voltages: 3.3V uP 3.3V Adc ( Analog) 1.8V uP 1.8V Adc (Analog) 5.0V Adc (Analog) +3.3V uP POR 120msec 1.8V uP 1.8V Adc TPS7H1201-HT +5V Analog Switched +5V Analog 500 usec +1.8V @ 250mA +5V @ 250mA +5V Analog TPS40200-HT Bias Voltage Vin = 6V - 52V Reverse Bias Protection Generator TPS40200-HT Input Current sense Buck +5V Bus Input Filter INA271-HT 3.3V @ 100mA 3.3V uP Buck Converter Converter +3.3V Adc uP power TPS40200-HT Input Filter 3.3V @ 100mA 3.3V Analog Buck Converter Sequencing logic (using REF5025-HT & OPA211-HT) Analog Power TPS40200-HT Input Filter TPS76901-HT Buck Converter LDO uP power uP power 500 usec 1.8V @ 50mA 1.8V uP +5.0V Adc TPS50301-HT Input Filter Buck Converter 1.8V @ 200mA 1.8V Analog Analog Power TPS40210-HT 6V Input Input Filter -+8V @ 20mA Boost Converter Input Current Sense signal 120msec HIGH TEMP POL EVM Optional TPS7H1201-HT +1.8V @ 250mA LDO PVin = 1.6V - 6.3V TPS50301-HT Buck Converter Iout Max = 3A With External Overload Protection Vin = 3V - 6.3V 2.5V @ 3A Generic HT Op Amp Board • Unpopulated HT board for oven evaluations • Options for multiple configurations 4MB HT Flash EVM Board • Simple HT board allowing oven testing of 14-pin ceramic package TI High Temperature Products HT Webpage: http://www.ti.com/ht TI HiRel Contact: Mont Taylor mont-taylor@ti.com (903) 868-6316 Comments/Feedback Please Visit : www.ti.com/ht HT PRODUCT ONE PAGE OVERVIEW SLIDES ADS1278-HT Released Octal Simultaneous Sampling 24-Bit 128KSPS ADC • Simultaneous Sampling of 8 inputs up to • 128KSPS Data Rate @ 103 dB SNR Low-Power: 52 kSPS, 57 mW/ch SPI or Frame-Sync Serial Interface AC Performance: • -96 dB THD • 101 dB SNR (High Resolution Mode) Linear Phase Digital Filter Modulator Output Option (digital filter bypass) ENOB = 16.9 bits at 210C • • • • • Down-Hole Drilling High Temperature Environments Vibration Analysis Pressure Sensors Acoustics • • • • • • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Selectable Operating Modes: Mode Data Rate SNR Power Diss. High Speed 128kSPS 96dB 985mW High Resolution 52kSPS 101dB 985mW Low Power 52kSPS 97dB 455mW Low Speed 10kSPS 98dB 120mW • -55°C to +175°C (64-pin Plastic QFP (PAP) – 1Q13 • -55°C to +210°C (84-pin Ceramic QFP (HFQ) & KGD) • -55°C to +210°C (4Ceramic Lead-formed FP (HKP)) ADS1282-HT Released Ultra-High Performance ΔΣ ADC with Low-Noise PGA • Extremely High Resolution • 122-dB SNR (250 SPS, High-Res. Mode) • 119-dB SNR (250 SPS, Low-Power Mode) • Ultra-Linear – THD: –101 dB, INL: 0.5ppm • Flexible Data Rate: 250SPS to 4KSPS • Onboard High Performance Digital Filter: • SINC + FIR + IIR (selectable) • Linear or Minimum Phase • 0.5Hz to 7.5Hz High Pass • Filter Bypass Mode • Low Power: 56.1 mW (High-Res. Mode) and • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability AVDD VREF DVDD 46.1 mW (Low-Power Mode) ADS1282 MUX • • • • • Down-Hole Drilling High Temperature Environments Vibration Analysis Pressure Sensors Acoustics CLK SYNC PWDN RESET In1 PGA In2 1 to 64 4th order ∆Σ Mod. Programmable Digital Filter & Calibration SPI 3 Serial Interface I/O Mod. Out Over-Range AVSS • -55°C to +175°C (28-pin Plastic TSSOP (PW)) – Released • -55°C to +210°C (28-pin Ceramic DIP (JDJ) & KGD) – Released DGND ADS1243-HT Released Octal Low Noise Low-Power 24-Bit ADC • Multiple transducer signals can be easily • 24-Bits No Missing Codes sampled using the internal multiplexer • Up to 8 Inputs Channels and Eight Data I/Os • Allows user to measure input signals from • Programmable 15SPS Data Output Rates 20mV (full-scale) to VDD • Internal Input Buffer and PGA • Allows user to easily correct for off-set • 21-Bits Effective-Resolution (PGA=1) errors by issuing a calibration command • On-Chip Calibration • Enables high accuracy measurements • Highly linear (no linearity below 15ppm) throughout entire input range • Simultaneous 50 Hz and 60 Hz Rejection • Excellent 50 and 60Hz Rejection • Single-Cycle Settling • Controlled Baseline • External Differential Reference of 0.1V to 5V • One Assembly/Test Site & Fabrication Site • SPI Interface Compatible • Extended Product Life Cycle • 1ppm of full-scale Noise Performance ADS1240/41 • Product Traceability • 600 µW/ch power consumption AVDD AGND VREF+ VREF- DVDD DGND • 20-pin Ceramic FP (SJD), KGD and PW packages Down-Hole Drilling High Temperature Environments Vibration Analysis Pressure Sensors Acoustics AIN1 / D1 AIN5 / D5 AIN6 / D6 BUF PGA ADC SPI Serial Interface SCLK