Atotech’s Solutions for MLB
Production using Advanced
Basematerials
Speaker:
Jaime Peraza Ordaz
PMM Atotech Europe
mobile: +34 606 372 364
email: jaime.peraza@atotech.com
Tobias Sponholz
Global Assistant Product Manager BTT PTH
Mobile: +49 (0)173 - 628 64 80
Email: tobias.sponholz@atotech.com
Agenda
1
2
3
Application Guide
Horizontal Electroless Copper
Printoganth P Plus
Vertical Electroless Copper
Printoganth PV (E)
Direct Plating
4
Neopact
Seleo CP Plus
Atotech’s Solutions MLB Production using Advanced Basematerials
Saint Petersburg, May 2013, JPO
Proprietary and Confidential
Application Guide
Proprietary and Confidential
PTH Process Overview
Application and Pricing Guide
PTH PROCESS APPLICATION GUIDELINE
Segment
IC
Substrate
Application/
Technology
SAP
Recommended Process
Vertical
Horizontal
Direct Plating
Printoganth MV Plus
Printoganth SAP Plus
n/a
Printoganth MV Plus
Printoganth P Plus
n/a
Printoganth PV E
Printoganth P Plus
Neopact
Seleo CP Plus
Noviganth LS Plus
Printoganth U Plus or
Printoganth U
Seleo CP Plus
(GX92, GX13, GX-T31, ..)
MSAP, AMSAP
(BT, BT PCF, ...)
HDI &
MLB
Advanced
Materials
(PTFE, BT, High Tg FR4,
Standard
Materials
(standard FR4,…)
Proprietary and Confidential
Horizontal Electroless
Copper
Printoganth P Plus
Proprietary and Confidential
Printoganth P Plus
Features & Benefits
Market Introduction in Sept. 2009
Target Application
 Any production with advanced materials where
adhesion or blistering is an issue e.g.
flex, rigid-flex, PTFE, BT, PI, etc.
 HDI and AMSAP technology
Technical Benefits
 Extremely good non-blister behavior and coverage
performance
 Very good reliability
 Easily adjustable deposit rate 0.35 – 0.5µm / 4 min
 Enhanced bath stability
Printoganth P Plus enables highest flexibility
in production mix
Proprietary and Confidential
Horizontal MLB and HDI Processes
Comparison
Printoganth U
Printoganth U
Plus
Printoganth H-DK
Printoganth P
Printoganth P
Plus
+
+++
++
+++
+++
Deposition rate
0.35 µm
in 4 min
0.35 µm
in 4 min
0.5 µm
in 4 min
0.3 µm
in 4 min
0.35-0.5 µm
in 4 min
Non-blistering
performance
fair on all
standard base
materials
fair on all
standard base
materials
fair on all
standard base
materials
excellent even on
challenging base
materials
excellent even on
challenging base
materials
Bath Stability
+
++
+
+++
+++
No
No
No
Yes
Yes
4
5
4
4
4
Reliability
CN-free
CN-
Components
excl. NaOH
Printoganth P Plus is Atotech’s most capable
process for HDI manufacturing
Proprietary and Confidential
Horizontal Desmear
Uniplate P
Process Sequence
Sweller
Permanganate
Etch
Reducer
Securiganth E Sweller
Securiganth P500
Reduction Cleaner Securiganth E
or
Reduction Conditioner Securiganth P500
SECURIGANTH® desmear series is the industry standard for horizontal HDI
manufacturing.
Optimal desmear attack on a wide variety of base materials.
Proprietary and Confidential
Horizontal Activation & E’less Cu
Uniplate LB
Process Sequence
Cleaning
Cleaner Securiganth E
Etch
Cleaning
Securiganth SPS
Pre Dip
Neoganth Pre-Dip B
Activator
Neoganth
U Activator
Neoganth
800
Reducer
Neoganth WA Reducer S
E’less Copper
Printoganth P Plus
Proprietary and Confidential
Economic Activator Neoganth 800
Features & Benefits
New Ionic activator system for horizontal application running
at only 75ppm Pd
 Activator U = 225 ppm
Enables significant savings in running costs by less
consumed Pd
Fully compatible to established Atotech conditioning system
 easy drop in solution
Perfect coverage on a wide range of relevant base materials
Same excellent reliability results as Activator U
Robust & easy process
Wide working window
Activator 800 during Alpha site test
Proprietary and Confidential
Non-Blistering Performance
Theoretical Explanation
Non-blistering performance is related to
internal stress within deposited e’less Cu layer
Printoganth P series
Relevant factors for Cu deposit behavior
 Stabilizer type & concentration
 Stabilizer Co-deposits (e.g. Ni)
 Deposition temperature
 Baking after electroless Cu deposition
X-ray diffraction (XRD) measurement reveals
constant tensile stress with Printoganth P Plus
– a type of internal stress that is beneficial for
non-blistering!
