Direct Plating Neopact Seleo CP Plus Proprietary and Confidential Direct Plating Application Guide Segment Application / Build-up Technology Direct Plating Technology Recommended Process Organo/Pd Colloid Neopact Conductive Polymer Seleo CP Plus Conductive Polymer Seleo CP Plus Advanced Materials HDI, MLB (PTFE, BT, High Tg FR4, PI, Ceramic…) Standard & Advanced Materials (High Tg FR4, halogen free, …) Standard Materials MLB, DS (Low – mid Tg FR4) Proprietary and Confidential Neopact Main Industry Requirements Reliability TCT 500 – 1000 cycles Thermal shock 3 – 9 x 288°C Functionality Control systems e.g. engine, braking, climate Communication / navigation Entertainment systems Automotive Cost Costs of raw materials OEM demands for lower cost Environment RoHS / EU regulations Recycling regulations Waste water restrictions Proprietary and Confidential Industry Neopact Background Market release more than 18 years ago Direct metallization process for flex material and MLB production such as back panels for end- market like automotive and industry High Pd adsorption of conductor on all types of laminates for good conductivity Conductor Neopact 400ppm Pd Pd activator type A Pd activator type B 90ppm Pd Magnification 315000x Proprietary and Confidential 250ppm Pd Neopact Features & Benefits Tin- free Pd colloidal activation system Highly versatile, reliable application for different technologies Suitable for ALL base materials (PTFE / Flex) Applicable as vertical and horizontal process Good adhesion of acid copper on surfaces with low roughness All customer requirements fulfilled MIL P-55110 MIL P-55110 D MIL P-50884 SN 57030 IPC-TM-650 IPC-A-600F Perfag 3 B Bosch K8 (Automotive) Proprietary and Confidential Neopact Process Sequence – Vertical Process Temp (°C) Time (min) Process Baths 35 2 Etch Cleaner based on SPS or Etch Cleaner Securiganth C 50 5 Conditioner Neopact UX 30 2 Selector Neopact AB or Securiganth Etch Cleaner 20 1 Pre Dip Neopact Conductor 50 5 Conductor Neopact Post Dip 25 1.5 Post Dip Neopact Etch Cleaner Conditioner Selector Pre Dip Acid Cu Plating Proprietary and Confidential Neopact Typical Results – Base Materials PIC 170 Isola DE117 Tg = 170ºC DuPont Pyralux AP Rogers R4350 Tg > 280ºC Proprietary and Confidential Neopact Typical Results – BMV FR4 Ø 4mil depth 65µm RCC Ø 4mil depth 65µm Proprietary and Confidential Neopact References Horizontal Vertical Total 16 28 44 2.000.000 m² 300.000 m² 2.300.000 m² Europe 11 26 37 Japan 2 1 3 China 2 0 2 Taiwan 1 0 1 RoW 0 0 0 No. of lines Total capacity Status 03/2010 Neopact is a well established production proven process for several applications and end-user markets Proprietary and Confidential Seleo CP Plus Proprietary and Confidential What is Seleo CP Plus? Direct Plating process (alternative to electroless copper) for MLB and HDI manufacturing Based on a conductive polymer as conductive layer Very GREEN and short process with only 4 active process steps Seleo CP Plus – The Plus for your green conscience Proprietary and Confidential Why use Seleo CP Plus? Features and Benefits Environmentally friendly Very short & simple process Low chemistry usage per m² cut board Low generation of waste water Low consumption of fresh water No usage