POL DIN 1:128 DOUT AIN7 / D7 • -55°C to +210°C – Released • -55°C to +175°C – Potential XOUT DRDY AIN3 / D3 AIN4 / D4 XIN CS AIN2 / D2 MUX • • • • • Clock Generator Offset DAC AIN0 / D0 RESET AINCOM Control SYNC PWDN ADS8320-HT Released 16-Bit High-Speed, 2.7 to 5V microPower Sampling ADC • 16-Bit, 100kHz Sampling Rate • MicroPOWER: • <4mW at 100kHz and 2.7V • Power-Down: <60 uW • Serial SPI and SSI Interface • 8-pin Ceramic FP (HKJ) Package and KGD • • • • • • Pin-out compatible with ADS7816 and • • • • • ADS7822 Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability Down-Hole Drilling High Temperature Environments Vibration Analysis Pressure Sensors Acoustics • -55°C to +210°C (8-pin Ceramic FP (HKJ) and KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released ADS8509-HT Released 16-Bit 250KSPS True Bipolar Serial ADC • Pin Compatible With ADS7809 • Low Off-Set • Very Low Off-set Drift • Data can be read during device power-down • Highly Integrated- with onboard reference, • 250-kHz Sampling Rate • 4V, 5V, 10V, ±3.33V, ±5V, ±10-V Input • • • • • • • Ranges SPI Compatible Serial Output Daisy-Chain (TAG) Feature On board reference, reference buffer & Clock Internal or External Reference Low Power Dissipation at 250 KSPS Simple DSP Interface 20-pin Plastic (DB) Package • • • • • • reference buffer and conversion clock Long-term stability from No Probing Laser Trim Controlled Baseline One Fabrication and Assembly/Test Sites Extended Product Life Cycle Product Traceability Selectable Operating Modes: R/C- SAR Down-Hole Drilling High Temperature Environments Vibration Analysis Pressure Sensors Acoustics SB/BTC- 4.9K Serial Data Out & Control R2IN 2.5K 10K R3IN PWRD COMPARATOR CS- CAP REF • -55°C to +175°C – Released BUSY- CDAC 9.8K Data BUF • • • • • R1IN Dataclk 4K 2.5V INTERNAL REFERENCE Clock EXT/INT- ADS6142-HT Released Low-Power High-Performance 14-bit, 65 MSPS ADC w/ Selectable outputs • Highest performance 14-bit available gives • 14-bit resolution with No Missing Codes best performance in extended temperatures • Maximum Sample Rate: 125 MSPS • Selectable LVDS or CMOS outputs • Better dynamic performance, Gain, and • No External Decoupling required for Reference programmability enables more margin • 74.7 dBFS SNR, 95 dBc SFDR at 50MHz IF • Low power enhances battery life and • Internal coarse and fine gain settings reduces thermal effects • 73.5 dBFS SNR, 96 dBc SFDR @ 50MHz IF • 70.4 dBFS SNR, 80 dBc SFDR @ 170MHz IF • Gain and other programmable settings • Low power dissipation: 285mW (CMOS) allow device to be optimized to your needs • Programmable Output Clock Position and Drive • Controlled Baseline Strength to Ease Data Capture • One Fabrication and Assembly/Test Site • 32-pin plastic package and KGD • Product Traceability • Extended Product Life Cycle • Extended Product-Change Notification • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -40°C to +210°C KGD – Released • -55°C to +175°C (Plastic) – RTM 2H13 LM95172 Released 13-Bit to 16-Bit 200°C Digital Output Temperature Sensor with 3-Wire Interface • Analog and Digital Supply Voltage: 3.0V -5.5V • Total Operating Supply Current: 400 μA (Typ) • Shutdown −40°C to +175°C → 12 μA • Shutdown −40°C to +200°C → 28 μA • Temperature Accuracy: • +175°C to +200°C → ±3.0°C (max) • +160°C to +175°C → ±2.0°C (max) • Temperature Resolution: • 13-bit: 0.0625°C/LSB • 16-bit: 0.0078125°C/LSB • Conversion Time: • 13-bit: 43 ms (Max) • 16-bit: 350 ms (Max) • 10-pin Ceramic Dual Flat-Pack Package • • • • • • Down-Hole Drilling Automotive high temperature applications Heavy Industrial Power Controllers Heavy Industrial motors, gear boxes Geothermal instrumentation High Temperature Test Equipment • -40°C to +200°C • Shutdown mode saves power yet wakes • • • • • • • • up for one-shot temperature update Integrated linear ΔΣ ADC produces high accuracy, fast conversion rates and extremely low output noise which improves system performance Universal SPI and MICROWIRE Bus interface standards provides flexibility High noise immunity of the Serial I/O (SI/O) output is ideal for challenging electromagnetic environments Controlled Baseline One Fabrication and Assembly/Test Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification INA129-HT Released Precision, Low Power Instrumentation Amplifiers • Low Offset Voltage • Low Drift: 1μV/C max • Low Input Bias Current: 50nA max • High CMRR: 110dB min • Inputs Protected