Proprietary and Confidential
relative strain
X
Z
Printoganth P Plus
Applications
Flex-Rigid Board
FR4 Production Board
No Blistering due to excellent stress characteristics
Bright deposition color
Proprietary and Confidential
Reliability
Summary
Quick Via Pull test, 3-6 mil
– all passed.
Solder Shock Test (6x 288°C, 10s floating)
with THs and BMVs
– No ICDs, passed.
Solder Shock Test (9x 326°C, 10s), THs & BMVs
with THs and BMVs
– few ICDs, ok.
IST (+150°C / RT @ 3’/ cool down within 2‘,
max. 10% resistance increase)
– 2000 cycles passed.
Various E-tests (daisy chains)
– all passed.
Printoganth P Plus fulfills all reliability
requirements for high-end HDI production.
Proprietary and Confidential
Printoganth P Plus
Customer References
Customer
Country
Lines
Capacity
[Tm²/ yr]
Panel Type
AT&S
Austria
2
240
FR4
KCC
Korea
5
1000
FR4, RCC
INTERFLEX
Korea
3
700
PI
Korea / China
3
720
PI, Rigid-Flex
R2R
LGIT
Korea
3
640
BT, FR4
AMSAP
Youngpoon
Korea
2
480
PI, Rigid-Flex
Daisho
Japan
1
180
Rigid-Flex
Shennan
China
1
180
BT, FR4
Founder
China
1
240
FR4,..
Foxconn
China
2
620
High Tg FR4
ASE
Taiwan
1
120
BT
Simmtech
Korea
1
320
Unimicron
Taiwan
1
SI FLEX
TOTAL
26
Proprietary and Confidential
Remark
AMSAP
AMSAP
Vertical Electroless Copper
Printoganth PV (E)
Proprietary and Confidential
Process Sequence
Activation & E‘less Cu
Products
Temp.
(°C)
Time
(min)
Securiganth Cleaner 902
60
4
SPS
30
1
Neoganth LS Pre Dip
RT
1
Activator
Neoganth LS Activator Plus
Neoganth
V8 Pd)
(60 ppm)
(75 ppm
40
50
4
Reducer
Neoganth LS Reducer
30
3
E’less Copper
Printoganth PV (E)
34
8-20
Desmear
Cleaning
Etch
Cleaning
Pre Dip
Proprietary and Confidential
Activation Series Neoganth LS Plus
Features & Benefits
Ionic Activator for vertical application
Optimal coverage at low running cost (75ppm Pd)
Fine & homogeneous distribution of Pd particles
No tooling hole issues
Pre Dip
Activator
Reducer
Not corrosive
Improved robustness, no precipitations during manual
replenishment
Easy handling, no premixing
100% compatible to established conditioning concept
Proprietary and Confidential
Economic Activator EXPT Neoganth V8
Features & Benefits
New ionic activator system for vertical MLB/HDI applications
running at only 60 ppm Pd
 Enables significant savings in running costs by less consumed Pd
Modified complexing agents
 Ensures good coverage despite low palladium content
 ‘Locking’ copper ions in a stable complex enhances bath lifetime
Less alkaline
 Improved bath stability by reduced carbonate formation
Perfect coverage on a wide range of relevant base materials
Fully compatible to established Atotech conditioning system
 Easy drop in solution
Robust & easy process
 No additional NaOH dosing required by optimized replenishment concept
 Wide working window
Activator Neoganth V8 –
full power ionic activation at low cost
Proprietary and Confidential
Printoganth PV vs PV E
Comparison
…
Cleaning
Etch
Cleaning
Printoganth PV
Printoganth PV E
Printoganth V Copper
Printoganth V Copper E
Printoganth V Basic
Printoganth PV Stabilizer
Cu Reduction Solution
NaOH
Pre Dip
Identical stabilizer system
Activator
Same bath performance
Reducer
Different Cu source (CuSO4, CuCl) to be more flexible
in supply chain
E’less Copper
PV E potentially more cost-effective due to higher
concentrated Cu additive
Proprietary and Confidential
Printoganth PV (E)
Features and Benefits
Versatile vertical e’less Cu process for advanced MLB/HDI applications
Superior adhesion on most materials including PI, PTFE, BT... due to optimal
internal stress characteristics of the copper deposit:
 No blistering
 No pull away
Highly reliable process
 Fulfills all standard reliability requirements such as SST, IST, TCT
 No ICDs at standard conditions and only low occurrence at harsh solder shock conditions as 9x
326ºC
Low to high build deposit possible
 Deposition speed 0.3 - 0.6µm in 10 min
Environmentally friendly
 Tartrate based
 Cyanide free
Proprietary and Confidential
Printoganth PV E
Coverage in Through Holes
Pos.1
Pos.6
Pos.2
Pos.7
Pos.3
Pos.8
Pos.4
Pos.9
Pos.5
Pos.10
Proprietary and Confidential
Printoganth PV E
Coverage in Blind Micro Via
SEM picture
Excellent BMV coverage despite strong
glass fiber protrusion!