of harmful chemicals as e.g. formaldehyde, cyanide CN– HCHO Economical advantages No dependence on Pd price Low space requirement Reduced investment costs Low running costs (chemistry / fresh water / waste water) Technical benefits Selective process with excellent reliability BMV & direct pattern plating capable Horizontal & vertical application possible Robust conductive layer – 2 time holding time possible Copper particle free production Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO Proprietary and Confidential Pd Seleo CP Plus Process Description Etch Cleaner Conditioner Adhesion Promoter Polyconduct S Metallization (E’lytic Cu) MnO MnO22 + 2 + 4H+ S Proprietary and Confidential S + Mn2+ + 2 H2O Seleo CP Plus A Truly Selective Process Etching gap In the conductive layer Seleo CP Plus reduces the risk of a gap developing in the conductive layer near to inner layers which can occur if non selective direct plating processes are used which require etching to clean innerlayers (e.g. carbon/graphite and some conductive palladium processes) Proprietary and Confidential Horizontal Process Comparison Footprint E’less Copper Cleaner 2 Etch Cleaner Pre Dip 4 Activator 3x 18.1 m 3 3x 3x 5 6 Reducer E’less Copper 1 Etch Cleaner (optional) 2 Conditioner 3 Adhesion Promoter 4 Polyconduct 3x 3x 10.8 m 1 Seleo CP Plus 1x + 3x 3x Reduced line length 3x 2 less active modules 1x + 2x 1 less cascade rinse Calculation Basis: Uniplate Seleo CP (UTS-s, 1.5m/min), Triple Rinses Proprietary and Confidential Environmental Benefits Total Chemistry & Water Consumption Uniplate (UTS-s, 1.5m/min), Triple Rinses + 27% E'less Cu 14000 Seleo CP Plus 12208 12000 8000 - 69% 6000 - 100% - 31% 4700 4487 - 82% - 97% - 93% - 90% - 100% - 100% 4000 1380 2000 0 140 228 158 25 38 21 1 31 4 25 2 4 0 Ag en t Re d ne nt po Co m et al M Proprietary and Confidential uc in g /S al t as e B pl ex an t Co m c O rg an i or ga ni c In In or ga ni c A ci d an t O xi d ft w at er So r DI w at e w at er 0 Ci ty g/m² c.b. 60% less chemistry consumed 28% less fresh water consumed (5.2kg/m²) 9618 10000 0 Environmental Benefits Total Wastewater Generated Rinses & Active Modules Uniplate (UTS-s, 1.5m/min), Triple Rinses 12000 Seleo CP Plus 9940 10000 g/m² c.b. 8000 E'less Cu + 34% 7408 - 69% 29% less generated wastewater (5.5kg/m²) 7820 6000 - 12% 4000 - 97% - 100% - 75% 2414 1464 1293 2000 1362 908 46 0 327 83 0 Rinse Water Acidic/Alkaline Rinse Water Complex Conc. Oxidizing Conc. Complex Proprietary and Confidential Conc. Alcaline Conc. Acidic Reliability – SST Solder Shock Test & ICD Performance Hole diameter 1.0mm 6x @ 288°C (acc. IPC-TM-650 #2.6.7.1) Hole diameter 1.0mm 9x @ 288°C (ISOLA E-Cu 114) Solder shock test, up to 9x at 288ºC, passed ! Proprietary and Confidential Reliability – TCT Temperature Cycle Test 1000 cycles & ICD Performance Ø1.0mm ML 2.4mm (ISOLA IS 400) 1000 cycles TCT and soldering Ø1.0mm ML 1.7mm (Panasonic R1566) 1000 cycles TCT and soldering Temperature cycle test, up to 1000cycles and soldering, passed ! Proprietary and Confidential Reliability – IST Interconnect Stress Test & ICD Performance Post interconnect (power circuit) Hole diameter 1.0mm 2000 cycles IST (Shengyi S1000) Interconnect stress test, up to 2000 