To 40V • Wide Supply Range: 2.25V to 18V • Low Quiescent Current: 2mA • 8-pin Ceramic Dual FP (HKJ) and Ceramic DIP (JDJ) Packages and KGD • Ideal for Bridge, Thermo-couple, and • • • • • • RTD Sensor, Amplifier and Data Acquisition applications Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification Bridge Amplifier • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +210°C (8-pin Ceramic Dual FP (HKJ)) – Released • -55°C to +210°C (8-pin Ceramic DIP (JD) & KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released INA129 INA333-HT Released Micro-Power, Zero Drift, Low Power, Single Supply Instrumentation Amplifier • Low Offset Voltage: 15uV • Low Drift: 0.2uV/C • Low Input Bias Current: 2044pA max • Input Voltage Noise: 55nV/rt-Hz, 1kHz • Supply Current: 345uA max • Wide Supply Range: 1.8V to 5.5V • RFI Filtered Inputs • 8-pin Ceramic Dual FP (HKJ), Ceramic DIP (JD) Packages, KGD, and Plastic SOIC (D) • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • • • • -55°C -55°C -55°C -55°C to to to to +210°C +210°C +210°C +175°C (8-pin (8-pin (8-pin (8-pin • Creates excellent accuracy • Ideal for maximum power efficiency • Easy compatibility for battery powered apps • Great for high impedance applications • Low Noise • Enables high accuracy • Enhances noise immunity • Controlled Baseline • One Fabrication and Assembly/Test Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification Ceramic Dual FP (HKJ)) – Released Ceramic DIP (JD) & KGD) – Released Ceramic Lead-formed FP (HKQ)) – Released Plastic SOIC (D)) – Potential INA271-HT Released Voltage Output High-Side Current Shunt Monitor • -16V to 80V common-mode range • Extended Bandwidth: Up to 130kHz • Split stages for filtering • Two gain option family • INA270: 20 V/V (potential) • INA271: 14 V/V • • • • • • Eliminates need for additional protective • • • • • • • components in the event of supply reversals Buffered output with filtering for simplified use in current control loops Preserves buffered voltage output Saves using an additional Op-Amp Controlled Baseline and Product Traceability One Fabrication and Assembly/Test Site Extended Product Life Cycle Extended Product-Change Notification Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +210°C (8-pin Ceramic Dual FP (HKJ) & KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released • -55°C to +175°C (8-pin Plastic SOIC (D)) – Potential THS4521-HT Released One Channel RRO Ultra Low Power Fully Differential Amplifier • Low Iq, Power-Down mode • Bandwidth: 145 MHz, Slew Rate: 490 V/μs • Low Input Voltage Noise • Negative rail input & output Common-Mode • • • • Control RRO – Rail-to-Rail Output Single, Dual and Quad options 2.5 to 5.5 (or ±1.25V to ±2.75) Supply Operation 8-pin Ceramic Dual FP (SHK) and KGD • Low quiescent current • Delivers high accuracy for 24-bit conversion • Allows easy DC coupling to ADC • Larger outputs with low voltage applications • Flexible supply for power sensitive apps • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification THS4521 Driving a 24-bit Delta Sigma ADC • • • • • Down-Hole Drilling High Temperature Environments Vibration Analysis Pressure Sensors Acoustics • -55°C to +175°C (8-pin Plastic SOIC (D)) • -55°C to +210°C (8-pin Ceramic Dual FP (SHK) and KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released INA128-HT Released Precision, Low Power Instrumentation Amplifiers • Low Offset Voltage • Low Drift: 1μV/C max • Low Input Bias Current: 30nA • High CMRR: 120dB min • Inputs Protected To 40V • Wide Supply Range: 2.25V to 18V • Low Quiescent Current: 2mA • 8-pin Plastic SOIC (D) Package • Ideal for Bridge, Thermo-couple, and • • • • • • RTD Sensor, Amplifier and Data Acquisition applications Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification Bridge Amplifier • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +175°C – Released INA128 OPA2333-HT Released Very Low Power Zero-Drift Series Operational Amplifier • • • • • • • • Ultra-Low Quiescent Current: 80µA (max) Low Offset Voltage: 26µV (max) Offset Voltage Drift: 0.05µV/°C Low Voltage Noise: 1.5 µVP-P Bandwidth: 350kHz Rail-to-Rail Input and Output Single-Supply Operation 1.8V to 5.5V Supply Voltage • • • • • Down-Hole Drilling High Temperature Environments Vibration Analysis Pressure Sensors Acoustics • Low Offset and Drift Removes Need for • • • • • • • • Calibration in Application RRIO Increases Dynamic Range 1.8V Supply Excellent