Proprietary and Confidential
Printoganth PV E
Coverage
Base material Tg °C
phenolic
Halogen
-free
Lead-free
Polycompatible imide
Backlight
PV E
Backlight
PV
x
D8
D9
x
x
D7-8
D7-8
x
x
D9-10
D9-10
D8-9
D8-9
Isola Duraver
104
135
Matsushita
R1566
150
Hitachi MCLBE-67G
150
DuPont
Pyralux AP
195
Isola Duraver
114
150
D8
D8
Isola Duraver
117
170
D9
D8
Nan-Ya NP175-TL
170
PIC DF-170
170
x
x
x
x
D10
x
D7-8
standard pth process without 902 Flex Cleaner or Reduction Conditioner
Proprietary and Confidential
D7
Printoganth PV E
Surface Adhesion
Excellent adhesion on exposed polyimide
Outstanding adhesion with Printoganth PV E !
Proprietary and Confidential
Printoganth PV E
Production Example – Exotic Materials
Korean Customer for military application
Final Product
Fe oxide
powder
EPDM Rubber
Proprietary and Confidential
Printoganth PV E
Solder Shock Results
Solder dip conditions
ICD
Inspected
Inner layer
6 x 10 sec @288°C
0
203
0%
9 x 10 sec @288°C
0
202
0%
12 x 10 sec @288°C
0
182
0%
15 x 10 sec @288°C
0
102
0%
18 x 10 sec @288°C
1
99
1%
% ICD
Alpha site test with customer production panel (Nanya NP-175TL, phenolic-cured FR4, Tg 175ºC)
Printoganth PV E fulfills
highest reliability requirements
Proprietary and Confidential
Printoganth PV E
Solder Shock Results
6x IR reflow + 1x solder shock
no pull away
no ICD
customer internal test results, production panels (EMC EM-320, lead-free high Tg 170ºC)
Solder shock tests
Test conditions
ICD
Inspected Inner layer
% ICD
6 x 10 sec @288°C
0
36
0%
10 x 10 sec @288°C
0
36
0%
14 x 10 sec @288°C
0
34
0%
18 x 10 sec @288°C
0
34
0%
Test at customer site with production panels (Isola E-Cu 114, dicy-cured FR4, Tg 150ºC)
Proprietary and Confidential
Printoganth PV E and PV
References
Customer
Country Lines
Capacity
Base Materials
Application
Boardtek
Taiwan
4
650.000
High Tg FR4, Teflon
high frequency
New Flex
Korea
1
120.000
PI, FR-4
Jiang Nan Institute
China
1
100.000
FR4, RCC, HTg
PC Chipset, Graphic
chipset, Mobile
military
ChangSung
Korea
1
60.000
Special
military
ACB
Europe
1
25.000
FR4, HTG, PI, PTFE
Military, automotive
Exception
Europe
1
23.000
FR4, HighTg, BT,
various
Others
-
4
30.000
various
various
Capacity
[m²/year]
Base Materials
Application
Customer
Country Lines
Sonic
India
1
72.000
FR4
Arktron
India
1
15.000
FR4
Meadville (DMC)
China
1
400.000
FR-4 High Tg,
Meadville (MAS)
China
1
350,000
FR-4 High Tg, HF
MEIKO
China
1
760.000
FR-4, HF
HDI
Mutual-Tek
Taiwan
1
240.000
FR4, PI
Flex-Rigid
status 2012-10
Proprietary and Confidential
High-layer MLB
Printoganth PV (E)
Summary
Printoganth PV (E)
 vertical e’less Cu process for MLB/HDI applications
 outstanding non-blistering performance
on any kind of base materials
 highly reliable
Deposit structure of Printoganth PV E
Optimal performance in conjunction with
 Securiganth BLG desmear
 Neoganth LS Plus activation
Outlook
 Neoganth V8 Activator for lower running cost
Plated BMV with Printoganth PV E
Proprietary and Confidential