cycles, passed ! Proprietary and Confidential Reliability Seleo CP Plus Summary Specifications solder float Solder Shock Test (SST) solder dip Temperature Cycle Test (TCT) -40°C (10’) +125°C (10’) -40°C (15’) +125°C (15’) Interconnect Stress Test (IST) 800 cycles Base Material 9x288°C, 10s ISOLA E-CU 114, IS 405 6x288°C, 10s ISOLA E-CU 114, IS 405 6x228°C, 10s PI- Flex 3x288°C, 10s HITACHI CHEMICAL MCL-BE-67G(H) 8x288°C, 10s SHENGY SYL-S1000, SYL-1141KF, SYL-1170 // MICA-HR01, HR33, 22B, 22B5, HR02 // HITACHI CHEMICAL MCL-BE-67G // Nan Ya AntiCAF R1766G // PANASONIC R1566W 6x288°C, 10s TUC TU662 // ISOLA IS 402 , IS 420 5x288°C, 10s HITACHI CHEMICAL MCL-BE-67G(H) // PANASONIC R1566W // ISOLA FR-370 Turbo, NELCO N4000-13 , N4000-6 200 cycles and 3x reflow as pre-cond. ISOLA IS402 500 cycles ISOLA IS402, IS405 1000 cycles and soldering 1x288°C, 10s ISOLA IS400 // PANASONIC R1566W 500 cycles SHENGY SYL-S1000, SYL-1141KF, SYL-1170 // MICA-HR01, HR33, 22B, 22B5, HR02 // HITACHI CHEMICAL MCL-BE-67G // Nan Ya AntiCAF R1766G // PANASONIC R1566W 3x reflow as pre-cond. ISOLA IS402 1000 cycles - ISOLA IS402 2000 cycles - SHENGY SYL-S1000 Proprietary and Confidential Customer Experiences Horizontal / Panel Plating 16 layers 3.2mm / 0.65mm AR 1:5 6 layers 1.6mm / 0.9mm AR 1:1.8 2.0mm / 0.11mm AR 1:18 8 layers 1.6mm / 0.2mm AR 1:8 4 layers 1.6mm / 1.1mm AR 1:1.5 Seleo CP Plus and smooth leveling down the hole Proprietary and Confidential Customer Experiences Horizontal / Full Pattern Plating 6 layers 1.6mm / 0.35mm AR 1:4.6 6 layers 1.6mm/0.7mm AR 1:2.3 10 layers 1.6mm / 0.3mm AR 1:5.3 detail 4 layers 1.6mm / 0.3mm AR 1:5.3 Compatible with Direct Imaging Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO Proprietary and Confidential Customer Experiences Horizontal / Mechanical Drilled BV 90µm / 100µm 1.0mm / 1.2mm 400µm / 500µm µ 90µm / 100µm 300µm / 300µm 250µm / 250µm Panel & Pattern Plating Proprietary and Confidential Customer Experiences Horizontal / Laser Drilled BMV 100 / 75 µm Large Window 100 / 75 µm 100 / 75 µm µm 1.0 / 1.2mm Inpulse 2HF / /75µm 2 A/dm , 100 10 ² minutes m µ, Copper 4 100 75µm 100 / 75µm Proprietary and Confidential 100 / 75µm Customer Experiences Horizontal Qualification Results 4 layer 10 layer 6 layer 12 layer 8 layer 1 week, 3 shifts 13380 panels ~1915 p./day 4335 m² ~620 m²/day Thickness: 1.0 2.4 mm Drill dia: 0.25 ~4.0 mm Aspect ratio: 1:10 MLB: 2 12 layer Basematerial: Tg 130 Tg 170 Proprietary and Confidential Customer Experiences Base Material Compatibility Supplier Arlon DuPont EMC Hitachi Chemical Isola ITEQ Matsushita Mica Nelco Material FR 25N DiClad 522/725 Pyralux AP8525 Pyralux AP8525R EM 320(5) MCL-BE-67G(H) GIA 671N DE 104 IS 402 IS 400 DE 114 DE 156 IS 410 IS 420 FR-370 TURBO G 200 IS 620i IS 640 P 96 IS 415 IT 140 IT 158 IT 180 IT 200 DB S 1650 C MC 100 EX Anticaf- R 1766 G R 1566 R 1566 W HR 02 H 01 22 22 B5 HR 33 N 4000-6 N 4000-13 N 7000 RO 3000 Tg [°C] Lead free processible Halogen free RoHS compliance yes yes yes yes yes no yes no no no no yes yes yes yes yes yes yes yes yes yes yes yes yes no no yes yes yes yes yes yes yes yes Yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes not available not available not available Yes yes yes yes 190 300 220 