for Battery Devices Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification • -55°C to +175°C (8-pin Plastic SOIC (D)) - Released • -55°C to +210°C (8-pin Ceramic DIP (JD), Ceramic FP (HKJ) and KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released OPA211-HT Released Lowest Power 1.1nV/√Hz 36V Operational Amplifier • • • • • • • • • • • Low Noise Bipolar Input: 1.1nV/√Hz at 1kHz Low Offset Voltage: 260µV (max) Low Offset Voltage Drift: 2µV/°C (max) Low Quiescent Current: 7.5mA (max) Wide Gain Bandwidth: 80MHz @ G=100 Wide Supply Range: ±2.25 to ±18V Slew-Rate: 27V/μs 16-Bit Settling: 750 ns Output Current: 30 mA Rail-to-Rail Output (unique in industry) 8-pin Ceramic QFP (HKJ) Package and KGD • Provides Minimal Signal Distortion • Very High Signal Accuracy • Very Wide Dynamic Range • Spans 5V to Full Industrial Range • Maximum Amplification at any VCC Range • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability 4.5 • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics 50 • -55°C to +210°C (8-pin Ceramic QFP (HKJ) and KGD)–Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released OPA2211-HT Development Dual Lowest Power 1.1nV/√Hz 36V Operational Amplifier • Provides Minimal Signal Distortion • Very High Signal Accuracy • Minimal Offset Change Over Temperature • Lowest Power at this Noise Level • Very Wide Dynamic Range • Spans 5V to Full Industrial Range • Maximum Amplification at any VCC Range • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Low Noise Bipolar Input • Low Offset Voltage • Low Offset Voltage Drift • Low Quiescent Current • Wide Gain Bandwidth • Wide Supply Range: ±2.25 to ±18V • Slew-Rate: 27V/μs • Output Current: 30 mA • Rail-to-Rail Output • 8-pin Plastic SOIC (D) Package 4.5 • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +175°C 50 TPS40200-HT Released Wide Input, Low Pin Count Buck Controller • 5.5V to 52V operation • Voltage Mode Control with Feed Forward • • • • • • • Compensation 753mV Voltage Reference Internal Under-Voltage Lockout Programmable Frequency (35kHz-500 kHz) Programmable Over-current Protection Frequency Synchronization Closed Loop Soft Start Integrated Driver • Many Applications w/ Wide input range • Voltage feed forward – great line regulation, • • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +175°C (8-pin Plastic SOIC (D))–Released • -55°C to +210°C (8-pin Ceramic FP (HKJ) and KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released VIN 1 RC 2 SS/SD 3 COMP 4 FB TPS40200 • • • • • • • • fast transient response Programmability allows frequency, overcurrent protection under voltage lockout Softstart enables smooth controlled power up Minimal external components needed Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification VIN 8 ISNS 7 Rsense GDRV 6 GND 5 VOUT TPS40210-HT Released 4.5 to 52V Input Current Mode Boost Controllers • • • • • • Soft Start Enable function Externally compensated Low ISENSE threshold (150mV) Supports Boost, Flyback, and SEPIC topologies 10-pin Ceramic DFP (HKK) Package, KGD, and Plastic TBD • Prevents inrush current • Enables use of small ISENSE resistors with • • • • • • • lower power dissipation Design and implementation flexibility Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification VIN = 4.5V52V; UVL • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics Soft Start prevents inrush current; has time-out timer when in OCP Freq adj., 35KHz1MHz N-channel FET gate driver; 500mA drive current ENABL E for on/off control External compensatio n for design flexibility • -55°C to +210°C – Released • -55°C to +175°C (Plastic TBD) – Potential Provides current feedback in the control loop; detects an OC based on 150mV threshold Senses switch current and sets OC threshold; low Isense threshold enables use of small resistor, and lower power dissipation LM5116WG-HT Development Wide Range 100V Synchronous Buck Controller • Emulated peak-current mode • Reduces PWM circuit noise sensitivity found • Wide Input Operating Range up to 100V in peak-current mode controllers - allowing • Low IQ shutdown (<10µA) reliable control of very small duty cycles • Programmable Soft Start • Supports high-voltage or wide-varying input • Free-run or synchronous operation: 50kHz-1MHz supply applications • Optional diode emulation mode • Provides Low standby mode “dark current” • Drives standard or logic level MOSFETs • Enables smooth well controlled power-up • Robust 3.5A peak gate drive • Slow Switching-Frequency allows higher • Programmable output from 1.215V to 80V efficiency and smaller duty-cycles while Fast • Precision 1.5% voltage reference Switching-Frequencies enable smaller space • Programmable current limit • Enables discontinuous mode operation for • Programmable line under-voltage lockout improved efficiency at light loads • Automatic switch to external bias supply • Controlled Baseline • 16-pin Ceramic DIP (HKK), KGD, Plastic TBD • One Fabrication and Assembly/Test Site • Extended Product Life Cycle • Product Traceability • Down-Hole Drilling • Extended Product-Change Notification • • • • High Temperature Vibration Analysis Pressure Sensors Acoustics • 57-55°C to +210°C – 16-pin Ceramic DIP – RTM 3Q13 DRV8332-HT Development Three Phase PWM Motor Driver • Highest power integrated drive on the market • Supply Voltage up to 50V (70V abs max) • Output Current 8A RMS/13A peak/Bridge • Advanced arch. with high efficiency up to 97% • PWM operation frequency up to 500kHz • Low RDSON MOSFETs (80mΩ) • Intelligent gate drive and cross conduction • High linearity of output signals to guarantee • • • • prevention • • Short dead time (5ns) • Spike voltage control to reduce overshoot • • Integrated Protection Features • Programmable cycle-by-cycle current limit • Two stage thermal protection • 44-pin plastic DDV Package precise and smooth operation No external snubber & schottky diodes Unmatched on-chip protection reduces design complexity and enables higher system reliability Controlled Baseline and Product Traceability One Fab site and Assembly/Test Site Extended Product Life Cycle Extended Product-Change Notification RESET_A RESET_B • • • • • Down-Hole Drilling Brushless DC Motors Vibration Analysis Pressure Sensors Actuators and Pumps • -55°C to +175°C – RTM 7/30/13 RESET_C REF5025-HT Released 2.5V Precision Voltage Reference • • • • • • • • Low Noise High Accuracy Low Temperature Drift: 40 ppm/°C High output Current: ±7mA 2.5V Voltage Output Wide Supply: 3.25V to 18V Thermal Shutdown Removed 8-pin Ceramic DFP (HKJ) Package, KGD, and Plastic (DGK) • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • High Accuracy and Low Noise for High • • • • • • • • Resolution Precision Applications Minimize system error over temperature Directly provide accurate voltage reference to ADC without additional op amp buffer Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification • -55°C to +210°C (8-pin Ceramic DFP (HKJ) and KGD)–Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released • -55°C to +175°C (8-pin Plastic (DGK)) – Potential TPS62000-HT Released Adjustable, High Temperature Step-Down Converter • • • • • • • • 2V to 5.5V input voltage range High Efficiency 300-mA output current Output voltage : adjustable(0.9V to 5V) 1.4-mA quiescent current (typ) 500 KHz switching frequency Thermal Shutdown Removed 10-pin Ceramic DFP (HKK) Package and KGD • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +210°C • Robust general purpose DC/DC converter • Low quiescent current • Supports low voltage DSPs and processors • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification TPS62110-HT Released 17Vin, 700 mAOUT Step-Down Converter • • • • • • • • High Efficiency Input Voltage: 3.1V to 17V Output Voltage: 1.2V to 16V(TPS62110) Output Current: 700 mA Low Quiescent Current Switching Frequency: 1.0MHz Thermal Shutdown Removed 16-pin Plastic TSSOP (PWP) Package Wide Input Voltage • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +175°C • Highest integration (FETs and Diode • • • • • • • • integrated) Smallest foot-print with only a small Inductor needed High efficiency and easy-to-use functionality! Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification TPS54362-HT Released 1Amp, 48V Step-Down DC/DC Converter With Low IQ Buck Converter • • • • • • • • • • • • • • Wide Inp Voltage Range: 4.8V to 48V 60V Load Dump protection Max. Load Current: 1A Adjustable Output Voltage: 0.9V to 18V Shutdown current: <5 μA typical Adjustable Frequency 200kHz to 2.2MHz Synchronization to external clock Soft start controlled with external capacitor Output Switch slew rate control Reset function with de-glitch timer Reset threshold and delay programmable Over voltage detect – Programmable Thermal Shutdown Removed 20-pin Plastic HTSSOP (PWP) Package • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +175°C • Low “dark current” in standby