220 150 150 220 135 140 145 150 155 180 170 175 185 220 220 260 200/220 140 160 180 200 135 137 140 148 153 170 > 170 not available not available not available 175 210 250 300 not available not available not available yes yes yes yes yes flourine yes yes yes yes yes bromine bromine bromine bromine Yes bromine no no no no no no no bromine yes yes yes bromine bromine yes yes yes no bromine not available not available not available yes bromine Halogen free flourine RO 4003 C >280 yes yes yes RO 4350 "yes" Rogers Shengyi Taconic Technolam TUC >280 yes yes yes R/flex 1000 S 1155 S 1000 S 1170 S 1141 RF 35 TLC-32 NP 140 TL >220 135 170 175 150-170 315 315 140 yes yes yes yes yes yes yes no yes bromine no bromine flourine flourine bromine yes yes yes yes yes yes yes yes CEM3 125-130 optional bromine yes Tu 662 150 yes no yes Resin Type Flame retardant/Filler woven fiberglass reinforced woven Glass/Teflon Polyimide Polyimide FR4 FR4 Polyimide dicy Tetrafunctunal epoxy phenolic difunctional epoxy modified epoxy phenolic , multifunctional epoy resin Epoxy- polyfunctional Epoxy FR4 BT + Epoxy BT + Epoxy Epoxy Polyimide + Epoxy FR4 dicy Tetra functional epoxy mulitfunctional epoxy multifunctional epoxy dicy dicy, phenolic Difunctional Epoxy resin Epoxy FR4 Phenolic cured system Phenolic cured (Dicy Free) system not available not available not available FR4 enhanced multifunctional resin Polyimide ceramic-filled PTFE glass-reinforced hydrocarbon/ceramic laminates glass-reinforced hydrocarbon/ceramic laminates Polyimide epoxy epoxy FR4 epoxy PTFE coated woven glass fabric PTFE coated woven glass fabric dicy, phenolic glas woven core and two layer of FR4 dicy epoxy FR4 ceramic filler no filler no filler no filler NO: halogen, antimony, or red phosphorus No flow prepreg no filler no filler inorganic filler no filler P, Al, Cl, Si, O inorganic filler Br / inorganic All material tested or produced with standard Seleo CP Plus process parameter Proprietary and Confidential Br Br / No No filler Br/ Ca Br no filler no filler Al2O3 filler no filler no filler no filler no filler Al, P, Ca, Si, Mg P/ inorganic inorganic filler no filler not available not available not available no filler no filler ceramic filler ceramic filler ceramic filler Buthyral Phenolic no filler no filler no no no no filler filler filler filler no filler Customer Reference Horizontal Lines Seleo CP Plus (1) Customer Country End Market Acid Copper Conversion/Start Up 1 04/2008 Czech Republic Prototyping, Industrial/Medical, Defensive Pattern Plating, Copper Strike Competitor 2 07/2008 Hungary Consumer, Communications, Computing Pattern Plating Seleo CP 3 04/2009 Italy Consumer. Industrial/ Medical, IC Packaging, Communications, Automotive Pattern Plating Competitor 4 04/2009 China Communications, Automotive Copper Strike Seleo CP 5 05/2009 Israel Industrial/ Medical Pattern Plating, Copper Strike Seleo CP 6 05/2009 Italy Consumer, Communications, Industrial/Medical, Defense/Aerospace, Computing, Automotive Copper Strike Competitor 7 06/2009 Germany Industrial/ Medical Pattern Plating Competitor 8 10/2010 China Communications, Computing, Consumer, Automotive Semi Panel Plating Compact CP 9 03/2011 Italy Industrial/Medical, Automotive, Defense/Aerospace, Communications, Consumer, IC