mode • Wide input voltage range, no external • • • • • • • • protection required Integrated Voltage supervisor Smaller LC Output filters Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification TPS50301-HT Released 3V to 6.3V Input, 3Amp Synchronous Step-Down SWIFT™ Converter • • • • • Split Power Rail: 3V to 6.3V on PVIN Integrated Power MOSFETS Load Current of 3-A at 210°C Monotonic Start-Up into Pre-Biased Outputs Flexible Switching Frequency Options: • 300kHz – 1MHz Adjustable Internal Oscillator • External Sync capability from 100KHz – 1MHz • Sync pin can be configured as a 500KHz output for Master/Slave applications • Low 100-μA Shutdown Quiescent Current • Adjustable Under voltage Lockout • 20-pin Ceramic FP (HKH) Package • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +210°C – Released • 90% Peak Efficiency; Optimized for Low • • • • • • • • • • Output Voltages Minimal external RCL components Easy On/Off Control Self-Protected from Fault Conditions Supported by SwitcherPro™ Software tool Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification TPS76901-HT Released Single Output LDO, 100mA, Adjustable • • • • • 100 mA output current Adjustable output voltage Vin up to 10V Max Family includes numerous voltage options Logic enabled shutdown puts the LDO in standby and reduces supply current • Thermal Shutdown Removed • • • • • • Ultra-low quiescent current LDO • Extends Battery Life and saves space in • • • • • • portable designs Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +175°C (5-pin Plastic SOT (DBV)) – Released • -55°C to +210°C (8-pin Ceramic DFP (HKJ) and KGD) – Released • -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released Prev MSP430F2619S-HT Released 16-Bit Ultra-Low-Power MCU • • • • • • • 120KB+256B Flash Memory 4KB RAM 12-Bit ADC Dual DAC 2 USCI Thermal Shutdown Removed 64-pin Plastic QFP (PM) Package • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +150°C • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification SM320F2812-HT Released Digital Signal Controller • Processor Performance • 110-120 MIPS with Flash Acceleration Tech • 150 MIPS out of RAM for time-critical code • Memory • 128Kw Flash • External memory interface (XINTF) supports systems w/ larger memory models • Control Peripherals • PWM outputs interfaces for three 3-phase motors • 12-bit ADC • 172-pin Ceramic QFP (HFG) Package and KGD • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification Code security 128Kw Flash + 2Kw OTP 18Kw RAM 4Kw Boot ROM Event Mgr B XINTF Memory Bus Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +220°C 150MIPs C28xTM 32-bit DSP 32x32 bit Multiplier RMW Atomic ALU 32-bit Timers (3) Real-Time JTAG 12-Bit ADC Peripheral Bus Interrupt Management • • • • • Event Mgr A Watchdog GPIO McBSP CAN 2.0B SCI-A 32-Bit Register File SCI-B SPI SM320F28335-HT Released Digital Signal Controller • Processor Performance • 200 MFLOPS@100MHz, Single-cycle MAC • 6-ch DMA support for EMIF, ADC, McBSP • Memory • Up to 512KB flash and 68KB RAM • Configurable 16- or 32-bit EMIF • Control Peripherals • PWM outputs interfaces • 6 High-resolution PWM outputs • Highest-speed on-chip ADC • Communications Ports • Each McBSP configurable as SPI, CAN 2.0b with 32 mailboxes, I2C at 400 Kbps Code security 512 KB Flash SM320F28335 68 KB RAM Boot ROM Memory Bus Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics TM C28x 32-bit DSC 32x32-bit Multiplier 32-bit Timers (3) Real-Time JTAG • -55°C to +210°C 6 CAP DMA Interrupt Management • • • • • 12 PWM (6 HRPWM) RMW Atomic ALU 32-bit Floating -Point Unit 2 QEP Peripheral Bus • Development Tools • Code Composer Studio™IDE • 181-pin Ceramic PGA (GB) Package and KGD • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification 12-bit ADC 88 GPIO 16/32-bit EMIF SPI 3 SCI 2 McBSP I²C 2 CAN SM470R1B1M-HT Released Arm 7 Microcontroller Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics Program Flash Peripheral Library Data RAM High End Timer Oscillator PLL CPU Bus CAN J1850 Digital Addr. Registers System Decoder MibADC 10-bit INC Memory Protection Registers Watchdog RTI Multiplier Debug Module • • • • • Memory 16-bit Thumb Instruction Set Decompression Plastic LQFP (PGE) Packages & KGD • Open-Architecture w/ Full 3rd Party Support • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification JTAG Iinterface • ARM7TDMI™ Compatible • Thumb extension • Debug module • Multiplier with JTAG Interface • Performance Enhancements • ARM7 CPU Accelerator • 60 MHz RISC Co-Processor • High Performance DMA • TMS470R1B1M • 1024 HB Flash and 64 KB RAM • 12-Channel ADC • 16 Channel DMA • 84-pin Ceramic QFP (HFQ) and 144-pin SCI I2C Shifter DMA 32-bit ALU IEM ARM7TDMI SYSTEM Module • -55°C to +220°C (84-pin Ceramic QFP (HFQ) and KGD) – Released • -55°C to +175°C (144-pin Plastic LQFP (PGE)) – RTM 4Q’12 SPI I/Os / EBM ECP OMAPL137-HT Released C674x DSP + ARM9 Processor • Dual CPU Cores: • ARM926EJ-S™ (MPU) • C674x DSP Core • Memory: • ARM: 16K I$, 16K D$, 64K ROM • DSP: 32K L1D, 32K L1P, 256K L2 Cache, • Compatible with C6747 DSP • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification 128K RAM and 1MB ROM • Peripherals (1.8/ 3.3V IOs) • 10/100 Ethernet MAC • EMIF1–Supports 133MHz SDRAM 16/32-bit • EMIF2–Supports Async/NAND Flash 8/16 bit • USB 2.0 • UHPI, McASP (3), UART(3), I2C(2), SPI(2), RTC, Timers (3) • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors ARM9 Subsystem DSP Subsystem ARM 926EJ-S CPU 300 MHz C674x DSP Core 300 MHz L1P 16K L1D 16K L1P 32K L1D 32K L2 256K 128KB RAM LCD Controller Switched Central Resource (SCR) / EDMA Peripherals UHPI • -55°C to +175°C (176-pin Plastic QFP (PTP)) – Released • -55°C to +175°C (KGD) OMAP-L137 DSP + ARM Connectivity USB 2.0 USB 1.1 Serial Interfaces SPI (2) McASP (3) System WD PWM Timer (3) EMAC Program/Data Storage I2C (2) UART (3) SDRAM 32-bit Async EMIF 16-bit MMC/SD SM28VLT32-HT Released 4-Mbyte Flash Storage Device Memory • 32-Megabit Flash Memory Device • Serial Peripheral Interface (SPI) Compatible • 3.3-V Supply for IO, 1.8 V for Core • 2-M x 16-Bit Word Access • Synchronous Read/Write/Erase Operations • Sector Protection Through Programmable • • • • Hardware Locks 20-MHz Maximum Clock Frequency Built-In-Self-Test (BIST) Data Retention: 1000 hrs 14-pin Ceramic FP (HKN) Package and KGD • • • • • Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors General Data Collection Applications at Extreme High/Low-Temperatures • -55°C to +210°C • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability • Extended Product-Change Notification SN65HVD233-HT Released CAN High-Temp Transceiver With Diagnostic Functions • Bus pin short-circuit protection to ±36V • ESD protection exceed 16kV • Designed for signaling rates up to 1 Mbps • High Impedance • 3.3 V supply • Glitch free power up & power down protection • Thermal Shut-down removed • • • • Down-Hole Drilling High Temperature Environments CAN Data Bus Industrial Automation • Device is unharmed by shorts to these • • • • • • • • • • voltages Compatibility with existing signaling schemes Up to 120 nodes on bus Ideal for microcontrollers and DSPs Hot pluggable without data Corruption Loopback for Diagnostic Functions Available Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability • -55°C to +175°C (8-pin Plastic SOIC (D)) – Released • -55°C to +210°C (8-pin Ceramic FP, Ceramic DIP (JDJ), and KGD) – Released ISO7221C-HT Released Dual High-Speed Digital Isolator • Silicon Integrated SiO2 Dielectric Capacitor • 0–25 Mbps and DC Signal Pass with Fail Safe • 25 Mbps Signaling Rate • TTL Inputs • 1ns Skew, 1ns Jitter, 2ns Pulse Distortion • Input Threshold, Noise Filter • High Magnetic Immunity (1E6 > Inductive) • 3-KV HBM ESD on All Pins • 3.3V and 5V Supply Supported • Estimate 3000-V Max Isolation • 8-pin Plastic SOIC (D) Package • Down-Hole Drilling • High Temperature Environments • Industrial Controls (PLC, Servo, Motor Control, Sensors) • Power Supply/Regulation Systems • Industrial Automation (Fieldbus, Modbus, Profibus, Device Net Data Buses, Smart Distributed Systems (SDS), CAN, RS485, USB • Automotive Electronics & Hybrid Vehicles • -55°C to +175°C • Proven Reliability of SiO2 Dielectric • Low Skew, Jitter, & Pulse Width Distortion • Filters Noisy Signals before Entering System • High Immunity for Noisy Environments • High Reliable in Harsh Environments • Flexibility with Power Supplies • Highly Reliable in Harsh Environments • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Extended Product Life Cycle • Product Traceability SN65HVD11-HT Released 3.3V RS-485 High-Temp Single Half-Duplex Transceiver • Based on ANSI TIA/EIA-485-A • Operate with single 3.3-V supply • Speed of 10Mbps • Common-mode voltage range (-7V to +12V) • 16-kV HBM Bus I/O ESD protection • Failsafe receiver for open circuit, short circuit • • • • • and idle-bus conditions >41mV