Packaging Copper Strike Compact CP 10 04/2011 Spain Industrial/ Medical, Consumer, Automotive Pattern Plating Seleo CP Rebuilding Proprietary and Confidential Customer Reference Horizontal Lines Seleo CP Plus (2) Customer Country End Market Acid Copper Conversion/Start Up 11 09/2011 Italy Communications, Computing, Consumer, Automotive Pattern Plating New Line / Competitor 12 10/2011 Germany Industrial/ Medical Pattern Plating, Copper Strike New line UTS-XL / Competitor 13 11/2011 Germany Consumer, Communications, Computing, Automotive, Industrial/Medical, Defense/Aerospace Copper Strike Seleo CP 14 03/2012 China Communications, Computing, Consumer, Automotive Semi Panel Plating CP Rebuilding 15 07/2012 Italy Communications, Industrial/Medical, Consumer Pattern Plating Competitor 16 09/2012 Brazil Industrial/Medical, Automotive, Defense Pattern Plating New Line / Competitor 17 03/2013 China Communications, Computing, Consumer, Automotive Semi Panel Plating Compact CP 18 03/2013 India Automotive, Industrial/Medical Copper Strike Seleo CP Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO Proprietary and Confidential Customer Reference Vertical Lines Seleo CP Plus (1) Customer Country End Market Acid Copper Conversion/Start Up 1 06/2008 Slovakia Prototyping, Industrial/Medical Copper Strike New Line PPT / Competitor 2 2011 UK Prototyping, Industrial/Medical Copper Strike Seleo CP 3 2012 Canada Industrial/Medical, Consumer, Communications Pattern Plating Seleo CP 4 2012 Canada Industrial/Medical, Consumer, Communications Pattern Plating Seleo CP 5 2012 Canada Industrial/Medical, Consumer, Communications Pattern Plating Seleo CP 6 02/2011 Brazil Automotive, Consumer, Computing, Communications Pattern Plating Competitor 7 04/2011 Brazil Automotive, Communications, Computing, Industrial/Medical, Aerospace Pattern Plating Competitor 8 04/2011 Brazil Communications, Automotive, Industrial/Medical Pattern Plating Competitor 9 10/2011 Brazil Automotive, Communications, Computing Pattern Plating Competitor 10 11/2011 Brazil Communications, Computing, Industrial/Medical Pattern Plating Competitor Proprietary and Confidential Customer Reference Vertical Lines Seleo CP Plus (2) Customer Country End Market Acid Copper Conversion/Start Up 11 03/2012 Brazil Communications, Computing, Industrial Pattern Plating Competitor 12 03/2012 Brazil Communications, Computing, Industrial Pattern Plating Competitor 13 11/2012 Czech Republic Industrial Panel Plating New Line PPT 14 01/2013 Brazil Industrial, Automotive, Computing, Consumer Pattern Plating New Line Competitor 15 02/2013 Brazil Automotive, Industrial Pattern Plating Competitor 16 02/2013 Brazil Industrial, Automotive, Computing, Consumer Pattern Plating Competitor Proprietary and Confidential OEM Reference Proprietary and Confidential Thank you for your attention! For more information contact : Jaime Peraza Ordaz PMM Atotech Europe Mobile: +34 606 372 364 Email: jaime.peraza@atotech.com Cyril Champion Product Marketing Manager Europe PTH-PP Mobil : +33 6 20 14 79 78 Email: cyril.champion@atotech.com Tobias Sponholz Global Assistant Product Manager BTT PTH Mobile: +49 (0)173 - 628 64 80 Email: tobias.sponholz@atotech.com