receiver input hysteresis Glitch free power up & power down protection Industry standard SN75176 pinout Thermal Shut-down removed 8-pin Ceramic FP (HKJ), CDIP SB (JDJ), KGD, and Plastic SOIC (D) offerings • RS-485 standard versatile • Ideal for use with DSPs • Enables use in long cable networks • Extended ESD level of protection • Protected in all situations • Rejects spurious noise signals and prevents • • • • • • false changes in the receiver output state Hot pluggable without data Corruption Controlled Baseline One Assembly/Test Site One Fabrication Site Extended Product Life Cycle Product Traceability • Down-Hole Drilling • High Temperature Environments • Digital Motor Control • • • • • -55°C -55°C -55°C -55°C -55°C to to to to to +175°C +210°C +210°C +210°C +210°C (8-pin Plastic SOIC (D) Package – Released (8-pin Ceramic FP (HKJ) Package) – Released (8-pin Ceramic DIP SB (JDJ) Package) – Released (Known-Good-Die) – Released (8-pin Ceramic Lead-formed FP (HKQ)) – Released SN65HVD1040-HT Released Low-Power CAN Transceiver with Bus Wake-Up • Full compliant to the CAN standard • 5μA Standby Mode With Bus Wake-Up • Dominant time-out circuit • Bus-Fault Protection Bus fault, pin short• • • • • • • • • • • circuit, cross-wire, overvoltage and loss of ground protection from -27 to +40V ±12kV ESD on Bus, Split pins and very Low Electro-Magnetic Emissions (EME) 1Mbps signaling rates meets ISO 11898-5 High 125mV of Hysteresis Glitch-free Power-Up/Down protection Thermal Shutdown Removed 8-pin Ceramic Dual FP (HKJ), HKQ, KGD, and Plastic SOIC (D) Down-Hole Drilling High Temperature Vibration Analysis Pressure Sensors Acoustics • -55°C to +210°C – Released • -55°C to +175°C – Potential • Enables quick wakeup for transmission • Prevents driver from blocking network • • • • • • • • communications during HW and SW failures Device is unharmed by shorts to these voltages and during these scenarios Ensures high ESD protection and minimal interference with improved EMI Existing signaling scheme compatibility Hot pluggable without data corruption Controlled Baseline, One Fabrication and Assembly/Test site One Fabrication Site Extended Product Life Cycle and Traceability Extended Product-Change Notification OPA820-HT Released Unity-Gain stable, Low Noise, Voltage-Feedback Operational Amplifier • Small Signal Bandwidth: 240MHz, G = +2 • Slew rate: 240V/µs • Offset Voltage: 4µV/˚C (max) • Low Input Voltage Noise: 2.5nV/Hz • Flexible Supply Voltage • Dual ±2.5V to ±6V • Single +5V to +12V • Excellent DC accuracy • ±750mV Input Offset Voltage • ±400nA Input Offset Current • Low Quiescent Current: 6.4mA (max) • High Output Current (±110mA) • Low Supply Current (5.6mA/Ch.) • 8-pin Ceramic Dual Lead-formed FP, Plastic SOIC (D) and KGD • Enables the fast conditioning of high • • • • • • • • • • • frequency signals with high linearity Low initial offset eliminates calibration need providing accuracy across full temp range Enabling high dynamic range and gain without distortion Enables both single or split supply voltages High DC accuracy for pulse amplifier apps Extends battery life s and ideal for portable applications Provides large drive capability Controlled Baseline One Fabrication and Assembly/Test Site Extended Product Life Cycle Product Traceability Extended Product-Change Notification • Down-Hole Drilling • High Temperature • Vibration Analysis, Pressure Sensors • -55°C to +210°C KGD – Released • -55°C to +210°C (8-pin Ceramic Dual Lead-formed FP) • -55°C to +175°C (8-pin SOIC (D)) – Potential TPS7H1201-HT Released 6.3V, 0.5A Low Drop-Out Regulator • VIN = 1.5V to 6.3V • Ultra Low Dropout: 200mV (Max) at • • • • • • • • 500mA • PMOS Pass Device Device 2% Accuracy Ultra Low Noise: (27x VOUT) μVRMS TPS7H2101 PSRR: >45db up to 1 KHz Programmable SoftStart Programmable OCP, with current reading Power Good Output (for Sequencing) Temperature Range: -55°C to 210°C Packaged in Thermally Enhanced 16-pin Ceramic Flatpack and Known-Good-Die (KGD) Packaged in Waffle Pak • Power Management – LDO • RF Components VCOs, Receiver, ADC’s Amplifiers • High voltage, high PSRR, low noise and Clean Analog Supply Requirement Applications IQ VIN IOUT VOUT (V) (μA) PG NR/SS 1.5 – 6.3 0.5 0.8 – 6.1 TBD YES YES (V) (A) VDO Enable (mV) YES 200 TI High Temperature Products HT Webpage: http://www.ti.com/ht TI HiRel Contact: Mont Taylor mont-taylor@ti.com (903) 868-6316 Comments/Feedback Please Visit : www.ti.com/ht